Electronic components shared by two or more pixel-elements

Industry

CPC
H01L27/14641

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/14641Electronic components shared by two or more pixel-elements

Industries

Patents Grantslast 30 patents

Information Patent Grant
System and method for sub-column parallel digitizers for hybrid sta...
- Patent number 11,973,090
- Issue date Apr 30, 2024
- DePuy Synthes Products, Inc.
- Laurent Blanquart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging element and electronic device
- Patent number 11,973,103
- Issue date Apr 30, 2024
- Sony Group Corporation
- Kyosuke Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensors including an amorphous region and an electron suppres...
- Patent number 11,948,956
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Hyungi Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging element, method for manufacturing the same, and...
- Patent number 11,948,958
- Issue date Apr 2, 2024
- Sony Group Corporation
- Hideyuki Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging apparatus
- Patent number 11,948,963
- Issue date Apr 2, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hirofumi Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device having projection regions from light shi...
- Patent number 11,948,952
- Issue date Apr 2, 2024
- Canon Kabushiki Kaisha
- Kazuo Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensors
- Patent number 11,935,906
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Jonghyun Go
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensors
- Patent number 11,929,375
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Jonghyun Go
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image-capturing element having floation diffusion and h...
- Patent number 11,929,380
- Issue date Mar 12, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yusuke Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device, driving method therefor, and electronic...
- Patent number 11,916,093
- Issue date Feb 27, 2024
- Sony Group Corporation
- Akira Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensors including phase detection pixel
- Patent number 11,910,112
- Issue date Feb 20, 2024
- Samsung Electronics Co., Ltd.
- Hongki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging element, stacked-type imaging element and solid-state imagi...
- Patent number 11,901,382
- Issue date Feb 13, 2024
- Sony Group Corporation
- Akira Furukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Global shutter pixel circuit and method for computer vision applica...
- Patent number 11,894,400
- Issue date Feb 6, 2024
- Magic Leap, Inc.
- Erez Tadmor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging apparatus having phase difference detection pixels receivin...
- Patent number 11,888,004
- Issue date Jan 30, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Keiichiro Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image pickup element, method of manufacturing image pickup element,...
- Patent number 11,862,652
- Issue date Jan 2, 2024
- Sony Group Corporation
- Shuji Manda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device and electronic device
- Patent number 11,848,341
- Issue date Dec 19, 2023
- Semiconductor Energy Laboratory Co., Ltd.
- Yoshiyuki Kurokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 11,848,337
- Issue date Dec 19, 2023
- DePuy Synthes Products, Inc.
- Laurent Blanquart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS image sensor having indented photodiode structure
- Patent number 11,843,007
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor comprising array of colored pixels
- Patent number 11,843,877
- Issue date Dec 12, 2023
- Samsung Electronics Co., Ltd.
- Heeryung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and manufacturing method therefor
- Patent number 11,843,886
- Issue date Dec 12, 2023
- Canon Kabushiki Kaisha
- Mineo Shimotsusa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensors
- Patent number 11,843,015
- Issue date Dec 12, 2023
- Samsung Electronics Co., Ltd.
- Min Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photo receiver
- Patent number 11,837,620
- Issue date Dec 5, 2023
- Sumitomo Electric Industries, Ltd.
- Hideki Yagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method, apparatus, and system providing an imager with pixels havin...
- Patent number 11,832,004
- Issue date Nov 28, 2023
- Nikolai E. Bock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and pixel array of image sensor
- Patent number 11,825,226
- Issue date Nov 21, 2023
- Samsung Electronics Co., Ltd.
- Mooyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging apparatus, imaging system, and distance measure...
- Patent number 11,818,486
- Issue date Nov 14, 2023
- Sony Group Corporation
- Takuya Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensors
- Patent number 11,817,465
- Issue date Nov 14, 2023
- Samsung Electronics Co., Ltd.
- Jung Bin Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device, drive method thereof and electronic app...
- Patent number 11,817,473
- Issue date Nov 14, 2023
- Sony Group Corporation
- Taiichiro Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel-array substrate
- Patent number 11,810,931
- Issue date Nov 7, 2023
- OmniVision Technologies, Inc.
- Hui Zang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor comprising entangled pixel
- Patent number 11,798,973
- Issue date Oct 24, 2023
- Samsung Electronics Co., Ltd.
- Younggu Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging device and imaging system
- Patent number 11,798,961
- Issue date Oct 24, 2023
- Canon Kabushiki Kaisha
- Hiroki Hiyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IMAGING DEVICE, METHOD FOR DRIVING THE SAME, AND ELECTRONIC DEVICE
- Publication number 20240145516
- Publication date May 2, 2024
- Sony Semiconductor Solutions Corporation
- MASAHIKO NAKAMIZO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND ELECTRONIC DEVICE
- Publication number 20240098385
- Publication date Mar 21, 2024
- Sony Semiconductor Solutions Corporation
- REN HIYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT, STACKED-TYPE IMAGING ELEMENT AND SOLID-STATE IMAGI...
- Publication number 20240096914
- Publication date Mar 21, 2024
- SONY GROUP CORPORATION
- Akira FURUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD, APPARATUS, AND SYSTEM PROVIDING AN IMAGER WITH PIXELS HAVIN...
- Publication number 20240080582
- Publication date Mar 7, 2024
- Lodestar Licensing Group LLC
- Nikolai E. Bock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE AND ELECTRONIC DEVICE
- Publication number 20240079424
- Publication date Mar 7, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Yoshiyuki Kurokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240073562
- Publication date Feb 29, 2024
- Canon Kabushiki Kaisha
- Mineo Shimotsusa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC EQUIPMENT
- Publication number 20240063237
- Publication date Feb 22, 2024
- Sony Semiconductor Solutions Corporation
- TAKURO MURASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS IMAGE SENSOR HAVING INDENTED PHOTODIODE STRUCTURE
- Publication number 20240063234
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGE PICKUP DEVICE, METHOD OF MANUFACTURING SOLID-STAT...
- Publication number 20240047490
- Publication date Feb 8, 2024
- SONY GROUP CORPORATION
- Ryosuke NAKAMURA
- G01 - MEASURING TESTING
Information Patent Application
IMAGE SENSOR COMPRISING ARRAY OF COLORED PIXELS
- Publication number 20240048857
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Heeryung PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240047487
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- FENG-CHIEN HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE, DRIVE METHOD THEREOF AND ELECTRONIC APP...
- Publication number 20240047504
- Publication date Feb 8, 2024
- SONY GROUP CORPORATION
- Taiichiro Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE, DRIVING METHOD THEREFOR, AND ELECTRONIC...
- Publication number 20240047502
- Publication date Feb 8, 2024
- SONY GROUP CORPORATION
- Akira TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE
- Publication number 20240038807
- Publication date Feb 1, 2024
- Sony Semiconductor Solutions Corporation
- Takuya Kurihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND METHOD OF FABRICATING THE SAME
- Publication number 20240030263
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Kook Tae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION APPARATUS AND SYSTEM
- Publication number 20240014228
- Publication date Jan 11, 2024
- Canon Kabushiki Kaisha
- TAKAFUMI MIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240006424
- Publication date Jan 4, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Takeshi AOKI
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
IMAGING DEVICE AND IMAGING SYSTEM
- Publication number 20240006427
- Publication date Jan 4, 2024
- Canon Kabushiki Kaisha
- Hiroki Hiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIRESOLUTION IMAGER FOR NIGHT VISION
- Publication number 20240006430
- Publication date Jan 4, 2024
- SRI International
- Rui Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION APPARATUS, EQUIPMENT, LAYERED STRUCTURE
- Publication number 20240006451
- Publication date Jan 4, 2024
- Canon Kabushiki Kaisha
- SHINYA ICHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
- Publication number 20240007768
- Publication date Jan 4, 2024
- Sony Semiconductor Solutions Corporation
- NORIHIRO KUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE PICKUP ELEMENT, METHOD OF MANUFACTURING IMAGE PICKUP ELEMENT,...
- Publication number 20230411424
- Publication date Dec 21, 2023
- SONY GROUP CORPORATION
- Shuji Manda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND METHOD OF FABRICATING THE SAME
- Publication number 20230411415
- Publication date Dec 21, 2023
- Samsung Electronics Co., Ltd.
- Changkeun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING APPARATUS AND ELECTRONIC DEVICE
- Publication number 20230402475
- Publication date Dec 14, 2023
- Sony Semiconductor Solutions Corporation
- Keiichiro TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE AND EQUIPMENT
- Publication number 20230395629
- Publication date Dec 7, 2023
- Canon Kabushiki Kaisha
- KAZUNORI MATSUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGE PICKUP DEVICE AND ELECTRONIC APPARATUS
- Publication number 20230387154
- Publication date Nov 30, 2023
- SONY GROUP CORPORATION
- Atsushi MASAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIN DIODE DETECTOR, METHOD OF MAKING THE SAME, AND SYSTEM INCLUDING...
- Publication number 20230378389
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lianjie LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGE SENSOR AND IMAGE-CAPTURING DEVICE
- Publication number 20230379597
- Publication date Nov 23, 2023
- Nikon Corporation
- Atsushi KOMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSORS
- Publication number 20230369357
- Publication date Nov 16, 2023
- Samsung Electronics Co., Ltd.
- Jung Bin YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE DEEP TRENCH ISOLATION (BDTI) STRUCTURE FOR CMOS IMAGE SENSOR
- Publication number 20230361149
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS

Electronic components shared by two or more pixel-elements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

System and method for sub-column parallel digitizers for hybrid sta...

Solid-state imaging element and electronic device

Image sensors including an amorphous region and an electron suppres...

Solid-state imaging element, method for manufacturing the same, and...

Imaging apparatus

Solid-state imaging device having projection regions from light shi...

Image sensors

Image sensors

Solid-state image-capturing element having floation diffusion and h...

Solid-state imaging device, driving method therefor, and electronic...

Image sensors including phase detection pixel

Imaging element, stacked-type imaging element and solid-state imagi...

Global shutter pixel circuit and method for computer vision applica...

Imaging apparatus having phase difference detection pixels receivin...

Image pickup element, method of manufacturing image pickup element,...

Imaging device and electronic device

Image sensor

CMOS image sensor having indented photodiode structure

Image sensor comprising array of colored pixels

Solid-state imaging device and manufacturing method therefor

Image sensors

Photo receiver

Method, apparatus, and system providing an imager with pixels havin...

Image sensor and pixel array of image sensor

Solid-state imaging apparatus, imaging system, and distance measure...

Image sensors

Solid-state imaging device, drive method thereof and electronic app...

Pixel-array substrate

Image sensor comprising entangled pixel

Imaging device and imaging system

Patents Applicationslast 30 patents

IMAGING DEVICE, METHOD FOR DRIVING THE SAME, AND ELECTRONIC DEVICE

IMAGE SENSOR AND ELECTRONIC DEVICE

IMAGING ELEMENT, STACKED-TYPE IMAGING ELEMENT AND SOLID-STATE IMAGI...

METHOD, APPARATUS, AND SYSTEM PROVIDING AN IMAGER WITH PIXELS HAVIN...

IMAGING DEVICE AND ELECTRONIC DEVICE

SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD THEREFOR

SOLID-STATE IMAGING DEVICE AND ELECTRONIC EQUIPMENT

CMOS IMAGE SENSOR HAVING INDENTED PHOTODIODE STRUCTURE

SOLID-STATE IMAGE PICKUP DEVICE, METHOD OF MANUFACTURING SOLID-STAT...

IMAGE SENSOR COMPRISING ARRAY OF COLORED PIXELS

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SOLID-STATE IMAGING DEVICE, DRIVE METHOD THEREOF AND ELECTRONIC APP...

SOLID-STATE IMAGING DEVICE, DRIVING METHOD THEREFOR, AND ELECTRONIC...

SOLID-STATE IMAGING DEVICE

IMAGE SENSOR AND METHOD OF FABRICATING THE SAME

PHOTOELECTRIC CONVERSION APPARATUS AND SYSTEM

ELECTRONIC DEVICE

IMAGING DEVICE AND IMAGING SYSTEM

MULTIRESOLUTION IMAGER FOR NIGHT VISION

PHOTOELECTRIC CONVERSION APPARATUS, EQUIPMENT, LAYERED STRUCTURE

SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS

IMAGE PICKUP ELEMENT, METHOD OF MANUFACTURING IMAGE PICKUP ELEMENT,...

IMAGE SENSOR AND METHOD OF FABRICATING THE SAME

IMAGING APPARATUS AND ELECTRONIC DEVICE

IMAGING DEVICE AND EQUIPMENT

SOLID-STATE IMAGE PICKUP DEVICE AND ELECTRONIC APPARATUS

PIN DIODE DETECTOR, METHOD OF MAKING THE SAME, AND SYSTEM INCLUDING...

SOLID-STATE IMAGE SENSOR AND IMAGE-CAPTURING DEVICE

IMAGE SENSORS

BACKSIDE DEEP TRENCH ISOLATION (BDTI) STRUCTURE FOR CMOS IMAGE SENSOR