Electroplating using modulated, pulsed or reversing current

Industry

CPC
C25D5/18

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CCHEMISTRY METALLURGY C25Electrolytic processing C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS ELECTROFORMING APPARATUS THEREFOR C25D5/00Electroplating characterised by the process Pretreatment or after-treatment of work-pieces

Current Industry

C25D5/18Electroplating using modulated, pulsed or reversing current

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Composite materials
- Patent number 12,241,167
- Issue date Mar 4, 2025
- The University of Manchester
- Wenji Yang
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Method of preparing a high density interconnect printed circuit boa...
- Patent number 12,245,383
- Issue date Mar 4, 2025
- Atotech Deutschland GmbH & Co. KG
- Bert Reents
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and device for induced localized electrodeposition on back s...
- Patent number 12,241,174
- Issue date Mar 4, 2025
- Jiangsu University
- Kun Xu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Non-enzyme sensor, non-enzyme sensor element and fabricating method...
- Patent number 12,234,569
- Issue date Feb 25, 2025
- National Tsing Hua University
- Hsiang-Yu Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Compositionally modulated zinc-iron multilayered coatings
- Patent number 12,203,190
- Issue date Jan 21, 2025
- The Boeing Company
- Stephen P. Gaydos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Gold electroplating solution and method
- Patent number 12,173,423
- Issue date Dec 24, 2024
- Hutchinson Technology Incorporated
- Kurt C. Swanson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating and deplating currents for material co-planarity in semicon...
- Patent number 12,146,235
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Paul R. McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Localized electrochemical deposition
- Patent number 12,139,810
- Issue date Nov 12, 2024
- Arizona Board of Regents on behalf of Arizona State University
- Antony Aguilar
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composition for cobalt plating comprising additive for void-free su...
- Patent number 12,098,473
- Issue date Sep 24, 2024
- BASF SE
- Sathana Kitayaporn
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrodeposited compositions and nanolaminated alloys for articles...
- Patent number 12,084,773
- Issue date Sep 10, 2024
- Modumetal, Inc.
- John D. Whitaker
- B82 - NANO-TECHNOLOGY
Information Patent Grant
System for reliable, high throughput, complex electric field genera...
- Patent number 12,077,876
- Issue date Sep 3, 2024
- Modumetal, Inc.
- Leslie Ann Collinson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Topology optimized high interface packing structures
- Patent number 12,076,965
- Issue date Sep 3, 2024
- Modumetal, Inc.
- Christina A. Lomasney
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Acidic aqueous composition for electrolytic copper plating
- Patent number 12,071,702
- Issue date Aug 27, 2024
- Atotech Deutschland GmbH
- Kun Si
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Gradient metallic structure and surface treatment to produce a grad...
- Patent number 12,060,648
- Issue date Aug 13, 2024
- City University of Hong Kong
- Jian Lu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing sequences for high density interconnect printed circu...
- Patent number 12,063,751
- Issue date Aug 13, 2024
- Atotech Deutschland GmbH & Co. KG
- Akif Özkök
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating apparatus and electroplating method
- Patent number 12,054,846
- Issue date Aug 6, 2024
- Samsung Electronics Co., Ltd.
- Taiseung Cha
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Nano-twinned Cu—Ni alloy layer and method for manufacturing the same
- Patent number 12,037,670
- Issue date Jul 16, 2024
- NATIONAL YANG MING CHIAO TUNG UNIVERSITY
- Chih Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Pulse plating of lithium material in electrochemical devices
- Patent number 12,027,690
- Issue date Jul 2, 2024
- QuantumScape Battery, Inc.
- Timothy Holme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure including copper plating layer or copper alloy plating layer
- Patent number 11,993,862
- Issue date May 28, 2024
- Ishihara Chemical Co., LTD
- Masaru Hatabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for making ultralow platinum loading and high durability mem...
- Patent number 11,982,009
- Issue date May 14, 2024
- Florida State University Research Foundation, Inc.
- Jian-ping Zheng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Hybrid electro-processing of a metal workpiece
- Patent number 11,965,265
- Issue date Apr 23, 2024
- The United States of America as represented by the Secretary of the Navy
- David Sapiro
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Steel sheet for can making and method for manufacturing the same
- Patent number 11,939,692
- Issue date Mar 26, 2024
- JFE Steel Corporation
- Yusuke Nakagawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating apparatus and electroplating method
- Patent number 11,926,920
- Issue date Mar 12, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Zhaowei Jia
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods for alkaliating roll anodes
- Patent number 11,916,217
- Issue date Feb 27, 2024
- Nanoscale Components, Inc.
- Robert W. Grant
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Film formation method for metallic coating and film formation devic...
- Patent number 11,913,129
- Issue date Feb 27, 2024
- Toyota Jidosha Kabushiki Kaisha
- Haruki Kondoh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrodeposition of high damping magnetic alloys
- Patent number 11,913,130
- Issue date Feb 27, 2024
- Seagate Technology LLC
- Jie Gong
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for manufacturing a package
- Patent number 11,913,132
- Issue date Feb 27, 2024
- Advanced Semiconductor Engineering, Inc.
- Chia Chun Hsu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating transition metal oxides
- Patent number 11,859,304
- Issue date Jan 2, 2024
- Xerion Advanced Battery Corp.
- Mehmet Nurullah Ates
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for continuously applying nanolaminate metal c...
- Patent number 11,851,781
- Issue date Dec 26, 2023
- Modumetal, Inc.
- Christina A. Lomasney
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Compositionally modulated zinc-manganese multilayered coatings
- Patent number 11,826,981
- Issue date Nov 28, 2023
- The Boeing Company
- Stephen P. Gaydos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRIC WIRES AND CABLES FOR SPACE APPLICATIONS
- Publication number 20250075361
- Publication date Mar 6, 2025
- AXON'CABLE
- Ning YU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING AND DEPLATING CURRENTS FOR MATERIAL CO-PLANARITY IN SEMICON...
- Publication number 20250051951
- Publication date Feb 13, 2025
- Applied Materials, Inc.
- Paul R. McHugh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DEVICE AND METHOD FOR COATING A COMPONENT OR SEMI-FINISHED PRODUCT...
- Publication number 20250019853
- Publication date Jan 16, 2025
- VDEH-Betriebsforschungsinstitut GmbH
- Andreas Bán
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS FOR ALKALIATING ROLL ANODES
- Publication number 20240405190
- Publication date Dec 5, 2024
- Nanoscale Components, Inc.
- Robert W. Grant
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FUNCTIONALLY GRADED ALLOY COATING AND METHOD FOR PREPARATION
- Publication number 20240384430
- Publication date Nov 21, 2024
- Faraday Technology, Inc.
- Timothy D. Hall
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PULSE PLATING OF LITHIUM MATERIAL IN ELECTROCHEMICAL DEVICES
- Publication number 20240387794
- Publication date Nov 21, 2024
- QUANTUMSCAPE BATTERY, INC.
- Timothy HOLME
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PISTON RING HAVING A WEAR PROTECTION LAYER CONTAINING PARTICLES, ME...
- Publication number 20240384791
- Publication date Nov 21, 2024
- FEDERAL-MOGUL BURSCHEID GMBH
- Stefan Dürdoth
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLYSER SYSTEM AND METHOD OF ELECTRODE MANUFACTURE
- Publication number 20240376615
- Publication date Nov 14, 2024
- SUNGREENH2 PTE. LTD.
- Saeid Masudy Panah
- B22 - CASTING POWDER METALLURGY
Information Patent Application
ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
- Publication number 20240368795
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Taiseung Cha
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...
- Publication number 20240341042
- Publication date Oct 10, 2024
- Atotech Deutschland GmbH & Co. KG
- Bert REENTS
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DURABLE POROUS STRUCTURES AND ELECTRONICS DEVICES INCORPORATING THE...
- Publication number 20240328024
- Publication date Oct 3, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Sujan Dewanjee
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
POROUS METAL STRUCTURE FOR PRODUCING ETHANOL FROM CARBON DIOXIDE AN...
- Publication number 20240287690
- Publication date Aug 29, 2024
- Korea Advanced Institute of Science and Technology
- Hye Ryung BYON
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPLEX WAVEFORM FOR ELECTROLYTIC PLATING
- Publication number 20240271307
- Publication date Aug 15, 2024
- MacDermid Enthone Inc.
- Donald Desalvo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PROCESS FOR HYSTERETIC CURRENT-VOLTAGE MEDIATED VOID-FREE SUPERCONF...
- Publication number 20240229282
- Publication date Jul 11, 2024
- Government of the United States of America, as Represented by the Secretary o...
- Trevor Michael Braun
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND DEVICE FOR INDUCED LOCALIZED ELECTRODEPOSITION ON BACK S...
- Publication number 20240229283
- Publication date Jul 11, 2024
- Jiangsu University
- Kun XU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Single Step Electrolytic Method of Filling Through-Holes in Printed...
- Publication number 20240224432
- Publication date Jul 4, 2024
- MacDermid Enthone Inc.
- Donald Desalvo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Preparation Method of Electroplated Part and Electroplated Part
- Publication number 20240191384
- Publication date Jun 13, 2024
- Tyco Electronics (Shanghai) Co., Ltd.
- Daiqiong (Diana) Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
A PROCESS FOR ELECTROCHEMICAL DEPOSITION OF COPPER WITH DIFFERENT C...
- Publication number 20240183052
- Publication date Jun 6, 2024
- Atotech Deutschland GmbH & Co. KG
- Peter HAACK
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
- Publication number 20240183051
- Publication date Jun 6, 2024
- ACM Research (Shanghai) Inc.
- Zhaowei JIA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METAL SHEET MATERIAL, LAYERED BODY, INSULATED CIRCUIT BOARD, AND ME...
- Publication number 20240178115
- Publication date May 30, 2024
- MITSUBISHI MATERIALS CORPORATION
- Marina Sakamaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LEVELING AGENT AND ELECTROLYTIC COMPOSITION FOR FILLING VIA HOLE
- Publication number 20240133039
- Publication date Apr 25, 2024
- YMT CO., LTD.
- Sung Wook CHUN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LEVELING AGENT AND ELECTROLYTIC COMPOSITION FOR FILLING VIA HOLE
- Publication number 20240132441
- Publication date Apr 25, 2024
- YMT CO., LTD.
- Sung Wook CHUN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLATING SYSTEM AND METHOD THEREOF
- Publication number 20240102194
- Publication date Mar 28, 2024
- YUAN ZE UNIVERSITY
- Cheng-EN HO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20240018681
- Publication date Jan 18, 2024
- ACM RESEARCH (SHANGHAI), INC.
- Yinuo Jin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ALUMINUM AND ALUMINUM ALLOY ELECTROPLATED COATINGS
- Publication number 20230392275
- Publication date Dec 7, 2023
- The Boeing Company
- Vijaykumar S. IJERI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR MANUFACTURING A PACKAGE
- Publication number 20230374689
- Publication date Nov 23, 2023
- Advanced Semiconductor Engineering, Inc.
- Chia Chun HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IRON-TUNGSTEN COATING FORMULATIONS AND PROCESSES
- Publication number 20230357944
- Publication date Nov 9, 2023
- The Boeing Company
- Vijaykumar S. IJERI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING-DEPLATING WAVEFORM BASED CONTACT CLEANING FOR A SUBSTRATE E...
- Publication number 20230313408
- Publication date Oct 5, 2023
- LAM RESEARCH CORPORATION
- Liu YANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING TRANSITION METAL OXIDES
- Publication number 20230313404
- Publication date Oct 5, 2023
- XERION ADVANCED BATTERY CORP.
- Mehmet Nurullah Ates
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER ELECTRODEPOSITION SEQUENCE FOR THE FILLING OF COBALT LINED F...
- Publication number 20230298894
- Publication date Sep 21, 2023
- LAM RESEARCH CORPORATION
- Jeyavel Velmurugan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Electroplating using modulated, pulsed or reversing current

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Composite materials

Method of preparing a high density interconnect printed circuit boa...

Method and device for induced localized electrodeposition on back s...

Non-enzyme sensor, non-enzyme sensor element and fabricating method...

Compositionally modulated zinc-iron multilayered coatings

Gold electroplating solution and method

Plating and deplating currents for material co-planarity in semicon...

Localized electrochemical deposition

Composition for cobalt plating comprising additive for void-free su...

Electrodeposited compositions and nanolaminated alloys for articles...

System for reliable, high throughput, complex electric field genera...

Topology optimized high interface packing structures

Acidic aqueous composition for electrolytic copper plating

Gradient metallic structure and surface treatment to produce a grad...

Manufacturing sequences for high density interconnect printed circu...

Electroplating apparatus and electroplating method

Nano-twinned Cu—Ni alloy layer and method for manufacturing the same

Pulse plating of lithium material in electrochemical devices

Structure including copper plating layer or copper alloy plating layer

Method for making ultralow platinum loading and high durability mem...

Hybrid electro-processing of a metal workpiece

Steel sheet for can making and method for manufacturing the same

Electroplating apparatus and electroplating method

Methods for alkaliating roll anodes

Film formation method for metallic coating and film formation devic...

Electrodeposition of high damping magnetic alloys

Method for manufacturing a package

Electroplating transition metal oxides

Method and apparatus for continuously applying nanolaminate metal c...

Compositionally modulated zinc-manganese multilayered coatings

Patents Applicationslast 30 patents

ELECTRIC WIRES AND CABLES FOR SPACE APPLICATIONS

PLATING AND DEPLATING CURRENTS FOR MATERIAL CO-PLANARITY IN SEMICON...

DEVICE AND METHOD FOR COATING A COMPONENT OR SEMI-FINISHED PRODUCT...

METHODS FOR ALKALIATING ROLL ANODES

FUNCTIONALLY GRADED ALLOY COATING AND METHOD FOR PREPARATION

PULSE PLATING OF LITHIUM MATERIAL IN ELECTROCHEMICAL DEVICES

PISTON RING HAVING A WEAR PROTECTION LAYER CONTAINING PARTICLES, ME...

ELECTROLYSER SYSTEM AND METHOD OF ELECTRODE MANUFACTURE

ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD

METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOA...

DURABLE POROUS STRUCTURES AND ELECTRONICS DEVICES INCORPORATING THE...

POROUS METAL STRUCTURE FOR PRODUCING ETHANOL FROM CARBON DIOXIDE AN...

COMPLEX WAVEFORM FOR ELECTROLYTIC PLATING

PROCESS FOR HYSTERETIC CURRENT-VOLTAGE MEDIATED VOID-FREE SUPERCONF...

METHOD AND DEVICE FOR INDUCED LOCALIZED ELECTRODEPOSITION ON BACK S...

Single Step Electrolytic Method of Filling Through-Holes in Printed...

Preparation Method of Electroplated Part and Electroplated Part

A PROCESS FOR ELECTROCHEMICAL DEPOSITION OF COPPER WITH DIFFERENT C...

ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD

METAL SHEET MATERIAL, LAYERED BODY, INSULATED CIRCUIT BOARD, AND ME...

LEVELING AGENT AND ELECTROLYTIC COMPOSITION FOR FILLING VIA HOLE

LEVELING AGENT AND ELECTROLYTIC COMPOSITION FOR FILLING VIA HOLE

PLATING SYSTEM AND METHOD THEREOF

PLATING APPARATUS AND PLATING METHOD

ALUMINUM AND ALUMINUM ALLOY ELECTROPLATED COATINGS

METHOD FOR MANUFACTURING A PACKAGE

IRON-TUNGSTEN COATING FORMULATIONS AND PROCESSES

PLATING-DEPLATING WAVEFORM BASED CONTACT CLEANING FOR A SUBSTRATE E...

ELECTROPLATING TRANSITION METAL OXIDES

COPPER ELECTRODEPOSITION SEQUENCE FOR THE FILLING OF COBALT LINED F...