TREA

Encapsulating or impregnating

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  • CPC
  • H01F27/327
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Parent Industries

HELECTRICITY H01Electric elements H01FMAGNETS INDUCTANCES TRANSFORMERS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES H01F27/00Details of transformers or inductances, in general

Current Industry

H01F27/327Encapsulating or impregnating
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    METHOD FOR PRODUCING SPACERS FOR A WINDING UNIT AND VOLTAGE-RESISTA...
    • Publication number 20250054690
    • Publication date Feb 13, 2025
    • Siemens Energy Global GmbH & Co. KG
    • Andre Luiz MORENO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MOLD TRANSFORMER
    • Publication number 20250037928
    • Publication date Jan 30, 2025
    • LS ELECTRIC CO., LTD.
    • Yoon Sun LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE EMBEDDED MAGNETIC INDUCTOR STRUCTURES AND MANUFACTURING TEC...
    • Publication number 20250022814
    • Publication date Jan 16, 2025
    • Intel Corporation
    • William J. LAMBERT
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LAMINATED COIL COMPONENT
    • Publication number 20240347266
    • Publication date Oct 17, 2024
    • Murata Manufacturing Co., Ltd.
    • Reiji OZAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    APPARATUS AND METHOD FOR PHYSICAL VAPOR DEPOSITION
    • Publication number 20240339310
    • Publication date Oct 10, 2024
    • Taiwan Semiconductor Manufacturing Company Limited
    • Yu-Young WANG
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    COIL COMPONENT AND METHOD FOR MANUFACTURING COIL COMPONENT
    • Publication number 20240327307
    • Publication date Oct 3, 2024
    • Murata Manufacturing Co., Ltd.
    • Reiji OZAWA
    • C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
  • Information Patent Application

    THREE-DIMENSIONAL (3D) INDUCTOR WITH TWO-SIDE BONDING WIRES
    • Publication number 20240321507
    • Publication date Sep 26, 2024
    • QUALCOMM Incorporated
    • Kai LIU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MAGNETIC COMPONENT
    • Publication number 20240321498
    • Publication date Sep 26, 2024
    • CYNTEC CO., LTD.
    • Yung-Shou Hsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INDUCTOR COMPONENT
    • Publication number 20240304374
    • Publication date Sep 12, 2024
    • Murata Manufacturing Co., Ltd.
    • Yoshimasa YOSHIOKA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INDUCTOR COMPONENT
    • Publication number 20240304375
    • Publication date Sep 12, 2024
    • Murata Manufacturing Co., Ltd.
    • Yoshimasa YOSHIOKA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INDUCTOR COMPONENT
    • Publication number 20240304373
    • Publication date Sep 12, 2024
    • Murata Manufacturing Co., Ltd.
    • Yoshimasa YOSHIOKA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD TO FORM MULTILE ELECTRICAL COMPONENTS AND A SINGLE ELECTRICA...
    • Publication number 20240242880
    • Publication date Jul 18, 2024
    • CYNTEC CO., LTD.
    • Chin Hung Wei
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PLANAR MAGNETIC ELEMENT AND MANUFACTURING METHOD THEREOF
    • Publication number 20240234004
    • Publication date Jul 11, 2024
    • DELTA ELECTRONICS (SHANGHAI) CO.,LTD.
    • Teng LIU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    TRANSFORMER CHIP
    • Publication number 20240222353
    • Publication date Jul 4, 2024
    • Rohm Co., Ltd.
    • Toru HIGUCHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INDUCTOR
    • Publication number 20240212925
    • Publication date Jun 27, 2024
    • TAI-TECH ADVANCED ELECTRONICS CO., LTD.
    • Hsiang-Chung Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL DEVICE
    • Publication number 20240203640
    • Publication date Jun 20, 2024
    • TDK Corporation
    • Chen WANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    TRANSFORMER INSTALLATION
    • Publication number 20240186051
    • Publication date Jun 6, 2024
    • Hitachi Energy Ltd
    • Antonio NOGUES
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20240177920
    • Publication date May 30, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Ye Ji JUNG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20240145162
    • Publication date May 2, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Sang Jin KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PLANAR MAGNETIC ELEMENT AND MANUFACTURING METHOD THEREOF
    • Publication number 20240136103
    • Publication date Apr 25, 2024
    • DELTA ELECTRONICS (SHANGHAI) CO.,LTD.
    • Teng LIU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    TRANSFORMER AND POWER CONVERSION DEVICE
    • Publication number 20240128010
    • Publication date Apr 18, 2024
    • Mitsubishi Electric Corporation
    • Shingo TAKABUCHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HIGH-FREQUENCY COIL COMPONENT
    • Publication number 20240128018
    • Publication date Apr 18, 2024
    • TDK Corporation
    • Shigeki YANAGIDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20240087793
    • Publication date Mar 14, 2024
    • MURATA MANUFACTURING CO., LTD.
    • Hirofumi OIE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ISOLATOR
    • Publication number 20240087802
    • Publication date Mar 14, 2024
    • Kabushiki Kaisha Toshiba
    • Jia LIU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER SUBSTRATE, INTEGRATED MAGNETIC DEVICE, POWER SOURCE APPA...
    • Publication number 20240038442
    • Publication date Feb 1, 2024
    • NEC PLATFORMS, LTD.
    • Hiromitsu TAHARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CORE
    • Publication number 20240013964
    • Publication date Jan 11, 2024
    • Panasonic Intellectual Property Management Co., Ltd.
    • Shana YANAGIMOTO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INDUCTOR AND INDUCTOR MANUFACTURING METHOD
    • Publication number 20240006113
    • Publication date Jan 4, 2024
    • DARFON ELECTRONICS CORP.
    • Zuei-Chown Jou
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED CIRCUIT WITH INDUCTOR IN MAGNETIC PACKAGE
    • Publication number 20240006392
    • Publication date Jan 4, 2024
    • TEXAS INSTRUMENTS INCORPORATED
    • Anton Winkler
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED CIRCUIT WITH INDUCTOR IN MAGNETIC PACKAGE
    • Publication number 20240006259
    • Publication date Jan 4, 2024
    • TEXAS INSTRUMENTS INCORPORATED
    • Hidetoshi Inoue
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20240006118
    • Publication date Jan 4, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Ji Hyung Jung
    • H01 - BASIC ELECTRIC ELEMENTS