Encapsulation of active face of flip-chip device

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CPC
H01L21/563

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/563Encapsulation of active face of flip-chip device

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,334,420
- Issue date Jun 17, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Hyeong Il Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated package including device dies connected via interconne...
- Patent number 12,334,464
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming thereof
- Patent number 12,327,825
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,327,812
- Issue date Jun 10, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with underfill containment barrier
- Patent number 12,327,773
- Issue date Jun 10, 2025
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using a coreless signal distribution structure
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- Issue date Jun 3, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna in package having antenna on package substrate
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- Issue date Jun 3, 2025
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for package with interposers
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- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
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- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Tai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill vacuum process
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- Issue date May 27, 2025
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with improved interposer structure
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- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded product for semiconductor strip and method of manufacturing...
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- Issue date May 20, 2025
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- Seunghwan Kim
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Information Patent Grant
Aligning bumps in fan-out packaging process
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- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
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Information Patent Grant
Semiconductor device having a heat dissipation structure connected...
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- Issue date May 13, 2025
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- Po-Yuan Teng
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Information Patent Grant
Semiconductor package
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- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Jang-woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package including stress buffering layer
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- Issue date May 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Chien-Mei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including heat sink with exposed side from enc...
- Patent number 12,300,584
- Issue date May 13, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Hyung Jun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor EMI shielding component, semiconductor package struct...
- Patent number 12,293,976
- Issue date May 6, 2025
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- E-Tung Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging stacking flip chip
- Patent number 12,293,984
- Issue date May 6, 2025
- Hebei Beixin Semiconductor Technology Co., Ltd.
- Honglei Ran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 12,283,545
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die with warpage release layer structure in package a...
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- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive bump of a semiconductor device and fabricating method th...
- Patent number 12,278,199
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforcing resin composition, electronic component, method for man...
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- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shigeru Yamatsu
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Information Patent Grant
Underfill film for semiconductor package and method for manufacturi...
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- Issue date Apr 15, 2025
- Doosan Corporation
- Taejin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
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- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and substrate structure thereof
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- Issue date Apr 15, 2025
- Siliconware Precision Industries Co., Ltd.
- Wen-Chen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with improved die pad and solder mask...
- Patent number 12,278,205
- Issue date Apr 15, 2025
- Texas Instruments Incorporated
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,272,568
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with conductive pillars and reinforcin...
- Patent number 12,272,687
- Issue date Apr 8, 2025
- Advanced Semiconductor Engineering, Inc.
- Ya Fang Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device including forming a first...
- Patent number 12,266,612
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE WITH RIVETING STRUCTURE BETWEEN TWO RINGS AND...
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Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER AND METHOD FOR MANUFACTU...
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SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR...
- Publication number 20250192008
- Publication date Jun 12, 2025
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- Hyung Jun Cho
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER AND METHOD FOR MANUFACTU...
- Publication number 20250192019
- Publication date Jun 12, 2025
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SEMICONDUCTOR PACKAGE WITH THERMAL RELAXATION BLOCK AND MANUFACTURI...
- Publication number 20250183245
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
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ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250183239
- Publication date Jun 5, 2025
- Siliconware Precision Industries Co., Ltd.
- Yi-Min Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Comprising Interconnect Structures
- Publication number 20250183056
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20250183140
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzu-Sheng Tseng
- H01 - BASIC ELECTRIC ELEMENTS
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THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF FORM...
- Publication number 20250167060
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME
- Publication number 20250167138
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20250167061
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jinwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH UNDERFILL SQUEEZE-UP, AND METHODS FOR...
- Publication number 20250157828
- Publication date May 15, 2025
- Micron Technology, Inc.
- Youngrae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250157949
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
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- Publication date May 15, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DU...
- Publication number 20250157956
- Publication date May 15, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND TESTING METHOD
- Publication number 20250155498
- Publication date May 15, 2025
- Advanced Semiconductor Engineering, Inc.
- Chen-Chao WANG
- G01 - MEASURING TESTING
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VERTICAL SEMICONDUCTOR RFID STRUCTURE, RFID TAG DEVICE, AND MANUFAC...
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- AP MEMORY TECHNOLOGY CORPORATION
- WEN-LIANG CHEN
- G06 - COMPUTING CALCULATING COUNTING
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LOGIC DRIVE BASED ON STANDARDIZED COMMODITY PROGRAMMABLE LOGIC SEMI...
- Publication number 20250149529
- Publication date May 8, 2025
- iCometrue Company Ltd.
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250149401
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor Device and Methods of Making and Using Pre-Molded Bri...
- Publication number 20250149454
- Publication date May 8, 2025
- STATS ChipPAC Pte Ltd.
- Linda Pei Ee Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250132216
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND A METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250132220
- Publication date Apr 24, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Hyeon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132214
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE HAVING DISMANTLABLE STRUCTURE AND METHOD THEREFOR
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- NXP B.V.
- Yu Ling Tsai
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CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250125206
- Publication date Apr 17, 2025
- Powertech Technology Inc.
- SHANG YU CHANG CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250125208
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE BASED ON STANDARDIZED COMMODITY PROGRAMMABLE LOGIC SEMI...
- Publication number 20250118721
- Publication date Apr 10, 2025
- iCometrue Company Ltd.
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THEREOF
- Publication number 20250118575
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20250118642
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Encapsulation of active face of flip-chip device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor devices and methods of manufacturing semiconductor de...

Encapsulated package including device dies connected via interconne...

Package structure and method of forming thereof

Semiconductor device and manufacturing method thereof

Package with underfill containment barrier

Semiconductor package using a coreless signal distribution structure

Antenna in package having antenna on package substrate

Methods and apparatus for package with interposers

Semiconductor structure and manufacturing method thereof

Underfill vacuum process

Semiconductor package with improved interposer structure

Molded product for semiconductor strip and method of manufacturing...

Aligning bumps in fan-out packaging process

Semiconductor device having a heat dissipation structure connected...

Semiconductor package

Semiconductor device package including stress buffering layer

Semiconductor device including heat sink with exposed side from enc...

Semiconductor EMI shielding component, semiconductor package struct...

Method for packaging stacking flip chip

Package structure and method of manufacturing the same

Semiconductor die with warpage release layer structure in package a...

Conductive bump of a semiconductor device and fabricating method th...

Reinforcing resin composition, electronic component, method for man...

Underfill film for semiconductor package and method for manufacturi...

Semiconductor package

Electronic package and substrate structure thereof

Semiconductor device package with improved die pad and solder mask...

Semiconductor package and manufacturing method thereof

Semiconductor device package with conductive pillars and reinforcin...

Method for forming a semiconductor device including forming a first...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE WITH RIVETING STRUCTURE BETWEEN TWO RINGS AND...

SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER AND METHOD FOR MANUFACTU...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER AND METHOD FOR MANUFACTU...

POWER MODULE HAVING INTERCONNECTED BASE PLATE WITH MOLDED METAL AND...

SEMICONDUCTOR PACKAGE WITH THERMAL RELAXATION BLOCK AND MANUFACTURI...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor Device Comprising Interconnect Structures

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF FORM...

PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

SEMICONDUCTOR ASSEMBLIES WITH UNDERFILL SQUEEZE-UP, AND METHODS FOR...

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DU...

PACKAGE STRUCTURE AND TESTING METHOD

VERTICAL SEMICONDUCTOR RFID STRUCTURE, RFID TAG DEVICE, AND MANUFAC...

LOGIC DRIVE BASED ON STANDARDIZED COMMODITY PROGRAMMABLE LOGIC SEMI...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Methods of Making and Using Pre-Molded Bri...

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

ELECTRONIC DEVICES AND A METHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE HAVING DISMANTLABLE STRUCTURE AND METHOD THEREFOR

CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

LOGIC DRIVE BASED ON STANDARDIZED COMMODITY PROGRAMMABLE LOGIC SEMI...

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THEREOF

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME