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Encapsulation of active face of flip-chip device
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H01L21/563
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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/563
Encapsulation of active face of flip-chip device
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Patents Grants
last 30 patents
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Patent Grant
Package structure including stacked pillar portions and method for...
Patent number
12,368,123
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Jung-Hua Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package and manufacturing method thereof
Patent number
12,368,116
Issue date
Jul 22, 2025
Siliconware Precision Industries Co., Ltd.
Feng Kao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor apparatuses with radio-frequency line elements, and a...
Patent number
12,368,111
Issue date
Jul 22, 2025
Infineon Technologies AG
Walter Hartner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip package having underfill material surrounding a...
Patent number
12,368,127
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company Limited
Po-Chen Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor device including passivation...
Patent number
12,368,090
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company Ltd.
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die package with ring structure
Patent number
12,362,197
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Yu-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure with underfill
Patent number
12,362,196
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Kuan-Yu Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposer including stepped surfaces and methods of forming the same
Patent number
12,362,246
Issue date
Jul 15, 2025
Taiwan Semiconductor Manufacturing Company Limited
Yu-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure and method for forming the same
Patent number
12,355,001
Issue date
Jul 8, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Yen-Chu Tu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Under chip bridge
Patent number
12,354,964
Issue date
Jul 8, 2025
FRONTGRADE TECHNOLOGIES INC.
Sean Thorne
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of fabricating the same
Patent number
12,355,005
Issue date
Jul 8, 2025
Samsung Electronics Co., Ltd.
Jongho Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die corner removal for underfill crack suppression in semiconductor...
Patent number
12,347,802
Issue date
Jul 1, 2025
Taiwan Semiconductor Manufacturing Company Limited
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package having warpage control
Patent number
12,347,817
Issue date
Jul 1, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Heh-Chang Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with a porous air vent
Patent number
12,347,737
Issue date
Jul 1, 2025
Micron Technology, Inc.
Jong Sik Paek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Shielded semiconductor package with open terminal and methods of ma...
Patent number
12,341,108
Issue date
Jun 24, 2025
STATS ChipPAC Pte. Ltd.
ChangOh Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Through-substrate underfill formation for an integrated circuit ass...
Patent number
12,341,121
Issue date
Jun 24, 2025
Intel Corporation
Eng Huat Goh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of thinning a semiconductor die
Patent number
12,341,130
Issue date
Jun 24, 2025
Western Digital Technologies, Inc.
Meiqin Hao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
Patent number
12,334,420
Issue date
Jun 17, 2025
Amkor Technology Singapore Holding Pte Ltd.
Hyeong Il Jeon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Encapsulated package including device dies connected via interconne...
Patent number
12,334,464
Issue date
Jun 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Kuo-Chiang Ting
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of forming thereof
Patent number
12,327,825
Issue date
Jun 10, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Jen-Yuan Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
12,327,812
Issue date
Jun 10, 2025
Amkor Technology Singapore Holding Pte Ltd.
Yeong Beom Ko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package with underfill containment barrier
Patent number
12,327,773
Issue date
Jun 10, 2025
Intel Corporation
Rahul Jain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package using a coreless signal distribution structure
Patent number
12,322,731
Issue date
Jun 3, 2025
Amkor Technology Singapore Holding Pte Ltd.
Do Hyung Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Antenna in package having antenna on package substrate
Patent number
12,322,856
Issue date
Jun 3, 2025
Texas Instruments Incorporated
Yiqi Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatus for package with interposers
Patent number
12,322,670
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chun-Lin Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and manufacturing method thereof
Patent number
12,322,742
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company Ltd.
Hsiang-Tai Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Underfill vacuum process
Patent number
12,315,775
Issue date
May 27, 2025
International Business Machines Corporation
Toyohiro Aoki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with improved interposer structure
Patent number
12,308,313
Issue date
May 20, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Wen Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Molded product for semiconductor strip and method of manufacturing...
Patent number
12,308,253
Issue date
May 20, 2025
Samsung Electronics Co., Ltd.
Seunghwan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Aligning bumps in fan-out packaging process
Patent number
12,300,659
Issue date
May 13, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Ying-Jui Huang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE CONNECTED...
Publication number
20250239528
Publication date
Jul 24, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Po-Yuan Teng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
Publication number
20250233111
Publication date
Jul 17, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Shiuan Wong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE
Publication number
20250233301
Publication date
Jul 17, 2025
TEXAS INSTRUMENTS INCORPORATED
Yiqi Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANTENNA PACKAGE USING BALL ATTACH ARRAY TO CONNECT ANTENNA AND BASE...
Publication number
20250226583
Publication date
Jul 10, 2025
Intel Corporation
Jimin Yao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT WAFER LEVEL PACKAGING OF SEMICONDUCTOR DEVICES
Publication number
20250226264
Publication date
Jul 10, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
George CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250226317
Publication date
Jul 10, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Yung-Chi Chu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250218995
Publication date
Jul 3, 2025
UNITED MICROELECTRONICS CORP.
Chen-Hsiao Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250218996
Publication date
Jul 3, 2025
UNITED MICROELECTRONICS CORP.
Chen-Hsiao Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIQUID-BASED METHOD FOR EMBEDDING COMPONENTS IN THICK SUBSTRATES
Publication number
20250218881
Publication date
Jul 3, 2025
Intel Corporation
Mahdi MOHAMMADIGHALENI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Packages And Methods Of Forming The Same
Publication number
20250219024
Publication date
Jul 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250218997
Publication date
Jul 3, 2025
UNITED MICROELECTRONICS CORP.
Chen-Hsiao Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250218994
Publication date
Jul 3, 2025
UNITED MICROELECTRONICS CORP.
Chen-Hsiao Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE WITH WARPAGE RELEASE LAYER STRUCTURE IN PACKAGE
Publication number
20250210543
Publication date
Jun 26, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chin-Hua WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
Publication number
20250201686
Publication date
Jun 19, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Li-Ling Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF
Publication number
20250201695
Publication date
Jun 19, 2025
Siliconware Precision Industries Co., Ltd.
Wen-Chen Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
Publication number
20250201583
Publication date
Jun 19, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Jiun-Ting Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH RIVETING STRUCTURE BETWEEN TWO RINGS AND...
Publication number
20250192072
Publication date
Jun 12, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Chien Hung Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER AND METHOD FOR MANUFACTU...
Publication number
20250192018
Publication date
Jun 12, 2025
Samsung Electronics Co., Ltd.
Byung Ho KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR...
Publication number
20250192008
Publication date
Jun 12, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Hyung Jun Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER AND METHOD FOR MANUFACTU...
Publication number
20250192019
Publication date
Jun 12, 2025
Samsung Electronics Co., Ltd.
Byung Ho Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER MODULE HAVING INTERCONNECTED BASE PLATE WITH MOLDED METAL AND...
Publication number
20250183123
Publication date
Jun 5, 2025
Alpha and Omega Semiconductor International LP
Zhiqiang Niu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH THERMAL RELAXATION BLOCK AND MANUFACTURI...
Publication number
20250183245
Publication date
Jun 5, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Shih-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20250183239
Publication date
Jun 5, 2025
Siliconware Precision Industries Co., Ltd.
Yi-Min Fu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device Comprising Interconnect Structures
Publication number
20250183056
Publication date
Jun 5, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
Publication number
20250183140
Publication date
Jun 5, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Tzu-Sheng Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF FORM...
Publication number
20250167060
Publication date
May 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Min Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME
Publication number
20250167138
Publication date
May 22, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Shu-Shen Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
Publication number
20250167061
Publication date
May 22, 2025
Samsung Electronics Co., Ltd.
Jinwoo Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR ASSEMBLIES WITH UNDERFILL SQUEEZE-UP, AND METHODS FOR...
Publication number
20250157828
Publication date
May 15, 2025
Micron Technology, Inc.
Youngrae Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE
Publication number
20250157949
Publication date
May 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Po-Chen LAI
H01 - BASIC ELECTRIC ELEMENTS