Encapsulation of active face of flip-chip device

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H01L21/563

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/563Encapsulation of active face of flip-chip device

Industries

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Patents Grantslast 30 patents

Information Patent Grant
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- Issue date Mar 25, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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Semiconductor package and method of forming the same
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- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Chen
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Information Patent Grant
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- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
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- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
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Chip package structure
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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- Taiwan Semiconductor Manufacturing Company, Ltd
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Information Patent Grant
Dummy metal bonding pads for underfill application in semiconductor...
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- Taiwan Semiconductor Manufacturing Company Limited
- Ming-Chih Yew
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Information Patent Grant
Three-dimensional integrated circuit structures and methods of form...
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- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Min Lin
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Information Patent Grant
Package structure with metallic layer over the surfaces of a plural...
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- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and testing method
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- Issue date Feb 4, 2025
- Advanced Semiconductor Engineering, Inc.
- Chen-Chao Wang
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Information Patent Grant
Semiconductor packages
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
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- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate having integrated passive device(s) between leads
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- Texas Instruments Incorporated
- Rajen Manicon Murugan
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Semiconductor package with dummy pattern not electrically connected...
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- Jin-Woo Park
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Information Patent Grant
Integrated circuit package and method of forming thereof
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- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package including forming cav...
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- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process tool for analyzing bonded workpiece interface
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- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hau-Yi Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package structures including redistribution layers
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- Issue date Jan 14, 2025
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package, package-on-package structure, and manuf...
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- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip packaging
- Patent number 12,199,085
- Issue date Jan 14, 2025
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

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- Advanced Semiconductor Engineering, Inc.
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SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION
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- UTAC Headquarters Pte. Ltd.
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- Samsung Electronics Co., Ltd.
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- ASTI GLOBAL INC., TAIWAN
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- Daeyoung JUNG
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- Hiu Hay Nichole Lam
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SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
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- Amkor Technology Singapore Holding Pte. Ltd.
- Yi Seul Han
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Encapsulation of active face of flip-chip device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fan-out wafer level packaging of semiconductor devices

Semiconductor package and method of forming the same

Semiconductor package with thermal relaxation block and manufacturi...

Semiconductor package with riveting structure between two rings and...

Semiconductor packages and methods of forming the same

Chip package structure

Logic drive based on standardized commodity programmable logic semi...

Semiconductor device comprising interconnect structures

Semiconductor package including cavity-mounted device

Photonic package laser area macro-void pressure relief micro-channels

Package structure

Semiconductor package with top circuit and an IC with a gap over th...

Package structure and methods of manufacturing the same

Semiconductor package and method of manufacturing semiconductor pac...

Semiconductor package with improved interposer structure

Semiconductor die package and method of manufacture

Dummy metal bonding pads for underfill application in semiconductor...

Three-dimensional integrated circuit structures and methods of form...

Package structure with metallic layer over the surfaces of a plural...

Package structure and testing method

Semiconductor packages

Semiconductor package and method of forming the same

Package substrate having integrated passive device(s) between leads

Semiconductor package with dummy pattern not electrically connected...

Integrated circuit package and method of forming thereof

Manufacturing method of semiconductor package including forming cav...

Process tool for analyzing bonded workpiece interface

Multi-die package structures including redistribution layers

Integrated fan-out package, package-on-package structure, and manuf...

Multi-chip packaging

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

LOW COST PACKAGE WARPAGE SOLUTION

CURABLE COMPOSITION, CURED PRODUCT FORMED FROM THE SAME AND USE OF...

Semiconductor Device and Method of Forming FOWLP with Pre-Molded Em...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

Method of Fabricating Redistribution Circuit Structure

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

UNDERFILL STRUCTURE, AND SEMICONDUCTOR CHIP CARRYING MODULE AND MET...

MODULAR INTERCONNECTION UNIT, SEMICONDUCTOR PACKAGE AND METHOD FOR...

PACKAGE WITH RECESS FOR BALANCING CREEPAGE CURRENT PATHS

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF, AND SUBSTRATE...

SEMICONDUCTOR DEVICE WITH HYBRID ROUTING AND METHOD THEREFOR

WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTO...

LIQUID EPOXY RESIN COMPOSITION FOR USE AS MOLD UNDERFILL MATERIAL F...

Semiconductor Device and Method of Making Redistribution Layers wit...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

CARRYING SUBSTRATE, ELECTRONIC PACKAGE HAVING THE CARRYING SUBSTRAT...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

METHOD OF MANUFACTURING SEMICONDUCTOR ASSEMBLIES

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...