Etched tri-metal structure

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CPC
H05K2201/0361

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0361Etched tri-metal structure

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Base material for printed circuit board and printed circuit board
- Patent number 11,013,113
- Issue date May 18, 2021
- Sumitomo Electric Industries, Ltd.
- Motohiko Sugiura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module and method of manufacturing module
- Patent number 10,958,860
- Issue date Mar 23, 2021
- Canon Kabushiki Kaisha
- Satoshi Nozu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor structure and display device
- Patent number 10,756,121
- Issue date Aug 25, 2020
- Innolux Corporation
- Ming-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust multi-layer wiring elements and assemblies with embedded mic...
- Patent number 10,032,646
- Issue date Jul 24, 2018
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for displaying images and fabricating method thereof
- Patent number 8,796,691
- Issue date Aug 5, 2014
- Innolux Corporation
- Chieh-Wen Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of manufacturing wire, TFT, and flat panel display device
- Patent number 8,513,070
- Issue date Aug 20, 2013
- Samsung Display Co., Ltd.
- Dong-Wook Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnection element for electric circuits
- Patent number 8,299,368
- Issue date Oct 30, 2012
- Invensas Corporation
- Kimitaka Endo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making printed wiring board and method of making printed...
- Patent number 8,152,953
- Issue date Apr 10, 2012
- Fujitsu Limited
- Hideaki Yoshimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 8,138,423
- Issue date Mar 20, 2012
- Toyo Kohan Co., Ltd.
- Mitsuhiro Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabricating method for printed circuit board
- Patent number 8,065,797
- Issue date Nov 29, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Ryoichi Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate with a cavity, semiconductor package and fabricat...
- Patent number 8,049,114
- Issue date Nov 1, 2011
- Unimicron Technology Corp.
- Kuo-Ching Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection board, and multi-layer wiring board, substrate for semic...
- Patent number 8,028,402
- Issue date Oct 4, 2011
- Hitachi Chemical Co., Ltd.
- Hidehiro Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating a packaging substrate
- Patent number 7,964,106
- Issue date Jun 21, 2011
- Unimicron Technology Corp.
- Chang-Fu Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring element having pin interface
- Patent number 7,911,805
- Issue date Mar 22, 2011
- Tessera, Inc.
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layered metal structure for interconnect element
- Patent number 7,696,439
- Issue date Apr 13, 2010
- Tessera, Inc.
- David Light
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for a flexible microelectronic assembly and a method of f...
- Patent number 7,659,617
- Issue date Feb 9, 2010
- Tessera, Inc.
- Teck-Gyu Kang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectronic component with photo-imageable substrate
- Patent number 7,632,708
- Issue date Dec 15, 2009
- Tessera, Inc.
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method of manufacturing the same
- Patent number 7,480,151
- Issue date Jan 20, 2009
- Dai Nippon Printing Co., Ltd.
- Yoichi Miura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating a printed circuit board
- Patent number 7,451,540
- Issue date Nov 18, 2008
- Motorola, Inc.
- Jaroslaw A. Magera
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing circuit board
- Patent number 7,441,330
- Issue date Oct 28, 2008
- Fujitsu Limited
- Kenji Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a wiring board
- Patent number 7,325,301
- Issue date Feb 5, 2008
- Dai Nippon Printing Co., Ltd.
- Yoichi Miura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and method of manufacturing the same
- Patent number 7,284,320
- Issue date Oct 23, 2007
- Toyo Kohan Co., Ltd.
- Kinji Saijo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier, method of manufacturing a carrier and an electronic device
- Patent number 7,247,938
- Issue date Jul 24, 2007
- NXP B.V.
- Roelf Anco Jacob Groenhuis
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
Electrical circuit board and method for making the same
- Patent number 7,176,382
- Issue date Feb 13, 2007
- Visteon Global Technologies, Inc.
- Zhong-You Shi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 7,176,582
- Issue date Feb 13, 2007
- NXP B.V.
- Hendrik Klaas Kloen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered metal laminate and process for producing the same
- Patent number 7,175,919
- Issue date Feb 13, 2007
- Toyo Kohan Co., Ltd.
- Kinji Saijo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a printed circuit board
- Patent number 7,152,315
- Issue date Dec 26, 2006
- Visteon Global Technologies, Inc.
- Mohan R. Paruchuri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming multilayer circuit board
- Patent number 7,124,503
- Issue date Oct 24, 2006
- Visteon Global Technologies, Inc.
- Delin Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical circuit board and a method for making the same
- Patent number 6,998,540
- Issue date Feb 14, 2006
- Visteon Global Technologies, Inc.
- Robert Edward Belke, Jr.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vented circuit board for cooling power components
- Patent number 6,977,346
- Issue date Dec 20, 2005
- Visteon Global Technologies, Inc.
- Vivek A. Jairazbhoy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BASE MATERIAL FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD
- Publication number 20210022245
- Publication date Jan 21, 2021
- Sumitomo Electric Industries, Ltd.
- Motohiko SUGIURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE AND METHOD OF MANUFACTURING MODULE
- Publication number 20200029039
- Publication date Jan 23, 2020
- Canon Kabushiki Kaisha
- Satoshi Nozu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION ELEMENT FOR ELECTRIC CIRCUITS
- Publication number 20130119012
- Publication date May 16, 2013
- Tessera Interconnect Materials, Inc.
- Kimitaka Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of manufacturing wire, TFT, and flat panel display device
- Publication number 20120315717
- Publication date Dec 13, 2012
- Samsung Mobile Display Co., Ltd.
- Dong-Wook Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE WITH A CAVITY, SEMICONDUCTOR PACKAGE AND FABRICAT...
- Publication number 20100236817
- Publication date Sep 23, 2010
- Kuo-Ching Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE STRUCUTRE WITH CAVITY AND METHOD FOR MAKING THE SAME
- Publication number 20100206619
- Publication date Aug 19, 2010
- Kuo-Ching Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM FOR DISPLAYING IMAGES AND FABRICATING METHOD THEREOF
- Publication number 20100065852
- Publication date Mar 18, 2010
- TPO DISPLAYS CORP.
- Chieh-Wen LIN
- G02 - OPTICS
Information Patent Application
PROCESS OF PACKAGE SUBSTRATE
- Publication number 20090314650
- Publication date Dec 24, 2009
- Subtron Technology Co. Ltd.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FABRICATING A PACKAGING SUBSTRATE
- Publication number 20090294401
- Publication date Dec 3, 2009
- Chang-Fu Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING PRINTED WIRING BOARD AND METHOD OF MAKING PRINTED...
- Publication number 20090294056
- Publication date Dec 3, 2009
- Fujitsu Limited
- Hideaki YOSHIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnection element for electric circuits
- Publication number 20090188706
- Publication date Jul 30, 2009
- Tessera Interconnect Materials, Inc.
- Kimitaka Endo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board and method for manufacturing printed wiring board
- Publication number 20090145630
- Publication date Jun 11, 2009
- MULTI INC.
- Mitsuhiro Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Robust multi-layer wiring elements and assemblies with embedded mic...
- Publication number 20090115047
- Publication date May 7, 2009
- Tessera, Inc.
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connection board, and multi-layer wiring board, substrate for semic...
- Publication number 20090008141
- Publication date Jan 8, 2009
- Hidehiro NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer wiring element having pin interface
- Publication number 20090002964
- Publication date Jan 1, 2009
- Tessera, Inc.
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION BOARD, AND MULTI-LAYER WIRING BOARD, SUBSTRATE FOR SEMIC...
- Publication number 20080289868
- Publication date Nov 27, 2008
- Hidehiro NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate for a flexible microelectronic assembly and a method of f...
- Publication number 20080128886
- Publication date Jun 5, 2008
- Tessera, Inc.
- Teck-Gyu Kang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wiring board and method of manufacturing the same
- Publication number 20080106880
- Publication date May 8, 2008
- Dai Nippon Printing Co., Ltd.
- Yoichi Miura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Layered metal structure for interconnect element
- Publication number 20080093108
- Publication date Apr 24, 2008
- Tessera, Inc.
- David Light
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FABRICATING A PRINTED CIRCUIT BOARD
- Publication number 20080092376
- Publication date Apr 24, 2008
- MOTOROLA, INC.
- Jaroslaw A. Magera
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fabricating method for printed circuit board
- Publication number 20080052905
- Publication date Mar 6, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Ryoichi Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION BOARD, AND MULTI-LAYER WIRING BOARD, SUBSTRATE FOR SEMIC...
- Publication number 20080010819
- Publication date Jan 17, 2008
- Hidehiro NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for producing circuit board
- Publication number 20070289128
- Publication date Dec 20, 2007
- FUJITSU LIMITED
- Kenji Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Microelectronic component with photo-imageable substrate
- Publication number 20070148941
- Publication date Jun 28, 2007
- Tessera, Inc.
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed-wiring board, multilayer printed-wiring board and manufactu...
- Publication number 20070074902
- Publication date Apr 5, 2007
- CMK CORPORATION
- Eiji Hirata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayered metal laminate and process for producing the same
- Publication number 20060163329
- Publication date Jul 27, 2006
- TOYO KOHAN CO., LTD
- Kinji Saijo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connection substrate, multi-layer wiring board using the connection...
- Publication number 20060162956
- Publication date Jul 27, 2006
- Hidehiro Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board and process for producing the same
- Publication number 20060011382
- Publication date Jan 19, 2006
- Yoichi Miura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer printed wiring board and method of manufacturing the same
- Publication number 20050193555
- Publication date Sep 8, 2005
- TOYO KOHAN CO., LTD
- Kinji Saijo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method of manufacturing same
- Publication number 20050167794
- Publication date Aug 4, 2005
- Koninklije Philips Electronics N.V. a corporation
- Hendrik Klaas Kloen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Etched tri-metal structure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Base material for printed circuit board and printed circuit board

Module and method of manufacturing module

Conductor structure and display device

Robust multi-layer wiring elements and assemblies with embedded mic...

System for displaying images and fabricating method thereof

Methods of manufacturing wire, TFT, and flat panel display device

Interconnection element for electric circuits

Method of making printed wiring board and method of making printed...

Printed wiring board and method for manufacturing printed wiring board

Fabricating method for printed circuit board

Package substrate with a cavity, semiconductor package and fabricat...

Connection board, and multi-layer wiring board, substrate for semic...

Method for fabricating a packaging substrate

Multilayer wiring element having pin interface

Layered metal structure for interconnect element

Substrate for a flexible microelectronic assembly and a method of f...

Microelectronic component with photo-imageable substrate

Wiring board and method of manufacturing the same

Method for fabricating a printed circuit board

Process for producing circuit board

Method of manufacturing a wiring board

Multilayer printed wiring board and method of manufacturing the same

Carrier, method of manufacturing a carrier and an electronic device

Electrical circuit board and method for making the same

Semiconductor device and method of manufacturing same

Multilayered metal laminate and process for producing the same

Method of making a printed circuit board

Method for forming multilayer circuit board

Electrical circuit board and a method for making the same

Vented circuit board for cooling power components

Patents Applicationslast 30 patents

BASE MATERIAL FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD

MODULE AND METHOD OF MANUFACTURING MODULE

INTERCONNECTION ELEMENT FOR ELECTRIC CIRCUITS

Methods of manufacturing wire, TFT, and flat panel display device

PACKAGE SUBSTRATE WITH A CAVITY, SEMICONDUCTOR PACKAGE AND FABRICAT...

PACKAGE SUBSTRATE STRUCUTRE WITH CAVITY AND METHOD FOR MAKING THE SAME

SYSTEM FOR DISPLAYING IMAGES AND FABRICATING METHOD THEREOF

PROCESS OF PACKAGE SUBSTRATE

METHOD FOR FABRICATING A PACKAGING SUBSTRATE

METHOD OF MAKING PRINTED WIRING BOARD AND METHOD OF MAKING PRINTED...

Interconnection element for electric circuits

Printed wiring board and method for manufacturing printed wiring board

Robust multi-layer wiring elements and assemblies with embedded mic...

Connection board, and multi-layer wiring board, substrate for semic...

Multilayer wiring element having pin interface

CONNECTION BOARD, AND MULTI-LAYER WIRING BOARD, SUBSTRATE FOR SEMIC...

Substrate for a flexible microelectronic assembly and a method of f...

Wiring board and method of manufacturing the same

Layered metal structure for interconnect element

METHOD FOR FABRICATING A PRINTED CIRCUIT BOARD

Fabricating method for printed circuit board

CONNECTION BOARD, AND MULTI-LAYER WIRING BOARD, SUBSTRATE FOR SEMIC...

Process for producing circuit board

Microelectronic component with photo-imageable substrate

Printed-wiring board, multilayer printed-wiring board and manufactu...

Multilayered metal laminate and process for producing the same

Connection substrate, multi-layer wiring board using the connection...

Wiring board and process for producing the same

Multilayer printed wiring board and method of manufacturing the same

Semiconductor device and method of manufacturing same