Etching inorganic layers

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H01L21/31105

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/31105Etching inorganic layers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Dual metal silicide structures for advanced integrated circuit stru...
- Patent number 12,225,740
- Issue date Feb 11, 2025
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning material including silicon-containing layer and method f...
- Patent number 12,205,824
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Defect free germanium oxide gap fill
- Patent number 12,198,936
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Huiyuan Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gate line plug structures for advanced integrated circuit structure...
- Patent number 12,199,167
- Issue date Jan 14, 2025
- Intel Corporation
- Byron Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plugs for interconnect lines for advanced integrated circuit struct...
- Patent number 12,199,168
- Issue date Jan 14, 2025
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of formation
- Patent number 12,165,875
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsu Ming Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact over active gate structures for advanced integrated circuit...
- Patent number 12,142,667
- Issue date Nov 12, 2024
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective etchant compositions and methods
- Patent number 12,129,418
- Issue date Oct 29, 2024
- Entegris, Inc.
- Hsing-Chen Wu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Interconnect structure and method for forming the same
- Patent number 12,125,783
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with resistive element
- Patent number 12,119,262
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Sheh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective silicon deposition
- Patent number 12,106,972
- Issue date Oct 1, 2024
- Applied Materials, Inc.
- Yifeng Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process monitoring method and process monitoring system
- Patent number 12,107,021
- Issue date Oct 1, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chunyang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-transparency semiconductor-metal interfaces
- Patent number 12,094,760
- Issue date Sep 17, 2024
- International Business Machines Corporation
- Markus Fabian Ritter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film stack simplification for high aspect ratio patterning and vert...
- Patent number 12,080,592
- Issue date Sep 3, 2024
- Lam Research Corporation
- Hui-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 12,080,782
- Issue date Sep 3, 2024
- Samsung Electronics Co., Ltd.
- Jun Noh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching method and plasma etching apparatus
- Patent number 12,062,522
- Issue date Aug 13, 2024
- Tokyo Electron Limited
- Keiji Kitagaito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gate cut and fin trim isolation for advanced integrated circuit str...
- Patent number 12,057,492
- Issue date Aug 6, 2024
- Intel Corporation
- Tahir Ghani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective silicon dioxide removal using low pressure low bias deute...
- Patent number 12,057,319
- Issue date Aug 6, 2024
- Lam Research Corporation
- Juline Shoeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate treatment apparatus and substrate treatment method
- Patent number 12,046,487
- Issue date Jul 23, 2024
- Kioxia Corporation
- Yoshinori Kitamura
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Semiconductor device suppressing rounded shapes of source/drain con...
- Patent number 12,009,399
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jyun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for metal gate surface clean
- Patent number 11,996,283
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shich-Chang Suen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide semiconductor device, power converter, and method o...
- Patent number 11,984,492
- Issue date May 14, 2024
- Mitsubishi Electric Corporation
- Yuji Ebiike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal silicide structures for advanced integrated circuit stru...
- Patent number 11,961,767
- Issue date Apr 16, 2024
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual metal gate structure having portions of metal gate layers in c...
- Patent number 11,955,532
- Issue date Apr 9, 2024
- Intel Corporation
- Jeffrey S. Leib
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous metal line compositions for advanced integrated circu...
- Patent number 11,955,534
- Issue date Apr 9, 2024
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench contact structures for advanced integrated circuit structure...
- Patent number 11,948,997
- Issue date Apr 2, 2024
- Intel Corporation
- Subhash M. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of patterning
- Patent number 11,901,190
- Issue date Feb 13, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Chin-Yuan Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple gate field-effect transistors having various gate oxide th...
- Patent number 11,894,276
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench plug hardmask for advanced integrated circuit structure fabr...
- Patent number 11,887,838
- Issue date Jan 30, 2024
- Intel Corporation
- Anthony St. Amour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned contacts
- Patent number 11,887,891
- Issue date Jan 30, 2024
- Intel Corporation
- Mark T. Bohr
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PHOTORESIST COMPOSITION AND METHOD OF FORMING PATTERN...
- Publication number 20250054758
- Publication date Feb 13, 2025
- Samsung SDI Co., Ltd.
- Dong Wan RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEUTRAL STRESS DIAMOND-LIKE CARBON
- Publication number 20250046611
- Publication date Feb 6, 2025
- Applied Materials, Inc.
- Jialiang WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...
- Publication number 20250022939
- Publication date Jan 16, 2025
- Intel Corporation
- Andrew W. Yeoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING MARK ON SEMICONDUCTOR DEVICE
- Publication number 20250015011
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- LIANG-SHIUAN PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20250006801
- Publication date Jan 2, 2025
- SK HYNIX INC.
- Young Gwang YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPRINT METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240427234
- Publication date Dec 26, 2024
- KIOXIA Corporation
- Kazuya FUKUHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR INCREASING STABILITY OF SOFT OR ORGANIC...
- Publication number 20240404829
- Publication date Dec 5, 2024
- TOKYO ELECTRON LIMITED
- Katie LUTKER-LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM STACK SIMPLIFICATION FOR HIGH ASPECT RATIO PATTERNING AND VERT...
- Publication number 20240387258
- Publication date Nov 21, 2024
- LAM RESEARCH CORPORATION
- Hui-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH SEMICON...
- Publication number 20240387716
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240379540
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chung-Liang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PAD ON A THROUGH-SILICON VIA
- Publication number 20240379596
- Publication date Nov 14, 2024
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED CONTACT STRUCTURES AND METHODS FOR MAKING THE SAME
- Publication number 20240379770
- Publication date Nov 14, 2024
- QUALCOMM Incorporated
- Xia LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240371984
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- JUN NOH LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUASI FIELD-PLATE STRUCTURE FOR SEMICONDUCTOR DEVICES
- Publication number 20240363697
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-An Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR BOW COMPENSATION USING TENSILE NITRIDE
- Publication number 20240363357
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- David H. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE SILICON DIOXIDE REMOVAL USING LOW PRESSURE LOW BIAS DEUTE...
- Publication number 20240355636
- Publication date Oct 24, 2024
- LAM RESEARCH CORPORATION
- Juline Shoeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STR...
- Publication number 20240332399
- Publication date Oct 3, 2024
- Intel Corporation
- Tahir GHANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...
- Publication number 20240312820
- Publication date Sep 19, 2024
- KIOXIA Corporation
- Yoshio MIZUTA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
MULTIPLE GATE FIELD-EFFECT TRANSISTORS HAVING VARIOUS GATE OXIDE TH...
- Publication number 20240243016
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING HIGH VOLTAGE TRANSISTOR AND STRUCTURE RESULTING T...
- Publication number 20240234566
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- LING MEI LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL METAL GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTUR...
- Publication number 20240186403
- Publication date Jun 6, 2024
- Intel Corporation
- Jeffrey S. LEIB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRU...
- Publication number 20240178071
- Publication date May 30, 2024
- Intel Corporation
- Jeffrey S. LEIB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATION FOR A SEMICONDUCTOR STRUCTURE
- Publication number 20240170324
- Publication date May 23, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Yi TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...
- Publication number 20240162332
- Publication date May 16, 2024
- Intel Corporation
- Subhash M. JOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PATTERNING UNDERLYING STRUCTURE
- Publication number 20240145244
- Publication date May 2, 2024
- Powerchip Semiconductor Manufacturing Corporation
- Yun-An Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED POWER DELIVERY REGULATION CIRCUITS IN GLASS CORE USING E...
- Publication number 20240113047
- Publication date Apr 4, 2024
- Intel Corporation
- Srinivasan Raman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH PLUG HARDMASK FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABR...
- Publication number 20240105520
- Publication date Mar 28, 2024
- Intel Corporation
- Anthony ST. AMOUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20240096796
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Yongjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY CARBON FILMS FOR PATTERNING APPLICATIONS
- Publication number 20240087894
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Eswaranand VENKATASUBRAMANIAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...
- Publication number 20240047556
- Publication date Feb 8, 2024
- Intel Corporation
- Andrew W. YEOH
- H01 - BASIC ELECTRIC ELEMENTS

Etching inorganic layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Dual metal silicide structures for advanced integrated circuit stru...

Patterning material including silicon-containing layer and method f...

Defect free germanium oxide gap fill

Gate line plug structures for advanced integrated circuit structure...

Plugs for interconnect lines for advanced integrated circuit struct...

Semiconductor device and methods of formation

Contact over active gate structures for advanced integrated circuit...

Selective etchant compositions and methods

Interconnect structure and method for forming the same

Semiconductor device structure with resistive element

Selective silicon deposition

Process monitoring method and process monitoring system

High-transparency semiconductor-metal interfaces

Film stack simplification for high aspect ratio patterning and vert...

Semiconductor device and method of forming the same

Plasma etching method and plasma etching apparatus

Gate cut and fin trim isolation for advanced integrated circuit str...

Selective silicon dioxide removal using low pressure low bias deute...

Substrate treatment apparatus and substrate treatment method

Semiconductor device suppressing rounded shapes of source/drain con...

Method for metal gate surface clean

Silicon carbide semiconductor device, power converter, and method o...

Dual metal silicide structures for advanced integrated circuit stru...

Dual metal gate structure having portions of metal gate layers in c...

Heterogeneous metal line compositions for advanced integrated circu...

Trench contact structures for advanced integrated circuit structure...

Method of patterning

Multiple gate field-effect transistors having various gate oxide th...

Trench plug hardmask for advanced integrated circuit structure fabr...

Self-aligned contacts

Patents Applicationslast 30 patents

SEMICONDUCTOR PHOTORESIST COMPOSITION AND METHOD OF FORMING PATTERN...

NEUTRAL STRESS DIAMOND-LIKE CARBON

CONTACT OVER ACTIVE GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT...

METHOD OF FORMING MARK ON SEMICONDUCTOR DEVICE

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

IMPRINT METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHODS AND STRUCTURES FOR INCREASING STABILITY OF SOFT OR ORGANIC...

FILM STACK SIMPLIFICATION FOR HIGH ASPECT RATIO PATTERNING AND VERT...

STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH SEMICON...

INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME

CONDUCTIVE PAD ON A THROUGH-SILICON VIA

SELF-ALIGNED CONTACT STRUCTURES AND METHODS FOR MAKING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

QUASI FIELD-PLATE STRUCTURE FOR SEMICONDUCTOR DEVICES

METHODS FOR BOW COMPENSATION USING TENSILE NITRIDE

SELECTIVE SILICON DIOXIDE REMOVAL USING LOW PRESSURE LOW BIAS DEUTE...

GATE CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STR...

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...

MULTIPLE GATE FIELD-EFFECT TRANSISTORS HAVING VARIOUS GATE OXIDE TH...

METHOD OF FORMING HIGH VOLTAGE TRANSISTOR AND STRUCTURE RESULTING T...

DUAL METAL GATE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTUR...

DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRU...

METHOD OF FABRICATION FOR A SEMICONDUCTOR STRUCTURE

TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...

METHOD OF PATTERNING UNDERLYING STRUCTURE

INTEGRATED POWER DELIVERY REGULATION CIRCUITS IN GLASS CORE USING E...

TRENCH PLUG HARDMASK FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABR...

INTEGRATED CIRCUIT DEVICE

HIGH DENSITY CARBON FILMS FOR PATTERNING APPLICATIONS

HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCU...