Evaporation or sublimation of a compound

Industry

CPC
H05K2203/083

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/083Evaporation or sublimation of a compound

Industries

Patents Grantslast 30 patents

Information Patent Grant
Forming sacrificial composite materials for package-on-package arch...
- Patent number 9,793,233
- Issue date Oct 17, 2017
- Intel Corporation
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming sacrificial composite materials for package-on-package arch...
- Patent number 9,472,519
- Issue date Oct 18, 2016
- Intel Corporation
- Rajasekaran Swaminathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component assembly
- Patent number 9,426,899
- Issue date Aug 23, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forming sacrificial composite materials for package-on-package arch...
- Patent number 9,006,887
- Issue date Apr 14, 2015
- Intel Corporation
- Rajasekaran Swaminathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling device, electronic substrate and electronic device
- Patent number 8,917,507
- Issue date Dec 23, 2014
- Molex Incorporated
- Hideo Nagasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrode structure and method for forming bump
- Patent number 8,887,383
- Issue date Nov 18, 2014
- Panasonic Corporation
- Yasushi Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding structure manufacturing method, heating and melting treatme...
- Patent number 8,757,474
- Issue date Jun 24, 2014
- Ayumi Industry Co., Ltd.
- Hideyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip mounting resin composition and bump forming resin composi...
- Patent number 8,709,293
- Issue date Apr 29, 2014
- Panasonic Corporation
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure of connecting printed wiring boards, method of connecting...
- Patent number 8,507,803
- Issue date Aug 13, 2013
- Sumitomo Electric Industries, Ltd.
- Masamichi Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for connecting between substrates, flip-chip mounting struct...
- Patent number 8,501,583
- Issue date Aug 6, 2013
- Panasonic Corporation
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Planar heat pipe for cooling
- Patent number 8,305,762
- Issue date Nov 6, 2012
- Thales Nederland B.V.
- Wessel Willems Wits
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Bump forming method using self-assembling resin and a wall surface
- Patent number 8,297,488
- Issue date Oct 30, 2012
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for jointing circuit board
- Patent number 8,115,109
- Issue date Feb 14, 2012
- Panasonic Corporation
- Masayoshi Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for printing features with smaller dimensions
- Patent number 8,105,643
- Issue date Jan 31, 2012
- Cabot Corporation
- Anthony James
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Flip chip connection structure having powder-like conductive substa...
- Patent number 8,097,958
- Issue date Jan 17, 2012
- Panasonic Corporation
- Susumu Sawada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Portable electronic device with maintenance capability
- Patent number 8,077,461
- Issue date Dec 13, 2011
- FIH (Hong Kong) Limited
- Hsing-Yuan Hsieh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for producing a module with components stacked one above ano...
- Patent number 7,993,969
- Issue date Aug 9, 2011
- Infineon Technologies AG
- Jens Pohl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for mutually connecting substrates, flip chip mounting body,...
- Patent number 7,919,357
- Issue date Apr 5, 2011
- Panasonic Corporation
- Susumu Sawada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for forming bumps and solder bump
- Patent number 7,799,607
- Issue date Sep 21, 2010
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bank forming method, wiring pattern forming method, electro-optical...
- Patent number 7,732,003
- Issue date Jun 8, 2010
- Seiko Epson Corporation
- Naoyuki Toyoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip mounting process and bump-forming process using electrica...
- Patent number 7,726,545
- Issue date Jun 1, 2010
- Panasonic Corporation
- Takashi Ichiryu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forming vias using sacrificial material
- Patent number 7,727,886
- Issue date Jun 1, 2010
- Intel Corporation
- Lakshmi Supriya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for mounting electronic-component module
- Patent number 7,650,692
- Issue date Jan 26, 2010
- Murata Manufacturing Co., Ltd.
- Kunihiro Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming conductive pattern and wiring board
- Patent number 7,640,659
- Issue date Jan 5, 2010
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conformal coating enhanced to provide heat detection
- Patent number 7,619,867
- Issue date Nov 17, 2009
- International Business Machines Corporation
- Dale Larry Christensen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal management system and method for electronic assemblies
- Patent number 7,595,988
- Issue date Sep 29, 2009
- Raytheon Company
- James S. Wilson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat-decaying materials, transfer sheet using the same, and pattern...
- Patent number 7,591,921
- Issue date Sep 22, 2009
- Sekisui Chemical Co., Ltd.
- Hiroji Fukui
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Encapsulated multi-phase electronics heat-sink
- Patent number 7,561,425
- Issue date Jul 14, 2009
- The Boeing Company
- Eric S. Mindock
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal management system and method for electronic assemblies
- Patent number 7,292,439
- Issue date Nov 6, 2007
- Raytheon Company
- James S. Wilson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making a solder between metallic balls of an electronic...
- Patent number 7,156,283
- Issue date Jan 2, 2007
- L'Air Liquide, Societe Anonyme a Directoire et Conseil de Surveillance pour l...
- Claude Bonet
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FABRICATING FUNCTIONAL CIRCUITS ON 3D FREEFORM SURFACES VIA INTENSE...
- Publication number 20240276648
- Publication date Aug 15, 2024
- The Penn State Research Foundation
- Ning Yi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FILM THICKNESS REGULATOR AND MANUFACTURING METHOD THEREOF, FILM THI...
- Publication number 20170037507
- Publication date Feb 9, 2017
- BOE TECHNOLOGY GROUP CO., LTD.
- Xiaohu LI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BONDING STRUCTURE MANUFACTURING METHOD, HEATING AND MELTING TREATME...
- Publication number 20140246481
- Publication date Sep 4, 2014
- Hideyuki ABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding Structure Manufacturing Method, Heating And Melting Treatme...
- Publication number 20130105558
- Publication date May 2, 2013
- AYUMI INDUSTRY CO., LTD.
- Hideyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL PATTERN FORMATION SYSTEM
- Publication number 20120060708
- Publication date Mar 15, 2012
- Li-Jiuan Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COOLING DEVICE, ELECTRONIC SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20120033385
- Publication date Feb 9, 2012
- Molex Incorporated
- Hideo Nagasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Inkjet printer
- Publication number 20110134181
- Publication date Jun 9, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Sung Il Oh
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Method of Temporarily Attaching a Rigid Carrier to a Substrate
- Publication number 20100297829
- Publication date Nov 25, 2010
- The Arizona Board of Regents, a body corporate acting for and on behalf of Ar...
- Shawn O'Rourke
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE OF CONNECTING PRINTED WIRING BOARDS, METHOD OF CONNECTING...
- Publication number 20100230141
- Publication date Sep 16, 2010
- Sumitomo Electric Industries, Ltd.
- Masamichi Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Forming sacrificial composite materials for package-on-package arch...
- Publication number 20100224993
- Publication date Sep 9, 2010
- Rajasekaran Swaminathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL PATTERN FORMATION METHOD AND METAL PATTERN FORMATON SYSTEM
- Publication number 20100151147
- Publication date Jun 17, 2010
- Li-Jiuan Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MOUNTING ELECTRONIC-COMPONENT MODULE, METHOD FOR MANUFAC...
- Publication number 20100085722
- Publication date Apr 8, 2010
- Murata Manufacturing Co., Ltd.
- Kunihiro KOYAMA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRODE STRUCTURE AND METHOD FOR FORMING BUMP
- Publication number 20100044091
- Publication date Feb 25, 2010
- PANASONIC CORPORATION
- Yasushi Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PORTABLE ELECTRONIC DEVICE WITH MAINTENANCE CAPABILITY
- Publication number 20100046176
- Publication date Feb 25, 2010
- FIH (HONG KONG) LIMITED
- HSING-YUAN HSIEH
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC COMPONENT ASSEMBLY, ELECTRIC COMPONENT WITH SOLDER BUMP...
- Publication number 20100011572
- Publication date Jan 21, 2010
- Takashi Kitae
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR CONNECTING BETWEEN SUBSTRATES, FLIP-CHIP MOUNTING STRUCT...
- Publication number 20100007033
- Publication date Jan 14, 2010
- Takashi KITAE
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR MUTUALLY CONNECTING SUBSTRATES, FLIP CHIP MOUNTING BODY,...
- Publication number 20100001411
- Publication date Jan 7, 2010
- Susumu SAWADA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CIRCUIT BOARD AND METHOD FOR JOINTING CIRCUIT BOARD
- Publication number 20090266592
- Publication date Oct 29, 2009
- Panasonic Corporation
- Masayoshi Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING CONDUCTIVE PATTERN AND WIRING BOARD
- Publication number 20090133901
- Publication date May 28, 2009
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION STRUCTURE AND METHOD OF PRODUCING THE SAME
- Publication number 20090102064
- Publication date Apr 23, 2009
- PANASONIC CORPORATION
- Susumu Sawada
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
FLIP-CHIP MOUNTING BODY AND FLIP-CHIP MOUNTING METHOD
- Publication number 20090085227
- Publication date Apr 2, 2009
- Matsushita Electric Industrial Co., Ltd.
- Tsukasa Shiraishi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
BUMP FORMING METHOD AND BUMP FORMING APPARATUS
- Publication number 20090078746
- Publication date Mar 26, 2009
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLANAR HEAT PIPE FOR COOLING
- Publication number 20090065180
- Publication date Mar 12, 2009
- THALES NEDERLAND B.V.
- Wessel Willems Wits
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Electronic Component Mounted Body, Electronic Component with Solder...
- Publication number 20090008776
- Publication date Jan 8, 2009
- Takashi Kitae
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Forming vias using sacrificial material
- Publication number 20090004841
- Publication date Jan 1, 2009
- Lakshmi Supriya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MOUNTING ELECTRONIC-COMPONENT MODULE, METHOD FOR MANUFAC...
- Publication number 20080192447
- Publication date Aug 14, 2008
- MURATA MANUFACTURING CO., LTD.
- Kunihiro KOYAMA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Element substrate and method of manufacturing the same
- Publication number 20080173471
- Publication date Jul 24, 2008
- Seiko Epson Corporation
- Toshihiko Kaneda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Flip Clip Mounting Process And Bump-Forming Process Using Electrica...
- Publication number 20080165518
- Publication date Jul 10, 2008
- Takashi Ichiryu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Flip-Chip Mounting Resin Composition and Bump Forming Resin Composi...
- Publication number 20080128664
- Publication date Jun 5, 2008
- Takashi Kitae
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Thermal Management System and Method for Electronic Assemblies
- Publication number 20080062650
- Publication date Mar 13, 2008
- Raytheon Company
- James S. Wilson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Evaporation or sublimation of a compound

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Forming sacrificial composite materials for package-on-package arch...

Forming sacrificial composite materials for package-on-package arch...

Electronic component assembly

Forming sacrificial composite materials for package-on-package arch...

Cooling device, electronic substrate and electronic device

Electrode structure and method for forming bump

Bonding structure manufacturing method, heating and melting treatme...

Flip-chip mounting resin composition and bump forming resin composi...

Structure of connecting printed wiring boards, method of connecting...

Method for connecting between substrates, flip-chip mounting struct...

Planar heat pipe for cooling

Bump forming method using self-assembling resin and a wall surface

Circuit board and method for jointing circuit board

Process for printing features with smaller dimensions

Flip chip connection structure having powder-like conductive substa...

Portable electronic device with maintenance capability

Method for producing a module with components stacked one above ano...

Method for mutually connecting substrates, flip chip mounting body,...

Process for forming bumps and solder bump

Bank forming method, wiring pattern forming method, electro-optical...

Flip chip mounting process and bump-forming process using electrica...

Forming vias using sacrificial material

Method for mounting electronic-component module

Method for forming conductive pattern and wiring board

Conformal coating enhanced to provide heat detection

Thermal management system and method for electronic assemblies

Heat-decaying materials, transfer sheet using the same, and pattern...

Encapsulated multi-phase electronics heat-sink

Thermal management system and method for electronic assemblies

Method for making a solder between metallic balls of an electronic...

Patents Applicationslast 30 patents

FABRICATING FUNCTIONAL CIRCUITS ON 3D FREEFORM SURFACES VIA INTENSE...

FILM THICKNESS REGULATOR AND MANUFACTURING METHOD THEREOF, FILM THI...

BONDING STRUCTURE MANUFACTURING METHOD, HEATING AND MELTING TREATME...

Bonding Structure Manufacturing Method, Heating And Melting Treatme...

METAL PATTERN FORMATION SYSTEM

COOLING DEVICE, ELECTRONIC SUBSTRATE AND ELECTRONIC DEVICE

Inkjet printer

Method of Temporarily Attaching a Rigid Carrier to a Substrate

STRUCTURE OF CONNECTING PRINTED WIRING BOARDS, METHOD OF CONNECTING...

Forming sacrificial composite materials for package-on-package arch...

METAL PATTERN FORMATION METHOD AND METAL PATTERN FORMATON SYSTEM

METHOD FOR MOUNTING ELECTRONIC-COMPONENT MODULE, METHOD FOR MANUFAC...

ELECTRODE STRUCTURE AND METHOD FOR FORMING BUMP

PORTABLE ELECTRONIC DEVICE WITH MAINTENANCE CAPABILITY

ELECTRONIC COMPONENT ASSEMBLY, ELECTRIC COMPONENT WITH SOLDER BUMP...

METHOD FOR CONNECTING BETWEEN SUBSTRATES, FLIP-CHIP MOUNTING STRUCT...

METHOD FOR MUTUALLY CONNECTING SUBSTRATES, FLIP CHIP MOUNTING BODY,...

CIRCUIT BOARD AND METHOD FOR JOINTING CIRCUIT BOARD

METHOD FOR FORMING CONDUCTIVE PATTERN AND WIRING BOARD

CONNECTION STRUCTURE AND METHOD OF PRODUCING THE SAME

FLIP-CHIP MOUNTING BODY AND FLIP-CHIP MOUNTING METHOD

BUMP FORMING METHOD AND BUMP FORMING APPARATUS

PLANAR HEAT PIPE FOR COOLING

Electronic Component Mounted Body, Electronic Component with Solder...

Forming vias using sacrificial material

METHOD FOR MOUNTING ELECTRONIC-COMPONENT MODULE, METHOD FOR MANUFAC...

Element substrate and method of manufacturing the same

Flip Clip Mounting Process And Bump-Forming Process Using Electrica...

Flip-Chip Mounting Resin Composition and Bump Forming Resin Composi...

Thermal Management System and Method for Electronic Assemblies