Evaporators

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CPC
H05K7/20309

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/20309Evaporators

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Regenerative preheater for phase change cooling applications
- Patent number 12,363,865
- Issue date Jul 15, 2025
- The Research Foundation for the State University of New York
- Sadegh Khalili
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Two-phase liquid-cooled electrical power apparatus
- Patent number 12,349,325
- Issue date Jul 1, 2025
- Raytheon Company
- Stephen B. Kuznetsov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid system for servers
- Patent number 12,336,152
- Issue date Jun 17, 2025
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manifold systems, devices, and methods for thermal management of ha...
- Patent number 12,324,131
- Issue date Jun 3, 2025
- Seguente, Inc.
- Raffaele Luca Amalfi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stack-PCB architecture with embedded vapor chamber
- Patent number 12,317,408
- Issue date May 27, 2025
- Meta Platforms Technologies, LLC
- Michael Nikkhoo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Boiler plates for computing systems
- Patent number 12,317,451
- Issue date May 27, 2025
- ZT GROUP INT'L, INC.
- Ting Yu Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Configurable multi-chip module heatsink for selective dissipation o...
- Patent number 12,309,962
- Issue date May 20, 2025
- International Business Machines Corporation
- William James Anderl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vapor chamber, electronic device, metallic sheet for vapor chamber...
- Patent number 12,298,082
- Issue date May 13, 2025
- Dai Nippon Printing Co., Ltd.
- Shinichiro Takahashi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Scalable cooling architecture for liquid and air cooling
- Patent number 12,295,119
- Issue date May 6, 2025
- Dell Products L.P.
- Tyler Baxter Duncan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assembly and method for cooling an apparatus
- Patent number 12,284,785
- Issue date Apr 22, 2025
- MBDA UK Limited
- Michael Andrew Palmer
- F41 - WEAPONS
Information Patent Grant
Cooling systems, cooling structures and electronic devices and meth...
- Patent number 12,284,793
- Issue date Apr 22, 2025
- Intel Corporation
- Ritu Bawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat dissipation member and electronic apparatus
- Patent number 12,270,609
- Issue date Apr 8, 2025
- Lenovo (Beijing) Limited
- Lianming Guo
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling device
- Patent number 12,274,029
- Issue date Apr 8, 2025
- HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
- Sviataslau Alehavich Filatau
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat pipe for improved thermal performance at cold plate interface
- Patent number 12,262,508
- Issue date Mar 25, 2025
- Intel Corporation
- Juha Paavola
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joint, cooling system, and computer apparatus
- Patent number 12,253,199
- Issue date Mar 18, 2025
- Huawei Technologies Co., Ltd.
- Xinhu Gong
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Tank for heat dissipation and a cooling system including the same
- Patent number 12,245,406
- Issue date Mar 4, 2025
- FIRMUS METAL TECHNOLOGIES SINGAPORE PTE LTD
- Jonathan Levee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Refrigeration system for data center
- Patent number 12,238,902
- Issue date Feb 25, 2025
- BEIJING BAIDU NETCOM SCIENCE TECHNOLOGY CO., LTD.
- Zhiming Luo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Immersion cooling for integrated circuit devices
- Patent number 12,238,892
- Issue date Feb 25, 2025
- Intel Corporation
- Raanan Sover
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Intelligent low pressure two-phase cold plate with flow stabilizati...
- Patent number 12,238,895
- Issue date Feb 25, 2025
- NVIDIA Corporation
- Ali Heydari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for cooling of superconducting power transmissi...
- Patent number 12,232,298
- Issue date Feb 18, 2025
- VEIR, Inc.
- Stephen Paul Ashworth
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Air transportable modular shipping container for data centers
- Patent number 12,213,275
- Issue date Jan 28, 2025
- Switch, LTD.
- Rob Roy
- E04 - BUILDING
Information Patent Grant
Method for manufacturing vapor chamber
- Patent number 12,213,284
- Issue date Jan 28, 2025
- Jentech Precision Industrial Co., LTD.
- Chun-Ta Yeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for an ion emitter-assisted heatpipe
- Patent number 12,204,385
- Issue date Jan 21, 2025
- Dell Products L.P.
- Qinghong He
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Housing comprising a composite wall integrating at least one coolin...
- Patent number 12,207,442
- Issue date Jan 21, 2025
- SAFRAN ELECTRONICS & DEFENSE
- Muriel Sabah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation device for electronic element
- Patent number 12,178,015
- Issue date Dec 24, 2024
- KMW Inc.
- Duk Yong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor chamber and manufacturing method of the same
- Patent number 12,173,968
- Issue date Dec 24, 2024
- Cooler Master Co., Ltd.
- Chi-Lung Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermal management device for circuit breakers
- Patent number 12,171,086
- Issue date Dec 17, 2024
- EATON INTELLIGENT POWER LIMITED
- Ankit Bhagat
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
System and method to help mitigate heat in an electronic device
- Patent number 12,150,280
- Issue date Nov 19, 2024
- Intel Corporation
- Baomin Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hybrid heat sink
- Patent number 12,150,277
- Issue date Nov 19, 2024
- SHENZHEN ENVICOOL TECHNOLOGY CO., LTD
- Viacheslav Stetsyuk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling apparatus for electronic element
- Patent number 12,144,149
- Issue date Nov 12, 2024
- KMW Inc.
- Duk Yong Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IMPROVED MICROCHANNEL EVAPORATOR
- Publication number 20250240921
- Publication date Jul 24, 2025
- WIELAND PROVIDES S.R.L.
- Franco PROVENZIANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ORGANIC RANKINE CYCLE FOR DATA CENTER ELECTRONICS COOLING AND THERM...
- Publication number 20250234496
- Publication date Jul 17, 2025
- Western Digital Technologies, Inc.
- Hussam Zebian
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrically Isolating Heat Pipe Assembly
- Publication number 20250234491
- Publication date Jul 17, 2025
- TE Connectivity Solutions GMBH
- Matthew MISHRIKEY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION SYSTEM AND POWER DEVICE
- Publication number 20250227899
- Publication date Jul 10, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Jiyang LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION SYSTEM AND POWER DEVICE
- Publication number 20250227882
- Publication date Jul 10, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Jiyang LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING ARRANGEMENT WITH A HEAT SINK FOR AT LEAST ONE MICROCHIP
- Publication number 20250212362
- Publication date Jun 26, 2025
- RITTAL GMBH & CO. KG
- Juan Carlos CACHO ALONSO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT DISSIPATION SYSTEMS FOR ELECTRONIC DEVICES AND RELATED METHODS
- Publication number 20250212365
- Publication date Jun 26, 2025
- Intel Corporation
- Gaurav Patankar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC CONNECTORS FOR USE ON BOARD A SPACECRAFT
- Publication number 20250202144
- Publication date Jun 19, 2025
- AIRBUS DEFENCE AND SPACE SAS
- Denis GALIANA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated, Pumped, Closed-Loop Two-Phase Heatsink
- Publication number 20250194049
- Publication date Jun 12, 2025
- Google LLC
- Tanya Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TANK FOR HEAT DISSIPATION AND A COOLING SYSTEM INCLUDING THE SAME
- Publication number 20250185218
- Publication date Jun 5, 2025
- FIRMUS METAL TECHNOLOGIES SINGAPORE PTE LTD
- Jonathan LEVEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SERVER ROOM THERMO-HYGROSTAT USING OUTDOOR AIR
- Publication number 20250185219
- Publication date Jun 5, 2025
- CHUNG LOCK OH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TWO-PHASE RADIATING FIN AND HEAT SINK
- Publication number 20250185211
- Publication date Jun 5, 2025
- ZTE Corporation
- Kaiwen DUAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL MANAGEMENT SYSTEM, ENERGY STORAGE DEVICE, AND PHOTOVOLTAIC...
- Publication number 20250185213
- Publication date Jun 5, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Tao HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VEHICLE THERMAL MANAGEMENT SYSTEM
- Publication number 20250153542
- Publication date May 15, 2025
- Hyundai Motor Company
- Gi Sang Yun
- B60 - VEHICLES IN GENERAL
Information Patent Application
COMBINATION HEAT DISSIPATION UNIT
- Publication number 20250151231
- Publication date May 8, 2025
- ASIA VITAL COMPONENTS (CHINA) CO., LTD.
- XIWEN XIONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT PIPE FOR IMPROVED THERMAL PERFORMANCE AT COLD PLATE INTERFACE
- Publication number 20250142778
- Publication date May 1, 2025
- Intel Corporation
- Juha Paavola
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
AIR TRANSPORTABLE MODULAR SHIPPING CONTAINER FOR DATA CENTERS
- Publication number 20250126739
- Publication date Apr 17, 2025
- Switch, Ltd.
- Rob Roy
- E04 - BUILDING
Information Patent Application
VAPOR CHAMBER, RADIATOR AND ELECTRONIC DEVICE
- Publication number 20250107043
- Publication date Mar 27, 2025
- ZTE Corporation
- Zhen SUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOSIPHON FOR COMPUTING COMPONENTS
- Publication number 20250089209
- Publication date Mar 13, 2025
- ZT Group Int’l, Inc. dba ZT Systems
- Ting Yu Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING VAPOR CHAMBER
- Publication number 20250089210
- Publication date Mar 13, 2025
- Jentech Precision Industrial Co., LTD.
- Chun-Ta YEH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR COOLING
- Publication number 20250089212
- Publication date Mar 13, 2025
- Nokia Technologies Oy
- Raffaele Luca AMALFI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NOVEL HEAT PIPE CONFIGURATIONS
- Publication number 20250089213
- Publication date Mar 13, 2025
- Honeywell International Inc.
- Tao Liu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Integrated Vapor Chamber for Electronic Devices
- Publication number 20250081397
- Publication date Mar 6, 2025
- Google LLC
- Eric Chuang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Implementation of Two-Phase Cold Plate Loops with Design Features t...
- Publication number 20250081405
- Publication date Mar 6, 2025
- Seguente, Inc.
- Ryan Enright
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ACTIVE/PASSIVE COOLING SYSTEM WITH PUMPED REFRIGERANT
- Publication number 20250071943
- Publication date Feb 27, 2025
- Munters Corporation
- Wei Fang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID COOLING SYSTEM FOR DATA CENTER AND CONTROL METHOD THEREOF
- Publication number 20250063702
- Publication date Feb 20, 2025
- Hebei Qinhuai Data Co., Limited.
- Binghua ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pumped Two-Phase Cooling of Aircraft Electronics
- Publication number 20250060168
- Publication date Feb 20, 2025
- The Boeing Company
- Michael F. Stoia
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
LIQUID COOLING SYSTEM FOR DATA CENTER, CONTROL METHOD, AND EDGE DAT...
- Publication number 20250063701
- Publication date Feb 20, 2025
- Hebei Qinhuai Data Co., Limited.
- Binghua ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EDGE DATA CENTER
- Publication number 20250063703
- Publication date Feb 20, 2025
- Hebei Qinhuai Data Co., Limited.
- Binghua ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REFRIGERATION DEVICE AND DATA CENTER
- Publication number 20250048602
- Publication date Feb 6, 2025
- Hebei Qinhuai Data Co., Limited.
- Binghua ZHANG
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...

Evaporators

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Regenerative preheater for phase change cooling applications

Two-phase liquid-cooled electrical power apparatus

Hybrid system for servers

Manifold systems, devices, and methods for thermal management of ha...

Stack-PCB architecture with embedded vapor chamber

Boiler plates for computing systems

Configurable multi-chip module heatsink for selective dissipation o...

Vapor chamber, electronic device, metallic sheet for vapor chamber...

Scalable cooling architecture for liquid and air cooling

Assembly and method for cooling an apparatus

Cooling systems, cooling structures and electronic devices and meth...

Heat dissipation member and electronic apparatus

Cooling device

Heat pipe for improved thermal performance at cold plate interface

Joint, cooling system, and computer apparatus

Tank for heat dissipation and a cooling system including the same

Refrigeration system for data center

Immersion cooling for integrated circuit devices

Intelligent low pressure two-phase cold plate with flow stabilizati...

Systems and methods for cooling of superconducting power transmissi...

Air transportable modular shipping container for data centers

Method for manufacturing vapor chamber

Method and apparatus for an ion emitter-assisted heatpipe

Housing comprising a composite wall integrating at least one coolin...

Heat dissipation device for electronic element

Vapor chamber and manufacturing method of the same

Thermal management device for circuit breakers

System and method to help mitigate heat in an electronic device

Hybrid heat sink

Cooling apparatus for electronic element

Patents Applicationslast 30 patents

IMPROVED MICROCHANNEL EVAPORATOR

ORGANIC RANKINE CYCLE FOR DATA CENTER ELECTRONICS COOLING AND THERM...

Electrically Isolating Heat Pipe Assembly

HEAT DISSIPATION SYSTEM AND POWER DEVICE

HEAT DISSIPATION SYSTEM AND POWER DEVICE

COOLING ARRANGEMENT WITH A HEAT SINK FOR AT LEAST ONE MICROCHIP

HEAT DISSIPATION SYSTEMS FOR ELECTRONIC DEVICES AND RELATED METHODS

ELECTRONIC CONNECTORS FOR USE ON BOARD A SPACECRAFT

Integrated, Pumped, Closed-Loop Two-Phase Heatsink

TANK FOR HEAT DISSIPATION AND A COOLING SYSTEM INCLUDING THE SAME

SERVER ROOM THERMO-HYGROSTAT USING OUTDOOR AIR

TWO-PHASE RADIATING FIN AND HEAT SINK

THERMAL MANAGEMENT SYSTEM, ENERGY STORAGE DEVICE, AND PHOTOVOLTAIC...

VEHICLE THERMAL MANAGEMENT SYSTEM

COMBINATION HEAT DISSIPATION UNIT

HEAT PIPE FOR IMPROVED THERMAL PERFORMANCE AT COLD PLATE INTERFACE

AIR TRANSPORTABLE MODULAR SHIPPING CONTAINER FOR DATA CENTERS

VAPOR CHAMBER, RADIATOR AND ELECTRONIC DEVICE

THERMOSIPHON FOR COMPUTING COMPONENTS

METHOD FOR MANUFACTURING VAPOR CHAMBER

APPARATUS FOR COOLING

NOVEL HEAT PIPE CONFIGURATIONS

Integrated Vapor Chamber for Electronic Devices

Implementation of Two-Phase Cold Plate Loops with Design Features t...

ACTIVE/PASSIVE COOLING SYSTEM WITH PUMPED REFRIGERANT

LIQUID COOLING SYSTEM FOR DATA CENTER AND CONTROL METHOD THEREOF

Pumped Two-Phase Cooling of Aircraft Electronics

LIQUID COOLING SYSTEM FOR DATA CENTER, CONTROL METHOD, AND EDGE DAT...

EDGE DATA CENTER

REFRIGERATION DEVICE AND DATA CENTER