Evaporators

Industry

CPC
H05K7/20309

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/20309Evaporators

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Thermal management device for circuit breakers
- Patent number 12,171,086
- Issue date Dec 17, 2024
- EATON INTELLIGENT POWER LIMITED
- Ankit Bhagat
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
System and method to help mitigate heat in an electronic device
- Patent number 12,150,280
- Issue date Nov 19, 2024
- Intel Corporation
- Baomin Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hybrid heat sink
- Patent number 12,150,277
- Issue date Nov 19, 2024
- SHENZHEN ENVICOOL TECHNOLOGY CO., LTD
- Viacheslav Stetsyuk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling apparatus for electronic element
- Patent number 12,144,149
- Issue date Nov 12, 2024
- KMW Inc.
- Duk Yong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for vapor-compressed cooling
- Patent number 12,144,151
- Issue date Nov 12, 2024
- Quanta Computer Inc.
- Chao-Jung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipating device
- Patent number 12,144,150
- Issue date Nov 12, 2024
- VAST GLORY ELECTRONIC & HARDWARE & PLASTIC (HUI ZHOU) LTD
- Xiao-Yao Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat-activated pump with integrated evaporator for electronic chip...
- Patent number 12,133,363
- Issue date Oct 29, 2024
- Hamfop Technologies LLC
- Mudasir Ahmad
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Active/passive cooling system
- Patent number 12,127,380
- Issue date Oct 22, 2024
- Munters Corporation
- Michael Boucher
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Composite cooling system and data center
- Patent number 12,127,367
- Issue date Oct 22, 2024
- HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
- Jinliang Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3-D structured two-phase cooling boilers with nano structured boili...
- Patent number 12,120,851
- Issue date Oct 15, 2024
- Microsoft Technology Licensing, LLC
- Dennis Trieu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vapor chamber and manufacturing method of the same
- Patent number 12,117,244
- Issue date Oct 15, 2024
- Cooler Master Co., Ltd.
- Chi-Lung Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling module and electronic apparatus
- Patent number 12,120,848
- Issue date Oct 15, 2024
- Lenovo (Singapore) Pte. Ltd.
- Hao-Yu Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High-availability liquid cooling system for chip and server
- Patent number 12,114,468
- Issue date Oct 8, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling of power semiconductors
- Patent number 12,107,032
- Issue date Oct 1, 2024
- ABB Schweiz AG
- Colin Tschida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling device for use in alternating magnetic fields, coil arrange...
- Patent number 12,095,347
- Issue date Sep 17, 2024
- Airbus (S.A.S.)
- Ludovic Ybanez
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Cooling system in electronics cabinet comprising thermally coupled...
- Patent number 12,096,602
- Issue date Sep 17, 2024
- Pfannenberg GmbH
- Russell Fuller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Server and cooling system for enhanced immersion cooling
- Patent number 12,089,366
- Issue date Sep 10, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling system and data center
- Patent number 12,089,377
- Issue date Sep 10, 2024
- HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
- Jian Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Intelligent dual function cold plate system with heat pipe for data...
- Patent number 12,069,836
- Issue date Aug 20, 2024
- NVIDIA Corporation
- Ali Heydari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Data center liquid conduction and carbon dioxide based cooling appa...
- Patent number 12,063,761
- Issue date Aug 13, 2024
- Nautilus TRUE, LLC
- Arnold Castillo Magcale
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Shrouded powder patch
- Patent number 12,050,061
- Issue date Jul 30, 2024
- Aavid Thermalloy, LLC
- Sukhvinder S. Kang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Integrated heat spreader with enhanced vapor chamber for multichip...
- Patent number 12,046,536
- Issue date Jul 23, 2024
- Intel Corporation
- Je-Young Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air conditioner for sealed enclosures
- Patent number 12,048,114
- Issue date Jul 23, 2024
- Hoffman Enclosures Inc.
- Michael Koehler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Evaporative thermal management systems and methods
- Patent number 12,031,753
- Issue date Jul 9, 2024
- GE Aviation Systems LLC
- Brian Magann Rush
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Thermal management of circuit boards
- Patent number 12,028,962
- Issue date Jul 2, 2024
- Micron Technology, Inc.
- Xiaopeng Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power conductor and vehicle power distribution circuit incorporatin...
- Patent number 12,016,161
- Issue date Jun 18, 2024
- Aptiv Technologies AG
- Guillaume Tournabien
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Nucleation control system and method leading to enhanced boiling ba...
- Patent number 12,010,816
- Issue date Jun 11, 2024
- Michigan Technological University
- Amitabh Narain
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermal storage for high load short duration cooling
- Patent number 12,000,679
- Issue date Jun 4, 2024
- Hamilton Sundstrand Corporation
- Mark G. Vignali
- F41 - WEAPONS
Information Patent Grant
System for cooling server boards in a data center
- Patent number 11,997,832
- Issue date May 28, 2024
- CALYOS SA
- Vincent Dupont
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipation system and an associated method thereof
- Patent number 11,997,839
- Issue date May 28, 2024
- GE Grid Solutions LLC
- Alistair Martin Waddell
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICES WITH A LOOPED THERMAL MODULE HAVING A UNIDIRECTI...
- Publication number 20240397665
- Publication date Nov 28, 2024
- Apple Inc.
- Jifang TIAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION SYSTEM, POWER SUPPLY SYSTEM, AND CHARGING PILE
- Publication number 20240389283
- Publication date Nov 21, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Zhisheng LIAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR COOLING ELECTRONIC DEVICES
- Publication number 20240389277
- Publication date Nov 21, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Danny J. Lohan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DATA CENTER COOLING SYSTEM, CONTROL METHOD, AND DATA CENTER
- Publication number 20240381589
- Publication date Nov 14, 2024
- Hebei Qinhuai Data Co., Limited.
- Binghua ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER ELECTRONICS COOLING LOOP FOR REFRIGERANT COMPRESSOR
- Publication number 20240381595
- Publication date Nov 14, 2024
- Myongsok SONG
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
IMMERSION COOLING DEVICE
- Publication number 20240381587
- Publication date Nov 14, 2024
- Fulian Precision Electronics (Tianjin) Co., LTD.
- TSUNG-LIN LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Air Conditioner for Sealed Enclosures
- Publication number 20240365501
- Publication date Oct 31, 2024
- Hoffman Enclosures Inc.
- Michael Koehler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTIMIZED AND AUTOMATED DYNAMIC THERMAL REGULATION METHOD AND APPAR...
- Publication number 20240365513
- Publication date Oct 31, 2024
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPARATUS AND METHOD FOR CONDENSATION PREVENTION FOR 2-PHASE COOLIN...
- Publication number 20240361357
- Publication date Oct 31, 2024
- Advantest Corporation
- Peter Weixiang ZHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICES
- Publication number 20240357779
- Publication date Oct 24, 2024
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Wenqiang WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT EXCHANGE DEVICE AND HEAT EXCHANGE SYSTEM
- Publication number 20240349463
- Publication date Oct 17, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Yongqi QIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR A PUMPED LIQUID COOLING SYSTEM USING A PHA...
- Publication number 20240349453
- Publication date Oct 17, 2024
- The Durbin Group, LLC
- Joseph Marsala
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION LIQUID COOLING DEVICE
- Publication number 20240334649
- Publication date Oct 3, 2024
- Hebei Qinhuai Data Co., Limited.
- Binghua ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REFRIGERATION CYCLE APPARATUS
- Publication number 20240334650
- Publication date Oct 3, 2024
- DAIKIN INDUSTRIES, LTD.
- Motoki TAKAGI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EVAPORATIVE THERMAL MANAGEMENT SYSTEMS AND METHODS
- Publication number 20240310085
- Publication date Sep 19, 2024
- GE AVIATION SYSTEMS LLC
- Brian Magann Rush
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
PUMP-DRIVEN TWO-PHASE LIQUID COOLING SYSTEM, AND LIQUID SUPPLEMENTA...
- Publication number 20240276678
- Publication date Aug 15, 2024
- ZTE Corporation
- Cheng TAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED REFRIGERATION APPARATUS
- Publication number 20240263853
- Publication date Aug 8, 2024
- Hebei Qinhuai Data Co., Limited.
- Binghua ZHANG
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
METHOD AND APPARATUS FOR AN ION EMITTER-ASSISTED HEATPIPE
- Publication number 20240231447
- Publication date Jul 11, 2024
- DELL PRODUCTS, L.P.
- Qinghong He
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COOLING SYSTEM
- Publication number 20240237287
- Publication date Jul 11, 2024
- Delta Electronics, Inc.
- Ren-Chun CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SCALABLE COOLING ARCHITECTURE FOR LIQUID AND AIR COOLING
- Publication number 20240237289
- Publication date Jul 11, 2024
- Tyler Baxter Duncan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SERVER WITH HYBRID THERMAL MANAGEMENT SYSTEM
- Publication number 20240237308
- Publication date Jul 11, 2024
- Carrier Corporation
- Arindom Joardar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
A TANK FOR HEAT DISSIPATION AND A COOLING SYSTEM INCLUDING THE SAME
- Publication number 20240224475
- Publication date Jul 4, 2024
- FIRMUS METAL TECHNOLOGIES SINGAPORE PTE LTD
- Jonathan LEVEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL MANAGEMENT DEVICE FOR CIRCUIT BREAKERS
- Publication number 20240206123
- Publication date Jun 20, 2024
- Eaton Intelligent Power Limited
- Ankit Bhagat
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CONTAINER DATA CENTER AND REFRIGERATION CONTROL METHOD THEREOF
- Publication number 20240188256
- Publication date Jun 6, 2024
- Hebei Qinhuai Data Co., Limited.
- Binghua ZHANG
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
ANGLED AND STEPPED FACEPLATE FOR TELECOMMUNICATIONS AND NETWORKING...
- Publication number 20240179877
- Publication date May 30, 2024
- CIENA CORPORATION
- Daniel Rivaud
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REFRIGERATION SYSTEM AND DEVICE PROVIDED WITH REFRIGERATION APPARATUS
- Publication number 20240179878
- Publication date May 30, 2024
- Hebei Qinhuai Data Co., Limited.
- Binghua ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING SYSTEM WITH IN-SERIES HIGH-TEMPERATURE AND LOW-TEMPERATURE...
- Publication number 20240172402
- Publication date May 23, 2024
- THERMAL WORKS LLC
- Doron Shapiro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VAPOR CHAMBER STRUCTURE
- Publication number 20240164059
- Publication date May 16, 2024
- ASIA VITAL COMPONENTS (CHINA) CO., LTD.
- Han-Min Liu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
System for the Reuse of Heat in a Data Center
- Publication number 20240164065
- Publication date May 16, 2024
- Nan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING APPARATUS FOR SUPERCONDUCTING FAULT CURRENT LIMITER
- Publication number 20240164058
- Publication date May 16, 2024
- LS ELECTRIC CO., LTD.
- Ki Nam RYU
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Evaporators

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thermal management device for circuit breakers

System and method to help mitigate heat in an electronic device

Hybrid heat sink

Cooling apparatus for electronic element

Systems and methods for vapor-compressed cooling

Heat dissipating device

Heat-activated pump with integrated evaporator for electronic chip...

Active/passive cooling system

Composite cooling system and data center

3-D structured two-phase cooling boilers with nano structured boili...

Vapor chamber and manufacturing method of the same

Cooling module and electronic apparatus

High-availability liquid cooling system for chip and server

Cooling of power semiconductors

Cooling device for use in alternating magnetic fields, coil arrange...

Cooling system in electronics cabinet comprising thermally coupled...

Server and cooling system for enhanced immersion cooling

Cooling system and data center

Intelligent dual function cold plate system with heat pipe for data...

Data center liquid conduction and carbon dioxide based cooling appa...

Shrouded powder patch

Integrated heat spreader with enhanced vapor chamber for multichip...

Air conditioner for sealed enclosures

Evaporative thermal management systems and methods

Thermal management of circuit boards

Power conductor and vehicle power distribution circuit incorporatin...

Nucleation control system and method leading to enhanced boiling ba...

Thermal storage for high load short duration cooling

System for cooling server boards in a data center

Heat dissipation system and an associated method thereof

Patents Applicationslast 30 patents

ELECTRONIC DEVICES WITH A LOOPED THERMAL MODULE HAVING A UNIDIRECTI...

HEAT DISSIPATION SYSTEM, POWER SUPPLY SYSTEM, AND CHARGING PILE

SYSTEMS AND METHODS FOR COOLING ELECTRONIC DEVICES

DATA CENTER COOLING SYSTEM, CONTROL METHOD, AND DATA CENTER

POWER ELECTRONICS COOLING LOOP FOR REFRIGERANT COMPRESSOR

IMMERSION COOLING DEVICE

Air Conditioner for Sealed Enclosures

OPTIMIZED AND AUTOMATED DYNAMIC THERMAL REGULATION METHOD AND APPAR...

APPARATUS AND METHOD FOR CONDENSATION PREVENTION FOR 2-PHASE COOLIN...

DISPLAY DEVICES

HEAT EXCHANGE DEVICE AND HEAT EXCHANGE SYSTEM

METHOD AND APPARATUS FOR A PUMPED LIQUID COOLING SYSTEM USING A PHA...

IMMERSION LIQUID COOLING DEVICE

REFRIGERATION CYCLE APPARATUS

EVAPORATIVE THERMAL MANAGEMENT SYSTEMS AND METHODS

PUMP-DRIVEN TWO-PHASE LIQUID COOLING SYSTEM, AND LIQUID SUPPLEMENTA...

INTEGRATED REFRIGERATION APPARATUS

METHOD AND APPARATUS FOR AN ION EMITTER-ASSISTED HEATPIPE

COOLING SYSTEM

SCALABLE COOLING ARCHITECTURE FOR LIQUID AND AIR COOLING

SERVER WITH HYBRID THERMAL MANAGEMENT SYSTEM

A TANK FOR HEAT DISSIPATION AND A COOLING SYSTEM INCLUDING THE SAME

THERMAL MANAGEMENT DEVICE FOR CIRCUIT BREAKERS

CONTAINER DATA CENTER AND REFRIGERATION CONTROL METHOD THEREOF

ANGLED AND STEPPED FACEPLATE FOR TELECOMMUNICATIONS AND NETWORKING...

REFRIGERATION SYSTEM AND DEVICE PROVIDED WITH REFRIGERATION APPARATUS

COOLING SYSTEM WITH IN-SERIES HIGH-TEMPERATURE AND LOW-TEMPERATURE...

VAPOR CHAMBER STRUCTURE

System for the Reuse of Heat in a Data Center

COOLING APPARATUS FOR SUPERCONDUCTING FAULT CURRENT LIMITER