Evaporators

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CPC
H05K7/20309

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/20309Evaporators

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Joint, cooling system, and computer apparatus
- Patent number 12,253,199
- Issue date Mar 18, 2025
- Huawei Technologies Co., Ltd.
- Xinhu Gong
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Tank for heat dissipation and a cooling system including the same
- Patent number 12,245,406
- Issue date Mar 4, 2025
- FIRMUS METAL TECHNOLOGIES SINGAPORE PTE LTD
- Jonathan Levee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Refrigeration system for data center
- Patent number 12,238,902
- Issue date Feb 25, 2025
- BEIJING BAIDU NETCOM SCIENCE TECHNOLOGY CO., LTD.
- Zhiming Luo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Immersion cooling for integrated circuit devices
- Patent number 12,238,892
- Issue date Feb 25, 2025
- Intel Corporation
- Raanan Sover
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Intelligent low pressure two-phase cold plate with flow stabilizati...
- Patent number 12,238,895
- Issue date Feb 25, 2025
- NVIDIA Corporation
- Ali Heydari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for cooling of superconducting power transmissi...
- Patent number 12,232,298
- Issue date Feb 18, 2025
- VEIR, Inc.
- Stephen Paul Ashworth
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Air transportable modular shipping container for data centers
- Patent number 12,213,275
- Issue date Jan 28, 2025
- Switch, LTD.
- Rob Roy
- E04 - BUILDING
Information Patent Grant
Method for manufacturing vapor chamber
- Patent number 12,213,284
- Issue date Jan 28, 2025
- Jentech Precision Industrial Co., LTD.
- Chun-Ta Yeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for an ion emitter-assisted heatpipe
- Patent number 12,204,385
- Issue date Jan 21, 2025
- Dell Products L.P.
- Qinghong He
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Housing comprising a composite wall integrating at least one coolin...
- Patent number 12,207,442
- Issue date Jan 21, 2025
- SAFRAN ELECTRONICS & DEFENSE
- Muriel Sabah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation device for electronic element
- Patent number 12,178,015
- Issue date Dec 24, 2024
- KMW Inc.
- Duk Yong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor chamber and manufacturing method of the same
- Patent number 12,173,968
- Issue date Dec 24, 2024
- Cooler Master Co., Ltd.
- Chi-Lung Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermal management device for circuit breakers
- Patent number 12,171,086
- Issue date Dec 17, 2024
- EATON INTELLIGENT POWER LIMITED
- Ankit Bhagat
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
System and method to help mitigate heat in an electronic device
- Patent number 12,150,280
- Issue date Nov 19, 2024
- Intel Corporation
- Baomin Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hybrid heat sink
- Patent number 12,150,277
- Issue date Nov 19, 2024
- SHENZHEN ENVICOOL TECHNOLOGY CO., LTD
- Viacheslav Stetsyuk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling apparatus for electronic element
- Patent number 12,144,149
- Issue date Nov 12, 2024
- KMW Inc.
- Duk Yong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for vapor-compressed cooling
- Patent number 12,144,151
- Issue date Nov 12, 2024
- Quanta Computer Inc.
- Chao-Jung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipating device
- Patent number 12,144,150
- Issue date Nov 12, 2024
- VAST GLORY ELECTRONIC & HARDWARE & PLASTIC (HUI ZHOU) LTD
- Xiao-Yao Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat-activated pump with integrated evaporator for electronic chip...
- Patent number 12,133,363
- Issue date Oct 29, 2024
- Hamfop Technologies LLC
- Mudasir Ahmad
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Active/passive cooling system
- Patent number 12,127,380
- Issue date Oct 22, 2024
- Munters Corporation
- Michael Boucher
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Composite cooling system and data center
- Patent number 12,127,367
- Issue date Oct 22, 2024
- HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
- Jinliang Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3-D structured two-phase cooling boilers with nano structured boili...
- Patent number 12,120,851
- Issue date Oct 15, 2024
- Microsoft Technology Licensing, LLC
- Dennis Trieu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vapor chamber and manufacturing method of the same
- Patent number 12,117,244
- Issue date Oct 15, 2024
- Cooler Master Co., Ltd.
- Chi-Lung Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling module and electronic apparatus
- Patent number 12,120,848
- Issue date Oct 15, 2024
- Lenovo (Singapore) Pte. Ltd.
- Hao-Yu Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High-availability liquid cooling system for chip and server
- Patent number 12,114,468
- Issue date Oct 8, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling of power semiconductors
- Patent number 12,107,032
- Issue date Oct 1, 2024
- ABB Schweiz AG
- Colin Tschida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling device for use in alternating magnetic fields, coil arrange...
- Patent number 12,095,347
- Issue date Sep 17, 2024
- Airbus (S.A.S.)
- Ludovic Ybanez
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Cooling system in electronics cabinet comprising thermally coupled...
- Patent number 12,096,602
- Issue date Sep 17, 2024
- Pfannenberg GmbH
- Russell Fuller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Server and cooling system for enhanced immersion cooling
- Patent number 12,089,366
- Issue date Sep 10, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling system and data center
- Patent number 12,089,377
- Issue date Sep 10, 2024
- HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
- Jian Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
THERMOSIPHON FOR COMPUTING COMPONENTS
- Publication number 20250089209
- Publication date Mar 13, 2025
- ZT Group Int’l, Inc. dba ZT Systems
- Ting Yu Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING VAPOR CHAMBER
- Publication number 20250089210
- Publication date Mar 13, 2025
- Jentech Precision Industrial Co., LTD.
- Chun-Ta YEH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR COOLING
- Publication number 20250089212
- Publication date Mar 13, 2025
- Nokia Technologies Oy
- Raffaele Luca AMALFI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NOVEL HEAT PIPE CONFIGURATIONS
- Publication number 20250089213
- Publication date Mar 13, 2025
- Honeywell International Inc.
- Tao Liu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Integrated Vapor Chamber for Electronic Devices
- Publication number 20250081397
- Publication date Mar 6, 2025
- Google LLC
- Eric Chuang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Implementation of Two-Phase Cold Plate Loops with Design Features t...
- Publication number 20250081405
- Publication date Mar 6, 2025
- Seguente, Inc.
- Ryan Enright
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ACTIVE/PASSIVE COOLING SYSTEM WITH PUMPED REFRIGERANT
- Publication number 20250071943
- Publication date Feb 27, 2025
- Munters Corporation
- Wei Fang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID COOLING SYSTEM FOR DATA CENTER AND CONTROL METHOD THEREOF
- Publication number 20250063702
- Publication date Feb 20, 2025
- Hebei Qinhuai Data Co., Limited.
- Binghua ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pumped Two-Phase Cooling of Aircraft Electronics
- Publication number 20250060168
- Publication date Feb 20, 2025
- The Boeing Company
- Michael F. Stoia
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
LIQUID COOLING SYSTEM FOR DATA CENTER, CONTROL METHOD, AND EDGE DAT...
- Publication number 20250063701
- Publication date Feb 20, 2025
- Hebei Qinhuai Data Co., Limited.
- Binghua ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EDGE DATA CENTER
- Publication number 20250063703
- Publication date Feb 20, 2025
- Hebei Qinhuai Data Co., Limited.
- Binghua ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REFRIGERATION DEVICE AND DATA CENTER
- Publication number 20250048602
- Publication date Feb 6, 2025
- Hebei Qinhuai Data Co., Limited.
- Binghua ZHANG
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
SYSTEM AND METHOD TO HELP MITIGATE HEAT IN AN ELECTRONIC DEVICE
- Publication number 20250048596
- Publication date Feb 6, 2025
- Intel Corporation
- Baomin Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WATER-COOLED HEAT DISSIPATION DEVICE
- Publication number 20250040091
- Publication date Jan 30, 2025
- YUNG SHEN SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROWETTING AND THERMOELECTRICS ASSISTED TWO PHASE COOLING OF PO...
- Publication number 20250024641
- Publication date Jan 16, 2025
- HAMILTON SUNDSTRAND CORPORATION
- Debabrata Pal
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL GROUND PLANE WITH VARIABLE IONIZED FLUID FLOW CONTROL FROM...
- Publication number 20250024643
- Publication date Jan 16, 2025
- Intel Corporation
- Jeff Ku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING MODULE ASSEMBLY FOR POLE-MOUNTED NETWORK NODE
- Publication number 20250008682
- Publication date Jan 2, 2025
- Telefonaktiebolaget LM Ericsson (publ)
- Ulf AHLBERG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING SYSTEM FOR ELECTRONIC COMPONENT RACKS
- Publication number 20250008700
- Publication date Jan 2, 2025
- JJ COOLING INNOVATION SÀRL
- John R. Thome
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VAPOR CHAMBER AND MANUFACTURING METHOD OF THE SAME
- Publication number 20250003693
- Publication date Jan 2, 2025
- Cooler Master Co., Ltd.
- Chi-Lung CHEN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
3-D STRUCTURED TWO-PHASE COOLING BOILERS WITH NANO STRUCTURED BOILI...
- Publication number 20240431075
- Publication date Dec 26, 2024
- Microsoft Technology Licensing, LLC
- Dennis TRIEU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICES WITH A LOOPED THERMAL MODULE HAVING A UNIDIRECTI...
- Publication number 20240397665
- Publication date Nov 28, 2024
- Apple Inc.
- Jifang TIAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION SYSTEM, POWER SUPPLY SYSTEM, AND CHARGING PILE
- Publication number 20240389283
- Publication date Nov 21, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Zhisheng LIAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR COOLING ELECTRONIC DEVICES
- Publication number 20240389277
- Publication date Nov 21, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Danny J. Lohan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DATA CENTER COOLING SYSTEM, CONTROL METHOD, AND DATA CENTER
- Publication number 20240381589
- Publication date Nov 14, 2024
- Hebei Qinhuai Data Co., Limited.
- Binghua ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER ELECTRONICS COOLING LOOP FOR REFRIGERANT COMPRESSOR
- Publication number 20240381595
- Publication date Nov 14, 2024
- Myongsok SONG
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
IMMERSION COOLING DEVICE
- Publication number 20240381587
- Publication date Nov 14, 2024
- Fulian Precision Electronics (Tianjin) Co., LTD.
- TSUNG-LIN LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Air Conditioner for Sealed Enclosures
- Publication number 20240365501
- Publication date Oct 31, 2024
- Hoffman Enclosures Inc.
- Michael Koehler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTIMIZED AND AUTOMATED DYNAMIC THERMAL REGULATION METHOD AND APPAR...
- Publication number 20240365513
- Publication date Oct 31, 2024
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPARATUS AND METHOD FOR CONDENSATION PREVENTION FOR 2-PHASE COOLIN...
- Publication number 20240361357
- Publication date Oct 31, 2024
- Advantest Corporation
- Peter Weixiang ZHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICES
- Publication number 20240357779
- Publication date Oct 24, 2024
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Wenqiang WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Evaporators

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Joint, cooling system, and computer apparatus

Tank for heat dissipation and a cooling system including the same

Refrigeration system for data center

Immersion cooling for integrated circuit devices

Intelligent low pressure two-phase cold plate with flow stabilizati...

Systems and methods for cooling of superconducting power transmissi...

Air transportable modular shipping container for data centers

Method for manufacturing vapor chamber

Method and apparatus for an ion emitter-assisted heatpipe

Housing comprising a composite wall integrating at least one coolin...

Heat dissipation device for electronic element

Vapor chamber and manufacturing method of the same

Thermal management device for circuit breakers

System and method to help mitigate heat in an electronic device

Hybrid heat sink

Cooling apparatus for electronic element

Systems and methods for vapor-compressed cooling

Heat dissipating device

Heat-activated pump with integrated evaporator for electronic chip...

Active/passive cooling system

Composite cooling system and data center

3-D structured two-phase cooling boilers with nano structured boili...

Vapor chamber and manufacturing method of the same

Cooling module and electronic apparatus

High-availability liquid cooling system for chip and server

Cooling of power semiconductors

Cooling device for use in alternating magnetic fields, coil arrange...

Cooling system in electronics cabinet comprising thermally coupled...

Server and cooling system for enhanced immersion cooling

Cooling system and data center

Patents Applicationslast 30 patents

THERMOSIPHON FOR COMPUTING COMPONENTS

METHOD FOR MANUFACTURING VAPOR CHAMBER

APPARATUS FOR COOLING

NOVEL HEAT PIPE CONFIGURATIONS

Integrated Vapor Chamber for Electronic Devices

Implementation of Two-Phase Cold Plate Loops with Design Features t...

ACTIVE/PASSIVE COOLING SYSTEM WITH PUMPED REFRIGERANT

LIQUID COOLING SYSTEM FOR DATA CENTER AND CONTROL METHOD THEREOF

Pumped Two-Phase Cooling of Aircraft Electronics

LIQUID COOLING SYSTEM FOR DATA CENTER, CONTROL METHOD, AND EDGE DAT...

EDGE DATA CENTER

REFRIGERATION DEVICE AND DATA CENTER

SYSTEM AND METHOD TO HELP MITIGATE HEAT IN AN ELECTRONIC DEVICE

WATER-COOLED HEAT DISSIPATION DEVICE

ELECTROWETTING AND THERMOELECTRICS ASSISTED TWO PHASE COOLING OF PO...

THERMAL GROUND PLANE WITH VARIABLE IONIZED FLUID FLOW CONTROL FROM...

COOLING MODULE ASSEMBLY FOR POLE-MOUNTED NETWORK NODE

COOLING SYSTEM FOR ELECTRONIC COMPONENT RACKS

VAPOR CHAMBER AND MANUFACTURING METHOD OF THE SAME

3-D STRUCTURED TWO-PHASE COOLING BOILERS WITH NANO STRUCTURED BOILI...

ELECTRONIC DEVICES WITH A LOOPED THERMAL MODULE HAVING A UNIDIRECTI...

HEAT DISSIPATION SYSTEM, POWER SUPPLY SYSTEM, AND CHARGING PILE

SYSTEMS AND METHODS FOR COOLING ELECTRONIC DEVICES

DATA CENTER COOLING SYSTEM, CONTROL METHOD, AND DATA CENTER

POWER ELECTRONICS COOLING LOOP FOR REFRIGERANT COMPRESSOR

IMMERSION COOLING DEVICE

Air Conditioner for Sealed Enclosures

OPTIMIZED AND AUTOMATED DYNAMIC THERMAL REGULATION METHOD AND APPAR...

APPARATUS AND METHOD FOR CONDENSATION PREVENTION FOR 2-PHASE COOLIN...

DISPLAY DEVICES