Fillers Particles Fibers Reinforcement materials

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/02Fillers Particles Fibers Reinforcement materials

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Patents Grantslast 30 patents

Information Patent Grant
Direct printing and writing using undercooled metallic core-shell p...
- Patent number 12,226,831
- Issue date Feb 18, 2025
- Iowa State University Research Foundation, Inc.
- Martin Thuo
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for processing metal nanowire ink with metal ions
- Patent number 12,227,661
- Issue date Feb 18, 2025
- EKC Technology, Inc.
- Ying-Syi Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wiring substrate
- Patent number 12,219,704
- Issue date Feb 4, 2025
- Ibiden Co., Ltd.
- Naoki Mizutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, prepreg, film with resin, sheet of metal foil wi...
- Patent number 12,209,160
- Issue date Jan 28, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Daisuke Nii
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for manufacturing dielectric sheet, method for manufacturing...
- Patent number 12,213,249
- Issue date Jan 28, 2025
- Sumitomo Electric Industries, Ltd.
- Shingo Kaimori
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Circuit board
- Patent number 12,207,404
- Issue date Jan 21, 2025
- LG Innotek Co., Ltd
- Yong Suk Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Beveled overburden for vias and method of making the same
- Patent number 12,207,405
- Issue date Jan 21, 2025
- Corning Incorporated
- Dhananjay Joshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive garment fastening product
- Patent number 12,201,167
- Issue date Jan 21, 2025
- Prym Intimates Group Limited
- Heenatikumbure Kavisekara Mudiyanselage Anjana Piushan Kavisekara
- A41 - WEARING APPAREL
Information Patent Grant
Glass cloth, prepreg, and printed wiring board
- Patent number 12,193,155
- Issue date Jan 7, 2025
- Asahi Kasei Kabushiki Kaisha
- Hiroyuki Honma
- D10 - INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEX...
Information Patent Grant
Electronic device
- Patent number 12,185,461
- Issue date Dec 31, 2024
- Innolux Corporation
- Cheng-Chi Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper-clad laminate and method of forming the same
- Patent number 12,173,201
- Issue date Dec 24, 2024
- VERSIV COMPOSITES LIMITED
- Jennifer Adamchuk
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Connected structure of substrate and carbon nanotube wire
- Patent number 12,166,324
- Issue date Dec 10, 2024
- Furukawa Electric Co., Ltd.
- Satoshi Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,156,329
- Issue date Nov 26, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seong Ho Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 12,144,122
- Issue date Nov 12, 2024
- Sumitomo Electric Industries Ltd.
- Shoichiro Sakai
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Resin composition, prepreg, resin sheet, laminate, metal foil-clad...
- Patent number 12,134,696
- Issue date Nov 5, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Takaaki Ogashiwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal base substrate, electronic component mounting substrate
- Patent number 12,127,342
- Issue date Oct 22, 2024
- Mitsubishi Materials Corporation
- Fumiaki Ishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing textile with conductive yarns and integrate...
- Patent number 12,120,823
- Issue date Oct 15, 2024
- Myant Inc.
- Tony Chahine
- D04 - BRAIDING LACE-MAKING KNITTING TRIMMINGS NON-WOVEN FABRICS
Information Patent Grant
Methods of dispensing a metallic nanoparticle composition from a no...
- Patent number 12,101,893
- Issue date Sep 24, 2024
- XTPL S.A.
- Mateusz Zając
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Wiring board
- Patent number 12,101,894
- Issue date Sep 24, 2024
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,101,878
- Issue date Sep 24, 2024
- LG Innotek Co., Ltd
- Dong Hwa Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ink composition, method for forming a conductive member, and conduc...
- Patent number 12,091,567
- Issue date Sep 17, 2024
- Kuprion Inc.
- Zhenggang Li
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Hybrid nanosilver/liquid metal ink composition and uses thereof
- Patent number 12,096,554
- Issue date Sep 17, 2024
- Xerox Corporation
- Naveen Chopra
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Nanocomposite material for ultraviolet curable direct write semicon...
- Patent number 12,096,561
- Issue date Sep 17, 2024
- Raytheon Company
- Craig A. Armiento
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dielectric substrate and method of forming the same
- Patent number 12,049,577
- Issue date Jul 30, 2024
- VERSIV COMPOSITES LIMITED
- Jennifer Adamchuk
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Transparent conductive film
- Patent number 12,046,392
- Issue date Jul 23, 2024
- Chasm Advanced Materials Inc.
- Robert F. Praino
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Circuit structure
- Patent number 12,035,467
- Issue date Jul 9, 2024
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low dielectric substrate for high-speed millimeter-wave communication
- Patent number 12,035,461
- Issue date Jul 9, 2024
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical device having heat dissipation structure using filler an...
- Patent number 12,028,985
- Issue date Jul 2, 2024
- SOLUM CO., LTD.
- Jun Kyu Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Prepreg, metal-clad laminate, and wiring board
- Patent number 12,022,611
- Issue date Jun 25, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yasunori Hoshino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 11,997,801
- Issue date May 28, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Woo Seok Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HEAT SPREADING COATING FOR ELECTRONIC ASSEMBLIES
- Publication number 20250071883
- Publication date Feb 27, 2025
- Elbit Systems Ltd.
- Reut BEN ZAKEN (BITTON)
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250071892
- Publication date Feb 27, 2025
- Sumitomo Electric Industries, Ltd.
- Kenji TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE, FABRIC SENSOR, WEARABLE ELECTRONIC DEVICE INCLUDING TH...
- Publication number 20250063654
- Publication date Feb 20, 2025
- Yale University
- LINA SANCHEZ-BOTERO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED WIRING BOARD AND METHOD OF MANUFACTURING PRINTED WIRING BOARD
- Publication number 20250063651
- Publication date Feb 20, 2025
- Sumitomo Electric Industries, Ltd.
- Kazuhiro MIYATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SMART WEARABLE CLOTHING INCLUDING STRETCHABLE CIRCUIT ELECTRODE AND...
- Publication number 20250063656
- Publication date Feb 20, 2025
- MIDAS H&T INC.
- Se Yun CHANG
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SUBSTRATE
- Publication number 20250056729
- Publication date Feb 13, 2025
- MURATA MANUFACTURING CO., LTD.
- Ryuichi KUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FIBER WEAVE IN A PRINTED CIRCUIT BOARD SUBSTRATE
- Publication number 20250048549
- Publication date Feb 6, 2025
- Dell Products L.P.
- Sanjay Kumar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COATING AGENT AND METHOD FOR MANUFACTURING MODULE USING THE COATING...
- Publication number 20250048560
- Publication date Feb 6, 2025
- SEKISUI CHEMICAL CO., LTD.
- Satoru KUROZUMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20250048562
- Publication date Feb 6, 2025
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ARCHITECTED LIQUID METAL NETWORKS AND PROCESSES OF MAKING AND USING...
- Publication number 20250040041
- Publication date Jan 30, 2025
- Government of the United States as Represented by the Secretary of the Air Force
- Carl J. Thrasher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ARTICLE WITH CATALYTIC INK AND ELECTRICALLY-CONDUCTIVE PATTERN
- Publication number 20250040044
- Publication date Jan 30, 2025
- James S. Honan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATED VIA-IN-VIA VERTICAL CONNECTION
- Publication number 20250031318
- Publication date Jan 23, 2025
- Nokia Solutions and Networks Oy
- Paul BROWN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC WIRING MEMBER
- Publication number 20250024592
- Publication date Jan 16, 2025
- NGK Electronics Devices, Inc.
- Hiroshi KOUNO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier and Method for Manufacturing the Same Using a Des...
- Publication number 20250024611
- Publication date Jan 16, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Nina WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BIODEGRADABLE COMPOSITE MATERIAL
- Publication number 20250019505
- Publication date Jan 16, 2025
- CTK RESEARCH AND DEVELOPMENT CANADA LTD.
- Jitendra Panda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC WIRING MEMBER
- Publication number 20250024599
- Publication date Jan 16, 2025
- NGK Electronics Devices, Inc.
- Hiroshi KOUNO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250008645
- Publication date Jan 2, 2025
- IBIDEN CO., LTD.
- Youhong WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CROSSTALK NOISE REDUCTION BY HIGH PERMEABILITY INSULATOR
- Publication number 20250006647
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Hiroyuki Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250008652
- Publication date Jan 2, 2025
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240431031
- Publication date Dec 26, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20240422896
- Publication date Dec 19, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chulmun Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20240407088
- Publication date Dec 5, 2024
- KYOCERA CORPORATION
- Hidetoshi YUGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240407094
- Publication date Dec 5, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RADIATION-SENSITIVE COMPOSITION FOR FORMING INSULATION FILM, RESIN...
- Publication number 20240389227
- Publication date Nov 21, 2024
- JSR Corporation
- Ryouji TATARA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKA...
- Publication number 20240381529
- Publication date Nov 14, 2024
- Resonac Corporation
- Shunsuke OTAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240365468
- Publication date Oct 31, 2024
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND MANUFACTURING METHOD THEREFOR
- Publication number 20240357739
- Publication date Oct 24, 2024
- TOPPAN Holdings Inc.
- Tomoyuki Ishii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20240357741
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Yeonkyung CHUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Transparent Conductive Film
- Publication number 20240355501
- Publication date Oct 24, 2024
- Chasm Advanced Materials, Inc.
- Robert F. Praino
- B82 - NANO-TECHNOLOGY
Information Patent Application
COMPOSITE POLYIMIDE SUBSTRATE, COMPOSITE POLYIMIDE COMPOSITION, AND...
- Publication number 20240343027
- Publication date Oct 17, 2024
- LG ELECTRONICS INC.
- Takashi KINO
- B32 - LAYERED PRODUCTS

Fillers Particles Fibers Reinforcement materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Direct printing and writing using undercooled metallic core-shell p...

Method for processing metal nanowire ink with metal ions

Wiring substrate

Resin composition, prepreg, film with resin, sheet of metal foil wi...

Method for manufacturing dielectric sheet, method for manufacturing...

Circuit board

Beveled overburden for vias and method of making the same

Conductive garment fastening product

Glass cloth, prepreg, and printed wiring board

Electronic device

Copper-clad laminate and method of forming the same

Connected structure of substrate and carbon nanotube wire

Printed circuit board

Method of manufacturing printed circuit board

Resin composition, prepreg, resin sheet, laminate, metal foil-clad...

Metal base substrate, electronic component mounting substrate

Method of manufacturing textile with conductive yarns and integrate...

Methods of dispensing a metallic nanoparticle composition from a no...

Wiring board

Circuit board

Ink composition, method for forming a conductive member, and conduc...

Hybrid nanosilver/liquid metal ink composition and uses thereof

Nanocomposite material for ultraviolet curable direct write semicon...

Dielectric substrate and method of forming the same

Transparent conductive film

Circuit structure

Low dielectric substrate for high-speed millimeter-wave communication

Electrical device having heat dissipation structure using filler an...

Prepreg, metal-clad laminate, and wiring board

Printed circuit board

Patents Applicationslast 30 patents

HEAT SPREADING COATING FOR ELECTRONIC ASSEMBLIES

PRINTED WIRING BOARD

STRETCHABLE, FABRIC SENSOR, WEARABLE ELECTRONIC DEVICE INCLUDING TH...

PRINTED WIRING BOARD AND METHOD OF MANUFACTURING PRINTED WIRING BOARD

SMART WEARABLE CLOTHING INCLUDING STRETCHABLE CIRCUIT ELECTRODE AND...

SUBSTRATE

FIBER WEAVE IN A PRINTED CIRCUIT BOARD SUBSTRATE

COATING AGENT AND METHOD FOR MANUFACTURING MODULE USING THE COATING...

WIRING SUBSTRATE

ARCHITECTED LIQUID METAL NETWORKS AND PROCESSES OF MAKING AND USING...

ARTICLE WITH CATALYTIC INK AND ELECTRICALLY-CONDUCTIVE PATTERN

PLATED VIA-IN-VIA VERTICAL CONNECTION

CERAMIC WIRING MEMBER

Component Carrier and Method for Manufacturing the Same Using a Des...

BIODEGRADABLE COMPOSITE MATERIAL

CERAMIC WIRING MEMBER

PRINTED WIRING BOARD

CROSSTALK NOISE REDUCTION BY HIGH PERMEABILITY INSULATOR

PRINTED WIRING BOARD

PRINTED WIRING BOARD

CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

WIRING BOARD

PRINTED WIRING BOARD

RADIATION-SENSITIVE COMPOSITION FOR FORMING INSULATION FILM, RESIN...

METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKA...

WIRING SUBSTRATE

WIRING BOARD AND MANUFACTURING METHOD THEREFOR

PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME

Transparent Conductive Film

COMPOSITE POLYIMIDE SUBSTRATE, COMPOSITE POLYIMIDE COMPOSITION, AND...