Fillers Particles Fibers Reinforcement materials

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H05K2201/02

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/02Fillers Particles Fibers Reinforcement materials

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Patents Grantslast 30 patents

Information Patent Grant
Circuit board
- Patent number 12,369,248
- Issue date Jul 22, 2025
- LG Innotek Co., Ltd
- Min Young Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric, copper clad laminate, circuit board, method for manufac...
- Patent number 12,336,096
- Issue date Jun 17, 2025
- Nippon Pillar Packing Co., Ltd.
- Manami Noda
- B32 - LAYERED PRODUCTS
Information Patent Grant
Laminate, bonding method, and intermediate product for circuit board
- Patent number 12,336,117
- Issue date Jun 17, 2025
- NHK Spring Co., Ltd.
- Takeshi Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 12,328,814
- Issue date Jun 10, 2025
- TANAZAWA HAKKOSHA CO., LTD.
- Keiichiro Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermosetting resin composition, cured product, and printed wiring...
- Patent number 12,319,865
- Issue date Jun 3, 2025
- TAIYO HOLDINGS CO., LTD.
- Yoshikazu Daigo
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Preparation method for copper clad laminate having low dielectric c...
- Patent number 12,311,646
- Issue date May 27, 2025
- JIANGMEN DEZHONGTAI ENGINEERING PLASTICS TECHNOLOGY CO., LTD.
- Yonghua Liang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Wiring substrate
- Patent number 12,309,920
- Issue date May 20, 2025
- Ibiden Co., Ltd.
- Shogo Fukui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, copper foil with resin, dielectric layer, copper...
- Patent number 12,297,354
- Issue date May 13, 2025
- Mitsui Mining & Smelting Co., Ltd.
- Yoshihiro Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 12,289,829
- Issue date Apr 29, 2025
- Ibiden Co., Ltd.
- Jun Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminate, laminate with buildup layer, laminate with metal foil, an...
- Patent number 12,284,755
- Issue date Apr 22, 2025
- SEKISUI KASEI CO., LTD.
- Koichiro Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transparent composite nanowire electrodes
- Patent number 12,284,756
- Issue date Apr 22, 2025
- Massachusetts Institute of Technology
- Jeffrey C. Grossman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed wiring board
- Patent number 12,279,368
- Issue date Apr 15, 2025
- Ibiden Co., Ltd.
- Satoru Kawai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stretchable interconnects for flexible electronic surfaces
- Patent number 12,278,022
- Issue date Apr 15, 2025
- Alpha Assembly Solutions Inc.
- Narahari Pujari
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Wiring board and display device
- Patent number 12,279,378
- Issue date Apr 15, 2025
- Kyocera Corporation
- Nobuyuki Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Machine-knittable conductive hybrid yarns
- Patent number 12,264,421
- Issue date Apr 1, 2025
- Propel, LLC
- Clare King
- D02 - YARNS MECHANICAL FINISHING OF YARNS OR ROPES WARPING OR BEAMING
Information Patent Grant
Curable compositions
- Patent number 12,258,445
- Issue date Mar 25, 2025
- AGC Multi Material America, Inc.
- Laibao Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Extension structure of flexible substrates with conductive wires th...
- Patent number 12,262,479
- Issue date Mar 25, 2025
- UNEO INC.
- Chih-Sheng Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and wiring board manufacturing method
- Patent number 12,250,773
- Issue date Mar 11, 2025
- Shinko Electric Industries Co., Ltd.
- Toshiaki Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded printed circuit board
- Patent number 12,245,376
- Issue date Mar 4, 2025
- Shinko Electric Industries Co., Ltd.
- Seiji Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct printing and writing using undercooled metallic core-shell p...
- Patent number 12,226,831
- Issue date Feb 18, 2025
- Iowa State University Research Foundation, Inc.
- Martin Thuo
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for processing metal nanowire ink with metal ions
- Patent number 12,227,661
- Issue date Feb 18, 2025
- EKC Technology, Inc.
- Ying-Syi Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wiring substrate
- Patent number 12,219,704
- Issue date Feb 4, 2025
- Ibiden Co., Ltd.
- Naoki Mizutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, prepreg, film with resin, sheet of metal foil wi...
- Patent number 12,209,160
- Issue date Jan 28, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Daisuke Nii
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for manufacturing dielectric sheet, method for manufacturing...
- Patent number 12,213,249
- Issue date Jan 28, 2025
- Sumitomo Electric Industries, Ltd.
- Shingo Kaimori
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Circuit board
- Patent number 12,207,404
- Issue date Jan 21, 2025
- LG Innotek Co., Ltd
- Yong Suk Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Beveled overburden for vias and method of making the same
- Patent number 12,207,405
- Issue date Jan 21, 2025
- Corning Incorporated
- Dhananjay Joshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive garment fastening product
- Patent number 12,201,167
- Issue date Jan 21, 2025
- Prym Intimates Group Limited
- Heenatikumbure Kavisekara Mudiyanselage Anjana Piushan Kavisekara
- A41 - WEARING APPAREL
Information Patent Grant
Glass cloth, prepreg, and printed wiring board
- Patent number 12,193,155
- Issue date Jan 7, 2025
- Asahi Kasei Kabushiki Kaisha
- Hiroyuki Honma
- D10 - INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEX...
Information Patent Grant
Electronic device
- Patent number 12,185,461
- Issue date Dec 31, 2024
- Innolux Corporation
- Cheng-Chi Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper-clad laminate and method of forming the same
- Patent number 12,173,201
- Issue date Dec 24, 2024
- VERSIV COMPOSITES LIMITED
- Jennifer Adamchuk
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
METALLIZED RESIN FILM, PRINTED WIRING BOARD, CURRENT COLLECTOR FILM...
- Publication number 20250230550
- Publication date Jul 17, 2025
- Kaneka Corporation
- Takashi Itoh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COMPOSITION, FLUORORESIN SHEET, AND METHOD FOR PRODUCING SAME
- Publication number 20250230298
- Publication date Jul 17, 2025
- DAIKIN INDUSTRIES, LTD.
- Yuki UEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS CLOTH, PREPREG, AND PRINTED WIRING BOARD
- Publication number 20250234457
- Publication date Jul 17, 2025
- Asahi Kasei Kabushiki Kaisha
- Amane HIROSE
- D03 - WEAVING
Information Patent Application
CONDUCTIVE ADHESIVE LAYER AND HEAT DISSIPATION STRUCTURE
- Publication number 20250223471
- Publication date Jul 10, 2025
- Tatsuta Electric Wire & Cable Co., Ltd.
- Tomohiro NAGATAKE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN COMPOSITION, PREPREG, FILM WITH RESIN, SHEET OF METAL FOIL WI...
- Publication number 20250223423
- Publication date Jul 10, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Akito HASHIMOTO
- B32 - LAYERED PRODUCTS
Information Patent Application
WIRING BOARD
- Publication number 20250220813
- Publication date Jul 3, 2025
- KYOCERA CORPORATION
- Hiroaki SANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SMART YARN AND METHOD FOR MANUFACTURING A YARN CONTAINING AN ELECTR...
- Publication number 20250207302
- Publication date Jun 26, 2025
- Siren Care, Inc.
- Jie Fu
- A41 - WEARING APPAREL
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250212336
- Publication date Jun 26, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Ki Ran PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250203767
- Publication date Jun 19, 2025
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20250203768
- Publication date Jun 19, 2025
- KYOCERA CORPORATION
- Makoto YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal Management in Circuit Board Assemblies
- Publication number 20250203753
- Publication date Jun 19, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL NANOWIRE INK FOR THE FORMATION OF TRANSPARENT CONDUCTIVE FILM...
- Publication number 20250188302
- Publication date Jun 12, 2025
- EKC Technology, Inc.
- Ying-Syi Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRING BOARD
- Publication number 20250185162
- Publication date Jun 5, 2025
- KYOCERA CORPORATION
- Hiroaki SANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL-COATED SUBSTRATES, INTERPOSERS, AND METHODS FOR PRODUCTION TH...
- Publication number 20250185156
- Publication date Jun 5, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREPREG AND USES OF THE SAME
- Publication number 20250176100
- Publication date May 29, 2025
- TAIWAN UNION TECHNOLOGY CORPORATION
- Jui-Hsiang TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ALTERNATIVE FOR FR-4 MATERIAL
- Publication number 20250168976
- Publication date May 22, 2025
- Papershell AB
- Anders BREITHOLTZ
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING SUBSTRATE
- Publication number 20250168972
- Publication date May 22, 2025
- IBIDEN CO., LTD.
- Haruhiko MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOSETTING RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATE, PRI...
- Publication number 20250163267
- Publication date May 22, 2025
- Masashi OJI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METALLIZED VIAS IN GLASS AND SILICON SUBSTRATES, INTERPOSERS, AND M...
- Publication number 20250159807
- Publication date May 15, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20250159799
- Publication date May 15, 2025
- KYOCERA CORPORATION
- Yuki TAKESHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING ME...
- Publication number 20250142722
- Publication date May 1, 2025
- Resonac Corporation
- Masashi OHKOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20250142724
- Publication date May 1, 2025
- KYOCERA CORPORATION
- Toshifumi HIGASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROPARTICLE-FILLED LAMINATE MATERIAL
- Publication number 20250126708
- Publication date Apr 17, 2025
- Dell Products L.P.
- Sandor T. FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250126709
- Publication date Apr 17, 2025
- IBIDEN CO., LTD.
- Tomoyuki IKEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20250120016
- Publication date Apr 10, 2025
- KYOCERA CORPORATION
- Hiroaki SANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROLESS SEED LAYER DEPOSITION ON GLASS CORE SUBSTRATES
- Publication number 20250106997
- Publication date Mar 27, 2025
- Intel Corporation
- Ehsan ZAMANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS THROUGH GLASS VIAS (TGVS)
- Publication number 20250089156
- Publication date Mar 13, 2025
- Intel Corporation
- Mohamed R. SABER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250089164
- Publication date Mar 13, 2025
- InnoLux Corporation
- Cheng-Chi WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SPREADING COATING FOR ELECTRONIC ASSEMBLIES
- Publication number 20250071883
- Publication date Feb 27, 2025
- Elbit Systems Ltd.
- Reut BEN ZAKEN (BITTON)
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250071892
- Publication date Feb 27, 2025
- Sumitomo Electric Industries, Ltd.
- Kenji TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Fillers Particles Fibers Reinforcement materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board

Dielectric, copper clad laminate, circuit board, method for manufac...

Laminate, bonding method, and intermediate product for circuit board

Printed wiring board and method for manufacturing printed wiring board

Thermosetting resin composition, cured product, and printed wiring...

Preparation method for copper clad laminate having low dielectric c...

Wiring substrate

Resin composition, copper foil with resin, dielectric layer, copper...

Printed wiring board

Laminate, laminate with buildup layer, laminate with metal foil, an...

Transparent composite nanowire electrodes

Printed wiring board

Stretchable interconnects for flexible electronic surfaces

Wiring board and display device

Machine-knittable conductive hybrid yarns

Curable compositions

Extension structure of flexible substrates with conductive wires th...

Wiring board and wiring board manufacturing method

Embedded printed circuit board

Direct printing and writing using undercooled metallic core-shell p...

Method for processing metal nanowire ink with metal ions

Wiring substrate

Resin composition, prepreg, film with resin, sheet of metal foil wi...

Method for manufacturing dielectric sheet, method for manufacturing...

Circuit board

Beveled overburden for vias and method of making the same

Conductive garment fastening product

Glass cloth, prepreg, and printed wiring board

Electronic device

Copper-clad laminate and method of forming the same

Patents Applicationslast 30 patents

METALLIZED RESIN FILM, PRINTED WIRING BOARD, CURRENT COLLECTOR FILM...

COMPOSITION, FLUORORESIN SHEET, AND METHOD FOR PRODUCING SAME

GLASS CLOTH, PREPREG, AND PRINTED WIRING BOARD

CONDUCTIVE ADHESIVE LAYER AND HEAT DISSIPATION STRUCTURE

RESIN COMPOSITION, PREPREG, FILM WITH RESIN, SHEET OF METAL FOIL WI...

WIRING BOARD

SMART YARN AND METHOD FOR MANUFACTURING A YARN CONTAINING AN ELECTR...

PRINTED CIRCUIT BOARD

PRINTED WIRING BOARD

CERAMIC WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

Thermal Management in Circuit Board Assemblies

METAL NANOWIRE INK FOR THE FORMATION OF TRANSPARENT CONDUCTIVE FILM...

WIRING BOARD

METAL-COATED SUBSTRATES, INTERPOSERS, AND METHODS FOR PRODUCTION TH...

PREPREG AND USES OF THE SAME

ALTERNATIVE FOR FR-4 MATERIAL

ELECTRONIC COMPONENT MOUNTING SUBSTRATE

THERMOSETTING RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATE, PRI...

METALLIZED VIAS IN GLASS AND SILICON SUBSTRATES, INTERPOSERS, AND M...

WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING ME...

WIRING BOARD

MICROPARTICLE-FILLED LAMINATE MATERIAL

PRINTED WIRING BOARD

WIRING BOARD

ELECTROLESS SEED LAYER DEPOSITION ON GLASS CORE SUBSTRATES

LOW STRESS THROUGH GLASS VIAS (TGVS)

ELECTRONIC DEVICE

HEAT SPREADING COATING FOR ELECTRONIC ASSEMBLIES

PRINTED WIRING BOARD