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  • Information Patent Application

    WIRING BOARD

    • Publication number 20250120016
    • Publication date Apr 10, 2025
    • KYOCERA CORPORATION
    • Hiroaki SANO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTROLESS SEED LAYER DEPOSITION ON GLASS CORE SUBSTRATES

    • Publication number 20250106997
    • Publication date Mar 27, 2025
    • Intel Corporation
    • Ehsan ZAMANI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LOW STRESS THROUGH GLASS VIAS (TGVS)

    • Publication number 20250089156
    • Publication date Mar 13, 2025
    • Intel Corporation
    • Mohamed R. SABER
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE

    • Publication number 20250089164
    • Publication date Mar 13, 2025
    • InnoLux Corporation
    • Cheng-Chi WANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    HEAT SPREADING COATING FOR ELECTRONIC ASSEMBLIES

    • Publication number 20250071883
    • Publication date Feb 27, 2025
    • Elbit Systems Ltd.
    • Reut BEN ZAKEN (BITTON)
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD

    • Publication number 20250071892
    • Publication date Feb 27, 2025
    • Sumitomo Electric Industries, Ltd.
    • Kenji TAKAHASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    STRETCHABLE, FABRIC SENSOR, WEARABLE ELECTRONIC DEVICE INCLUDING TH...

    • Publication number 20250063654
    • Publication date Feb 20, 2025
    • Yale University
    • LINA SANCHEZ-BOTERO
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    PRINTED WIRING BOARD AND METHOD OF MANUFACTURING PRINTED WIRING BOARD

    • Publication number 20250063651
    • Publication date Feb 20, 2025
    • Sumitomo Electric Industries, Ltd.
    • Kazuhiro MIYATA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SMART WEARABLE CLOTHING INCLUDING STRETCHABLE CIRCUIT ELECTRODE AND...

    • Publication number 20250063656
    • Publication date Feb 20, 2025
    • MIDAS H&T INC.
    • Se Yun CHANG
    • A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
  • Information Patent Application

    SUBSTRATE

    • Publication number 20250056729
    • Publication date Feb 13, 2025
    • MURATA MANUFACTURING CO., LTD.
    • Ryuichi KUBO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FIBER WEAVE IN A PRINTED CIRCUIT BOARD SUBSTRATE

    • Publication number 20250048549
    • Publication date Feb 6, 2025
    • Dell Products L.P.
    • Sanjay Kumar
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COATING AGENT AND METHOD FOR MANUFACTURING MODULE USING THE COATING...

    • Publication number 20250048560
    • Publication date Feb 6, 2025
    • SEKISUI CHEMICAL CO., LTD.
    • Satoru KUROZUMI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE

    • Publication number 20250048562
    • Publication date Feb 6, 2025
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ARCHITECTED LIQUID METAL NETWORKS AND PROCESSES OF MAKING AND USING...

    • Publication number 20250040041
    • Publication date Jan 30, 2025
    • Government of the United States as Represented by the Secretary of the Air Force
    • Carl J. Thrasher
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ARTICLE WITH CATALYTIC INK AND ELECTRICALLY-CONDUCTIVE PATTERN

    • Publication number 20250040044
    • Publication date Jan 30, 2025
    • James S. Honan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PLATED VIA-IN-VIA VERTICAL CONNECTION

    • Publication number 20250031318
    • Publication date Jan 23, 2025
    • Nokia Solutions and Networks Oy
    • Paul BROWN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CERAMIC WIRING MEMBER

    • Publication number 20250024592
    • Publication date Jan 16, 2025
    • NGK Electronics Devices, Inc.
    • Hiroshi KOUNO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Component Carrier and Method for Manufacturing the Same Using a Des...

    • Publication number 20250024611
    • Publication date Jan 16, 2025
    • AT&S Austria Technologie & Systemtechnik AG
    • Nina WANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BIODEGRADABLE COMPOSITE MATERIAL

    • Publication number 20250019505
    • Publication date Jan 16, 2025
    • CTK RESEARCH AND DEVELOPMENT CANADA LTD.
    • Jitendra Panda
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CERAMIC WIRING MEMBER

    • Publication number 20250024599
    • Publication date Jan 16, 2025
    • NGK Electronics Devices, Inc.
    • Hiroshi KOUNO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CROSSTALK NOISE REDUCTION BY HIGH PERMEABILITY INSULATOR

    • Publication number 20250006647
    • Publication date Jan 2, 2025
    • International Business Machines Corporation
    • Hiroyuki Mori
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED WIRING BOARD

    • Publication number 20250008645
    • Publication date Jan 2, 2025
    • IBIDEN CO., LTD.
    • Youhong WU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD

    • Publication number 20250008652
    • Publication date Jan 2, 2025
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD

    • Publication number 20240431031
    • Publication date Dec 26, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

    • Publication number 20240422896
    • Publication date Dec 19, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Chulmun Kang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD

    • Publication number 20240407088
    • Publication date Dec 5, 2024
    • KYOCERA CORPORATION
    • Hidetoshi YUGAWA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD

    • Publication number 20240407094
    • Publication date Dec 5, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    RADIATION-SENSITIVE COMPOSITION FOR FORMING INSULATION FILM, RESIN...

    • Publication number 20240389227
    • Publication date Nov 21, 2024
    • JSR Corporation
    • Ryouji TATARA
    • G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
  • Information Patent Application

    METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKA...

    • Publication number 20240381529
    • Publication date Nov 14, 2024
    • Resonac Corporation
    • Shunsuke OTAKE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING SUBSTRATE

    • Publication number 20240365468
    • Publication date Oct 31, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR