TREA

Fillers Particles Fibers Reinforcement materials

Follow

Industry

  • CPC
  • H05K2201/02
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/02Fillers Particles Fibers Reinforcement materials
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
    • Publication number 20240422896
    • Publication date Dec 19, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Chulmun Kang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD
    • Publication number 20240407088
    • Publication date Dec 5, 2024
    • KYOCERA CORPORATION
    • Hidetoshi YUGAWA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20240407094
    • Publication date Dec 5, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    RADIATION-SENSITIVE COMPOSITION FOR FORMING INSULATION FILM, RESIN...
    • Publication number 20240389227
    • Publication date Nov 21, 2024
    • JSR Corporation
    • Ryouji TATARA
    • G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
  • Information Patent Application

    METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKA...
    • Publication number 20240381529
    • Publication date Nov 14, 2024
    • Resonac Corporation
    • Shunsuke OTAKE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240365468
    • Publication date Oct 31, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD AND MANUFACTURING METHOD THEREFOR
    • Publication number 20240357739
    • Publication date Oct 24, 2024
    • TOPPAN Holdings Inc.
    • Tomoyuki Ishii
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME
    • Publication number 20240357741
    • Publication date Oct 24, 2024
    • Samsung Electronics Co., Ltd.
    • Yeonkyung CHUNG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Transparent Conductive Film
    • Publication number 20240355501
    • Publication date Oct 24, 2024
    • Chasm Advanced Materials, Inc.
    • Robert F. Praino
    • B82 - NANO-TECHNOLOGY
  • Information Patent Application

    COMPOSITE POLYIMIDE SUBSTRATE, COMPOSITE POLYIMIDE COMPOSITION, AND...
    • Publication number 20240343027
    • Publication date Oct 17, 2024
    • LG ELECTRONICS INC.
    • Takashi KINO
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240341034
    • Publication date Oct 10, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    USE OF INORGANIC THIN NON-WOVEN DIELECTRICS IN PRINTED CIRCUIT BOARDS
    • Publication number 20240341032
    • Publication date Oct 10, 2024
    • AVISHTECH, INC.
    • Tarun Amla
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240341033
    • Publication date Oct 10, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240334598
    • Publication date Oct 3, 2024
    • Shinko Electric Industries Co., Ltd.
    • Yuki KOBAYASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRICAL DEVICE HAVING HEAT DISSIPATION STRUCTURE USING FILLER AN...
    • Publication number 20240334614
    • Publication date Oct 3, 2024
    • SOLUM CO., LTD.
    • Jun Kyu Lee
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240324103
    • Publication date Sep 26, 2024
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    THERMAL SOLUTIONS FOR COOLING ELECTRONIC DEVICES
    • Publication number 20240314921
    • Publication date Sep 19, 2024
    • Intel Corporation
    • Jeff Ku
    • F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
  • Information Patent Application

    EXTENSION STRUCTURE OF FLEXIBLE SUBSTRATES WITH CONDUCTIVE WIRES TH...
    • Publication number 20240314938
    • Publication date Sep 19, 2024
    • UNEO INC.
    • Chih-Sheng HOU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SHEET FOR COMPONENT CARRIER COMPRISING SEPARATE STRUCTURES WITH FIL...
    • Publication number 20240314927
    • Publication date Sep 19, 2024
    • AT&S Austria Technologie & Systemtechnik AG
    • Nina WANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240306293
    • Publication date Sep 12, 2024
    • HAMILTON SUNDSTRAND CORPORATION
    • Andrew Edward PAGE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240306296
    • Publication date Sep 12, 2024
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20240306312
    • Publication date Sep 12, 2024
    • IBIDEN CO., LTD.
    • Jun SAKAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20240298406
    • Publication date Sep 5, 2024
    • IBIDEN CO., LTD.
    • Jun SAKAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT CARRIER BOARD
    • Publication number 20240292517
    • Publication date Aug 29, 2024
    • ASIA PACIFIC MICROSYSTEMS, INC.
    • Jer-Wei HSIEH
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20240292537
    • Publication date Aug 29, 2024
    • IBIDEN CO., LTD.
    • Susumu KAGOHASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND PRINTED WIRING...
    • Publication number 20240287373
    • Publication date Aug 29, 2024
    • TAIYO HOLDINGS CO., LTD.
    • Yoshikazu DAIGO
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20240292536
    • Publication date Aug 29, 2024
    • IBIDEN CO., LTD.
    • Susumu KAGOHASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240284606
    • Publication date Aug 22, 2024
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD STRUCTURE AND DISPLAY DEVICE
    • Publication number 20240284596
    • Publication date Aug 22, 2024
    • CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
    • Liang GAO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD, ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME, AND...
    • Publication number 20240276640
    • Publication date Aug 15, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Young-Gon Kim
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR