Filling compound

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CPC
H05K7/20463

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/20463Filling compound

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Pluggable intrinsically safe barrier
- Patent number 11,856,732
- Issue date Dec 26, 2023
- Volley Boast, LLC
- Mark E. Peters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation device for electronic component
- Patent number 11,744,049
- Issue date Aug 29, 2023
- Valeo Siemens eAutomotive (Shenzhen) Co., Ltd.
- Gongyuan Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package with embedded fan-based cooling system
- Patent number 11,570,930
- Issue date Jan 31, 2023
- Meta Platforms, Inc.
- Narsing Krishna Vijayrao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inverter
- Patent number 11,522,494
- Issue date Dec 6, 2022
- SMA Solar Technology AG
- Stefan Buchhold
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electrical feedthrough assembly
- Patent number 11,350,537
- Issue date May 31, 2022
- Analog Devices, Inc.
- Adam T. Winter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module, electronic component unit, and method...
- Patent number 11,317,541
- Issue date Apr 26, 2022
- Murata Manufacturing Co., Ltd.
- Shinichiro Kuroiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus including an insulating material and heat transfe...
- Patent number 11,234,349
- Issue date Jan 25, 2022
- Samsung Display Co., Ltd.
- Jaechun Park
- G02 - OPTICS
Information Patent Grant
Modular thermoelectric-based cooling device for heterogeneous packages
- Patent number 11,178,795
- Issue date Nov 16, 2021
- BAIDU USA LLC
- Tianyi Gao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Image capture assembly and aerial photographing aerial vehicle
- Patent number 11,115,567
- Issue date Sep 7, 2021
- SZ DJI Technology Co., Ltd
- Lei Zhang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Heat sink tray for printed circuit boards
- Patent number 10,986,723
- Issue date Apr 20, 2021
- Ingersoll-Rand Industrial U.S., Inc.
- Joshua O. Johnson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Control device for a gearbox control system of a motor vehicle
- Patent number 10,925,193
- Issue date Feb 16, 2021
- Robert Bosch GmbH
- Heiko Michel
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Elastic heat-dissipation structure and electronic device
- Patent number 10,881,025
- Issue date Dec 29, 2020
- CTRON ADVANCED MATERIAL CO., LTD.
- Yi-Hau Shiau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for the manufacture of thermal interfaces, thermal interfac...
- Patent number 10,834,854
- Issue date Nov 10, 2020
- Northeastern University
- Li Zhang
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
ROV propeller tailhood, ROV propeller and ROV
- Patent number 10,780,966
- Issue date Sep 22, 2020
- Tianjin Deepfar Ocean Technology Co., LTD
- Jiancang Wei
- B63 - SHIPS OR OTHER WATERBORNE VESSELS RELATED EQUIPMENT
Information Patent Grant
Image capture assembly and aerial photographing aerial vehicle
- Patent number 10,674,049
- Issue date Jun 2, 2020
- SZ DJI Technology Co., Ltd
- Lei Zhang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Heat spreader to structurally support an outer housing
- Patent number 10,667,432
- Issue date May 26, 2020
- Hewlett-Packard Development Company, L.P.
- Timothy J Sutherland
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus to provide a soft-start function to a high torque electri...
- Patent number 10,580,554
- Issue date Mar 3, 2020
- RAYMOND INNOVATIONS, LLC
- Will Hansen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Speaker apparatus having a heat dissipation structure
- Patent number 10,575,098
- Issue date Feb 25, 2020
- Nokia Technologies Oy
- Ian Davis
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic assembly, in particular for a transmission control modul...
- Patent number 10,524,391
- Issue date Dec 31, 2019
- Robert Bosch GmbH
- Uwe Liskow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dissipating heat using phase change material
- Patent number 10,524,392
- Issue date Dec 31, 2019
- Intel Corporation
- Tsung-Yu Chen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Heating-cooling module
- Patent number 10,504,812
- Issue date Dec 10, 2019
- Chicony Electronics Co., Ltd.
- Jih-Jian You
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display apparatus
- Patent number 10,492,293
- Issue date Nov 26, 2019
- Samsung Display Co., Ltd.
- Jaechun Park
- G02 - OPTICS
Information Patent Grant
Thermal cooling system
- Patent number 10,403,560
- Issue date Sep 3, 2019
- Intel Corporation
- Bijendra Singh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Onboard control device
- Patent number 10,396,010
- Issue date Aug 27, 2019
- Hitachi Automotive Systems, Ltd.
- Kazuhiro Suzuki
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electronic device and drive device including the same
- Patent number 10,374,490
- Issue date Aug 6, 2019
- DENSO CORPORATION
- Toshihisa Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipation structure
- Patent number 10,356,946
- Issue date Jul 16, 2019
- Kaneka Corporation
- Keisuke Oguma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flame retardant structure for electronic component
- Patent number 10,314,205
- Issue date Jun 4, 2019
- NANNING FUGUI PRECISION INDUSTRIAL CO., LTD.
- Ta-Wei Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module and method for manufacturing the same
- Patent number 10,305,008
- Issue date May 28, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takeshi Kawabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power supply unit
- Patent number 10,279,055
- Issue date May 7, 2019
- Tetra Laval Holdings & Finance S.A.
- Iosif Izrailit
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Double insulated heat spreader
- Patent number 10,098,261
- Issue date Oct 9, 2018
- Enphase Energy, Inc.
- Ryan Linderman
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC MODULE WITH LEAK-PROOF STRUCTURE
- Publication number 20250016961
- Publication date Jan 9, 2025
- Delta Electronics, Inc.
- I-Wen CHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGHLY THERMALLY CONDUCTIVE HYBRID THERMAL INTERFACE MATERIAL
- Publication number 20250016962
- Publication date Jan 9, 2025
- Honeywell International Inc.
- Yaqun Liu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMAL INTERFACE APPLIQUES
- Publication number 20240431077
- Publication date Dec 26, 2024
- Liquid Wire Inc.
- Mark William Ronay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION STRUCTURE AND PORTABLE INFORMATION DEVICE
- Publication number 20240297094
- Publication date Sep 5, 2024
- LENOVO (SINGAPORE) PTE. LTD.
- Ryota Watanabe
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE INCLUDING PCB EDGE HEAT DISSIPATION
- Publication number 20240260237
- Publication date Aug 1, 2024
- Western Digital Technologies, Inc.
- Wei Hong Tew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMMERSION COOLING SYSTEMS, APPARATUS, AND RELATED METHODS
- Publication number 20240260228
- Publication date Aug 1, 2024
- Intel Corporation
- Jimmy Chuang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENDOSCOPE
- Publication number 20240192480
- Publication date Jun 13, 2024
- HOYA CORPORATION
- Hisanori BESSHO
- G02 - OPTICS
Information Patent Application
CIRCUIT ASSEMBLY
- Publication number 20240057294
- Publication date Feb 15, 2024
- AUTONETWORKS TECHNOLOGIES, LTD.
- Taiji YANAGIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMAGING APPARATUS
- Publication number 20240048828
- Publication date Feb 8, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Tatsuya SATO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
POWER MODULE ASSEMBLY
- Publication number 20230397382
- Publication date Dec 7, 2023
- DELTA ELECTRONICS, INC.
- Kaijian Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY CONDUCTIVE RESIN COMPOSITION AND ELECTRONIC DEVICE
- Publication number 20230374189
- Publication date Nov 23, 2023
- Denka Company Limited
- Kazuyuki IGARASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL RADIATION HEAT DISSIPATION DEVICE AND PREPARATION METHOD AN...
- Publication number 20230137727
- Publication date May 4, 2023
- National Tsing Hua University
- Meng-Ting Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLUGGABLE INTRINSICALLY SAFE BARRIER
- Publication number 20230084512
- Publication date Mar 16, 2023
- Volley Boast, LLC
- Mark E. Peters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-VEHICLE ELECTRONIC CONTROL DEVICE
- Publication number 20220394881
- Publication date Dec 8, 2022
- Hitachi Astemo, Ltd.
- Yasuhiro TSUYUKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL TRANSCEIVER WITH HOUSING PRESSING THERMAL INTERFACE MATERIA...
- Publication number 20220386503
- Publication date Dec 1, 2022
- Prime World International Holdings Ltd.
- Che-Shou YEH
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
POWER CONVERTING SYSTEM AND BATTERY CHARGER WITH IMPROVED THERMAL D...
- Publication number 20220361359
- Publication date Nov 10, 2022
- WALL BOX CHARGERS S. L.
- Eduard CASTAÑEDA MAÑÉ
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
IC PACKAGE WITH EMBEDDED FAN-BASED COOLING SYSTEM
- Publication number 20220264765
- Publication date Aug 18, 2022
- META PLATFORMS, INC.
- Narsing Krishna Vijayrao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL DISSIPATION COMPOSITE MATERIAL AND MANUFACTURING METHOD THE...
- Publication number 20220098463
- Publication date Mar 31, 2022
- Industry-University Cooperation Foundation Hanyang University ERICA Campus
- Yong Ho Choa
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
MODULAR THERMOELECTRIC-BASED COOLING DEVICE FOR HETEROGENEOUS PACKAGES
- Publication number 20210385977
- Publication date Dec 9, 2021
- BAIDU USA LLC
- TIANYI GAO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT DISSIPATION DEVICE FOR ELECTRONIC COMPONENT
- Publication number 20210185861
- Publication date Jun 17, 2021
- Valeo Siemens eAutomotive (Shenzhen) Co., Ltd.
- Gongyuan Qu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELASTIC HEAT-DISSIPATION STRUCTURE AND ELECTRONIC DEVICE
- Publication number 20210007247
- Publication date Jan 7, 2021
- CTRON ADVANCED MATERIAL CO., LTD.
- Yi-Hau SHIAU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MODULE, ELECTRONIC COMPONENT UNIT, AND METHOD...
- Publication number 20200413570
- Publication date Dec 31, 2020
- Murata Manufacturing Co., Ltd.
- Shinichiro KUROIWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT RADIATING STRUCTURE AND ELECTRONIC DEVICE INCLUDING SAME
- Publication number 20200404808
- Publication date Dec 24, 2020
- Samsung Electronics Co., LTD
- Jungho KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRICAL FEEDTHROUGH ASSEMBLY
- Publication number 20200375049
- Publication date Nov 26, 2020
- Analog Devices, Inc.
- Adam T. Winter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INVERTER
- Publication number 20200313607
- Publication date Oct 1, 2020
- SMA Solar Technology AG
- Stefan Buchhold
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMAGE CAPTURE ASSEMBLY AND AERIAL PHOTOGRAPHING AERIAL VEHICLE
- Publication number 20200296261
- Publication date Sep 17, 2020
- SZ DJI Technology Co., Ltd.
- Lei ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY APPARATUS
- Publication number 20200060021
- Publication date Feb 20, 2020
- SAMSUNG DISPLAY CO., LTD.
- Jaechun PARK
- G02 - OPTICS
Information Patent Application
SPEAKER APPARATUS HAVING A HEAT DISSIPATION STRUCTURE
- Publication number 20190253803
- Publication date Aug 15, 2019
- Nokia Technologies Oy
- Ian DAVIS
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
HEAT SPREADER TO STRUCTURALLY SUPPORT AN OUTER HOUSING
- Publication number 20190132993
- Publication date May 2, 2019
- Hewlett-Packard Development Company, L.P.
- TIMOTHY J SUTHERLAND
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLAME RETARDANT STRUCTURE FOR ELECTRONIC COMPONENT
- Publication number 20190090387
- Publication date Mar 21, 2019
- NANNING FUGUI PRECISION INDUSTRIAL CO., LTD.
- TA-WEI YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Filling compound

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Pluggable intrinsically safe barrier

Heat dissipation device for electronic component

IC package with embedded fan-based cooling system

Inverter

Electrical feedthrough assembly

Electronic component module, electronic component unit, and method...

Display apparatus including an insulating material and heat transfe...

Modular thermoelectric-based cooling device for heterogeneous packages

Image capture assembly and aerial photographing aerial vehicle

Heat sink tray for printed circuit boards

Control device for a gearbox control system of a motor vehicle

Elastic heat-dissipation structure and electronic device

Methods for the manufacture of thermal interfaces, thermal interfac...

ROV propeller tailhood, ROV propeller and ROV

Image capture assembly and aerial photographing aerial vehicle

Heat spreader to structurally support an outer housing

Apparatus to provide a soft-start function to a high torque electri...

Speaker apparatus having a heat dissipation structure

Electronic assembly, in particular for a transmission control modul...

Dissipating heat using phase change material

Heating-cooling module

Display apparatus

Thermal cooling system

Onboard control device

Electronic device and drive device including the same

Heat dissipation structure

Flame retardant structure for electronic component

Semiconductor module and method for manufacturing the same

Power supply unit

Double insulated heat spreader

Patents Applicationslast 30 patents

ELECTRONIC MODULE WITH LEAK-PROOF STRUCTURE

HIGHLY THERMALLY CONDUCTIVE HYBRID THERMAL INTERFACE MATERIAL

THERMAL INTERFACE APPLIQUES

HEAT DISSIPATION STRUCTURE AND PORTABLE INFORMATION DEVICE

SEMICONDUCTOR STORAGE DEVICE INCLUDING PCB EDGE HEAT DISSIPATION

IMMERSION COOLING SYSTEMS, APPARATUS, AND RELATED METHODS

ENDOSCOPE

CIRCUIT ASSEMBLY

IMAGING APPARATUS

POWER MODULE ASSEMBLY

THERMALLY CONDUCTIVE RESIN COMPOSITION AND ELECTRONIC DEVICE

THERMAL RADIATION HEAT DISSIPATION DEVICE AND PREPARATION METHOD AN...

PLUGGABLE INTRINSICALLY SAFE BARRIER

IN-VEHICLE ELECTRONIC CONTROL DEVICE

OPTICAL TRANSCEIVER WITH HOUSING PRESSING THERMAL INTERFACE MATERIA...

POWER CONVERTING SYSTEM AND BATTERY CHARGER WITH IMPROVED THERMAL D...

IC PACKAGE WITH EMBEDDED FAN-BASED COOLING SYSTEM

THERMAL DISSIPATION COMPOSITE MATERIAL AND MANUFACTURING METHOD THE...

MODULAR THERMOELECTRIC-BASED COOLING DEVICE FOR HETEROGENEOUS PACKAGES

HEAT DISSIPATION DEVICE FOR ELECTRONIC COMPONENT

ELASTIC HEAT-DISSIPATION STRUCTURE AND ELECTRONIC DEVICE

ELECTRONIC COMPONENT MODULE, ELECTRONIC COMPONENT UNIT, AND METHOD...

HEAT RADIATING STRUCTURE AND ELECTRONIC DEVICE INCLUDING SAME

ELECTRICAL FEEDTHROUGH ASSEMBLY

INVERTER

IMAGE CAPTURE ASSEMBLY AND AERIAL PHOTOGRAPHING AERIAL VEHICLE

DISPLAY APPARATUS

SPEAKER APPARATUS HAVING A HEAT DISSIPATION STRUCTURE

HEAT SPREADER TO STRUCTURALLY SUPPORT AN OUTER HOUSING

FLAME RETARDANT STRUCTURE FOR ELECTRONIC COMPONENT