Finish coating of conductors by using conductive pastes, inks or powders

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CPC
H05K3/247

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/247Finish coating of conductors by using conductive pastes, inks or powders

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electrical connector and connector system having plated ground shields
- Patent number 11,183,787
- Issue date Nov 23, 2021
- TE CONNECTIVITY SERVICES GMBH
- John Joseph Consoli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing circuit board with embedded conductive circ...
- Patent number 11,058,014
- Issue date Jul 6, 2021
- Avary Holding (Shenzhen) Co., Limited.
- Xiao-Yan Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing at least one functional area on an electri...
- Patent number 10,862,259
- Issue date Dec 8, 2020
- TE Connectivity Germany GmbH
- Helge Schmidt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dry method of metallizing polymer thick film surfaces
- Patent number 10,588,220
- Issue date Mar 10, 2020
- Molex, LLC
- Patrick Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vehicular panel and wiring structure for vehicle
- Patent number 10,017,133
- Issue date Jul 10, 2018
- Yazaki Corporation
- Mitsunori Tsunoda
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method for manufacturing wiring structure, copper displacement plat...
- Patent number 9,888,585
- Issue date Feb 6, 2018
- Tokyo Electron Limited
- Shoso Shinguhara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor substrates with metal contact layer and method...
- Patent number 9,768,036
- Issue date Sep 19, 2017
- Semikron Elektronik GmbH & Co., KG
- Christian Göbl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device
- Patent number 9,726,357
- Issue date Aug 8, 2017
- SHARP KABUSHIKI KAISHA
- Masahiro Konishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing at least one functional area on an electri...
- Patent number 9,667,015
- Issue date May 30, 2017
- TE Connectivity Germany GmbH
- Helge Schmidt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board
- Patent number 9,609,747
- Issue date Mar 28, 2017
- FUJIFILM Corporation
- Yasuaki Matsushita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method of manufacturing electronic device
- Patent number 9,526,181
- Issue date Dec 20, 2016
- Seiko Instruments Inc.
- Atsushi Kozuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer micro-wire structure
- Patent number 9,426,885
- Issue date Aug 23, 2016
- Eastman Kodak Company
- Todd Mathew Spath
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor arrangement structure and method of mounting capacitor
- Patent number 9,398,693
- Issue date Jul 19, 2016
- Toyota Jidosha Kabushiki Kaisha
- Jun Muto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Paste composition and printed circuit board
- Patent number 8,822,048
- Issue date Sep 2, 2014
- Nitto Denko Corporation
- Hirofumi Ebe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for using flex circuit technology to create an...
- Patent number 8,546,701
- Issue date Oct 1, 2013
- Edwards Lifesciences Corporation
- Kenneth M. Curry
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Electrical contact enhancing coating
- Patent number 8,435,426
- Issue date May 7, 2013
- Brian K. Kyle
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Connector having a terminal with a tin plated contact pressed again...
- Patent number 8,403,684
- Issue date Mar 26, 2013
- Mitsubishi Electric Corporation
- Norikazu Tateishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 8,222,536
- Issue date Jul 17, 2012
- Fujikara Ltd.
- Shuzo Hirata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stripline flex circuit
- Patent number 8,166,642
- Issue date May 1, 2012
- The Boeing Company
- Peter T. Heisen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Article with a coating of electrically conductive polymer and preci...
- Patent number 8,153,271
- Issue date Apr 10, 2012
- Ormecon GmbH
- Bernhard Wessling
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pad structure with a nano-structured coating film
- Patent number 8,102,063
- Issue date Jan 24, 2012
- Advance Materials Corporation
- Lee-Sheng Yen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring material, wiring substrate and manufacturing method thereof,...
- Patent number 8,088,495
- Issue date Jan 3, 2012
- Sharp Kabushiki Kaisha
- Akiyoshi Fujii
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method and apparatus for using flex circuit technology to create an...
- Patent number 8,065,796
- Issue date Nov 29, 2011
- Edwards Lifesciences Corporation
- Kenneth M. Curry
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Mounting board and method of producing the same
- Patent number 8,039,760
- Issue date Oct 18, 2011
- Fujikura Ltd.
- Tomoharu Sagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Planar antenna and manufacturing method thereof
- Patent number 8,026,851
- Issue date Sep 27, 2011
- Toray Industries, Inc.
- Kiyohiko Itoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical contact enhancing coating
- Patent number 7,910,026
- Issue date Mar 22, 2011
- Brian K. Kyle
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wiring material, wiring substrate and manufacturing method thereof,...
- Patent number 7,718,273
- Issue date May 18, 2010
- Sharp Kabushiki Kaisha
- Akiyoshi Fujii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stripline flex circuit
- Patent number 7,629,538
- Issue date Dec 8, 2009
- The Boeing Company
- Peter T. Heisen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnection substrate and fabrication method thereof
- Patent number 7,233,069
- Issue date Jun 19, 2007
- Matsushita Electric Industrial Co., Ltd.
- Norihito Tsukahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pattern and fabricating method therefor, device and fabricating met...
- Patent number 7,220,682
- Issue date May 22, 2007
- Seiko Epson Corporation
- Toshimitsu Hirai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ARTICLE WITH CATALYTIC INK AND ELECTRICALLY-CONDUCTIVE PATTERN
- Publication number 20250040044
- Publication date Jan 30, 2025
- James S. Honan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Manufacturing Method for the Manufacturing of High-Precisi...
- Publication number 20210282268
- Publication date Sep 9, 2021
- Alexandre Perry Kamel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for Preparing Electrically Conductive Patterns and Articles...
- Publication number 20190357360
- Publication date Nov 21, 2019
- 3M Innovative Properties Company
- Meredith M. Doyle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITOR ARRANGEMENT STRUCTURE AND METHOD OF MOUNTING CAPACITOR
- Publication number 20140367154
- Publication date Dec 18, 2014
- Jun Muto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FLATTENING SURFACE OF CONDUCTIVE STRUCTURE AND CONDUCTIVE...
- Publication number 20140238725
- Publication date Aug 28, 2014
- Industrial Technology Research Institute
- Erh-Hao Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND SURFACE TREATMENT METHOD OF PRINTED CIRCU...
- Publication number 20140182905
- Publication date Jul 3, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Kyung Moo HAR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING AT LEAST ONE FUNCTIONAL AREA ON AN ELECTRI...
- Publication number 20140017393
- Publication date Jan 16, 2014
- Tyco Electronics AMP GmbH
- Helge Schmidt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR SEMICONDUCTOR PACKAGE HAVING COATING FILM AND METHOD...
- Publication number 20130029458
- Publication date Jan 31, 2013
- Hynix Semiconductor Inc.
- Woong Sun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASTE COMPOSITION AND PRINTED CIRCUIT BOARD
- Publication number 20120186865
- Publication date Jul 26, 2012
- Nitto Denko Corporation
- Hirofumi EBE
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD AND APPARATUS FOR USING FLEX CIRCUIT TECHNOLOGY TO CREATE AN...
- Publication number 20120037406
- Publication date Feb 16, 2012
- Edwards Lifesciences Corporation
- Kenneth M. Curry
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
STRUCTURE FOR CONNECTING CONNECTOR, AND HEAD LAMP LIGHT SOURCE LIGH...
- Publication number 20110235348
- Publication date Sep 29, 2011
- Norikazu Tateishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONTACT ENHANCING COATING
- Publication number 20110168958
- Publication date Jul 14, 2011
- Brian K. Kyle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PAD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20110108876
- Publication date May 12, 2011
- Lee-Sheng Yen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING BOARD AND METHOD OF PRODUCING THE SAME
- Publication number 20100258341
- Publication date Oct 14, 2010
- FUJIKURA LTD.
- Tomoharu SAGAWA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
WIRING MATERIAL, WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF,...
- Publication number 20100098937
- Publication date Apr 22, 2010
- Akiyoshi Fujii
- B32 - LAYERED PRODUCTS
Information Patent Application
Stripline Flex Circuit
- Publication number 20100043223
- Publication date Feb 25, 2010
- The Boeing Company
- Peter T. Heisen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Article with a Coating of Electrically Conductive Polymer and Preci...
- Publication number 20100012359
- Publication date Jan 21, 2010
- Ormecon GmbH
- Bernhard Wessling
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLANAR ANTENNA AND MANUFACTURING METHOD THEREOF
- Publication number 20090219212
- Publication date Sep 3, 2009
- TORAY INDUSTRIES, INC.
- Kiyohiko Itoh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE FOR SEMICONDUCTOR PACKAGE HAVING COATING FILM AND METHOD...
- Publication number 20090174073
- Publication date Jul 9, 2009
- Woong Sun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20090139748
- Publication date Jun 4, 2009
- FUJIKURA LTD.
- Shuzo HIRATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT PATTERN DESIGNING METHOD, WHEREIN AN ELECTROCONDUCTIVE COAT...
- Publication number 20090067145
- Publication date Mar 12, 2009
- SMK Corporation
- Nobuo Kasagi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power semiconductor substrates with metal contact layer and method...
- Publication number 20090008784
- Publication date Jan 8, 2009
- SEMIKRON Elektronik GmbH & Co. KG
- Christian Gobl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical contact enhancing coating
- Publication number 20080152791
- Publication date Jun 26, 2008
- Brian K. Kyle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRIPLINE FLEX CIRCUIT
- Publication number 20080110020
- Publication date May 15, 2008
- Peter T. Heisen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solderable pads utilizing nickel and silver nanoparticle ink jet inks
- Publication number 20070281099
- Publication date Dec 6, 2007
- Cabot Corporation
- James J. Howarth
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for using flex circuit technology to create an...
- Publication number 20070200254
- Publication date Aug 30, 2007
- Kenneth M. Curry
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Pattern and fabricating method therefor, device and fabricating met...
- Publication number 20070194449
- Publication date Aug 23, 2007
- SEIKO EPSON CORPORATION
- Toshimitsu Hirai
- G02 - OPTICS
Information Patent Application
Trimming resistor and method of manufacture thereof
- Publication number 20070080775
- Publication date Apr 12, 2007
- Hideki Akimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnection substrate and fabrication method thereof
- Publication number 20050079707
- Publication date Apr 14, 2005
- Norihito Tsukahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer wiring board assembly, multilayer wiring board assembly...
- Publication number 20050016765
- Publication date Jan 27, 2005
- FUJIKURA LTD.
- Reiji Higuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Finish coating of conductors by using conductive pastes, inks or powders

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electrical connector and connector system having plated ground shields

Method of manufacturing circuit board with embedded conductive circ...

Method for manufacturing at least one functional area on an electri...

Dry method of metallizing polymer thick film surfaces

Vehicular panel and wiring structure for vehicle

Method for manufacturing wiring structure, copper displacement plat...

Power semiconductor substrates with metal contact layer and method...

Light-emitting device

Method for manufacturing at least one functional area on an electri...

Wiring board

Electronic device and method of manufacturing electronic device

Multi-layer micro-wire structure

Capacitor arrangement structure and method of mounting capacitor

Paste composition and printed circuit board

Method and apparatus for using flex circuit technology to create an...

Electrical contact enhancing coating

Connector having a terminal with a tin plated contact pressed again...

Wiring substrate

Stripline flex circuit

Article with a coating of electrically conductive polymer and preci...

Pad structure with a nano-structured coating film

Wiring material, wiring substrate and manufacturing method thereof,...

Method and apparatus for using flex circuit technology to create an...

Mounting board and method of producing the same

Planar antenna and manufacturing method thereof

Electrical contact enhancing coating

Wiring material, wiring substrate and manufacturing method thereof,...

Stripline flex circuit

Interconnection substrate and fabrication method thereof

Pattern and fabricating method therefor, device and fabricating met...

Patents Applicationslast 30 patents

ARTICLE WITH CATALYTIC INK AND ELECTRICALLY-CONDUCTIVE PATTERN

Advanced Manufacturing Method for the Manufacturing of High-Precisi...

Methods for Preparing Electrically Conductive Patterns and Articles...

CAPACITOR ARRANGEMENT STRUCTURE AND METHOD OF MOUNTING CAPACITOR

METHOD OF FLATTENING SURFACE OF CONDUCTIVE STRUCTURE AND CONDUCTIVE...

PRINTED CIRCUIT BOARD AND SURFACE TREATMENT METHOD OF PRINTED CIRCU...

METHOD FOR MANUFACTURING AT LEAST ONE FUNCTIONAL AREA ON AN ELECTRI...

SUBSTRATE FOR SEMICONDUCTOR PACKAGE HAVING COATING FILM AND METHOD...

PASTE COMPOSITION AND PRINTED CIRCUIT BOARD

METHOD AND APPARATUS FOR USING FLEX CIRCUIT TECHNOLOGY TO CREATE AN...

STRUCTURE FOR CONNECTING CONNECTOR, AND HEAD LAMP LIGHT SOURCE LIGH...

ELECTRICAL CONTACT ENHANCING COATING

PAD STRUCTURE AND MANUFACTURING METHOD THEREOF

MOUNTING BOARD AND METHOD OF PRODUCING THE SAME

WIRING MATERIAL, WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF,...

Stripline Flex Circuit

Article with a Coating of Electrically Conductive Polymer and Preci...

PLANAR ANTENNA AND MANUFACTURING METHOD THEREOF

SUBSTRATE FOR SEMICONDUCTOR PACKAGE HAVING COATING FILM AND METHOD...

WIRING SUBSTRATE

CIRCUIT PATTERN DESIGNING METHOD, WHEREIN AN ELECTROCONDUCTIVE COAT...

Power semiconductor substrates with metal contact layer and method...

Electrical contact enhancing coating

STRIPLINE FLEX CIRCUIT

Solderable pads utilizing nickel and silver nanoparticle ink jet inks

Method and apparatus for using flex circuit technology to create an...

Pattern and fabricating method therefor, device and fabricating met...

Trimming resistor and method of manufacture thereof

Interconnection substrate and fabrication method thereof

Multilayer wiring board assembly, multilayer wiring board assembly...