fired compositions for inorganic substrates

Industry

CPC
H05K3/248

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/248fired compositions for inorganic substrates

Industries

Patents Grantslast 30 patents

Information Patent Grant
High frequency component
- Patent number 10,770,223
- Issue date Sep 8, 2020
- Murata Manufacturing Co., Ltd.
- Issei Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate, electrode forming method, and solar cell f...
- Patent number 8,766,089
- Issue date Jul 1, 2014
- Shin-Etsu Handotai Co., Ltd.
- Naoki Ishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric component and component and method for the production thereof
- Patent number 8,415,251
- Issue date Apr 9, 2013
- EPCOS AG
- Sebastian Brunner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module substrate and production method
- Patent number 8,413,321
- Issue date Apr 9, 2013
- EPCOS AG
- Sebastian Brunner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing an LTCC substrate
- Patent number 8,250,748
- Issue date Aug 28, 2012
- Biotronik CRM Patent AG
- Dieter Schwanke
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor substrate, electrode forming method, and solar cell f...
- Patent number 8,253,011
- Issue date Aug 28, 2012
- Shin-Etsu Handotai Co., Ltd.
- Naoki Ishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Co-processable photoimageable silver and corbon nanotube compositio...
- Patent number 8,002,603
- Issue date Aug 23, 2011
- E. I. Du Pont de Nemours and Company
- Haixin Yang
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Production of an electrical component and component
- Patent number 7,928,558
- Issue date Apr 19, 2011
- EPCOS AG
- Sebastian Brunner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for LTCC circuitry
- Patent number 7,820,490
- Issue date Oct 26, 2010
- Northrop Grumman Corporation
- Cynthia W. Berry
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate having fine line, electron source and image display appar...
- Patent number 7,807,334
- Issue date Oct 5, 2010
- Canon Kabushiki Kaisha
- Yoshimi Uda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 7,452,612
- Issue date Nov 18, 2008
- Alps Electric Co., Ltd.
- Shinji Murata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thick film circuit board, method of producing the same and integrat...
- Patent number 7,417,318
- Issue date Aug 26, 2008
- Denso Corporation
- Tohru Nomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and bonding pad composition
- Patent number 7,388,296
- Issue date Jun 17, 2008
- NGK Spark Plug Co., Ltd.
- Kazuhiro Urashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer electronic component and method for producing the same
- Patent number 7,362,560
- Issue date Apr 22, 2008
- NGK Spark Plug Co., Ltd.
- Yasuhiro Tsujimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for improving the thermal cycled adhesion of thick-film cond...
- Patent number 7,294,390
- Issue date Nov 13, 2007
- Delphi Technologies, Inc.
- Bradley H. Carter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Materials and structure for a high reliability BGA connection betwe...
- Patent number 7,287,323
- Issue date Oct 30, 2007
- National Semiconductor Corporation
- Michael Richard Ehlert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density electronic interconnection
- Patent number 7,271,028
- Issue date Sep 18, 2007
- Benedict G Pace
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming one or more base structures on an LTCC cofired mo...
- Patent number 7,127,809
- Issue date Oct 31, 2006
- Northrop Grumman Corporation
- Cynthia W. Berry
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate having fine line, electron source and image display appar...
- Patent number 7,015,637
- Issue date Mar 21, 2006
- Canon Kabushiki Kaisha
- Yoshimi Uda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Uphill screen printing in the manufacturing of microelectronic comp...
- Patent number 6,901,852
- Issue date Jun 7, 2005
- Micron Technology, Inc.
- John J. Michiels
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Uphill screen printing in the manufacturing of microelectronic comp...
- Patent number 6,899,025
- Issue date May 31, 2005
- Micron Technology, Inc.
- John M. Michiels
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Materials and structure for a high reliability bga connection betwe...
- Patent number 6,800,815
- Issue date Oct 5, 2004
- National Semiconductor Corporation
- Michael Richard Ehlert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Uphill screen printing in the manufacturing of microelectronic comp...
- Patent number 6,736,058
- Issue date May 18, 2004
- Micron Technology, Inc.
- John M. Michiels
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a joint between metal and a ceramic substra...
- Patent number 6,648,208
- Issue date Nov 18, 2003
- Leu-Wen Tsay
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component and manufacturing method thereof
- Patent number 6,642,449
- Issue date Nov 4, 2003
- TDK Corporation
- Masashi Gotoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate having fine line, electron source and image display appar...
- Patent number 6,621,207
- Issue date Sep 16, 2003
- Canon Kabushiki Kaisha
- Yoshimi Uda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Powder metal polymer organic sheet punching for substrate conductors
- Patent number 6,569,278
- Issue date May 27, 2003
- International Business Machines Corporation
- David H. Gabriels
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component and manufacturing method thereof
- Patent number 6,548,758
- Issue date Apr 15, 2003
- TDK Corporation
- Masashi Gotoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer conductor system with intermediate buffer layer for imp...
- Patent number 6,538,325
- Issue date Mar 25, 2003
- Delphi Technologies, Inc.
- Frans Peter Lautzenhiser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for improving the manufacturing safety of weld joints
- Patent number 6,488,199
- Issue date Dec 3, 2002
- Robert Bosch GmbH
- Jürgen Schwaiger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR SUBSTRATE, ELECTRODE FORMING METHOD, AND SOLAR CELL F...
- Publication number 20120289044
- Publication date Nov 15, 2012
- Shin-Etsu Chemical Co., Ltd.
- Naoki Ishikawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRIC COMPONENT AND COMPONENT AND METHOD FOR THE PRODUCTION THEREOF
- Publication number 20110146069
- Publication date Jun 23, 2011
- EPCOS AG, a corporation of Germany
- Sebastian Brunner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ceramic substrate and method of manufacturing the same
- Publication number 20110011631
- Publication date Jan 20, 2011
- SAMSUNG ELECTRO-MECHANICS CO.,
- Won Hee YOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Module Substrate and Production Method
- Publication number 20100224394
- Publication date Sep 9, 2010
- Sebastian Brunner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LTCC SUBSTRATE STRUCTURE AND METHOD FOR THE PRODUCTION THEREOF
- Publication number 20100059255
- Publication date Mar 11, 2010
- Dieter SCHWANKE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING METALLIZED ALUMINUM NITRIDE SUBSTRATE
- Publication number 20100015468
- Publication date Jan 21, 2010
- Yasuyuki Yamamoto
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Co-processable Photoimageable Silver and Corbon Nanotube Compositio...
- Publication number 20090284122
- Publication date Nov 19, 2009
- E.I. du Pont de Nemours and Company
- HAIXIN YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR SUBSTRATE, ELECTRODE FORMING METHOD, AND SOLAR CELL F...
- Publication number 20090243111
- Publication date Oct 1, 2009
- Shin-Etsu Handotai Co., Ltd.
- Naoki Ishikawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Thick film circuit component and method for manufacturing the same
- Publication number 20080311360
- Publication date Dec 18, 2008
- KOA CORPORATION
- Yukihisa Kitagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for the Production of an Electrical Component and Component
- Publication number 20070235834
- Publication date Oct 11, 2007
- EPCOS AG
- Sebastian Brunner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring substrate
- Publication number 20060280918
- Publication date Dec 14, 2006
- Alps Electric Co., Ltd.
- Shinji Murata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring substrate
- Publication number 20060280919
- Publication date Dec 14, 2006
- NGK SPARK PLUG CO., LTD.
- Kazuhiro Urashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding arrangement and method for LTCC circuitry
- Publication number 20060236533
- Publication date Oct 26, 2006
- Northrop Grumman Corporation
- Cynthia W. Berry
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for improving the thermal cycled adhesion of thick-film cond...
- Publication number 20060240231
- Publication date Oct 26, 2006
- Bradley H. Carter
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Method of connecting internal silver traces to external gold to pro...
- Publication number 20060125074
- Publication date Jun 15, 2006
- Phillip S. Fisher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High thermal cycle conductor system
- Publication number 20060009036
- Publication date Jan 12, 2006
- Rudolph John Bacher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer electronic component and method for producing the same
- Publication number 20050269287
- Publication date Dec 8, 2005
- NGK SPARK PLUG CO., LTD.
- Yasuhiro Tsujimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Uphill screen printing in the manufacturing of microelectronic comp...
- Publication number 20050218382
- Publication date Oct 6, 2005
- John M. Michiels
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Method of forming one or more base structures on an LTCC cofired mo...
- Publication number 20050205195
- Publication date Sep 22, 2005
- Cynthia W. Berry
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate having fine line, electron source and image display appar...
- Publication number 20050200267
- Publication date Sep 15, 2005
- Canon Kabushiki Kaisha
- Yoshimi Uda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding arrangement and method for LTCC circuitry
- Publication number 20050189630
- Publication date Sep 1, 2005
- Cynthia W. Berry
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thick film circuit board, method of producing the same and integrat...
- Publication number 20040212085
- Publication date Oct 28, 2004
- Denso Corporation
- Tohru Nomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Uphill screen printing in the manufacturing of microelectronic comp...
- Publication number 20040177777
- Publication date Sep 16, 2004
- John J. Michiels
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Uphill screen printing in the manufacturing of microelectronic comp...
- Publication number 20040163554
- Publication date Aug 26, 2004
- John M. Michiels
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Substrate having fine line, electron source and image display appar...
- Publication number 20040027054
- Publication date Feb 12, 2004
- Canon Kabushiki Kaisha
- Yoshimi Uda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for the production of electrical circuits
- Publication number 20030173719
- Publication date Sep 18, 2003
- Klaus-Peter Wilczek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic component and manufacturing method thereof
- Publication number 20030147196
- Publication date Aug 7, 2003
- TDK Corporation
- Masashi Gotoh
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Method of manufacturing a joint between metal and a ceramic substra...
- Publication number 20030141348
- Publication date Jul 31, 2003
- Leu-Wen Tsay
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Uphill screen printing in the manufacturing of microelectronic comp...
- Publication number 20020134259
- Publication date Sep 26, 2002
- John M. Michiels
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Multi-layer conductor system with intermediate buffer layer for imp...
- Publication number 20020125574
- Publication date Sep 12, 2002
- Frans Peter Lautzenhiser
- H01 - BASIC ELECTRIC ELEMENTS

fired compositions for inorganic substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High frequency component

Semiconductor substrate, electrode forming method, and solar cell f...

Electric component and component and method for the production thereof

Module substrate and production method

Method for producing an LTCC substrate

Semiconductor substrate, electrode forming method, and solar cell f...

Co-processable photoimageable silver and corbon nanotube compositio...

Production of an electrical component and component

Method for LTCC circuitry

Substrate having fine line, electron source and image display appar...

Wiring substrate

Thick film circuit board, method of producing the same and integrat...

Wiring substrate and bonding pad composition

Multilayer electronic component and method for producing the same

Method for improving the thermal cycled adhesion of thick-film cond...

Materials and structure for a high reliability BGA connection betwe...

High density electronic interconnection

Method of forming one or more base structures on an LTCC cofired mo...

Substrate having fine line, electron source and image display appar...

Uphill screen printing in the manufacturing of microelectronic comp...

Uphill screen printing in the manufacturing of microelectronic comp...

Materials and structure for a high reliability bga connection betwe...

Uphill screen printing in the manufacturing of microelectronic comp...

Method of manufacturing a joint between metal and a ceramic substra...

Electronic component and manufacturing method thereof

Substrate having fine line, electron source and image display appar...

Powder metal polymer organic sheet punching for substrate conductors

Electronic component and manufacturing method thereof

Multi-layer conductor system with intermediate buffer layer for imp...

Method for improving the manufacturing safety of weld joints

Patents Applicationslast 30 patents

SEMICONDUCTOR SUBSTRATE, ELECTRODE FORMING METHOD, AND SOLAR CELL F...

ELECTRIC COMPONENT AND COMPONENT AND METHOD FOR THE PRODUCTION THEREOF

Ceramic substrate and method of manufacturing the same

Module Substrate and Production Method

LTCC SUBSTRATE STRUCTURE AND METHOD FOR THE PRODUCTION THEREOF

METHOD FOR MANUFACTURING METALLIZED ALUMINUM NITRIDE SUBSTRATE

Co-processable Photoimageable Silver and Corbon Nanotube Compositio...

SEMICONDUCTOR SUBSTRATE, ELECTRODE FORMING METHOD, AND SOLAR CELL F...

Thick film circuit component and method for manufacturing the same

Method for the Production of an Electrical Component and Component

Wiring substrate

Wiring substrate

Bonding arrangement and method for LTCC circuitry

Method for improving the thermal cycled adhesion of thick-film cond...

Method of connecting internal silver traces to external gold to pro...

High thermal cycle conductor system

Multilayer electronic component and method for producing the same

Uphill screen printing in the manufacturing of microelectronic comp...

Method of forming one or more base structures on an LTCC cofired mo...

Substrate having fine line, electron source and image display appar...

Bonding arrangement and method for LTCC circuitry

Thick film circuit board, method of producing the same and integrat...

Uphill screen printing in the manufacturing of microelectronic comp...

Uphill screen printing in the manufacturing of microelectronic comp...

Substrate having fine line, electron source and image display appar...

Process for the production of electrical circuits

Electronic component and manufacturing method thereof

Method of manufacturing a joint between metal and a ceramic substra...

Uphill screen printing in the manufacturing of microelectronic comp...

Multi-layer conductor system with intermediate buffer layer for imp...