Firing or sintering at relative high temperatures for patterns on inorganic boards

Industry

CPC
H05K3/1291

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/1291Firing or sintering at relative high temperatures for patterns on inorganic boards

Industries

Patents Grantslast 30 patents

Information Patent Grant
Wiring formation method
- Patent number 12,096,570
- Issue date Sep 17, 2024
- FUJI CORPORATION
- Ryojiro Tominaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for printing a conductive pillar with high precision
- Patent number 12,089,343
- Issue date Sep 10, 2024
- Reophotonics, Ltd.
- Michael Zenou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
3D-printed ceramics with conductor infusion for ultra-high-speed el...
- Patent number 11,770,906
- Issue date Sep 26, 2023
- Schlumberger Technology Corporation
- John Michael Beshears
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solvent composition for electronic device production
- Patent number 11,655,381
- Issue date May 23, 2023
- Daicel Corporation
- Hiroyuki Fujii
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Aqueous based nanoparticle ink
- Patent number 11,591,483
- Issue date Feb 28, 2023
- Boise State University
- Kiyo Fujimoto
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Process for in-situ warpage monitoring during solder reflow for hea...
- Patent number 11,558,964
- Issue date Jan 17, 2023
- International Business Machines Corporation
- Jennifer I. Bennett
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed substrate forming method
- Patent number 11,540,397
- Issue date Dec 27, 2022
- FUJI CORPORATION
- Ryojiro Tominaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered ceramic substrate and method for manufacturing same
- Patent number 11,419,218
- Issue date Aug 16, 2022
- DIT CO., LTD.
- Tae Hyung Noh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing same
- Patent number 11,399,426
- Issue date Jul 26, 2022
- NGK Spark Plug Co., Ltd.
- Toshio Suzuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ceramic wiring board and method for producing the same
- Patent number 11,350,523
- Issue date May 31, 2022
- Murata Manufacturing Co., Ltd.
- Takahiro Sumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dispersing element, method for manufacturing structure with conduct...
- Patent number 11,328,835
- Issue date May 10, 2022
- Asahi Kasei Kabushiki Kaisha
- Eiichi Ohno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dispersing element, method for manufacturing structure with conduct...
- Patent number 11,270,809
- Issue date Mar 8, 2022
- Asahi Kasei Kabushiki Kaisha
- Eiichi Ohno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for in situ sintering of conductive ink
- Patent number 11,191,167
- Issue date Nov 30, 2021
- Stratasys Ltd.
- Ira Yudovin-Farber
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Ceramic substrate and method for manufacturing ceramic substrate
- Patent number 10,999,927
- Issue date May 4, 2021
- Murata Manufacturing Co., Ltd.
- Yosuke Mino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and production method therefor
- Patent number 10,785,879
- Issue date Sep 22, 2020
- NGK Spark Plug Co., Ltd.
- Tatsuya Katoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric connection structure and electric connection member
- Patent number 10,721,822
- Issue date Jul 21, 2020
- Japan Aviation Electronics Industry, Limited
- Junya Sato
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Conductive paste
- Patent number 10,702,954
- Issue date Jul 7, 2020
- Namics Corporation
- Yoshiaki Yoshii
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Core-shell nanostructures and related inks, films and methods
- Patent number 10,563,080
- Issue date Feb 18, 2020
- University of Louisville Research Foundation, Inc.
- Theodore Druffel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and electronic component
- Patent number 10,537,017
- Issue date Jan 14, 2020
- Sumitomo Electric Industries, Ltd.
- Kohei Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic substrate
- Patent number 10,524,365
- Issue date Dec 31, 2019
- NGK Spark Plug Co., Ltd.
- Tatsuya Katoh
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Highly conductive transparent glass-based circuit board
- Patent number 10,512,170
- Issue date Dec 17, 2019
- WUHAN HUASHANG GREEN TECHNOLOGY CO., LTD.
- Lianjia Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for firing copper paste
- Patent number 10,433,427
- Issue date Oct 1, 2019
- MATERIAL CONCEPT, INC.
- Junichi Koike
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Precision screen printing with sub-micron uniformity of metallizati...
- Patent number 10,410,900
- Issue date Sep 10, 2019
- Applied Materials, Inc.
- Shih-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic substrate, electronic component, and method of manufacturin...
- Patent number 10,405,430
- Issue date Sep 3, 2019
- Murata Manufacturing Co., Ltd.
- Tatsunori Kan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a ceramic substrate
- Patent number 10,375,837
- Issue date Aug 6, 2019
- NGK Spark Plug Co., Ltd.
- Tatsuya Katoh
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Multi-layer cooling element
- Patent number 10,327,323
- Issue date Jun 18, 2019
- CeramTec GmbH
- Alexander Dohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric connection structure and electric connection member
- Patent number 10,314,175
- Issue date Jun 4, 2019
- Japan Aviation Electronics Industry, Limited
- Junya Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas sensor, electrically conductive oxide sintered body, and wiring...
- Patent number 10,302,589
- Issue date May 28, 2019
- NGK Spark Plug Co., Ltd.
- Mina Sato
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Insulating ceramic paste, ceramic electronic component, and method...
- Patent number 10,292,264
- Issue date May 14, 2019
- Murata Manufacturing Co., Ltd.
- Sumiyo Nakamura
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Ceramic circuit board and electronic device
- Patent number 10,225,929
- Issue date Mar 5, 2019
- Kyocera Corporation
- Takafumi Kamei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
THICK FILM PRINTED COOLER FOR IMPROVED THERMAL MANAGEMENT OF DIRECT...
- Publication number 20240090119
- Publication date Mar 14, 2024
- Dana Canada Corporation
- Matthew S. BIRKETT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR PRINTING A CONDUCTIVE PILLAR WITH HIGH PRECISION
- Publication number 20240080992
- Publication date Mar 7, 2024
- Reophotonics, Ltd.
- Michael Zenou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WIRING FORMATION METHOD
- Publication number 20230112913
- Publication date Apr 13, 2023
- FUJI CORPORATION
- Ryojiro TOMINAGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND SYSTEM FOR FABRICATING FLEXIBLE ELECTRONICS
- Publication number 20220007516
- Publication date Jan 6, 2022
- Singapore University of Technology and Design
- Shaoying Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING CERAMIC SUBSTRATE
- Publication number 20210227690
- Publication date Jul 22, 2021
- MURATA MANUFACTURING CO., LTD.
- Yosuke MINO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dispersing Element, Method for Manufacturing Structure with Conduct...
- Publication number 20210225551
- Publication date Jul 22, 2021
- Asahi Kasei Kabushiki Kaisha
- Eiichi Ohno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED SUBSTRATE FORMING METHOD, AND PRINTED SUBSTRATE FORMING DEVICE
- Publication number 20210029832
- Publication date Jan 28, 2021
- FUJI CORPORATION
- Ryojiro TOMINAGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AQUEOUS BASED NANOPARTICLE INK
- Publication number 20210017408
- Publication date Jan 21, 2021
- BOISE STATE UNIVERSITY
- Kiyo Fujimoto
- B82 - NANO-TECHNOLOGY
Information Patent Application
MULTILAYERED CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20200084894
- Publication date Mar 12, 2020
- DIT Co., Ltd.
- Tae Hyung NOH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dispersing Element, Method for Manufacturing Structure with Conduct...
- Publication number 20200013521
- Publication date Jan 9, 2020
- Asahi Kasei Kabushiki Kaisha
- Eiichi Ohno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGHLY CONDUCTIVE TRANSPARENT GLASS-BASED CIRCUIT BOARD
- Publication number 20190327839
- Publication date Oct 24, 2019
- WUHAN HUASHANG GREEN TECHNOLOGY CO., LTD.
- Lianjia LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRECISION SCREEN PRINTING WITH SUB-MICRON UNIFORMITY OF METALLIZATI...
- Publication number 20190273008
- Publication date Sep 5, 2019
- Applied Materials, Inc.
- Shih-Ying Huang
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING CERAMIC SUBSTRATE
- Publication number 20190254162
- Publication date Aug 15, 2019
- MURATA MANUFACTURING CO., LTD.
- Yosuke MINO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of Fabricating Conductive Thick-Film Pastes of Base Metals...
- Publication number 20190143405
- Publication date May 16, 2019
- National Cheng Kung University
- Wen-Hsi Lee
- B22 - CASTING POWDER METALLURGY
Information Patent Application
ELECTRIC CONNECTION STRUCTURE AND ELECTRIC CONNECTION MEMBER
- Publication number 20190075658
- Publication date Mar 7, 2019
- Japan Aviation Electronics Industry, Limited
- Junya SATO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT
- Publication number 20190008035
- Publication date Jan 3, 2019
- Sumitomo Electric Industries, Ltd.
- Kohei OKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND PRODUCTION METHOD THEREFOR
- Publication number 20180324957
- Publication date Nov 8, 2018
- NGK SPARK PLUG CO., LTD.
- Tatsuya KATOH
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
INSULATING CERAMIC PASTE, CERAMIC ELECTRONIC COMPONET, AND METHOD...
- Publication number 20180302982
- Publication date Oct 18, 2018
- MURATA MANUFACTURING CO., LTD.
- Sumiyo Nakamura
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
METHOD AND SYSTEM FOR IN SITU SINTERING OF CONDUCTIVE INK
- Publication number 20180295728
- Publication date Oct 11, 2018
- STRATASYS LTD.
- Ira YUDOVIN-FARBER
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ELECTROCONDUCTIVE FILM AND METHOD FOR PRODUCING SAME
- Publication number 20180077798
- Publication date Mar 15, 2018
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Hidefumi FUJITA
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
GAS SENSOR, ELECTRICALLY CONDUCTIVE OXIDE SINTERED BODY, AND WIRING...
- Publication number 20180045673
- Publication date Feb 15, 2018
- NGK SPARK PLUG CO., LTD.
- Mina SATO
- G01 - MEASURING TESTING
Information Patent Application
PRECISION SCREEN PRINTING WITH SUB-MICRON UNIFORMITY OF METALLIZATI...
- Publication number 20180040498
- Publication date Feb 8, 2018
- Applied Materials, Inc.
- Shih-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CERAMIC SUBSTRATE, CERAMIC SUBSTRATE, AND...
- Publication number 20180014408
- Publication date Jan 11, 2018
- Tatsuya KATOH
- B32 - LAYERED PRODUCTS
Information Patent Application
CONDUCTIVE PASTE AND METHOD FOR PRODUCING CONDUCTIVE FILM USING SAME
- Publication number 20170362455
- Publication date Dec 21, 2017
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Hidefumi Fujita
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
THICK FILM PASTE AND USE THEREOF
- Publication number 20170342528
- Publication date Nov 30, 2017
- E I DU PONT DE NEMOURS AND COMPANY
- Howard David Glicksman
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
WIRING FORMING METHOD AND CIRCUIT BOARD
- Publication number 20170318681
- Publication date Nov 2, 2017
- FUJI MACHINE MFG. CO., LTD.
- Yoshitaka HASHIMOTO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CERAMIC SUBSTRATE, ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURIN...
- Publication number 20170303398
- Publication date Oct 19, 2017
- MURATA MANUFACTURING CO., LTD.
- Tatsunori KAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRIC CONNECTION STRUCTURE AND ELECTRIC CONNECTION MEMBER
- Publication number 20170273192
- Publication date Sep 21, 2017
- Japan Aviation Electronics Industry, Limited
- Junya SATO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MULTILAYER COOLER
- Publication number 20170265294
- Publication date Sep 14, 2017
- Alexander DOHN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORE-SHELL NANOSTRUCTURES AND RELATED INKS, FILMS AND METHODS
- Publication number 20170253758
- Publication date Sep 7, 2017
- UNIVERSITY OF LOUISVILLE RESEARCH FOUNDATION, INC.
- Theodore DRUFFEL
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Firing or sintering at relative high temperatures for patterns on inorganic boards

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring formation method

Methods for printing a conductive pillar with high precision

3D-printed ceramics with conductor infusion for ultra-high-speed el...

Solvent composition for electronic device production

Aqueous based nanoparticle ink

Process for in-situ warpage monitoring during solder reflow for hea...

Printed substrate forming method

Multilayered ceramic substrate and method for manufacturing same

Wiring board and method for manufacturing same

Ceramic wiring board and method for producing the same

Dispersing element, method for manufacturing structure with conduct...

Dispersing element, method for manufacturing structure with conduct...

Method and system for in situ sintering of conductive ink

Ceramic substrate and method for manufacturing ceramic substrate

Circuit board and production method therefor

Electric connection structure and electric connection member

Conductive paste

Core-shell nanostructures and related inks, films and methods

Printed circuit board and electronic component

Ceramic substrate

Highly conductive transparent glass-based circuit board

Method for firing copper paste

Precision screen printing with sub-micron uniformity of metallizati...

Ceramic substrate, electronic component, and method of manufacturin...

Method of manufacturing a ceramic substrate

Multi-layer cooling element

Electric connection structure and electric connection member

Gas sensor, electrically conductive oxide sintered body, and wiring...

Insulating ceramic paste, ceramic electronic component, and method...

Ceramic circuit board and electronic device

Patents Applicationslast 30 patents

THICK FILM PRINTED COOLER FOR IMPROVED THERMAL MANAGEMENT OF DIRECT...

METHODS FOR PRINTING A CONDUCTIVE PILLAR WITH HIGH PRECISION

WIRING FORMATION METHOD

METHOD AND SYSTEM FOR FABRICATING FLEXIBLE ELECTRONICS

CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING CERAMIC SUBSTRATE

Dispersing Element, Method for Manufacturing Structure with Conduct...

PRINTED SUBSTRATE FORMING METHOD, AND PRINTED SUBSTRATE FORMING DEVICE

AQUEOUS BASED NANOPARTICLE INK

MULTILAYERED CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING SAME

Dispersing Element, Method for Manufacturing Structure with Conduct...

HIGHLY CONDUCTIVE TRANSPARENT GLASS-BASED CIRCUIT BOARD

PRECISION SCREEN PRINTING WITH SUB-MICRON UNIFORMITY OF METALLIZATI...

CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING CERAMIC SUBSTRATE

Methods of Fabricating Conductive Thick-Film Pastes of Base Metals...

ELECTRIC CONNECTION STRUCTURE AND ELECTRIC CONNECTION MEMBER

PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT

CIRCUIT BOARD AND PRODUCTION METHOD THEREFOR

INSULATING CERAMIC PASTE, CERAMIC ELECTRONIC COMPONET, AND METHOD...

METHOD AND SYSTEM FOR IN SITU SINTERING OF CONDUCTIVE INK

ELECTROCONDUCTIVE FILM AND METHOD FOR PRODUCING SAME

GAS SENSOR, ELECTRICALLY CONDUCTIVE OXIDE SINTERED BODY, AND WIRING...

PRECISION SCREEN PRINTING WITH SUB-MICRON UNIFORMITY OF METALLIZATI...

METHOD FOR MANUFACTURING CERAMIC SUBSTRATE, CERAMIC SUBSTRATE, AND...

CONDUCTIVE PASTE AND METHOD FOR PRODUCING CONDUCTIVE FILM USING SAME

THICK FILM PASTE AND USE THEREOF

WIRING FORMING METHOD AND CIRCUIT BOARD

CERAMIC SUBSTRATE, ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURIN...

ELECTRIC CONNECTION STRUCTURE AND ELECTRIC CONNECTION MEMBER

MULTILAYER COOLER

CORE-SHELL NANOSTRUCTURES AND RELATED INKS, FILMS AND METHODS