Firing

Industry

CPC
H05K2203/1126

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/1126Firing

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing shielded printed wiring board and shielded...
- Patent number 12,150,239
- Issue date Nov 19, 2024
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Sirou Yamauchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for producing circuit board
- Patent number 12,133,328
- Issue date Oct 29, 2024
- Murata Manufacturing Co., Ltd.
- Tomoki Kato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic-copper composite, ceramic circuit board, power module, and...
- Patent number 12,109,640
- Issue date Oct 8, 2024
- DENKA COMPANY LIMITED
- Akimasa Yuasa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for manufacturing ceramic substrate and ceramic substrate
- Patent number 11,950,360
- Issue date Apr 2, 2024
- Murata Manufacturing Co., Ltd.
- Koki Sai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a glass substrate with a plurality of vias
- Patent number 11,646,246
- Issue date May 9, 2023
- Samtec, Inc.
- Tim Mobley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring board and probe card including same
- Patent number 11,497,126
- Issue date Nov 8, 2022
- POINT ENGINEERING CO., LTD.
- Bum Mo Ahn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered ceramic substrate and method for manufacturing same
- Patent number 11,419,218
- Issue date Aug 16, 2022
- DIT CO., LTD.
- Tae Hyung Noh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic wiring board and method for producing the same
- Patent number 11,350,523
- Issue date May 31, 2022
- Murata Manufacturing Co., Ltd.
- Takahiro Sumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Filling materials and methods of filling through holes of a substrate
- Patent number 11,251,109
- Issue date Feb 15, 2022
- Samtec, Inc.
- Tim Mobley
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Photosensitive glass paste, electronic component, and method for pr...
- Patent number 11,136,259
- Issue date Oct 5, 2021
- Murata Manufacturing Co., Ltd.
- Hiroyuki Kanbara
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Multilayer ceramic substrate and method of manufacturing multilayer...
- Patent number 11,140,778
- Issue date Oct 5, 2021
- Murata Manufacturing Co., Ltd.
- Issei Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for electrical circuits and method for producing a substr...
- Patent number 10,940,671
- Issue date Mar 9, 2021
- Rogers Germany GmbH
- Andreas Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and manufacturing method thereof
- Patent number 10,849,224
- Issue date Nov 24, 2020
- NGK Spark Plug Co., Ltd.
- Takahiro Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for electrical circuits and method for producing a substr...
- Patent number 10,821,704
- Issue date Nov 3, 2020
- Rogers Germany GmbH
- Andreas Meyer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wiring board and manufacturing method thereof
- Patent number 10,813,217
- Issue date Oct 20, 2020
- NGK Spark Plug Co., Ltd.
- Takahiro Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and production method therefor
- Patent number 10,785,879
- Issue date Sep 22, 2020
- NGK Spark Plug Co., Ltd.
- Tatsuya Katoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and electronic component
- Patent number 10,537,020
- Issue date Jan 14, 2020
- Sumitomo Electric Industries, Ltd.
- Kohei Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic substrate
- Patent number 10,524,365
- Issue date Dec 31, 2019
- NGK Spark Plug Co., Ltd.
- Tatsuya Katoh
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Highly conductive transparent glass-based circuit board
- Patent number 10,512,170
- Issue date Dec 17, 2019
- WUHAN HUASHANG GREEN TECHNOLOGY CO., LTD.
- Lianjia Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photosensitive glass paste and electronic component
- Patent number 10,390,427
- Issue date Aug 20, 2019
- Murata Manufacturing Co., Ltd.
- Hiroyuki Kanbara
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Method of manufacturing a ceramic substrate
- Patent number 10,375,837
- Issue date Aug 6, 2019
- NGK Spark Plug Co., Ltd.
- Tatsuya Katoh
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Non-conductive substrate with tracks formed by sand blasting
- Patent number 10,335,922
- Issue date Jul 2, 2019
- DIRECTOR GENERAL, CENTRE FOR MATERIALS FOR ELECTRONICS TECHNOLOGY
- Girish Phatak
- B24 - GRINDING POLISHING
Information Patent Grant
Electrical wiring member production method, electrical wiring membe...
- Patent number 10,299,376
- Issue date May 21, 2019
- Seiko Epson Corporation
- Hidefumi Nakamura
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Mother ceramic substrate, ceramic substrate, mother module componen...
- Patent number 10,257,927
- Issue date Apr 9, 2019
- Murata Manufacturing Co., Ltd.
- Yukio Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stretchable circuit board and method for manufacturing the same
- Patent number 10,076,025
- Issue date Sep 11, 2018
- Nippon Mektron, Ltd.
- Masayuki Iwase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal particle dispersion for electroconductive substrates, method...
- Patent number 9,972,413
- Issue date May 15, 2018
- Dai Nippon Printing Co., Ltd.
- Yoshinobu Omori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring substrate, manufacturing method therefor, and sub...
- Patent number 9,961,768
- Issue date May 1, 2018
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free low-melting glass composition, low-temperature sealing gl...
- Patent number 9,950,948
- Issue date Apr 24, 2018
- Hitachi Chemical Company, Ltd.
- Takashi Naito
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Method for fabricating blackened conductive patterns
- Patent number 9,839,138
- Issue date Dec 5, 2017
- Inktec Co., Ltd.
- Kwang Choon Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thick print copper pastes for aluminum nitride substrates
- Patent number 9,799,421
- Issue date Oct 24, 2017
- Heraeus Precious Metals North America Conshohocken LLC
- Virginia C. Garcia
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-LAYER CERAMIC PACKAGE HAVING A MULTILAYER CERAMIC BASE AND AT...
- Publication number 20230380077
- Publication date Nov 23, 2023
- Kyocera International, Inc.
- Hiroshi MAKINO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230013032
- Publication date Jan 19, 2023
- Murata Manufacturing Co., Ltd.
- Minoru HATASE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD
- Publication number 20220272837
- Publication date Aug 25, 2022
- Murata Manufacturing Co., Ltd.
- Tomoki KATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC-COPPER COMPOSITE, CERAMIC CIRCUIT BOARD, POWER MODULE, AND...
- Publication number 20220225498
- Publication date Jul 14, 2022
- DENKA COMPANY LIMITED
- Akimasa YUASA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING CERAMIC SUBSTRATE AND CERAMIC SUBSTRATE
- Publication number 20210360777
- Publication date Nov 18, 2021
- Murata Manufacturing Co., Ltd.
- Koki Sai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD AND PROBE CARD INCLUDING SAME
- Publication number 20210136927
- Publication date May 6, 2021
- POINT ENGINEERING CO., LTD.
- Bum Mo AHN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING MULTILAYER...
- Publication number 20200396834
- Publication date Dec 17, 2020
- MURATA MANUFACTURING CO., LTD.
- Issei Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20200084894
- Publication date Mar 12, 2020
- DIT Co., Ltd.
- Tae Hyung NOH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGHLY CONDUCTIVE TRANSPARENT GLASS-BASED CIRCUIT BOARD
- Publication number 20190327839
- Publication date Oct 24, 2019
- WUHAN HUASHANG GREEN TECHNOLOGY CO., LTD.
- Lianjia LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOSENSITIVE GLASS PASTE, ELECTRONIC COMPONENT, AND METHOD FOR PR...
- Publication number 20190112222
- Publication date Apr 18, 2019
- Murata Manufacturing Co., Ltd.
- Hiroyuki KANBARA
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
CIRCUIT BOARD AND PRODUCTION METHOD THEREFOR
- Publication number 20180324957
- Publication date Nov 8, 2018
- NGK SPARK PLUG CO., LTD.
- Tatsuya KATOH
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
A NON-CONDUCTIVE SUBSTRATE WITH TRACKS FORMED BY SAND BLASTING
- Publication number 20180264623
- Publication date Sep 20, 2018
- DIRECTOR GENERAL, CENTRE FOR MATERIALS FOR ELECTRONICS TECHNOLOGY
- Girish PHATAK
- B24 - GRINDING POLISHING
Information Patent Application
PHOTOSENSITIVE GLASS PASTE AND ELECTRONIC COMPONENT
- Publication number 20180220529
- Publication date Aug 2, 2018
- Murata Manufacturing Co., Ltd.
- Hiroyuki KANBARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR ELECTRICAL CIRCUITS AND METHOD FOR PRODUCING A SUBSTR...
- Publication number 20180200989
- Publication date Jul 19, 2018
- Rogers Germany GmbH
- Andreas MEYER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR MANUFACTURING CERAMIC SUBSTRATE, CERAMIC SUBSTRATE, AND...
- Publication number 20180014408
- Publication date Jan 11, 2018
- Tatsuya KATOH
- B32 - LAYERED PRODUCTS
Information Patent Application
LEAD-FREE LOW-MELTING GLASS COMPOSITION, LOW-TEMPERATURE SEALING GL...
- Publication number 20170253522
- Publication date Sep 7, 2017
- Hitachi Chemical Company, Ltd.
- Takashi NAITO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CERAMIC WIRING BOARD AND METHOD FOR PRODUCING THE SAME
- Publication number 20170135205
- Publication date May 11, 2017
- Murata Manufacturing Co., Ltd.
- Takahiro Sumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOTHER CERAMIC SUBSTRATE, CERAMIC SUBSTRATE, MOTHER MODULE COMPONEN...
- Publication number 20170079137
- Publication date Mar 16, 2017
- MURATA MANUFACTURING CO., LTD.
- Yukio MAEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BURNING METHOD
- Publication number 20150382477
- Publication date Dec 31, 2015
- Konica Minolta, Inc.
- Sayaka MORITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE PASTE
- Publication number 20150299477
- Publication date Oct 22, 2015
- NAMICS CORPORATION
- Yoshiaki YOSHII
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METAL PARTICLE DISPERSION FOR ELECTROCONDUCTIVE SUBSTRATES, METHOD...
- Publication number 20150279505
- Publication date Oct 1, 2015
- DAI NIPPON PRINTING CO., LTD.
- Yoshinobu Omori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating Blackened Conductive Patterns
- Publication number 20140377455
- Publication date Dec 25, 2014
- Kwang Choon Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THICK PRINT COPPER PASTES FOR ALUMINUM NITRIDE SUBSTRATES
- Publication number 20140363681
- Publication date Dec 11, 2014
- Heraeus Precious Metals North America Conshohocken, LLC
- Virginia C. Garcia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Via Fill Material For Solar Applications
- Publication number 20140332067
- Publication date Nov 13, 2014
- George E. Graddy
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC APPARATUS PROVIDED WITH SAME
- Publication number 20140284088
- Publication date Sep 25, 2014
- Kiyotaka Nakamura
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
CIRCUIT SUBSTRATE
- Publication number 20140251664
- Publication date Sep 11, 2014
- NGK Insulators, Ltd.
- Yukio AISAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MIXED-METAL SYSTEM CONDUCTORS FOR USE IN LOW-TEMPERATURE CO-FIRED C...
- Publication number 20140224530
- Publication date Aug 14, 2014
- E I DU PONT DE NEMOURS AND COMPANY
- KUMARAN MANIKANTAN NAIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON NITRIDE SUBSTRATE AND METHOD FOR PRODUCING SILICON NITRIDE...
- Publication number 20140220302
- Publication date Aug 7, 2014
- Youichirou Kaga
- B32 - LAYERED PRODUCTS
Information Patent Application
Sensor Device and Method for Manufacture
- Publication number 20140137402
- Publication date May 22, 2014
- Gerald Kloiber
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR MANUFACTURING CERAMIC PLATES
- Publication number 20130277415
- Publication date Oct 24, 2013
- Hiroshi ASANO
- B32 - LAYERED PRODUCTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing shielded printed wiring board and shielded...

Circuit board and method for producing circuit board

Ceramic-copper composite, ceramic circuit board, power module, and...

Method for manufacturing ceramic substrate and ceramic substrate

Method of fabricating a glass substrate with a plurality of vias

Multilayer wiring board and probe card including same

Multilayered ceramic substrate and method for manufacturing same

Ceramic wiring board and method for producing the same

Filling materials and methods of filling through holes of a substrate

Photosensitive glass paste, electronic component, and method for pr...

Multilayer ceramic substrate and method of manufacturing multilayer...

Substrate for electrical circuits and method for producing a substr...

Wiring board and manufacturing method thereof

Substrate for electrical circuits and method for producing a substr...

Wiring board and manufacturing method thereof

Circuit board and production method therefor

Printed circuit board and electronic component

Ceramic substrate

Highly conductive transparent glass-based circuit board

Photosensitive glass paste and electronic component

Method of manufacturing a ceramic substrate

Non-conductive substrate with tracks formed by sand blasting

Electrical wiring member production method, electrical wiring membe...

Mother ceramic substrate, ceramic substrate, mother module componen...

Stretchable circuit board and method for manufacturing the same

Metal particle dispersion for electroconductive substrates, method...

Multilayer wiring substrate, manufacturing method therefor, and sub...

Lead-free low-melting glass composition, low-temperature sealing gl...

Method for fabricating blackened conductive patterns

Thick print copper pastes for aluminum nitride substrates

Patents Applicationslast 30 patents

MULTI-LAYER CERAMIC PACKAGE HAVING A MULTILAYER CERAMIC BASE AND AT...

MODULE AND METHOD FOR MANUFACTURING SAME

CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD

CERAMIC-COPPER COMPOSITE, CERAMIC CIRCUIT BOARD, POWER MODULE, AND...

METHOD FOR MANUFACTURING CERAMIC SUBSTRATE AND CERAMIC SUBSTRATE

MULTILAYER WIRING BOARD AND PROBE CARD INCLUDING SAME

MULTILAYER CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING MULTILAYER...

MULTILAYERED CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING SAME

HIGHLY CONDUCTIVE TRANSPARENT GLASS-BASED CIRCUIT BOARD

PHOTOSENSITIVE GLASS PASTE, ELECTRONIC COMPONENT, AND METHOD FOR PR...

CIRCUIT BOARD AND PRODUCTION METHOD THEREFOR

A NON-CONDUCTIVE SUBSTRATE WITH TRACKS FORMED BY SAND BLASTING

PHOTOSENSITIVE GLASS PASTE AND ELECTRONIC COMPONENT

SUBSTRATE FOR ELECTRICAL CIRCUITS AND METHOD FOR PRODUCING A SUBSTR...

METHOD FOR MANUFACTURING CERAMIC SUBSTRATE, CERAMIC SUBSTRATE, AND...

LEAD-FREE LOW-MELTING GLASS COMPOSITION, LOW-TEMPERATURE SEALING GL...

CERAMIC WIRING BOARD AND METHOD FOR PRODUCING THE SAME

MOTHER CERAMIC SUBSTRATE, CERAMIC SUBSTRATE, MOTHER MODULE COMPONEN...

BURNING METHOD

CONDUCTIVE PASTE

METAL PARTICLE DISPERSION FOR ELECTROCONDUCTIVE SUBSTRATES, METHOD...

Method for Fabricating Blackened Conductive Patterns

THICK PRINT COPPER PASTES FOR ALUMINUM NITRIDE SUBSTRATES

Via Fill Material For Solar Applications

CIRCUIT BOARD AND ELECTRONIC APPARATUS PROVIDED WITH SAME

CIRCUIT SUBSTRATE

MIXED-METAL SYSTEM CONDUCTORS FOR USE IN LOW-TEMPERATURE CO-FIRED C...

SILICON NITRIDE SUBSTRATE AND METHOD FOR PRODUCING SILICON NITRIDE...

Sensor Device and Method for Manufacture

METHOD FOR MANUFACTURING CERAMIC PLATES