Flame-retardant Preventing of inflammation

Industry

CPC
H05K2201/012

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/012Flame-retardant Preventing of inflammation

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating a substrate with metal reflection layer
- Patent number 11,979,980
- Issue date May 7, 2024
- UNIFLEX Technology Inc.
- Cheng-I Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer resin substrate, and method of manufacturing multilayer...
- Patent number 11,963,294
- Issue date Apr 16, 2024
- Murata Manufacturing Co., Ltd.
- Tomohiro Furumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing electronics assembly
- Patent number 11,950,367
- Issue date Apr 2, 2024
- TACTOTEK OY
- Vinski Bräysy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical chips mounted on a deformed carrier
- Patent number 11,942,572
- Issue date Mar 26, 2024
- OSRAM OLED GmbH
- Siegfried Herrmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a substrate structure with high reflectance
- Patent number 11,937,370
- Issue date Mar 19, 2024
- UNIFLEX Technology Inc.
- Cheng-I Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive leadwire for physiological patient monitoring
- Patent number 11,931,177
- Issue date Mar 19, 2024
- General Electric Company
- Jussi Halinen
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Illuminated multilayer structure with embedded light sources
- Patent number 11,934,004
- Issue date Mar 19, 2024
- TACTOTEK OY
- Antti Keränen
- G02 - OPTICS
Information Patent Grant
Thermoplastic composition for laser direct structuring
- Patent number 11,912,863
- Issue date Feb 27, 2024
- MEP EUROPE B.V.
- Bernardus Antonius Gerardus Schrauwen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for manufacturing electronics assembly and electronics assembly
- Patent number 11,910,530
- Issue date Feb 20, 2024
- TACTOTEK OY
- Vinski Bräysy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, prepreg, laminate, multilayer printed wiring boa...
- Patent number 11,905,412
- Issue date Feb 20, 2024
- Resonac Corporation
- Takahiro Taki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for embedding and packaging multiple devices by layer and...
- Patent number 11,903,133
- Issue date Feb 13, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Organic insulating body, metal-clad laminate, and wiring board
- Patent number 11,879,049
- Issue date Jan 23, 2024
- Kyocera Corporation
- Satoshi Kajita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoplastic liquid crystal polymer film and circuit board using same
- Patent number 11,877,395
- Issue date Jan 16, 2024
- Kuraray Co., Ltd.
- Minoru Onodera
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multilayer resin substrate and method of manufacturing multilayer r...
- Patent number 11,856,713
- Issue date Dec 26, 2023
- Murata Manufacturing Co., Ltd.
- Masanori Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect, an electronic assembly and a method for manufacturing...
- Patent number 11,856,692
- Issue date Dec 26, 2023
- Imec VZW
- Steven Nagels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional molded circuit component
- Patent number 11,839,023
- Issue date Dec 5, 2023
- MAXELL, LTD.
- Atsushi Yusa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Multilayer coil circuit substrate
- Patent number 11,810,703
- Issue date Nov 7, 2023
- Murata Manufacturing Co., Ltd.
- Yuki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aerosol generating device having heater
- Patent number 11,800,603
- Issue date Oct 24, 2023
- KT & G Corporation
- Hun Il Lim
- A24 - TOBACCO CIGARS CIGARETTES SMOKERS' REQUISITES
Information Patent Grant
Thermally conductive board
- Patent number 11,778,739
- Issue date Oct 3, 2023
- Polytronics Technology Corp.
- Kuo Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically conductive film
- Patent number 11,751,327
- Issue date Sep 5, 2023
- Gentherm GmbH
- Martin Schaetzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aerosol generating device and method for controlling same
- Patent number 11,744,287
- Issue date Sep 5, 2023
- KT & G Corporation
- Hun Il Lim
- A24 - TOBACCO CIGARS CIGARETTES SMOKERS' REQUISITES
Information Patent Grant
Multilayer substrate and method for manufacturing the same
- Patent number 11,735,346
- Issue date Aug 22, 2023
- Murata Manufacturing Co., Ltd.
- Shingo Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit structure
- Patent number 11,729,908
- Issue date Aug 15, 2023
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aerosol generation device including mainstream smoke passage and pr...
- Patent number 11,700,885
- Issue date Jul 18, 2023
- KT & G Corporation
- Jung Ho Han
- A24 - TOBACCO CIGARS CIGARETTES SMOKERS' REQUISITES
Information Patent Grant
Aerosol generation device and heater for aerosol generation device
- Patent number 11,700,884
- Issue date Jul 18, 2023
- KT & G Corporation
- Hwi Kyeong An
- A24 - TOBACCO CIGARS CIGARETTES SMOKERS' REQUISITES
Information Patent Grant
Aerosol generating device and heater assembly for aerosol generatin...
- Patent number 11,700,886
- Issue date Jul 18, 2023
- KT & G Corporation
- Tae Hun Kim
- A24 - TOBACCO CIGARS CIGARETTES SMOKERS' REQUISITES
Information Patent Grant
Aerosol generating device having heater
- Patent number 11,696,600
- Issue date Jul 11, 2023
- KT & G Corporation
- Hun Il Lim
- F21 - LIGHTING
Information Patent Grant
Aerosol generation device and heater for aerosol generation device
- Patent number 11,666,092
- Issue date Jun 6, 2023
- KT & G Corporation
- Hwi Kyeong An
- A24 - TOBACCO CIGARS CIGARETTES SMOKERS' REQUISITES
Information Patent Grant
Organic board, metal-clad laminate, and wiring board
- Patent number 11,661,495
- Issue date May 30, 2023
- Kyocera Corporation
- Chie Chikara
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin substrate and method for manufacturing resin substrate
- Patent number 11,659,652
- Issue date May 23, 2023
- Murata Manufacturing Co., Ltd.
- Ryosuke Takada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME
- Publication number 20240155760
- Publication date May 9, 2024
- Shinko Electric Industries Co., Ltd.
- Yuji YUKIIRI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package Structure and Electronic Device
- Publication number 20240121887
- Publication date Apr 11, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Xiaojing Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...
- Publication number 20240064907
- Publication date Feb 22, 2024
- FICT LIMITED
- Taiji Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LCP EXTRUDED FILM AND METHOD FOR MANUFACTURING THE SAME, LCP EXTRUD...
- Publication number 20240032191
- Publication date Jan 25, 2024
- Denka Company Limited
- Yusuke MASUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20240008168
- Publication date Jan 4, 2024
- Murata Manufacturing Co., Ltd.
- Kosuke NISHIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONICS ASSEMBLY AND ELECTRONICS ASSEMBLY
- Publication number 20230389184
- Publication date Nov 30, 2023
- TactoTek Oy
- Vinski BRÄYSY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATING MATERIAL FOR CIRCUIT SUBSTRATE, AND METHOD FOR MANUFACTU...
- Publication number 20230371188
- Publication date Nov 16, 2023
- Denka Company Limited
- Shun UCHIYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Structure
- Publication number 20230354515
- Publication date Nov 2, 2023
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Articles and Structures with Laser Breakable and Platable Compounds
- Publication number 20230340226
- Publication date Oct 26, 2023
- SHPP Global Technologies B.V.
- Yunan CHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONICS ASSEMBLY AND ELECTRONICS ASSEMBLY
- Publication number 20230309231
- Publication date Sep 28, 2023
- TactoTek Oy
- Vinski BRÄYSY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING AN ELASTOMERIC COMPONENT COMPRISING A PRINTED...
- Publication number 20230300988
- Publication date Sep 21, 2023
- Dätwyler Schweiz AG
- Ronny VRIJENS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE
- Publication number 20230284381
- Publication date Sep 7, 2023
- Murata Manufacturing Co., Ltd.
- Kosuke NISHIO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION STRUCTURE AND CONNECTION STRUCTURE MANUFACTURING METHOD
- Publication number 20230262895
- Publication date Aug 17, 2023
- Murata Manufacturing Co., Ltd.
- Yuma OTSUKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN FILM WITH CONDUCTOR LAYER, MULTILAYER SUBSTRATE, AND METHOD F...
- Publication number 20230262876
- Publication date Aug 17, 2023
- Murata Manufacturing Co., Ltd.
- Mineto MITSUHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL DEVICE
- Publication number 20230247779
- Publication date Aug 3, 2023
- IRISO Electronics Co., Ltd.
- Yujiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS, ROBOT, AND MOTION STAGE
- Publication number 20230247766
- Publication date Aug 3, 2023
- SEIKO EPSON CORPORATION
- Mitsumi KISHIDA
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
LEAKAGE CHARACTERIZATION FOR ELECTRONIC CIRCUIT TEMPERATURE MONITORING
- Publication number 20230228824
- Publication date Jul 20, 2023
- International Business Machines Corporation
- Matthew Doyle
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method for manufacturing a component
- Publication number 20230209703
- Publication date Jun 29, 2023
- Scio Holding GmbH
- Marius Sillmann
- B60 - VEHICLES IN GENERAL
Information Patent Application
STRUCTURE FOR EMBEDDING AND PACKAGING MULTIPLE DEVICES BY LAYER AND...
- Publication number 20230189444
- Publication date Jun 15, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE
- Publication number 20230118261
- Publication date Apr 20, 2023
- Murata Manufacturing Co., Ltd.
- Takayuki SHIMAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE, SINGLE-SIDED METAL-CLAD LAMINATED SHEET, AND MULTI-LAYER...
- Publication number 20230106839
- Publication date Apr 6, 2023
- Kaneka Corporation
- Kanji Shimoosako
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laminated Component Carrier With a Thermoplastic Structure
- Publication number 20230054846
- Publication date Feb 23, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230053211
- Publication date Feb 16, 2023
- Murata Manufacturing Co., Ltd.
- Kosuke NISHIO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITIVE LEADWIRE FOR PHYSIOLOGICAL PATIENT MONITORING
- Publication number 20230043358
- Publication date Feb 9, 2023
- GENERAL ELECTRIC COMPANY
- Jussi Halinen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT, AN ELECTRONIC ASSEMBLY AND A METHOD FOR MANUFACTURING...
- Publication number 20230012885
- Publication date Jan 19, 2023
- IMEC vzw
- Steven NAGELS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin Sheet and Circuit Board Material Using the Same
- Publication number 20230007767
- Publication date Jan 5, 2023
- MCPP Innovation LLC
- Yuuko Hayakawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
- Publication number 20230007782
- Publication date Jan 5, 2023
- Avary Holding (Shenzhen) Co., Limited.
- CHAO PENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN MULTILAYER SUBSTRATE
- Publication number 20220418103
- Publication date Dec 29, 2022
- Murata Manufacturing Co., Ltd.
- Atsushi KASUYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20220394843
- Publication date Dec 8, 2022
- FUJIFILM CORPORATION
- Genya TANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20220394842
- Publication date Dec 8, 2022
- FUJIFILM CORPORATION
- Genya TANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Flame-retardant Preventing of inflammation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of fabricating a substrate with metal reflection layer

Multilayer resin substrate, and method of manufacturing multilayer...

Method for manufacturing electronics assembly

Optical chips mounted on a deformed carrier

Method for manufacturing a substrate structure with high reflectance

Capacitive leadwire for physiological patient monitoring

Illuminated multilayer structure with embedded light sources

Thermoplastic composition for laser direct structuring

Method for manufacturing electronics assembly and electronics assembly

Resin composition, prepreg, laminate, multilayer printed wiring boa...

Structure for embedding and packaging multiple devices by layer and...

Organic insulating body, metal-clad laminate, and wiring board

Thermoplastic liquid crystal polymer film and circuit board using same

Multilayer resin substrate and method of manufacturing multilayer r...

Interconnect, an electronic assembly and a method for manufacturing...

Three-dimensional molded circuit component

Multilayer coil circuit substrate

Aerosol generating device having heater

Thermally conductive board

Electrically conductive film

Aerosol generating device and method for controlling same

Multilayer substrate and method for manufacturing the same

Circuit structure

Aerosol generation device including mainstream smoke passage and pr...

Aerosol generation device and heater for aerosol generation device

Aerosol generating device and heater assembly for aerosol generatin...

Aerosol generating device having heater

Aerosol generation device and heater for aerosol generation device

Organic board, metal-clad laminate, and wiring board

Resin substrate and method for manufacturing resin substrate

Patents Applicationslast 30 patents

INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME

Package Structure and Electronic Device

CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...

LCP EXTRUDED FILM AND METHOD FOR MANUFACTURING THE SAME, LCP EXTRUD...

CIRCUIT BOARD

METHOD FOR MANUFACTURING ELECTRONICS ASSEMBLY AND ELECTRONICS ASSEMBLY

INSULATING MATERIAL FOR CIRCUIT SUBSTRATE, AND METHOD FOR MANUFACTU...

Circuit Structure

Articles and Structures with Laser Breakable and Platable Compounds

METHOD FOR MANUFACTURING ELECTRONICS ASSEMBLY AND ELECTRONICS ASSEMBLY

METHOD FOR PRODUCING AN ELASTOMERIC COMPONENT COMPRISING A PRINTED...

MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE

CONNECTION STRUCTURE AND CONNECTION STRUCTURE MANUFACTURING METHOD

RESIN FILM WITH CONDUCTOR LAYER, MULTILAYER SUBSTRATE, AND METHOD F...

ELECTRICAL DEVICE

ELECTRONIC APPARATUS, ROBOT, AND MOTION STAGE

LEAKAGE CHARACTERIZATION FOR ELECTRONIC CIRCUIT TEMPERATURE MONITORING

Method for manufacturing a component

STRUCTURE FOR EMBEDDING AND PACKAGING MULTIPLE DEVICES BY LAYER AND...

MULTILAYER SUBSTRATE

LAMINATE, SINGLE-SIDED METAL-CLAD LAMINATED SHEET, AND MULTI-LAYER...

Laminated Component Carrier With a Thermoplastic Structure

MULTILAYER BOARD AND METHOD OF MANUFACTURING THE SAME

CAPACITIVE LEADWIRE FOR PHYSIOLOGICAL PATIENT MONITORING

INTERCONNECT, AN ELECTRONIC ASSEMBLY AND A METHOD FOR MANUFACTURING...

Resin Sheet and Circuit Board Material Using the Same

CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR

RESIN MULTILAYER SUBSTRATE

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD