TREA

Flat component oriented parallel to the PCB surface

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  • CPC
  • H05K2201/10462
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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10462Flat component oriented parallel to the PCB surface
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    CIRCUIT BOARD, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME
    • Publication number 20250168965
    • Publication date May 22, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Gyumook Kim
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD WITH STIFFENER
    • Publication number 20250106984
    • Publication date Mar 27, 2025
    • KYOCCERA CORPORATION
    • Suguru KADOWAKI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    • Publication number 20250089171
    • Publication date Mar 13, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Seung Min Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME
    • Publication number 20250056730
    • Publication date Feb 13, 2025
    • USI Science and Technology (Shenzhen) Co., Ltd.
    • MING CHANG TSAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250048553
    • Publication date Feb 6, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Tae Hong MIN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MOUNTING ASSEMBLY AND CIRCUIT BOARD ASSEMBLY
    • Publication number 20250031309
    • Publication date Jan 23, 2025
    • ADLINK Technology Inc.
    • Chih-Liang FANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD
    • Publication number 20250016912
    • Publication date Jan 9, 2025
    • KYOCERA CORPORATION
    • Takafumi OYOSHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    STRAP FOR A WEARABLE DEVICE
    • Publication number 20240215171
    • Publication date Jun 27, 2024
    • Armour Surveillance Security Equipment and Technology Ltd
    • Patrick James FAWCETT
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Holder for a Button Cell, Arrangement Comprising a Holder, and Meth...
    • Publication number 20220192025
    • Publication date Jun 16, 2022
    • Würth Elektronik eiSos GmbH & Co. KG
    • Alexander Treml
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SERVER MICROPROCESSOR CARRIER WITH GUIDING ALIGNMENT ANTI-TILT AND...
    • Publication number 20190306985
    • Publication date Oct 3, 2019
    • Shelby A. Ferguson
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FLEXIBLE PRINTED CIRCUIT AND OPTICAL DEVICE
    • Publication number 20190239352
    • Publication date Aug 1, 2019
    • Sumitomo Osaka Cement Co., Ltd.
    • Norikazu MIYAZAKI
    • G02 - OPTICS
  • Information Patent Application

    ELECTRONIC DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20160007463
    • Publication date Jan 7, 2016
    • Samsung Electro-Mechanics Co., Ltd.
    • Do Jae YOO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COMPOSITE ELECTRONIC COMPONENT
    • Publication number 20140313682
    • Publication date Oct 23, 2014
    • NIHON DEMPA KOGYO CO., LTD.
    • HIROYUKI MITOME
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    RECHARGEABLE BATTERY PACK
    • Publication number 20140205864
    • Publication date Jul 24, 2014
    • Samsung SDI Co., Ltd.
    • Sang-Il Yi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FLEXIBLE PRINTED CIRCUIT BOARD AND OPTICAL COMMUNICATION MODULE INC...
    • Publication number 20140099123
    • Publication date Apr 10, 2014
    • ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    • Sae-Kyoung KANG
    • G02 - OPTICS
  • Information Patent Application

    CAPACITOR HOLDER
    • Publication number 20130140079
    • Publication date Jun 6, 2013
    • KITAGAWA INDUSTRIES CO., LTD.
    • Tatsuya Nakamura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Crystal Device Without External Package and Manufacturing Method Th...
    • Publication number 20120300424
    • Publication date Nov 29, 2012
    • ZTE CORPORATION
    • Fei Lv
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND PROBE THEREWITH
    • Publication number 20120268908
    • Publication date Oct 25, 2012
    • Medison Co., LTD
    • Gil Ju Jin
    • B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
  • Information Patent Application

    INTEGRATED CIRCUIT BOARD
    • Publication number 20120026698
    • Publication date Feb 2, 2012
    • LIEN CHANG ELECTRONIC ENTERPRISE CO., LTD.
    • CHUN-KONG CHAN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ALUMINUM ELECTROLYTE CAPACITOR
    • Publication number 20120019985
    • Publication date Jan 26, 2012
    • LIEN CHANG ELECTRONIC ENTERPRISE CO., LTD.
    • CHUN-KONG CHAN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND BACK LIGHT MODULE USING THE SAME
    • Publication number 20100232179
    • Publication date Sep 16, 2010
    • ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    • JIAN-SHIHN TSANG
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Assembly of electromagnetic relay and circuit board
    • Publication number 20100109821
    • Publication date May 6, 2010
    • FUJITSU COMPONENT LIMITED
    • Satoshi Takano
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Printed Circuit Board And Probe Therewith
    • Publication number 20100103637
    • Publication date Apr 29, 2010
    • Medison Co., Ltd.
    • Gil Ju Jin
    • B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
  • Information Patent Application

    CONSTANT-TEMPERATURE TYPE CRYSTAL OSCILLATOR
    • Publication number 20100085125
    • Publication date Apr 8, 2010
    • NIHON DEMPA KOGYO CO., LTD.
    • Manabu Ito
    • H03 - BASIC ELECTRONIC CIRCUITRY
  • Information Patent Application

    Constant-temperature type crystal oscillator
    • Publication number 20100052802
    • Publication date Mar 4, 2010
    • NIHON DEMPA KOGYO CO., LTD.
    • Junichi Arai
    • H03 - BASIC ELECTRONIC CIRCUITRY
  • Information Patent Application

    ELECTRONIC APPARATUS WITH A PIN MOUNT
    • Publication number 20090156025
    • Publication date Jun 18, 2009
    • HIPRO ELECTRONICS CO., LTD.
    • Po-Sheng LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CAPACITOR UNIT, AND ITS MANUFACTURING METHOD
    • Publication number 20090059470
    • Publication date Mar 5, 2009
    • Matushita Electric Industrial Co., Ltd.
    • Kazuki Morita
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Ovenized oscillator
    • Publication number 20090051446
    • Publication date Feb 26, 2009
    • Jeffrey A. McCracken
    • H03 - BASIC ELECTRONIC CIRCUITRY
  • Information Patent Application

    Stand-off mounting apparatus for discrete electrical components
    • Publication number 20080291653
    • Publication date Nov 27, 2008
    • Steven L. Sailor
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COMPONENT FIXING METHOD
    • Publication number 20080285246
    • Publication date Nov 20, 2008
    • YAZAKI CORPORATION
    • Yoshihiro KAWAMURA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR