Fluid cooling

Industry

CPC
H05K2201/064

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/064Fluid cooling

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Heat exchange method using fluorinated compounds having a low GWP
- Patent number 12,325,819
- Issue date Jun 10, 2025
- Solvay Specialty Polymers Italy S.p.A.
- Emanuela Antenucci
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Baffles for electronic circuits immersed in cooling fluid in a tank
- Patent number 12,322,676
- Issue date Jun 3, 2025
- Auradine, Inc.
- Anuya Reddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module comprising a pulsating heat pipe
- Patent number 12,322,675
- Issue date Jun 3, 2025
- Siemens Aktiengesellschaft
- Florian Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assemblies having embedded passive heat pipes and associ...
- Patent number 12,309,912
- Issue date May 20, 2025
- Eagle Technology, LLC
- Jason Thompson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board (PCB) cooling
- Patent number 12,309,911
- Issue date May 20, 2025
- Hamilton Sundstrand Corporation
- Yongduk Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power electronics assemblies having power electronics devices embed...
- Patent number 12,284,792
- Issue date Apr 22, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with embedded semiconductor component and embedde...
- Patent number 12,245,377
- Issue date Mar 4, 2025
- Johannes Stahr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods providing high-density memory arrangements with...
- Patent number 12,238,866
- Issue date Feb 25, 2025
- TORmem Inc.
- Steven White
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 12,224,226
- Issue date Feb 11, 2025
- Innolux Corporation
- Chin-Lung Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid ejecting head unit and liquid ejecting apparatus
- Patent number 12,179,484
- Issue date Dec 31, 2024
- Seiko Epson Corporation
- Ryota Kinoshita
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Airflow in a card-based computing device
- Patent number 12,177,961
- Issue date Dec 24, 2024
- NVIDIA Corporation
- Xiang Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Localized immersion cooling enclosure with thermal efficiency features
- Patent number 12,156,372
- Issue date Nov 26, 2024
- Cisco Technology, Inc.
- M. Baris Dogruoz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package assembly
- Patent number 12,150,243
- Issue date Nov 19, 2024
- Wiwynn Corporation
- Yi Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lighting for underwater use
- Patent number 12,031,710
- Issue date Jul 9, 2024
- PROPULSION SYSTEMS
- Marc Lamberts
- F21 - LIGHTING
Information Patent Grant
Stacking system
- Patent number 12,022,605
- Issue date Jun 25, 2024
- Delta Electronics, Inc.
- Yahong Xiong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods providing high-density memory arrangements with...
- Patent number 11,997,792
- Issue date May 28, 2024
- TORmem Inc.
- Steven White
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus with airflow chamber
- Patent number 11,991,820
- Issue date May 21, 2024
- Comcast Cable Communications, LLC
- Osman Cueto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assemblies having embedded passive heat pipes and associ...
- Patent number 11,985,759
- Issue date May 14, 2024
- Eagle Technology, LLC
- Jason Thompson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wireless charging assembly
- Patent number 11,979,026
- Issue date May 7, 2024
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Chi-Cheng Hsiao
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Internal architecture of a computing device
- Patent number 11,950,354
- Issue date Apr 2, 2024
- Apple Inc.
- Kristopher P. Laurent
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Low cost panel AESA with thermal management
- Patent number 11,917,746
- Issue date Feb 27, 2024
- Raytheon Company
- Miroslav Micovic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including heat dissipation structure
- Patent number 11,910,516
- Issue date Feb 20, 2024
- Samsung Electronics Co., Ltd.
- Hongki Moon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device with connected component carrier and fluid coolin...
- Patent number 11,889,622
- Issue date Jan 30, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Gerald Weis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Notched baffled heat exchanger for circuit boards
- Patent number 11,818,831
- Issue date Nov 14, 2023
- BorgWarner Inc.
- Aliihsan Karamavruc
- F02 - COMBUSTION ENGINES HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
Information Patent Grant
Thermal insulation and temperature control of components
- Patent number 11,785,705
- Issue date Oct 10, 2023
- Xerox Corporation
- Yunda Wang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Circuit board having a cooling area above and below a semiconductor...
- Patent number 11,778,735
- Issue date Oct 3, 2023
- Infineon Technologies AG
- Tomas Manuel Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method of manufacturing the same
- Patent number 11,744,004
- Issue date Aug 29, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Wei-Xiang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 11,716,831
- Issue date Aug 1, 2023
- Mitsubishi Electric Corporation
- Koji Kise
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic device comprising heat radiating structure
- Patent number 11,700,711
- Issue date Jul 11, 2023
- Samsung Electronics Co., Ltd.
- Chung-Hyo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power multilayer module having low inductance and fast switchi...
- Patent number 11,696,417
- Issue date Jul 4, 2023
- Wolfspeed, Inc.
- Matthew Feurtado
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250240866
- Publication date Jul 24, 2025
- Sony Interactive Entertainment Inc.
- Takayuki HACHIYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Liquid Cooling Using PCB Through Holes
- Publication number 20250240878
- Publication date Jul 24, 2025
- Jordan K. Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD WITH A BUILT-IN VAPOR CHAMBER
- Publication number 20250212312
- Publication date Jun 26, 2025
- Intel Corporation
- Jose DIAZ MARIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AIRFLOW IN A CARD-BASED COMPUTING DEVICE
- Publication number 20250212313
- Publication date Jun 26, 2025
- NVIDIA Corporation
- Xiang SUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250203762
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Dongkyun KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROFLUIDIC PRINTED CIRCUIT BOARD COOLING
- Publication number 20250176095
- Publication date May 29, 2025
- Microsoft Technology Licensing, LLC
- Shubhangi TEWARI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WATERPROOF AND SHOCKPROOF STRUCTURE OF FAN MODULE
- Publication number 20250159792
- Publication date May 15, 2025
- Delta Electronics, Inc.
- Kuo-Tung HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250140645
- Publication date May 1, 2025
- InnoLux Corporation
- Chin-Lung TING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Board Module and Communication Device
- Publication number 20250081326
- Publication date Mar 6, 2025
- Huawei Technologies Co., Ltd
- Xiaodong Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-CONTACT COOLING ASSEMBLY FOR COOLING SUBSTRATES
- Publication number 20250081327
- Publication date Mar 6, 2025
- ASM IP HOLDING B.V.
- Mandar Deshpande
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR SUPPORTING A HIGH THERMAL GRADIENT BETWEEN...
- Publication number 20250063650
- Publication date Feb 20, 2025
- Microsoft Technology Licensing, LLC
- Matthew David TURNER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS CAPABLE OF EFFICIENTLY COOLING HEAT SOURCE
- Publication number 20250040025
- Publication date Jan 30, 2025
- Canon Kabushiki Kaisha
- KOICHI SHIGETA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGE ASSEMBLY
- Publication number 20250040039
- Publication date Jan 30, 2025
- Wiwynn Corporation
- Yi Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Producing a PCB, as well as a PCB, and a Circuit Board
- Publication number 20240422894
- Publication date Dec 19, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Agneta Ljungbro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ON-BOARD CHARGER
- Publication number 20240407081
- Publication date Dec 5, 2024
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Suhua Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COLD PLATE HAVING OPENING AND RELATED SYSTEMS
- Publication number 20240357729
- Publication date Oct 24, 2024
- Tesla, Inc.
- Mohamed Haitham Helmy Nasr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLY AND SEMICONDUCTOR SWITCHING DEVICE
- Publication number 20240334587
- Publication date Oct 3, 2024
- SIEMENS AKTIENGESELLSCHAFT
- Matthias Eisner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fluid Assisted Thermoelectric PCB Thermal Management System
- Publication number 20240334651
- Publication date Oct 3, 2024
- Panasonic Automotive Systems Company of America, Division of Panasonic Corpor...
- NICHOLAS BRIAN HANSEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL MANAGEMENT IN DATA STORAGE DEVICE
- Publication number 20240324136
- Publication date Sep 26, 2024
- Western Digital Technologies, Inc.
- Tew Wei Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID COOLING STRUCTURE AND ELECTRONIC APPARATUS
- Publication number 20240324143
- Publication date Sep 26, 2024
- Huawei Technologies Co., Ltd
- Hui JIA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board Cooling Configurations
- Publication number 20240314917
- Publication date Sep 19, 2024
- Microsoft Technology Licensing, LLC
- Ruslan NAGIMOV
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Systems and Methods Providing High-Density Memory Arrangements with...
- Publication number 20240306305
- Publication date Sep 12, 2024
- TORmem Inc.
- Steven White
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER ELECTRONICS ASSEMBLIES HAVING POWER ELECTRONICS DEVICES EMBED...
- Publication number 20240292576
- Publication date Aug 29, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER DEVICE EMBEDDED PRINTED CIRCUIT BOARD ASSEMBLIES WITH THIN FI...
- Publication number 20240290687
- Publication date Aug 29, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLIES HAVING EMBEDDED PASSIVE HEAT PIPES AND ASSOCI...
- Publication number 20240260169
- Publication date Aug 1, 2024
- Eagle Technology, LLC
- JASON THOMPSON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20240237195
- Publication date Jul 11, 2024
- InnoLux Corporation
- Ker-Yih KAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLY AND ELECTRONIC DEVICE
- Publication number 20240237276
- Publication date Jul 11, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Qiang Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE ARCHITECTURES WITH IMPROVED COOLING
- Publication number 20240188212
- Publication date Jun 6, 2024
- Intel Corporation
- Mohammad Mamunur Rahman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHTING FOR UNDERWATER USE
- Publication number 20240175570
- Publication date May 30, 2024
- PROPULSION SYSTEMS
- Marc LAMBERTS
- F21 - LIGHTING
Information Patent Application
ELECTRONIC ASSEMBLY AND ELECTRONIC DEVICE
- Publication number 20240138103
- Publication date Apr 25, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Qiang Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Fluid cooling

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Heat exchange method using fluorinated compounds having a low GWP

Baffles for electronic circuits immersed in cooling fluid in a tank

Electronic module comprising a pulsating heat pipe

Electronic assemblies having embedded passive heat pipes and associ...

Printed circuit board (PCB) cooling

Power electronics assemblies having power electronics devices embed...

Component carrier with embedded semiconductor component and embedde...

Systems and methods providing high-density memory arrangements with...

Electronic device

Liquid ejecting head unit and liquid ejecting apparatus

Airflow in a card-based computing device

Localized immersion cooling enclosure with thermal efficiency features

Package assembly

Lighting for underwater use

Stacking system

Systems and methods providing high-density memory arrangements with...

Apparatus with airflow chamber

Electronic assemblies having embedded passive heat pipes and associ...

Wireless charging assembly

Internal architecture of a computing device

Low cost panel AESA with thermal management

Electronic device including heat dissipation structure

Electronic device with connected component carrier and fluid coolin...

Notched baffled heat exchanger for circuit boards

Thermal insulation and temperature control of components

Circuit board having a cooling area above and below a semiconductor...

Circuit board and method of manufacturing the same

Electronic device

Electronic device comprising heat radiating structure

High power multilayer module having low inductance and fast switchi...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

Liquid Cooling Using PCB Through Holes

PRINTED CIRCUIT BOARD WITH A BUILT-IN VAPOR CHAMBER

AIRFLOW IN A CARD-BASED COMPUTING DEVICE

SEMICONDUCTOR DEVICE

MICROFLUIDIC PRINTED CIRCUIT BOARD COOLING

WATERPROOF AND SHOCKPROOF STRUCTURE OF FAN MODULE

ELECTRONIC DEVICE

Circuit Board Module and Communication Device

NON-CONTACT COOLING ASSEMBLY FOR COOLING SUBSTRATES

SYSTEMS AND METHODS FOR SUPPORTING A HIGH THERMAL GRADIENT BETWEEN...

ELECTRONIC APPARATUS CAPABLE OF EFFICIENTLY COOLING HEAT SOURCE

PACKAGE ASSEMBLY

Method of Producing a PCB, as well as a PCB, and a Circuit Board

ON-BOARD CHARGER

COLD PLATE HAVING OPENING AND RELATED SYSTEMS

ELECTRONIC ASSEMBLY AND SEMICONDUCTOR SWITCHING DEVICE

Fluid Assisted Thermoelectric PCB Thermal Management System

THERMAL MANAGEMENT IN DATA STORAGE DEVICE

LIQUID COOLING STRUCTURE AND ELECTRONIC APPARATUS

Circuit Board Cooling Configurations

Systems and Methods Providing High-Density Memory Arrangements with...

POWER ELECTRONICS ASSEMBLIES HAVING POWER ELECTRONICS DEVICES EMBED...

POWER DEVICE EMBEDDED PRINTED CIRCUIT BOARD ASSEMBLIES WITH THIN FI...

ELECTRONIC ASSEMBLIES HAVING EMBEDDED PASSIVE HEAT PIPES AND ASSOCI...

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

ELECTRONIC ASSEMBLY AND ELECTRONIC DEVICE

PACKAGE SUBSTRATE ARCHITECTURES WITH IMPROVED COOLING

LIGHTING FOR UNDERWATER USE

ELECTRONIC ASSEMBLY AND ELECTRONIC DEVICE