Fluxing

Industry

CPC
B23K1/203

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B23Machine tools B23KSOLDERING OR UNSOLDERING WELDING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY B23K1/00Soldering

Current Industry

B23K1/203Fluxing

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Dual-type solder ball placement system
- Patent number 12,151,315
- Issue date Nov 26, 2024
- S.S.P. INC.
- Kyouho Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reflow oven with a zeolite box, and a method for recovering gas wit...
- Patent number 12,064,828
- Issue date Aug 20, 2024
- Illinois Tool Works Inc.
- Chuanbo Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux for resin-cored solder, resin-cored solder, and soldering method
- Patent number 12,017,307
- Issue date Jun 25, 2024
- Senju Metal Industry Co., Ltd.
- Yoko Kurasawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux, solder paste, and electronic circuit board
- Patent number 12,011,787
- Issue date Jun 18, 2024
- HARIMA CHEMICALS, INCORPORATED
- Kazuki Ikeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder material
- Patent number 11,850,685
- Issue date Dec 26, 2023
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux dotting tool
- Patent number 11,818,850
- Issue date Nov 14, 2023
- Samsung Electronics Co., Ltd.
- Seungjin Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder paste with mixed solder powders for high temperatu...
- Patent number 11,738,411
- Issue date Aug 29, 2023
- Indium Corporation
- Hongwen Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compliant pin surface mount technology pad for rework
- Patent number 11,647,591
- Issue date May 9, 2023
- International Business Machines Corporation
- Theron Lee Lewis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder joint
- Patent number 11,628,519
- Issue date Apr 18, 2023
- Lenovo (Singapore) Pte. Ltd.
- Ko Inaba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coating composition for tube of heat exchanger and coating method f...
- Patent number 11,603,471
- Issue date Mar 14, 2023
- Hyundai Motor Company
- Chang Yeol Yoo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Depth-adaptive mechanism for ball grid array dipping
- Patent number 11,605,610
- Issue date Mar 14, 2023
- Google LLC
- Fan Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for selectively pretinning a guidewire core
- Patent number 11,548,086
- Issue date Jan 10, 2023
- Abbott Cardiovascular Systems Inc.
- John A. Simpson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming bump electrode substrate
- Patent number 11,478,869
- Issue date Oct 25, 2022
- Senju Metal Industry Co., Ltd.
- Takahiro Hattori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering a conductor to an aluminum metallization
- Patent number 11,450,642
- Issue date Sep 20, 2022
- Infineon Technologies AG
- Edmund Riedl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reflow oven with a zeolite box, and a method for recovering gas wit...
- Patent number 11,440,116
- Issue date Sep 13, 2022
- Illinois Tool Works Inc.
- Chuanbo Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Closed socket brazed joint assembly
- Patent number 11,420,280
- Issue date Aug 23, 2022
- Transportation IP Holdings, LLC
- Andreas Athanassios Apostolopoulos
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Brazeable metal sheet material, and heat exchanger with components...
- Patent number 11,333,442
- Issue date May 17, 2022
- Modine Manufacturing Company
- Thomas Feldhege
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat exchanger and method of manufacturing the same
- Patent number 11,320,217
- Issue date May 3, 2022
- UACJ Corporation
- Yutaka Yanagawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering system with monitoring unit
- Patent number 11,292,069
- Issue date Apr 5, 2022
- ERSA GmbH
- Michael Schaefer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pattern bonded finned cold plate
- Patent number 11,278,978
- Issue date Mar 22, 2022
- International Business Machines Corporation
- Mark D. Schultz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-efficiency soldering apparatus for winding head of flat-wire m...
- Patent number 11,235,406
- Issue date Feb 1, 2022
- HEFEI JEE POWER SYSTEMS Co., Ltd.
- Lei Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aluminum to steel braze resistance spot welding
- Patent number 11,235,418
- Issue date Feb 1, 2022
- FCA US LLC
- John Macdonald
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leadless multi-layered ceramic capacitor stack
- Patent number 11,227,719
- Issue date Jan 18, 2022
- KEMET Electronics Corporation
- John E. McConnell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Jet solder bath and jet soldering apparatus
- Patent number 11,167,364
- Issue date Nov 9, 2021
- Senju Metal Industry Co., Ltd.
- Ryoichi Suzuki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting method, component mounting system, and manufactu...
- Patent number 11,140,788
- Issue date Oct 5, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tetsuya Tanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Jet solder bath and jet soldering device
- Patent number 11,130,188
- Issue date Sep 28, 2021
- Senju Metal Industry Co., Ltd.
- Takashi Sugihara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bonding method and solder joint
- Patent number 11,097,379
- Issue date Aug 24, 2021
- Lenovo (Singapore) Pte. Ltd.
- Ko Inaba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free and antimony-free tin solder reliable at high temperatures
- Patent number 11,090,768
- Issue date Aug 17, 2021
- Alpha Assembly Solutions Inc.
- Pritha Choudhury
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing battery stack cooling plate for electric v...
- Patent number 11,024,899
- Issue date Jun 1, 2021
- LT PRECISION CO., LTD.
- Yong Seok Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Brazing material outer coat and preparation method thereof, in-situ...
- Patent number 10,987,747
- Issue date Apr 27, 2021
- ZHENGZHOU RESEARCH INSTITUTE OF MECHANICAL ENGINEERING CO., LTD
- Weimin Long
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SOLDER-FREE JOINT AND WELDING METHOD THEREOF
- Publication number 20240391009
- Publication date Nov 28, 2024
- SHANGHAI JIAO TONG UNIVERSITY
- Zhen HUANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERING PROGRAM GENERATION
- Publication number 20240385587
- Publication date Nov 21, 2024
- Illinois Tool Works Inc.
- Gerardus Johannes Adrianus Maria DIEPSTRATEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUXING CALIBRATION
- Publication number 20240375202
- Publication date Nov 14, 2024
- Illinois Tool Works Inc.
- Gerardus Johannes Adrianus Maria DIEPSTRATEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUX, SOLDER PASTE, AND METHOD OF PRODUCING JOINED BODY
- Publication number 20240351148
- Publication date Oct 24, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Hiroaki KAWAMATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE STENCIL MASK AND A STENCIL PRINTING METHOD
- Publication number 20240343055
- Publication date Oct 17, 2024
- STATS ChipPAC Pte Ltd.
- HyunSeok PARK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR APPLYING AN ELECTRICAL CONNECTION MATERIAL OR FLUX MATER...
- Publication number 20240332448
- Publication date Oct 3, 2024
- ams-OSRAM International GmbH
- Sebastian Wittmann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR WETTING A COMPONENT WITH A FLUX
- Publication number 20240326148
- Publication date Oct 3, 2024
- Siemens Healthineers AG
- Harald Geyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TUBE FOR A HEAT EXCHANGER AND A METHOD FOR MANUFACTURING THEREOF
- Publication number 20240293898
- Publication date Sep 5, 2024
- VALEO SYSTEMES THERMIQUES
- Christian CASENAVE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUX TRANSFER APPARATUS, FLUX TRANSFER METHOD, AND MOUNTING APPARATUS
- Publication number 20240276695
- Publication date Aug 15, 2024
- SHINKAWA LTD.
- Shinichi YOSHIDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER MATERIAL
- Publication number 20240075559
- Publication date Mar 7, 2024
- Fuji Electric Co., Ltd.
- Hirohiko WATANABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flux for Resin-Cored Solder, Resin-Cored Solder, and Soldering Method
- Publication number 20240033863
- Publication date Feb 1, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Yoko KURASAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES
- Publication number 20230330788
- Publication date Oct 19, 2023
- Alpha Assembly Solutions Inc.
- Pritha Choudhury
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRONIZED FLUX FOR JET VALVE DISPENSER
- Publication number 20230321769
- Publication date Oct 12, 2023
- Honeywell International Inc.
- Juergen Rudolph
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SELECTIVELY PRETINNING A GUIDEWIRE CORE
- Publication number 20230095943
- Publication date Mar 30, 2023
- ABBOTT CARDIOVASCULAR SYSTEM INC.
- John A. Simpson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL-TYPE SOLDER BALL PLACEMENT SYSTEM
- Publication number 20230088097
- Publication date Mar 23, 2023
- S.S.P. INC.
- Kyouho LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DIE DIPPING STRUCTURE
- Publication number 20230023353
- Publication date Jan 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Chun Peng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUX DOTTING TOOL
- Publication number 20230007787
- Publication date Jan 5, 2023
- Samsung Electronics Co., Ltd.
- Seungjin LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPLIANT PIN SURFACE MOUNT TECHNOLOGY PAD FOR REWORK
- Publication number 20220400557
- Publication date Dec 15, 2022
- International Business Machines Corporation
- Theron Lee Lewis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW RESIDUE NO-CLEAN FLUX COMPOSITION AND METHOD FOR FABRICATING SE...
- Publication number 20220339744
- Publication date Oct 27, 2022
- SK HYNIX INC.
- Hyun Suk LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUX, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD
- Publication number 20220193834
- Publication date Jun 23, 2022
- HARIMA CHEMICALS, INCORPORATED
- Kazuki IKEDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDENSATION DEVICE, FLUX RECOVERY DEVICE, SOLDERING DEVICE, WATER...
- Publication number 20220126236
- Publication date Apr 28, 2022
- SENJU METAL INDUSTRY CO., LTD.
- Tsutomu HIYAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Depth-Adaptive Mechanism for Ball Grid Array Dipping
- Publication number 20220020719
- Publication date Jan 20, 2022
- Google LLC
- Fan Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING BUMP ELECTRODE SUBSTRATE
- Publication number 20210387276
- Publication date Dec 16, 2021
- SENJU METAL INDUSTRY CO., LTD.
- Takahiro HATTORI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BRAZED JOINT BODY, BRAZING METHOD, AND BRAZING MATERIAL
- Publication number 20210370427
- Publication date Dec 2, 2021
- MITSUBISHI ELECTRIC CORPORATION
- Koji ASAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD-FREE SOLDER PASTE WITH MIXED SOLDER POWDERS FOR HIGH TEMPERATU...
- Publication number 20210339344
- Publication date Nov 4, 2021
- Indium Corporation
- Hongwen Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER JOINT
- Publication number 20210316406
- Publication date Oct 14, 2021
- LENOVO (SINGAPORE) PTE. LTD.
- Ko Inaba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERING TOOL FOR INDUCTIVE SOLDERING
- Publication number 20210276112
- Publication date Sep 9, 2021
- SAINT-GOBAIN GLASS FRANCE
- Bernhard REUL
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Jet Solder Bath and Jet Soldering Device
- Publication number 20210245282
- Publication date Aug 12, 2021
- SENJU METAL INDUSTRY CO., LTD.
- Takashi Sugihara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-EFFICIENCY SOLDERING APPARATUS FOR WINDING HEAD OF FLAT-WIRE M...
- Publication number 20210220936
- Publication date Jul 22, 2021
- HEFEI JEE POWER SYSTEMS Co., Ltd.
- Lei LIU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
USING UNDERFILL OR FLUX TO PROMOTE PLACING AND PARALLEL BONDING OF...
- Publication number 20210210667
- Publication date Jul 8, 2021
- Facebook Technologies, LLC
- Daniel Brodoceanu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Dual-type solder ball placement system

Reflow oven with a zeolite box, and a method for recovering gas wit...

Flux for resin-cored solder, resin-cored solder, and soldering method

Flux, solder paste, and electronic circuit board

Solder material

Flux dotting tool

Lead-free solder paste with mixed solder powders for high temperatu...

Compliant pin surface mount technology pad for rework

Solder joint

Coating composition for tube of heat exchanger and coating method f...

Depth-adaptive mechanism for ball grid array dipping

Method for selectively pretinning a guidewire core

Method for forming bump electrode substrate

Soldering a conductor to an aluminum metallization

Reflow oven with a zeolite box, and a method for recovering gas wit...

Closed socket brazed joint assembly

Brazeable metal sheet material, and heat exchanger with components...

Heat exchanger and method of manufacturing the same

Soldering system with monitoring unit

Pattern bonded finned cold plate

High-efficiency soldering apparatus for winding head of flat-wire m...

Aluminum to steel braze resistance spot welding

Leadless multi-layered ceramic capacitor stack

Jet solder bath and jet soldering apparatus

Component mounting method, component mounting system, and manufactu...

Jet solder bath and jet soldering device

Solder bonding method and solder joint

Lead-free and antimony-free tin solder reliable at high temperatures

Method for manufacturing battery stack cooling plate for electric v...

Brazing material outer coat and preparation method thereof, in-situ...

Patents Applicationslast 30 patents

SOLDER-FREE JOINT AND WELDING METHOD THEREOF

SOLDERING PROGRAM GENERATION

FLUXING CALIBRATION

FLUX, SOLDER PASTE, AND METHOD OF PRODUCING JOINED BODY

SELECTIVE STENCIL MASK AND A STENCIL PRINTING METHOD

METHOD FOR APPLYING AN ELECTRICAL CONNECTION MATERIAL OR FLUX MATER...

APPARATUS AND METHOD FOR WETTING A COMPONENT WITH A FLUX

TUBE FOR A HEAT EXCHANGER AND A METHOD FOR MANUFACTURING THEREOF

FLUX TRANSFER APPARATUS, FLUX TRANSFER METHOD, AND MOUNTING APPARATUS

SOLDER MATERIAL

Flux for Resin-Cored Solder, Resin-Cored Solder, and Soldering Method

LEAD-FREE AND ANTIMONY-FREE TIN SOLDER RELIABLE AT HIGH TEMPERATURES

MICRONIZED FLUX FOR JET VALVE DISPENSER

METHOD FOR SELECTIVELY PRETINNING A GUIDEWIRE CORE

DUAL-TYPE SOLDER BALL PLACEMENT SYSTEM

SEMICONDUCTOR DIE DIPPING STRUCTURE

FLUX DOTTING TOOL

COMPLIANT PIN SURFACE MOUNT TECHNOLOGY PAD FOR REWORK

LOW RESIDUE NO-CLEAN FLUX COMPOSITION AND METHOD FOR FABRICATING SE...

FLUX, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD

CONDENSATION DEVICE, FLUX RECOVERY DEVICE, SOLDERING DEVICE, WATER...

Depth-Adaptive Mechanism for Ball Grid Array Dipping

METHOD FOR FORMING BUMP ELECTRODE SUBSTRATE

BRAZED JOINT BODY, BRAZING METHOD, AND BRAZING MATERIAL

LEAD-FREE SOLDER PASTE WITH MIXED SOLDER POWDERS FOR HIGH TEMPERATU...

SOLDER JOINT

SOLDERING TOOL FOR INDUCTIVE SOLDERING

Jet Solder Bath and Jet Soldering Device

HIGH-EFFICIENCY SOLDERING APPARATUS FOR WINDING HEAD OF FLAT-WIRE M...

USING UNDERFILL OR FLUX TO PROMOTE PLACING AND PARALLEL BONDING OF...