for altering the shape

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CPC
H01L21/3247

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/3247for altering the shape

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of performing gap filling including filling trenches between...
- Patent number 12,183,590
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- De-Wei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure
- Patent number 12,119,267
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Cheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a composite structure comprising a thin monocr...
- Patent number 12,087,631
- Issue date Sep 10, 2024
- Soitec
- Gweltaz Gaudin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride-containing STI liner for SiGe channel
- Patent number 12,046,479
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ya-Wen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a source/drain
- Patent number 11,929,401
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Wei Lee
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for manufacturing a CFET device
- Patent number 11,876,020
- Issue date Jan 16, 2024
- Soitec
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and SRAM cell
- Patent number 11,864,369
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Yu Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming thin semiconductor-on-insulator (SOI) substrates
- Patent number 11,855,159
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming a semiconductor device
- Patent number 11,742,215
- Issue date Aug 29, 2023
- Infineon Technologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing nitride semiconductor substrate
- Patent number 11,699,586
- Issue date Jul 11, 2023
- ENKRIS SEMICONDUCTOR, INC.
- Kai Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device
- Patent number 11,688,813
- Issue date Jun 27, 2023
- Samsung Electronics Co., Ltd.
- Seung Mo Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically or temperature activated shape-memory materials for wa...
- Patent number 11,658,129
- Issue date May 23, 2023
- Micron Technology, Inc.
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metal removal die singulation systems and related methods
- Patent number 11,605,561
- Issue date Mar 14, 2023
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of gap filling using conformal deposition-annealing-etching...
- Patent number 11,605,543
- Issue date Mar 14, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- De-Wei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,587,835
- Issue date Feb 21, 2023
- United Microelectronics Corp.
- Chun-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure
- Patent number 11,551,979
- Issue date Jan 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Cheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of healing an implanted layer comprising a heat treatment pr...
- Patent number 11,508,613
- Issue date Nov 22, 2022
- Commissariat A'Lenergie Atomique et aux Energies Alternatives
- Pablo Acosta Alba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating high-voltage (HV) transistor
- Patent number 11,488,837
- Issue date Nov 1, 2022
- United Microelectronics Corp.
- Chia-Jung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and manufacturing method thereof
- Patent number 11,448,932
- Issue date Sep 20, 2022
- WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Yuan Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferroelectric field effect transistor with nanowire core
- Patent number 11,302,810
- Issue date Apr 12, 2022
- International Business Machines Corporation
- Nanbo Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,296,236
- Issue date Apr 5, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Georgios Vellianitis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of gap filling using conformal deposition-annealing-etching...
- Patent number 11,289,343
- Issue date Mar 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- De-Wei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metal patterning die singulation systems and related methods
- Patent number 11,289,380
- Issue date Mar 29, 2022
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device, SRAM cell, and manufacturing method thereof
- Patent number 11,282,843
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Yu Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for smoothing the surface of a semiconductor-on-insulator s...
- Patent number 11,276,605
- Issue date Mar 15, 2022
- Soitec
- Oleg Kononchuk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming thin semiconductor-on-insulator (SOI) substrates
- Patent number 11,264,469
- Issue date Mar 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 11,239,349
- Issue date Feb 1, 2022
- Sumitomo Heavy Industries, Ltd.
- Takaomi Suzuki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Waveguide manufacturing process
- Patent number 11,231,550
- Issue date Jan 25, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Corrado Sciancalepore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a source/drain
- Patent number 11,217,672
- Issue date Jan 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light assisted platelet formation facilitating layer transfer from...
- Patent number 11,173,697
- Issue date Nov 16, 2021
- GlobalWafers Co., Ltd.
- Gang Wang
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE TREATMENT METHOD, SUBSTRATE TREATMENT APPARATUS, AND COMP...
- Publication number 20240249951
- Publication date Jul 25, 2024
- TOKYO ELECTRON LIMITED
- Kosuke YOSHIHARA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TEXTURED LUMIPHORE LAYER TO IMPROVE LIGHT EXTRACTION FOR LIGHT-EMIT...
- Publication number 20240213401
- Publication date Jun 27, 2024
- CreeLED, Inc.
- David SUICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Source/Drain
- Publication number 20240213330
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manfacturing Co., Ltd.
- Chien-Wei Lee
- C30 - CRYSTAL GROWTH
Information Patent Application
COMPLEMENTARY FIELD-EFFECT TRANSISTOR DEVICE INCLUDING AT LEAST ONE...
- Publication number 20240145314
- Publication date May 2, 2024
- SOITEC
- Walter Schwarzenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI WAFER
- Publication number 20240096645
- Publication date Mar 21, 2024
- ZING SEMICONDUCTOR CORPORATION
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING PROCESS WITH REDUCED OVERLAY DISTORTION
- Publication number 20240063022
- Publication date Feb 22, 2024
- TOKYO ELECTRON LIMITED
- Christopher Michael Netzband
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURVED SEMICONDUCTOR CHIP AND METHOD FOR FORMING THE SAME
- Publication number 20240063338
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JHENG-HONG JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING A THIN LAYER
- Publication number 20240030060
- Publication date Jan 25, 2024
- SOITEC
- Frédéric Mazen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A PAVED STRUCTURE
- Publication number 20240006231
- Publication date Jan 4, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Pierre MONTMEAT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Forming a Semiconductor Device Having a Second Semicond...
- Publication number 20230395394
- Publication date Dec 7, 2023
- INFINEON TECHNOLOGIES AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE-CONTAINING STI LINER FOR SIGE CHANNEL
- Publication number 20230386859
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ya-Wen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STEP-STACKED NANOWIRE CMOS STRUCTURE FOR LOW POWER LOGIC DEVICE AND...
- Publication number 20230335556
- Publication date Oct 19, 2023
- Samsung Electronics Co., Ltd.
- Byounghak Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU LITHOGRAPHY PATTERN ENHANCEMENT WITH LOCALIZED STRESS TREAT...
- Publication number 20230251584
- Publication date Aug 10, 2023
- TOKYO ELECTRON LIMITED
- Daniel J. FULFORD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR...
- Publication number 20230223264
- Publication date Jul 13, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20230154799
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Cheng CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI STRUCTURED SEMICONDUCTOR SILICON WAFER AND METHOD OF MAKING THE...
- Publication number 20230133092
- Publication date May 4, 2023
- ZING SEMICONDUCTOR CORPORATION
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI WAFER AND METHOD OF FINAL PROCESSING THE SAME
- Publication number 20230134308
- Publication date May 4, 2023
- ZING SEMICONDUCTOR CORPORATION
- Xing WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20230079925
- Publication date Mar 16, 2023
- Kokusai Electric Corporation
- Kimihiko NAKATANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF RF COMPONENTS
- Publication number 20230048614
- Publication date Feb 16, 2023
- STMicroelectronics (Tours) SAS
- Patrick HAUTTECOEUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Alignment Structure for Semiconductor Device and Method for Forming...
- Publication number 20230050645
- Publication date Feb 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Yen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Nitride Semiconductor Substrate
- Publication number 20220344154
- Publication date Oct 27, 2022
- ENKRIS SEMICONDUCTOR, INC.
- Kai CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CORRECTING WAFER BOW USING A DIRECT WRITE STRESS FILM
- Publication number 20220336226
- Publication date Oct 20, 2022
- TOKYO ELECTRON LIMITED
- Charlotte CUTLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING THIN SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATES
- Publication number 20220238662
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ta Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND SRAM CELL
- Publication number 20220199630
- Publication date Jun 23, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Yu YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Gap Filling Using Conformal Deposition-Annealing-Etching...
- Publication number 20220172958
- Publication date Jun 2, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- De-Wei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Source/Drain
- Publication number 20220123117
- Publication date Apr 21, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Wei Lee
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD FOR FABRICATING HIGH-VOLTAGE (HV) TRANSISTOR
- Publication number 20220093411
- Publication date Mar 24, 2022
- United Microelectronics Corp.
- Chia-Jung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE
- Publication number 20220068642
- Publication date Mar 3, 2022
- TOKYO ELECTRON LIMITED
- Koji KAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nitride-Containing STI Liner for SiGe Channel
- Publication number 20220051906
- Publication date Feb 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ya-Wen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Forming a Semiconductor Device
- Publication number 20220037165
- Publication date Feb 3, 2022
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS

for altering the shape

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of performing gap filling including filling trenches between...

Method for manufacturing semiconductor structure

Method for producing a composite structure comprising a thin monocr...

Nitride-containing STI liner for SiGe channel

Method of forming a source/drain

Method for manufacturing a CFET device

Memory device and SRAM cell

Method for forming thin semiconductor-on-insulator (SOI) substrates

Methods for forming a semiconductor device

Method of manufacturing nitride semiconductor substrate

Method of fabricating semiconductor device

Electrically or temperature activated shape-memory materials for wa...

Backside metal removal die singulation systems and related methods

Method of gap filling using conformal deposition-annealing-etching...

Semiconductor device and method for fabricating the same

Method for manufacturing semiconductor structure

Method of healing an implanted layer comprising a heat treatment pr...

Method for fabricating high-voltage (HV) transistor

Array substrate and manufacturing method thereof

Ferroelectric field effect transistor with nanowire core

Semiconductor device and manufacturing method thereof

Method of gap filling using conformal deposition-annealing-etching...

Backside metal patterning die singulation systems and related methods

Memory device, SRAM cell, and manufacturing method thereof

Process for smoothing the surface of a semiconductor-on-insulator s...

Method for forming thin semiconductor-on-insulator (SOI) substrates

Method of manufacturing semiconductor device and semiconductor device

Waveguide manufacturing process

Method of forming a source/drain

Light assisted platelet formation facilitating layer transfer from...

Patents Applicationslast 30 patents

SUBSTRATE TREATMENT METHOD, SUBSTRATE TREATMENT APPARATUS, AND COMP...

TEXTURED LUMIPHORE LAYER TO IMPROVE LIGHT EXTRACTION FOR LIGHT-EMIT...

Method of Forming a Source/Drain

COMPLEMENTARY FIELD-EFFECT TRANSISTOR DEVICE INCLUDING AT LEAST ONE...

SOI WAFER

WAFER BONDING PROCESS WITH REDUCED OVERLAY DISTORTION

CURVED SEMICONDUCTOR CHIP AND METHOD FOR FORMING THE SAME

METHOD FOR PREPARING A THIN LAYER

METHOD FOR MANUFACTURING A PAVED STRUCTURE

Methods for Forming a Semiconductor Device Having a Second Semicond...

NITRIDE-CONTAINING STI LINER FOR SIGE CHANNEL

STEP-STACKED NANOWIRE CMOS STRUCTURE FOR LOW POWER LOGIC DEVICE AND...

IN-SITU LITHOGRAPHY PATTERN ENHANCEMENT WITH LOCALIZED STRESS TREAT...

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR...

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE

SOI STRUCTURED SEMICONDUCTOR SILICON WAFER AND METHOD OF MAKING THE...

SOI WAFER AND METHOD OF FINAL PROCESSING THE SAME

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

MANUFACTURING METHOD OF RF COMPONENTS

Alignment Structure for Semiconductor Device and Method for Forming...

Method of Manufacturing Nitride Semiconductor Substrate

METHOD OF CORRECTING WAFER BOW USING A DIRECT WRITE STRESS FILM

METHOD FOR FORMING THIN SEMICONDUCTOR-ON-INSULATOR (SOI) SUBSTRATES

MEMORY DEVICE AND SRAM CELL

Method of Gap Filling Using Conformal Deposition-Annealing-Etching...

Method of Forming a Source/Drain

METHOD FOR FABRICATING HIGH-VOLTAGE (HV) TRANSISTOR

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE

Nitride-Containing STI Liner for SiGe Channel

Methods for Forming a Semiconductor Device