for bonding electronic components such as wafers, chips or semiconductors

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C09J2203/326

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CCHEMISTRY METALLURGY C09Paints, dyes C09JADHESIVES NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE USE OF MATERIALS AS ADHESIVES C09J2203/00Applications

Current Industry

C09J2203/326for bonding electronic components such as wafers, chips or semiconductors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Photochromic film laminate
- Patent number 12,360,401
- Issue date Jul 15, 2025
- Transitions Optical, Ltd.
- Brad S. Veldkamp
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Low bond-temperature hot melt adhesive with high impact strength an...
- Patent number 12,359,097
- Issue date Jul 15, 2025
- Sun Chemical Corporation
- Paul Kurtz
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive compositions including 1,4-cyclohexanedimethanol and metho...
- Patent number 12,359,106
- Issue date Jul 15, 2025
- Eastman Chemical (China) Co., Ltd.
- Ke Feng
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing electronic device
- Patent number 12,362,221
- Issue date Jul 15, 2025
- MITSUI CHEMICALS ICT MATERIA, INC.
- Toru Miura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing conductive polymer electrode by using drop...
- Patent number 12,364,152
- Issue date Jul 15, 2025
- Osong medical innovation foundation
- Ha Chul Jung
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of fabricating semiconductor device and method of separating...
- Patent number 12,354,879
- Issue date Jul 8, 2025
- Samsung Electronics Co., Ltd.
- Cheonil Park
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Two-part compositions including a uretdione-containing material and...
- Patent number 12,351,673
- Issue date Jul 8, 2025
- 3M Innovative Properties Company
- Kolby L. White
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Polyester film and use thereof
- Patent number 12,344,778
- Issue date Jul 1, 2025
- Toyobo Co., Ltd.
- Mei Matsumura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Apparatus for separating semiconductor chip and method for separati...
- Patent number 12,341,033
- Issue date Jun 24, 2025
- LG Chem, Ltd.
- Eun Bum Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polyurethane adhesive with semi-crystalline and highly crystalline...
- Patent number 12,331,226
- Issue date Jun 17, 2025
- Henkel AG & Co. KGaA
- James Ward
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Wafer processing laminate, temporary adhesive material for wafer pr...
- Patent number 12,322,637
- Issue date Jun 3, 2025
- Shin-Etsu Chemical Co., Ltd.
- Mitsuo Muto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing smart card
- Patent number 12,312,514
- Issue date May 27, 2025
- Dexerials Corporation
- Ryosuke Odaka
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermally reworkable adhesives for electronic devices
- Patent number 12,312,504
- Issue date May 27, 2025
- International Business Machines Corporation
- Joseph Michael Dennis
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive sheet for backgrinding and production method for semicondu...
- Patent number 12,312,512
- Issue date May 27, 2025
- Disco Corporation
- Karl Heinz Priewasser
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive sheet
- Patent number 12,286,573
- Issue date Apr 29, 2025
- MEKTEC CORPORATION
- Masayuki Iwase
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for processing a microelectronic substrate, and related me...
- Patent number 12,288,575
- Issue date Apr 29, 2025
- Seagate Technology LLC
- Zubair Ahmed Khan
- B24 - GRINDING POLISHING
Information Patent Grant
Adhesive sheet
- Patent number 12,286,569
- Issue date Apr 29, 2025
- Nitto Denko Corporation
- Shusaku Ueno
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Methods for manufacturing thermoplastic liquid crystal polymer film...
- Patent number 12,280,550
- Issue date Apr 22, 2025
- Kuraray Co., Ltd.
- Takahiro Nakashima
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
OLED panel lower part protection film, and organic light-emitting d...
- Patent number 12,279,474
- Issue date Apr 15, 2025
- Samsung Display Co., Ltd.
- Youngseo Choi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Surface protection film and method for manufacturing organic light...
- Patent number 12,275,875
- Issue date Apr 15, 2025
- LG Chem, Ltd.
- Jeong Min Choi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive tape for semiconductor package manufacturing process and m...
- Patent number 12,275,867
- Issue date Apr 15, 2025
- MODU TECH CO., LTD.
- Byeong Yeon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill film for semiconductor package and method for manufacturi...
- Patent number 12,278,117
- Issue date Apr 15, 2025
- Doosan Corporation
- Taejin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive tapes for receiving discrete components
- Patent number 12,266,558
- Issue date Apr 1, 2025
- KULICKE & SOFFA NETHERLANDS B.V.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curable silicone composition, cured product of same and method for...
- Patent number 12,258,496
- Issue date Mar 25, 2025
- Dow Toray Co., Ltd.
- Ryosuke Yamazaki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Curable silicone-(meth)acrylate composition and methods for its pre...
- Patent number 12,258,503
- Issue date Mar 25, 2025
- Dow Silicones Corporation
- Juyoung Yook
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Resin composition, adhesive member, and display device including th...
- Patent number 12,252,569
- Issue date Mar 18, 2025
- Samsung Display Co., Ltd.
- Keisuke Morita
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
UV-crosslinked hot-melt pressure-sensitive adhesive used for polyvi...
- Patent number 12,252,639
- Issue date Mar 18, 2025
- SHANGHAI JUJIAO ENTERPRISE DEVELOPMENT CO., LTD
- Feng Wang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Hierarchical combination of distributed statistics in a monitoring...
- Patent number 12,242,912
- Issue date Mar 4, 2025
- Ajay Khoche
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Roll-to-roll method of fabricating a wireless multi-layer laminate
- Patent number 12,242,911
- Issue date Mar 4, 2025
- Ajay Khoche
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Back grinding adhesive sheet, and method for manufacturing semicond...
- Patent number 12,243,766
- Issue date Mar 4, 2025
- Disco Corporation
- Karl Heinz Priewasser
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHOD FOR CLEANING SILICON AND HYDROCARBON CONTACT RESI...
- Publication number 20250233105
- Publication date Jul 17, 2025
- Ontos Equipment Systems, Inc.
- DANIEL PASCUAL
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE FILM, ADHESIVE TAPE, ADHESIVE TAPE WITH RELEASE FILM, SEMI...
- Publication number 20250230344
- Publication date Jul 17, 2025
- Resonac Corporation
- Akiko HAYASHIDE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Workpiece Processing Method
- Publication number 20250226229
- Publication date Jul 10, 2025
- LINTEC CORPORATION
- Hayato Nakanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTORS, DICING DIE BONDING FILM, AND METH...
- Publication number 20250226347
- Publication date Jul 10, 2025
- Resonac Corporation
- Takaaki NIWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
COMPOSITE FILM AND METHOD OF MANUFACTURING COPPER FOIL SUBSTRATE US...
- Publication number 20250215274
- Publication date Jul 3, 2025
- Taimide Technology Incorporation
- CHENG-CHENG TSAI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRESSURE SENSITIVE ADHESIVE SHEET AND METHOD FOR PRODUCING ELECTRON...
- Publication number 20250215283
- Publication date Jul 3, 2025
- LINTEC CORPORATION
- Tomofumi KATO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
REEL BODY
- Publication number 20250219304
- Publication date Jul 3, 2025
- Resonac Corporation
- Tetsuyuki SHIRAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR TEMPORARY FIXATION
- Publication number 20250215289
- Publication date Jul 3, 2025
- DENKA COMPANY LIMITED
- Takako HOSHINO TANIGAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE FILM FOR WAFER BACK GRINDING
- Publication number 20250215269
- Publication date Jul 3, 2025
- INNOX ADVANCED MATERIALS CO., LTD.
- Kyung-Woo Park
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE SHEET AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT OR...
- Publication number 20250215276
- Publication date Jul 3, 2025
- LINTEC CORPORATION
- Kenta NISHIJIMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE RESIN COMPOSITION
- Publication number 20250215270
- Publication date Jul 3, 2025
- TOYOBO MC Corporation
- Hiroyuki MIEDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FILM-SHAPED SINTERING MATERIAL FOR HEATING AND PRESSURIZATION, AND...
- Publication number 20250206989
- Publication date Jun 26, 2025
- Lintec Corporation
- Taku NEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH FILM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250210448
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Myoungchul Eum
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTORS, INTEGRATED DICING/DIE BONDING FIL...
- Publication number 20250210572
- Publication date Jun 26, 2025
- Resonac Corporation
- Yui KUNITO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE TAPES FOR RECEIVING DISCRETE COMPONENTS
- Publication number 20250210404
- Publication date Jun 26, 2025
- KULICKE & SOFFA NETHERLANDS B.V.
- Val Marinov
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
INDIVIDUALIZED PIECE-PROCESSED ADHESIVE FILM, METHOD FOR MANUFACTUR...
- Publication number 20250197681
- Publication date Jun 19, 2025
- DEXERIALS CORPORATION
- Yusuke TANAKA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTORS, DICING DIE BONDING FILM, AND METH...
- Publication number 20250197687
- Publication date Jun 19, 2025
- Resonac Corporation
- Yui KUNITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING INSULATION MEMBRANE FORMING MATERIAL, METHOD OF PROD...
- Publication number 20250201760
- Publication date Jun 19, 2025
- HD MICROSYSTEMS, LTD.
- Kenya ADACHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR MANUFACTURING SUCH A DISPLAY SCREEN
- Publication number 20250199356
- Publication date Jun 19, 2025
- THE SWATCH GROUP RESEARCH AND DEVELOPMENT LTD
- Michel SAGARDOYBURU
- G02 - OPTICS
Information Patent Application
LONG FILM AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE
- Publication number 20250197678
- Publication date Jun 19, 2025
- DEXERIALS CORPORATION
- Yusuke TANAKA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
THERMALLY-CONDUCTIVE ELECTRICAL CONDUCTING LAYER
- Publication number 20250197694
- Publication date Jun 19, 2025
- Tatsuta Electric Wire & Cable Co., Ltd.
- Yuusuke HARUNA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE COMPOSITION
- Publication number 20250197686
- Publication date Jun 19, 2025
- Shin-Etsu Polymer Co., Ltd.
- Shiori MOMMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DEBONDABLE SOLVENT-BORNE PRESSURE SENSITIVE ADHESIVE (PSA)
- Publication number 20250197691
- Publication date Jun 19, 2025
- Henkel AG & Co. KGaA
- Stefanie Stapf
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN COMPOSITION, ADHESIVE MEMBER, AND DISPLAY DEVICE INCLUDING TH...
- Publication number 20250188212
- Publication date Jun 12, 2025
- SAMSUNG DISPLAY CO., LTD.
- Keisuke MORITA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
COMPOUND, BONDING AGENT, BONDED BODY, PRINTED CIRCUIT BOARD, AND ME...
- Publication number 20250171470
- Publication date May 29, 2025
- DAICEL CORPORATION
- Akihiko Happoya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THERMALLY-CONDUCTIVE SHEET, METHOD FOR INSTALLING SAME, AND METHOD...
- Publication number 20250163299
- Publication date May 22, 2025
- SEKISUI POLYMATECH CO., LTD.
- Kenta KUROO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LOW BOND-TEMPERATURE HOT MELT ADHESIVE WITH HIGH IMPACT STRENGTH AN...
- Publication number 20250163300
- Publication date May 22, 2025
- Sun Chemical Corporation
- Paul KURTZ
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
INTEGRATED DICING/DIE BONDING FILM, METHOD FOR PRODUCING SAME, AND...
- Publication number 20250167034
- Publication date May 22, 2025
- Resonac Corporation
- Takahiro KURODA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAFER PRODUCTION METHOD USING PEEL TAPE AND ADHESIVE MATERIAL, PEEL...
- Publication number 20250167035
- Publication date May 22, 2025
- Mitsui Chemicals ICT Materia, Inc.
- Takashi SUZUKI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE STRUCTURE AND MANUFACTURING METHOD THEREOF, ELECTRONIC COM...
- Publication number 20250167160
- Publication date May 22, 2025
- Tohru YASHIRO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

for bonding electronic components such as wafers, chips or semiconductors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Photochromic film laminate

Low bond-temperature hot melt adhesive with high impact strength an...

Adhesive compositions including 1,4-cyclohexanedimethanol and metho...

Method for manufacturing electronic device

Method for manufacturing conductive polymer electrode by using drop...

Method of fabricating semiconductor device and method of separating...

Two-part compositions including a uretdione-containing material and...

Polyester film and use thereof

Apparatus for separating semiconductor chip and method for separati...

Polyurethane adhesive with semi-crystalline and highly crystalline...

Wafer processing laminate, temporary adhesive material for wafer pr...

Method for manufacturing smart card

Thermally reworkable adhesives for electronic devices

Adhesive sheet for backgrinding and production method for semicondu...

Adhesive sheet

Adhesive for processing a microelectronic substrate, and related me...

Adhesive sheet

Methods for manufacturing thermoplastic liquid crystal polymer film...

OLED panel lower part protection film, and organic light-emitting d...

Surface protection film and method for manufacturing organic light...

Adhesive tape for semiconductor package manufacturing process and m...

Underfill film for semiconductor package and method for manufacturi...

Adhesive tapes for receiving discrete components

Curable silicone composition, cured product of same and method for...

Curable silicone-(meth)acrylate composition and methods for its pre...

Resin composition, adhesive member, and display device including th...

UV-crosslinked hot-melt pressure-sensitive adhesive used for polyvi...

Hierarchical combination of distributed statistics in a monitoring...

Roll-to-roll method of fabricating a wireless multi-layer laminate

Back grinding adhesive sheet, and method for manufacturing semicond...

Patents Applicationslast 30 patents

SYSTEM AND METHOD FOR CLEANING SILICON AND HYDROCARBON CONTACT RESI...

ADHESIVE FILM, ADHESIVE TAPE, ADHESIVE TAPE WITH RELEASE FILM, SEMI...

Workpiece Processing Method

ADHESIVE FILM FOR SEMICONDUCTORS, DICING DIE BONDING FILM, AND METH...

COMPOSITE FILM AND METHOD OF MANUFACTURING COPPER FOIL SUBSTRATE US...

PRESSURE SENSITIVE ADHESIVE SHEET AND METHOD FOR PRODUCING ELECTRON...

REEL BODY

COMPOSITION FOR TEMPORARY FIXATION

ADHESIVE FILM FOR WAFER BACK GRINDING

ADHESIVE SHEET AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT OR...

ADHESIVE RESIN COMPOSITION

FILM-SHAPED SINTERING MATERIAL FOR HEATING AND PRESSURIZATION, AND...

DIE ATTACH FILM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

ADHESIVE FILM FOR SEMICONDUCTORS, INTEGRATED DICING/DIE BONDING FIL...

ADHESIVE TAPES FOR RECEIVING DISCRETE COMPONENTS

INDIVIDUALIZED PIECE-PROCESSED ADHESIVE FILM, METHOD FOR MANUFACTUR...

ADHESIVE FILM FOR SEMICONDUCTORS, DICING DIE BONDING FILM, AND METH...

HYBRID BONDING INSULATION MEMBRANE FORMING MATERIAL, METHOD OF PROD...

METHOD FOR MANUFACTURING SUCH A DISPLAY SCREEN

LONG FILM AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE

THERMALLY-CONDUCTIVE ELECTRICAL CONDUCTING LAYER

ADHESIVE COMPOSITION

DEBONDABLE SOLVENT-BORNE PRESSURE SENSITIVE ADHESIVE (PSA)

RESIN COMPOSITION, ADHESIVE MEMBER, AND DISPLAY DEVICE INCLUDING TH...

COMPOUND, BONDING AGENT, BONDED BODY, PRINTED CIRCUIT BOARD, AND ME...

THERMALLY-CONDUCTIVE SHEET, METHOD FOR INSTALLING SAME, AND METHOD...

LOW BOND-TEMPERATURE HOT MELT ADHESIVE WITH HIGH IMPACT STRENGTH AN...

INTEGRATED DICING/DIE BONDING FILM, METHOD FOR PRODUCING SAME, AND...

WAFER PRODUCTION METHOD USING PEEL TAPE AND ADHESIVE MATERIAL, PEEL...

ADHESIVE STRUCTURE AND MANUFACTURING METHOD THEREOF, ELECTRONIC COM...