for bonding electronic components such as wafers, chips or semiconductors

Industry

CPC
C09J2203/326

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Parent Industries

CCHEMISTRY METALLURGY C09Paints, dyes C09JADHESIVES NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE USE OF MATERIALS AS ADHESIVES C09J2203/00Applications

Current Industry

C09J2203/326for bonding electronic components such as wafers, chips or semiconductors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Protection tape and manufacturing method thereof
- Patent number 11,958,996
- Issue date Apr 16, 2024
- Nan Ya Plastics Corporation
- Te-Chao Liao
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
OLED panel lower part protection film, and organic light-emitting d...
- Patent number 11,963,383
- Issue date Apr 16, 2024
- Samsung Display Co., Ltd.
- Youngseo Choi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Water barrier laminate
- Patent number 11,945,195
- Issue date Apr 2, 2024
- Toyo Seikan Group Holdings, Ltd.
- Shunya Nangou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Protective film
- Patent number 11,938,713
- Issue date Mar 26, 2024
- Samsung Display Co., Ltd.
- Jae Bok Lee
- B32 - LAYERED PRODUCTS
Information Patent Grant
Underfill film for semiconductor package and method for manufacturi...
- Patent number 11,942,336
- Issue date Mar 26, 2024
- Doosan Corporation
- Taejin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film for component manufacture and component manufacturing method
- Patent number 11,942,349
- Issue date Mar 26, 2024
- Mitsui Chemicals Tohcello, Inc.
- Eiji Hayashishita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicone-based adhesive sheet, multilayer structure including same,...
- Patent number 11,939,497
- Issue date Mar 26, 2024
- Dow Toray Co., Ltd.
- Nohno Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive member, manufacturing method thereof, and electronic devic...
- Patent number 11,938,714
- Issue date Mar 26, 2024
- Samsung Electronics Co., Ltd.
- Daum Hwang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Adhesive composition for dicing tape and dicing tape comprising the...
- Patent number 11,932,784
- Issue date Mar 19, 2024
- LG Chem, Ltd.
- Da Ae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless communications and transducer based event detection platform
- Patent number 11,934,903
- Issue date Mar 19, 2024
- Ajay Khoche
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit material and circuit board containing the same
- Patent number 11,930,595
- Issue date Mar 12, 2024
- Shengyi Technology Co., Ltd.
- Weifeng Yin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anisotropic conductive film and connected structure
- Patent number 11,923,335
- Issue date Mar 5, 2024
- Dexerials Corporation
- Seiichiro Shinohara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Display module and display device
- Patent number 11,925,100
- Issue date Mar 5, 2024
- WUHAN TIANMA MICRO-ELECTRONICS CO., LTD.
- Xiangwei Zhao
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor apparatus for discharging heat
- Patent number 11,923,264
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Yongha Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, laminate, semiconductor wafer with resin composi...
- Patent number 11,924,979
- Issue date Mar 5, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Masashi Okaniwa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Adhesive tape, method for immobilizing electronic device component...
- Patent number 11,912,905
- Issue date Feb 27, 2024
- Sekisui Chemical Co., Ltd.
- Aya Adachi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Conductive film laminate and method of fabricating the same
- Patent number 11,912,910
- Issue date Feb 27, 2024
- Dongwoo Fine-Chem Co., Ltd.
- Hyuk Hwan Kwon
- B32 - LAYERED PRODUCTS
Information Patent Grant
Process of manufacturing a pressure sensitive adhesive having a low...
- Patent number 11,905,438
- Issue date Feb 20, 2024
- 3M Innovative Properties Company
- Niklas M. Matzeit
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Product with protective coating and manufacturing method thereof
- Patent number 11,904,351
- Issue date Feb 20, 2024
- Lanto Electronic Limited
- Hong Zhang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor-processing tape
- Patent number 11,901,211
- Issue date Feb 13, 2024
- Furukawa Electric Co., Ltd.
- Hirotoki Yokoi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polyester film, laminated film, and use thereof
- Patent number 11,899,167
- Issue date Feb 13, 2024
- Toyobo Co., Ltd.
- Shotaro Nishio
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Curable and optically clear pressure sensitive adhesives and uses t...
- Patent number 11,891,550
- Issue date Feb 6, 2024
- Henkel AG & Co. KGaA
- Yuxia Liu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Thermosetting resin composition, coverlay film, adhesive sheet, and...
- Patent number 11,884,815
- Issue date Jan 30, 2024
- Arisawa Mfg. Co., Ltd.
- Takashi Gondaira
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Thermally conductive moisture-curable resin composition and cured p...
- Patent number 11,879,077
- Issue date Jan 23, 2024
- Threebond Co., Ltd.
- Kentaro Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electronic device including display
- Patent number 11,877,405
- Issue date Jan 16, 2024
- Samsung Electronics Co., Ltd.
- Sungeun Park
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Fixing structure of wiring member
- Patent number 11,850,839
- Issue date Dec 26, 2023
- Autonetworks Technologies, Ltd.
- Daichi Fukushima
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing electronic device
- Patent number 11,848,215
- Issue date Dec 19, 2023
- Mitsui Chemicals Tohcello, Inc.
- Kouji Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method, curable resin compositio...
- Patent number 11,840,648
- Issue date Dec 12, 2023
- Resonac Corporation
- Emi Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for improving battery cycling performance
- Patent number 11,843,272
- Issue date Dec 12, 2023
- Ningde Amperex Technology Limited
- Ao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film and method for manufacturing electronic device
- Patent number 11,840,652
- Issue date Dec 12, 2023
- Mitsui Chemicals Tohcello, Inc.
- Kouji Igarashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INK-JET ADHESIVE, METHOD FOR PRODUCING ELECTRONIC COMPONENT, AND EL...
- Publication number 20240124729
- Publication date Apr 18, 2024
- Sekisui Chemical Co., Ltd.
- Yoshifumi SUGISAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRESSURE SENSITIVE ADHESIVE LAYER-FORMING ORGANOPOLYSILOXANE COMPOS...
- Publication number 20240117231
- Publication date Apr 11, 2024
- Dow Toray Co., Ltd.
- Maki ITOH
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CURABLE RESIN COMPOSITION FOR BONDING FILM, BONDING FILM, AND PRINT...
- Publication number 20240117120
- Publication date Apr 11, 2024
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CROSSLINKABLE AND CROSSLINKED COMPOSITIONS
- Publication number 20240101809
- Publication date Mar 28, 2024
- 3M Innovative Properties Company
- Peter M. Simone
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD, CURABLE RESIN COMPOSITIO...
- Publication number 20240093059
- Publication date Mar 21, 2024
- Resonac Corporation
- Emi MIYAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING AN ADHESIVE LAYER OF THERMOPLASTIC POLYMER(...
- Publication number 20240093063
- Publication date Mar 21, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Pierre Montmeat
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAFER TEMPORARY ADHESIVE TAPE, WAFER STACK STRUCTURE, AND METHOD OF...
- Publication number 20240087940
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Cheonil PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE TAPE WITH MONOLAYERED CONDUCTIVE PRESSURE S...
- Publication number 20240084176
- Publication date Mar 14, 2024
- 3M Innovative Properties Company
- Junbeom Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE TAPE SHEET, METHOD OF MANUFACTURING THE SAME AND METHOD OF...
- Publication number 20240079260
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Hansol Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOCURABLE COMPOSITION HAVING SHEET SHAPE, PHOTOCURABLE COMPOSITI...
- Publication number 20240076526
- Publication date Mar 7, 2024
- THREEBOND CO., LTD.
- Ryota OKAYAMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MOUNT TAPE HAVING AN INNER SUPPORT LAYER BETWEEN ADHESIVE LAYERS FO...
- Publication number 20240063047
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Brandon P. WIRZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE ADHESIVE ASSEMBLY FOR SEMICONDUCTOR DIE ATTACHMENT
- Publication number 20240063165
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Ramesh NALLAVELLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, AND LAMINATE
- Publication number 20240059827
- Publication date Feb 22, 2024
- DIC CORPORATION
- Masato Otsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SILICONE ADHESIVE COMPOSITION AND USE THEREOF
- Publication number 20240059932
- Publication date Feb 22, 2024
- Dow Toray Co., Ltd.
- Satoshi ONODERA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
BIAXIALLY STRETCHED POLYESTER FILM
- Publication number 20240052205
- Publication date Feb 15, 2024
- Toyobo Co., Ltd.
- Mei MATSUMURA
- G02 - OPTICS
Information Patent Application
ADHESIVE FILM, OPTICAL MEMBER INCLUDING SAME, AND OPTICAL DISPLAY D...
- Publication number 20240052214
- Publication date Feb 15, 2024
- Samsung SDI Co., Ltd.
- Dong Myeong SHIN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ULTRAVIOLET CURABLE RESIN COMPOSITION
- Publication number 20240043575
- Publication date Feb 8, 2024
- Denka Company Limited
- Yuki KIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CURABLE RESIN COMPOSITION, CURED OBJECT, RESIN SHEET, PRE...
- Publication number 20240043637
- Publication date Feb 8, 2024
- Nippon Kayaku Kabushiki-Kaisha
- Kazuyoshi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE COATING COMPOSITION FOR ELECTRICAL STEEL SHEET, ELECTRICAL...
- Publication number 20240043723
- Publication date Feb 8, 2024
- POSCO Co., Ltd
- Bongwoo HA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PRESSURE-SENSITIVE ADHESIVE SHEET FOR SEMICONDUCTOR PROCESSING
- Publication number 20240034914
- Publication date Feb 1, 2024
- Nitto Denko Corporation
- Jun AKIYAMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE TAPE FOR SEMICONDUCTOR DEVICE PRODUCTION
- Publication number 20240026195
- Publication date Jan 25, 2024
- Sekisui Chemical Co., Ltd
- Noriyuki UCHIDA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
APPLICATION OF LASER-RELEASABLE COMPOSITION
- Publication number 20240010892
- Publication date Jan 11, 2024
- MICROCOSM TECHNOLOGY CO., LTD.
- Bo-Hung Lai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DISPLAY MODULE, MANUFACTURING METHOD THEREOF, AND MOBILE TERMINAL
- Publication number 20240015940
- Publication date Jan 11, 2024
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Wenhua Yang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAVELENGTH SELECTIVE ADHESIVE COMPOSITIONS
- Publication number 20240002703
- Publication date Jan 4, 2024
- 3M Innovative Properties Company
- Encai Hao
- G02 - OPTICS
Information Patent Application
Corona Shielding Strip for a High-Voltage Rotating Electrical Machine
- Publication number 20240006948
- Publication date Jan 4, 2024
- SIEMENS AKTIENGESELLSCHAFT
- Jürgen Huber
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ADHESIVE ADDITIVE FOR ELECTRICAL CONDUCTIVITY AND METHODS FOR MANUF...
- Publication number 20230416576
- Publication date Dec 28, 2023
- Rivian IP Holdings, LLC
- Timothy E. Knight
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ADHESIVE COMPOSITIONS AND ARTICLES
- Publication number 20230416574
- Publication date Dec 28, 2023
- Michael J. Maher
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ARTICLE AND METHOD OF MAKING THE SAME
- Publication number 20230405971
- Publication date Dec 21, 2023
- 3M Innovative Properties Company
- Mario A. Perez
- B32 - LAYERED PRODUCTS
Information Patent Application
PROTECTION TAPE AND MANUFACTURING METHOD THEREOF
- Publication number 20230407146
- Publication date Dec 21, 2023
- Nan Ya Plastics Corporation
- TE-CHAO LIAO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
A DIAMOND ASSEMBLY
- Publication number 20230406732
- Publication date Dec 21, 2023
- ELEMENT SIX TECHNOLOGIES LIMITED
- Julian James Sargood Ellis
- B32 - LAYERED PRODUCTS

for bonding electronic components such as wafers, chips or semiconductors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Protection tape and manufacturing method thereof

OLED panel lower part protection film, and organic light-emitting d...

Water barrier laminate

Protective film

Underfill film for semiconductor package and method for manufacturi...

Film for component manufacture and component manufacturing method

Silicone-based adhesive sheet, multilayer structure including same,...

Adhesive member, manufacturing method thereof, and electronic devic...

Adhesive composition for dicing tape and dicing tape comprising the...

Wireless communications and transducer based event detection platform

Circuit material and circuit board containing the same

Anisotropic conductive film and connected structure

Display module and display device

Semiconductor apparatus for discharging heat

Resin composition, laminate, semiconductor wafer with resin composi...

Adhesive tape, method for immobilizing electronic device component...

Conductive film laminate and method of fabricating the same

Process of manufacturing a pressure sensitive adhesive having a low...

Product with protective coating and manufacturing method thereof

Semiconductor-processing tape

Polyester film, laminated film, and use thereof

Curable and optically clear pressure sensitive adhesives and uses t...

Thermosetting resin composition, coverlay film, adhesive sheet, and...

Thermally conductive moisture-curable resin composition and cured p...

Electronic device including display

Fixing structure of wiring member

Method for manufacturing electronic device

Semiconductor device manufacturing method, curable resin compositio...

Electronic device and method for improving battery cycling performance

Adhesive film and method for manufacturing electronic device

Patents Applicationslast 30 patents

INK-JET ADHESIVE, METHOD FOR PRODUCING ELECTRONIC COMPONENT, AND EL...

PRESSURE SENSITIVE ADHESIVE LAYER-FORMING ORGANOPOLYSILOXANE COMPOS...

CURABLE RESIN COMPOSITION FOR BONDING FILM, BONDING FILM, AND PRINT...

CROSSLINKABLE AND CROSSLINKED COMPOSITIONS

SEMICONDUCTOR DEVICE MANUFACTURING METHOD, CURABLE RESIN COMPOSITIO...

METHOD FOR TRANSFERRING AN ADHESIVE LAYER OF THERMOPLASTIC POLYMER(...

WAFER TEMPORARY ADHESIVE TAPE, WAFER STACK STRUCTURE, AND METHOD OF...

ELECTRICALLY CONDUCTIVE TAPE WITH MONOLAYERED CONDUCTIVE PRESSURE S...

ADHESIVE TAPE SHEET, METHOD OF MANUFACTURING THE SAME AND METHOD OF...

PHOTOCURABLE COMPOSITION HAVING SHEET SHAPE, PHOTOCURABLE COMPOSITI...

MOUNT TAPE HAVING AN INNER SUPPORT LAYER BETWEEN ADHESIVE LAYERS FO...

CONDUCTIVE ADHESIVE ASSEMBLY FOR SEMICONDUCTOR DIE ATTACHMENT

EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, AND LAMINATE

SILICONE ADHESIVE COMPOSITION AND USE THEREOF

BIAXIALLY STRETCHED POLYESTER FILM

ADHESIVE FILM, OPTICAL MEMBER INCLUDING SAME, AND OPTICAL DISPLAY D...

ULTRAVIOLET CURABLE RESIN COMPOSITION

THERMALLY CURABLE RESIN COMPOSITION, CURED OBJECT, RESIN SHEET, PRE...

ADHESIVE COATING COMPOSITION FOR ELECTRICAL STEEL SHEET, ELECTRICAL...

PRESSURE-SENSITIVE ADHESIVE SHEET FOR SEMICONDUCTOR PROCESSING

ADHESIVE TAPE FOR SEMICONDUCTOR DEVICE PRODUCTION

APPLICATION OF LASER-RELEASABLE COMPOSITION

DISPLAY MODULE, MANUFACTURING METHOD THEREOF, AND MOBILE TERMINAL

WAVELENGTH SELECTIVE ADHESIVE COMPOSITIONS

Corona Shielding Strip for a High-Voltage Rotating Electrical Machine

ADHESIVE ADDITIVE FOR ELECTRICAL CONDUCTIVITY AND METHODS FOR MANUF...

ADHESIVE COMPOSITIONS AND ARTICLES

ARTICLE AND METHOD OF MAKING THE SAME

PROTECTION TAPE AND MANUFACTURING METHOD THEREOF

A DIAMOND ASSEMBLY