for coupling an active element with fibres without intermediate optical elements

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G02B6/4202

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GPHYSICS G02Optics G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS G02B6/00Light guides

Current Industry

G02B6/4202for coupling an active element with fibres without intermediate optical elements

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Patents Grantslast 30 patents

Information Patent Grant
Optical alignment device
- Patent number 12,228,777
- Issue date Feb 18, 2025
- Electronics and Telecommunications Research Institute
- Joong-Seon Choe
- G02 - OPTICS
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 12,176,282
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical signal routing devices and systems
- Patent number 12,147,076
- Issue date Nov 19, 2024
- Waymo LLC
- James Dunphy
- G01 - MEASURING TESTING
Information Patent Grant
Electrical bridge package with integrated off-bridge photonic chann...
- Patent number 12,136,617
- Issue date Nov 5, 2024
- Celestial AI Inc.
- Ankur Aggarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic coupler
- Patent number 12,117,659
- Issue date Oct 15, 2024
- X Development LLC
- Yi-Kuei Ryan Wu
- G02 - OPTICS
Information Patent Grant
Semiconductor package structure
- Patent number 12,100,697
- Issue date Sep 24, 2024
- Advanced Semiconductor Engineering, Inc.
- Chang-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ear gel modules and earpiece monitoring devices incorporating same
- Patent number 12,082,946
- Issue date Sep 10, 2024
- YUKKA MAGIC LLC
- Shawn M. Stephenson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Photonic chip coupler connector module
- Patent number 12,068,791
- Issue date Aug 20, 2024
- Molex, LLC
- Thomas R. Marrapode
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Dynamic concentrator system and method therefor
- Patent number 12,066,612
- Issue date Aug 20, 2024
- PLX, Inc.
- Malcolm Humphrey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting photon detector
- Patent number 12,061,114
- Issue date Aug 13, 2024
- PSIQUANTUM CORP.
- Mark Thompson
- G01 - MEASURING TESTING
Information Patent Grant
Photonic integrated circuit (PIC) package
- Patent number 12,025,841
- Issue date Jul 2, 2024
- Lumentum Operations LLC
- Pavel Mamyshev
- G02 - OPTICS
Information Patent Grant
Optical module
- Patent number 12,025,842
- Issue date Jul 2, 2024
- Hisense Broadband Multimedia Technologies Co., Ltd
- Qian Shao
- G02 - OPTICS
Information Patent Grant
Chip-to-chip optical data communication system
- Patent number 11,994,724
- Issue date May 28, 2024
- Ayar Labs, Inc.
- Alexandra Wright
- G02 - OPTICS
Information Patent Grant
Optical transmission power supply cable
- Patent number 11,979,196
- Issue date May 7, 2024
- Kyocera Corporation
- Tomonori Sugime
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,960,127
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical combiner and laser apparatus
- Patent number 11,955,777
- Issue date Apr 9, 2024
- Fujikura Ltd.
- Tomoyuki Fujita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photonics integrated circuit package
- Patent number 11,935,837
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng Wei Kuo
- G02 - OPTICS
Information Patent Grant
Multi-wafer integration
- Patent number 11,916,043
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microbending fiber-optic sensor for vital sign monitoring and co-ex...
- Patent number 11,896,351
- Issue date Feb 13, 2024
- Hong Kong Applied Science and Technology Research Institute Company Limited
- Qian Cheng Zhao
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Optoelectronic ball grid array package with fiber
- Patent number 11,892,690
- Issue date Feb 6, 2024
- Acacia Communications, Inc.
- Christopher Doerr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor for determining liquid types
- Patent number 11,892,398
- Issue date Feb 6, 2024
- TOYOKO KAGAKU CO., LTD.
- Kiyoshi Hirakawa
- G01 - MEASURING TESTING
Information Patent Grant
Photonic optoelectronic module packaging
- Patent number 11,886,023
- Issue date Jan 30, 2024
- II-VI DELAWARE, INC.
- Gilles P. Denoyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with reduced stray light and ambient light refle...
- Patent number 11,860,394
- Issue date Jan 2, 2024
- Apple Inc.
- Yi Qiao
- G02 - OPTICS
Information Patent Grant
Package assembly and manufacturing method thereof
- Patent number 11,841,541
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguides for use in sensors or displays
- Patent number 11,788,869
- Issue date Oct 17, 2023
- Cornell University
- Robert Shepherd
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Optical sensor assembly
- Patent number 11,768,104
- Issue date Sep 26, 2023
- ArcSoft Corporation Limited
- Byung Il Min
- G01 - MEASURING TESTING
Information Patent Grant
Photonics packaging platform
- Patent number 11,762,155
- Issue date Sep 19, 2023
- Cisco Technology, Inc.
- Vipulkumar K. Patel
- G02 - OPTICS
Information Patent Grant
Sterilizing mats and methods of using the same
- Patent number 11,723,995
- Issue date Aug 15, 2023
- Mary-Allison Hyler
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Semiconductor devices having integrated optical components
- Patent number 11,728,276
- Issue date Aug 15, 2023
- Micron Technology, Inc.
- John F. Kaeding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical signal routing devices and systems
- Patent number 11,714,233
- Issue date Aug 1, 2023
- Waymo LLC
- James Dunphy
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
TITANIUM:SAPPHIRE (TI:SA) WAFERS, INTEGRATED TI:SA LASERS, AND METH...
- Publication number 20250062589
- Publication date Feb 20, 2025
- Yale University
- Hong Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE COMPRISING PHOTONIC IC CHIP ADJACEN...
- Publication number 20250062300
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chan-Hong CHERN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-SCALE WAVEGUIDES FOR INTEGRATED TWO-DIMENSIONAL PHOTONICS
- Publication number 20250052960
- Publication date Feb 13, 2025
- The University of Chicago
- Jiwoong Park
- G02 - OPTICS
Information Patent Application
OPTICAL MODULE AND OPTICAL COMMUNICATION DEVICE
- Publication number 20250052959
- Publication date Feb 13, 2025
- Kyocera Corporation
- Saki TSUJINO
- G02 - OPTICS
Information Patent Application
CO-PACKAGED ASSEMBLY AND NETWORK DEVICE
- Publication number 20250044529
- Publication date Feb 6, 2025
- ZTE CORPORATION
- Ningfeng TANG
- G02 - OPTICS
Information Patent Application
Optical Signal Routing Devices and Systems
- Publication number 20250035844
- Publication date Jan 30, 2025
- WAYMO LLC
- James Dunphy
- G01 - MEASURING TESTING
Information Patent Application
OPTICAL INTEGRATED DEVICE, OPTICAL TRANSMISSION DEVICE, AND OPTICAL...
- Publication number 20250012989
- Publication date Jan 9, 2025
- FUJITSU OPTICAL COMPONENTS LIMITED
- Masaki SUGIYAMA
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250015069
- Publication date Jan 9, 2025
- Advanced Semiconductor Engineering, Inc.
- Chang-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS TO CONTROL CROSS-TALK OF AN OPTICAL FIBER-BASED...
- Publication number 20250004598
- Publication date Jan 2, 2025
- Apple Inc.
- Harish GOVINDARAJAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
EAR GEL MODULES AND EARPIECE MONITORING DEVICES INCORPORATING SAME
- Publication number 20240407731
- Publication date Dec 12, 2024
- YUKKA MAGIC LLC
- Shawn M. Stephenson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240413125
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Seho You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT GUIDE COLUMN, AND METHOD AND APPARATUS FOR ADJUSTING SIDEWALL...
- Publication number 20240402439
- Publication date Dec 5, 2024
- LUXSHARE PRECISION INDUSTRY COMPANY LIMITED
- HSI-SHENG HSIA
- G02 - OPTICS
Information Patent Application
PHOTONIC CHIP COUPLER CONNECTOR MODULE
- Publication number 20240372631
- Publication date Nov 7, 2024
- Molex, LLC
- Thomas R. MARRAPODE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Superconducting Photon Detector
- Publication number 20240369408
- Publication date Nov 7, 2024
- PsiQuantum Corp.
- Mark Thompson
- G01 - MEASURING TESTING
Information Patent Application
OPTICALLY INTERCONNECTED HIGH BANDWIDTH MEMORY ARCHITECTURES
- Publication number 20240345344
- Publication date Oct 17, 2024
- Sunghwan Min
- G02 - OPTICS
Information Patent Application
OPTICAL DEVICE
- Publication number 20240329334
- Publication date Oct 3, 2024
- Sumitomo Electric Industries, Ltd.
- Hong Chuyen NGUYEN
- G02 - OPTICS
Information Patent Application
CO-PACKAGING OF PHOTONIC & ELECTRONIC INTEGRATED CIRCUIT DIE
- Publication number 20240329333
- Publication date Oct 3, 2024
- Intel Corporation
- Robert May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-to-Chip Optical Data Communication System
- Publication number 20240310589
- Publication date Sep 19, 2024
- Ayar Labs, Inc.
- Alexandra Wright
- G02 - OPTICS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT INCLUDING SEMICONDUCTOR OPTICAL AMPLIFIERS
- Publication number 20240288632
- Publication date Aug 29, 2024
- Infinera Corporation
- Daniel Semrau
- G02 - OPTICS
Information Patent Application
OPTICAL WAVEGUIDE PACKAGE AND LIGHT-EMITTING DEVICE
- Publication number 20240272379
- Publication date Aug 15, 2024
- Kyocera Corporation
- Yoshiaki Itakura
- G02 - OPTICS
Information Patent Application
ARCHITECTURE AND METHOD FOR V GROOVE FIBER ATTACH FOR A PHOTONIC IN...
- Publication number 20240272388
- Publication date Aug 15, 2024
- Intel Corporation
- Xiaoqian Li
- G02 - OPTICS
Information Patent Application
PHOTONICS INTEGRATED CIRCUIT PACKAGE
- Publication number 20240266296
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BRIGHTNESS PUMP-SIGNAL COMBINER WITH BIDIRECTIONALLY TAPERED S...
- Publication number 20240250493
- Publication date Jul 25, 2024
- Lumentum Operations LLC
- Gongwen ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-RESOLUTION HANDHELD OCT IMAGING SYSTEM
- Publication number 20240230315
- Publication date Jul 11, 2024
- THE FIRST AFFILIATED HOSPITAL OF JINAN UNIVERSITY (GUANGZHOU OVERSEAS CHINESE
- Shuixing Zhang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240210633
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-WAFER INTEGRATION
- Publication number 20240194650
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIBER OPTIC BEAM SPLITTER
- Publication number 20240168244
- Publication date May 23, 2024
- NETAFIM, LTD.
- ABRAHAM SCHWEITZER
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
HIGH-RESOLUTION HANDHELD OCT IMAGING SYSTEM
- Publication number 20240133674
- Publication date Apr 25, 2024
- THE FIRST AFFILIATED HOSPITAL OF JINAN UNIVERSITY (GUANGZHOU OVERSEAS CHINESE
- Shuixing Zhang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PHOTONIC OPTOELECTRONIC MODULE PACKAGING
- Publication number 20240118506
- Publication date Apr 11, 2024
- II-VI Delaware, Inc.
- Gilles P. Denoyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATION OF OPTICAL STRUCTURES ON PHOTONIC GLASS LAY...
- Publication number 20240111107
- Publication date Apr 4, 2024
- Applied Materials, Inc.
- Paul MEISSNER
- G02 - OPTICS

for coupling an active element with fibres without intermediate optical elements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Optical alignment device

Manufacturing method of semiconductor package

Optical signal routing devices and systems

Electrical bridge package with integrated off-bridge photonic chann...

Photonic coupler

Semiconductor package structure

Ear gel modules and earpiece monitoring devices incorporating same

Photonic chip coupler connector module

Dynamic concentrator system and method therefor

Superconducting photon detector

Photonic integrated circuit (PIC) package

Optical module

Chip-to-chip optical data communication system

Optical transmission power supply cable

Semiconductor package and manufacturing method thereof

Optical combiner and laser apparatus

Photonics integrated circuit package

Multi-wafer integration

Microbending fiber-optic sensor for vital sign monitoring and co-ex...

Optoelectronic ball grid array package with fiber

Sensor for determining liquid types

Photonic optoelectronic module packaging

Electronic devices with reduced stray light and ambient light refle...

Package assembly and manufacturing method thereof

Waveguides for use in sensors or displays

Optical sensor assembly

Photonics packaging platform

Sterilizing mats and methods of using the same

Semiconductor devices having integrated optical components

Optical signal routing devices and systems

Patents Applicationslast 30 patents

TITANIUM:SAPPHIRE (TI:SA) WAFERS, INTEGRATED TI:SA LASERS, AND METH...

SEMICONDUCTOR PACKAGE STRUCTURE COMPRISING PHOTONIC IC CHIP ADJACEN...

WAFER-SCALE WAVEGUIDES FOR INTEGRATED TWO-DIMENSIONAL PHOTONICS

OPTICAL MODULE AND OPTICAL COMMUNICATION DEVICE

CO-PACKAGED ASSEMBLY AND NETWORK DEVICE

Optical Signal Routing Devices and Systems

OPTICAL INTEGRATED DEVICE, OPTICAL TRANSMISSION DEVICE, AND OPTICAL...

SEMICONDUCTOR PACKAGE STRUCTURE

SYSTEMS AND METHODS TO CONTROL CROSS-TALK OF AN OPTICAL FIBER-BASED...

EAR GEL MODULES AND EARPIECE MONITORING DEVICES INCORPORATING SAME

SEMICONDUCTOR PACKAGE

LIGHT GUIDE COLUMN, AND METHOD AND APPARATUS FOR ADJUSTING SIDEWALL...

PHOTONIC CHIP COUPLER CONNECTOR MODULE

Superconducting Photon Detector

OPTICALLY INTERCONNECTED HIGH BANDWIDTH MEMORY ARCHITECTURES

OPTICAL DEVICE

CO-PACKAGING OF PHOTONIC & ELECTRONIC INTEGRATED CIRCUIT DIE

Chip-to-Chip Optical Data Communication System

PHOTONIC INTEGRATED CIRCUIT INCLUDING SEMICONDUCTOR OPTICAL AMPLIFIERS

OPTICAL WAVEGUIDE PACKAGE AND LIGHT-EMITTING DEVICE

ARCHITECTURE AND METHOD FOR V GROOVE FIBER ATTACH FOR A PHOTONIC IN...

PHOTONICS INTEGRATED CIRCUIT PACKAGE

HIGH BRIGHTNESS PUMP-SIGNAL COMBINER WITH BIDIRECTIONALLY TAPERED S...

HIGH-RESOLUTION HANDHELD OCT IMAGING SYSTEM

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

MULTI-WAFER INTEGRATION

FIBER OPTIC BEAM SPLITTER

HIGH-RESOLUTION HANDHELD OCT IMAGING SYSTEM

PHOTONIC OPTOELECTRONIC MODULE PACKAGING

METHODS FOR FABRICATION OF OPTICAL STRUCTURES ON PHOTONIC GLASS LAY...