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SEMICONDUCTOR PACKAGE
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Publication number 20240413125
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Publication date Dec 12, 2024
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Samsung Electronics Co., Ltd.
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Seho You
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H01 - BASIC ELECTRIC ELEMENTS
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OPTICAL DEVICE
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Publication number 20240329334
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Publication date Oct 3, 2024
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Sumitomo Electric Industries, Ltd.
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Hong Chuyen NGUYEN
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G02 - OPTICS
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PHOTONICS INTEGRATED CIRCUIT PACKAGE
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Publication number 20240266296
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Publication date Aug 8, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Feng Wei Kuo
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H01 - BASIC ELECTRIC ELEMENTS
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HIGH-RESOLUTION HANDHELD OCT IMAGING SYSTEM
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Publication number 20240230315
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Publication date Jul 11, 2024
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THE FIRST AFFILIATED HOSPITAL OF JINAN UNIVERSITY (GUANGZHOU OVERSEAS CHINESE
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Shuixing Zhang
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H04 - ELECTRIC COMMUNICATION TECHNIQUE
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MULTI-WAFER INTEGRATION
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Publication number 20240194650
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Publication date Jun 13, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Chin-Min Lin
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H01 - BASIC ELECTRIC ELEMENTS
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FIBER OPTIC BEAM SPLITTER
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Publication number 20240168244
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Publication date May 23, 2024
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NETAFIM, LTD.
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ABRAHAM SCHWEITZER
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H04 - ELECTRIC COMMUNICATION TECHNIQUE
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HIGH-RESOLUTION HANDHELD OCT IMAGING SYSTEM
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Publication number 20240133674
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Publication date Apr 25, 2024
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THE FIRST AFFILIATED HOSPITAL OF JINAN UNIVERSITY (GUANGZHOU OVERSEAS CHINESE
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Shuixing Zhang
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H04 - ELECTRIC COMMUNICATION TECHNIQUE
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PHOTONIC COUPLER
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Publication number 20230266542
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Publication date Aug 24, 2023
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X Development LLC
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Yi-Kuei Ryan Wu
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G02 - OPTICS
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OPTICAL ALIGNMENT DEVICE
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Publication number 20230258885
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Publication date Aug 17, 2023
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ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
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Joong-Seon CHOE
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G02 - OPTICS