for electrical inspection or testing

Industry

CPC
H05K1/0268

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0268for electrical inspection or testing

Industries

Patents Grantslast 30 patents

Information Patent Grant
LED circuit board structure and LED testing and packaging method
- Patent number 12,150,242
- Issue date Nov 19, 2024
- Ingentec Corporation
- Yi-Chuan Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 12,144,106
- Issue date Nov 12, 2024
- TPK Auto Tech (Xiamen) Limited
- Li Hua Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for detecting and adjusting poor back drills in printed circ...
- Patent number 12,135,347
- Issue date Nov 5, 2024
- R&D Circuits
- Michael Caprio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit structure and fabrication method thereof
- Patent number 12,133,337
- Issue date Oct 29, 2024
- INNOLUX CORPORATION
- Yi Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of electronic device
- Patent number 12,089,345
- Issue date Sep 10, 2024
- INNOLUX CORPORATION
- Yi-Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die package structure and method for fabricating the same
- Patent number 12,089,346
- Issue date Sep 10, 2024
- Realtek Semiconductor Corp.
- Hai-Tao Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device
- Patent number 12,074,152
- Issue date Aug 27, 2024
- Samsung Display Co., Ltd.
- Dae Hyuk Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control unit for a motor vehicle and method for producing and measu...
- Patent number 12,058,809
- Issue date Aug 6, 2024
- Vitesco Technologies Germany GmbH
- Christian Walda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder joint life predictor and solder joint life prediction method
- Patent number 12,032,039
- Issue date Jul 9, 2024
- Mitsubishi Electric Corporation
- Takuya Saeki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device and an inspection method of a display device
- Patent number 12,016,116
- Issue date Jun 18, 2024
- Samsung Display Co., Ltd.
- Yong Jin Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple circuit board tester
- Patent number 11,977,112
- Issue date May 7, 2024
- LAT Enterprises Inc.
- Laura Thiel
- G01 - MEASURING TESTING
Information Patent Grant
Printed circuit boards and memory modules
- Patent number 11,974,391
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Dongyoon Seo
- G11 - INFORMATION STORAGE
Information Patent Grant
Card reader
- Patent number 11,950,359
- Issue date Apr 2, 2024
- NIDEC SANKYO CORPORATION
- Ryo Uchiyama
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Traceability of subsequent layer structure manufacturing of main bo...
- Patent number 11,937,369
- Issue date Mar 19, 2024
- AT&S(China) Co. Ltd.
- Seok Kim Tay
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wiring structure
- Patent number 11,908,786
- Issue date Feb 20, 2024
- Advanced Semiconductor Engineering, Inc.
- Ting Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,910,529
- Issue date Feb 20, 2024
- Samsung Display Co., Ltd.
- Sehui Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus including a display panel with multiple pads
- Patent number 11,894,294
- Issue date Feb 6, 2024
- Samsung Display Co., Ltd.
- Hanho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus
- Patent number 11,895,774
- Issue date Feb 6, 2024
- Samsung Display Co., Ltd.
- Jaejin Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit mother board and detection method thereof
- Patent number 11,871,511
- Issue date Jan 9, 2024
- WUHAN TIANMA MICRO-ELECTRONICS CO., LTD.
- Han Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for locating open circuit failure point of test structure
- Patent number 11,852,674
- Issue date Dec 26, 2023
- Shanghai Huali Microelectronics Corporation
- Cheng Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stretchable display device
- Patent number 11,810,906
- Issue date Nov 7, 2023
- LG Display Co., Ltd.
- Seulki Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Display module and method for forming same
- Patent number 11,812,548
- Issue date Nov 7, 2023
- Xiamen Tianma Micro-Electronics Co., Ltd.
- Lei Suo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and manufacturing method thereof
- Patent number 11,798,875
- Issue date Oct 24, 2023
- Innolux Corporation
- Chung-Chun Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module substrate and semiconductor module including the same
- Patent number 11,792,921
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Sunki Yun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip-on-film package, display panel, and display device
- Patent number 11,749,146
- Issue date Sep 5, 2023
- Samsung Display Co., Ltd.
- Hee-Kwon Lee
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Electronic apparatus and inspection method
- Patent number 11,751,326
- Issue date Sep 5, 2023
- Sharp Kabushiki Kaisha
- Mitsuaki Morimoto
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit with constrained metal line arrangement
- Patent number 11,748,550
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- XinYong Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multilayer substrate and method for manufacturing the same
- Patent number 11,735,346
- Issue date Aug 22, 2023
- Murata Manufacturing Co., Ltd.
- Shingo Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple circuit board tester
- Patent number 11,703,538
- Issue date Jul 18, 2023
- LAT Enterprises, Inc.
- Laura Thiel
- G01 - MEASURING TESTING
Information Patent Grant
Short interconnect assembly with strip elastomer
- Patent number 11,696,396
- Issue date Jul 4, 2023
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20240381540
- Publication date Nov 14, 2024
- Innolux Corporation
- Yi-Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE FOR ELECTRONIC CONTROL DEVICE, AND METHOD FOR MANU...
- Publication number 20240357736
- Publication date Oct 24, 2024
- Hitachi Astemo, Ltd.
- Takanori SEKIGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MONITORING METHOD THEREFOR
- Publication number 20240310431
- Publication date Sep 19, 2024
- Wiwynn Corporation
- Gong-Bo SONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SPLIT PAD WITH TEST LINE
- Publication number 20240304503
- Publication date Sep 12, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE CIRCUIT BOARD TESTER
- Publication number 20240241171
- Publication date Jul 18, 2024
- LAT Enterprises Inc., d/b/a MediPak Energy Systems
- Laura Thiel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board and Manufacturing Method Thereof, and Terminal Device
- Publication number 20240237194
- Publication date Jul 11, 2024
- Honor Device Co., Ltd.
- Junjie Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20240213181
- Publication date Jun 27, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Hao SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Display Device
- Publication number 20240206259
- Publication date Jun 20, 2024
- LG Display Co., Ltd.
- Taeyung Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE
- Publication number 20240172362
- Publication date May 23, 2024
- SAMSUNG DISPLAY CO., LTD.
- SEHUI JANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROL BOARD, CONTROL APPARATUS AND METHOD FOR SECURITY ENHANCEMEN...
- Publication number 20240164011
- Publication date May 16, 2024
- HL KLEMOVE CORP.
- Minsu HAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board and Manufacturing Method Thereof, and Terminal Device
- Publication number 20240138056
- Publication date Apr 25, 2024
- Honor Device Co., Ltd.
- Junjie Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20240138065
- Publication date Apr 25, 2024
- SAMSUNG DISPLAY CO., LTD.
- JAEJIN OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGED BATTERY PACK SENSING MODULE FOR MULTIPLE ARRAYS
- Publication number 20240106095
- Publication date Mar 28, 2024
- FORD GLOBAL TECHNOLOGIES, L.L.C.
- Daniel Paul Roberts
- B60 - VEHICLES IN GENERAL
Information Patent Application
METHOD FOR ADDITIVE MANUFACTURING ELECTRONICS AND A PRINTING SUPPOR...
- Publication number 20240107681
- Publication date Mar 28, 2024
- HENSOLDT Sensors GmbH
- Jörg Sander
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240096378
- Publication date Mar 21, 2024
- Kabushiki Kaisha Toshiba
- Nobuhiro YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING S...
- Publication number 20240090125
- Publication date Mar 14, 2024
- KIOXIA Corporation
- Takashi YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT ARRANGEMENT, PRINTED CIRCUIT BOARD ARRANGEMENT, ELECTRIC DR...
- Publication number 20240074040
- Publication date Feb 29, 2024
- ZF Friedrichshafen AG
- Florian Ullrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20240074041
- Publication date Feb 29, 2024
- Chipbond Technology Corporation
- Gwo-Shyan Sheu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240006295
- Publication date Jan 4, 2024
- InnoLux Corporation
- Chung-Chun CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED CIRCUIT BOARD STRUCTURE, LED TESTING AND PACKAGING METHOD AND L...
- Publication number 20240008170
- Publication date Jan 4, 2024
- INGENTEC CORPORATION
- Yi-Chuan HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND SYSTEMS FOR IMPLEMENTING A MODULAR PLATFORM IMPLEMENTIN...
- Publication number 20230422399
- Publication date Dec 28, 2023
- Wolfspeed, Inc.
- Adam ANDERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM PACKAGE, DISPLAY PANEL, AND DISPLAY DEVICE
- Publication number 20230410703
- Publication date Dec 21, 2023
- SAMSUNG DISPLAY CO., LTD.
- Hee-Kwon Lee
- G02 - OPTICS
Information Patent Application
ELECTRONIC UNIT AND METHOD FOR TESTING AT LEAST ONE STATE OF AN ELE...
- Publication number 20230366921
- Publication date Nov 16, 2023
- Endress+Hauser SE+Co. KG
- Bernd Strütt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT WITH CONSTRAINED METAL LINE ARRANGEMENT, METHOD...
- Publication number 20230367949
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- XinYong WANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230363086
- Publication date Nov 9, 2023
- TPK Auto Tech (Xiamen) Limited
- Li Hua Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTIPLE CIRCUIT BOARD TESTER
- Publication number 20230349966
- Publication date Nov 2, 2023
- LAT Enterprises Inc., d/b/a MediPak Energy Systems
- Laura Thiel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE AND AN INSPECTION METHOD OF A DISPLAY DEVICE
- Publication number 20230328876
- Publication date Oct 12, 2023
- SAMSUNG DISPLAY CO., LTD.
- Yong Jin SHIN
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
PRINTED CIRCUIT BOARD FOR DEGRADATION DETECTION
- Publication number 20230276569
- Publication date Aug 31, 2023
- FANUC Corporation
- Takeshi SAWADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING STRUCTURE
- Publication number 20230268264
- Publication date Aug 24, 2023
- Advanced Semiconductor Engineering, Inc.
- Ting Wei HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230232543
- Publication date Jul 20, 2023
- Realtek Semiconductor Corp.
- Hai-Tao Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

for electrical inspection or testing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

LED circuit board structure and LED testing and packaging method

Electronic device

Method for detecting and adjusting poor back drills in printed circ...

Circuit structure and fabrication method thereof

Manufacturing method of electronic device

Die package structure and method for fabricating the same

Display device

Control unit for a motor vehicle and method for producing and measu...

Solder joint life predictor and solder joint life prediction method

Display device and an inspection method of a display device

Multiple circuit board tester

Printed circuit boards and memory modules

Card reader

Traceability of subsequent layer structure manufacturing of main bo...

Wiring structure

Display device

Display apparatus including a display panel with multiple pads

Electronic apparatus

Flexible circuit mother board and detection method thereof

Method for locating open circuit failure point of test structure

Stretchable display device

Display module and method for forming same

Electronic device and manufacturing method thereof

Module substrate and semiconductor module including the same

Chip-on-film package, display panel, and display device

Electronic apparatus and inspection method

Integrated circuit with constrained metal line arrangement

Multilayer substrate and method for manufacturing the same

Multiple circuit board tester

Short interconnect assembly with strip elastomer

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF ELECTRONIC DEVICE

WIRING SUBSTRATE FOR ELECTRONIC CONTROL DEVICE, AND METHOD FOR MANU...

CIRCUIT BOARD AND MONITORING METHOD THEREFOR

SPLIT PAD WITH TEST LINE

MULTIPLE CIRCUIT BOARD TESTER

Circuit Board and Manufacturing Method Thereof, and Terminal Device

DISPLAY PANEL AND DISPLAY DEVICE

Display Device

DISPLAY DEVICE

CONTROL BOARD, CONTROL APPARATUS AND METHOD FOR SECURITY ENHANCEMEN...

Circuit Board and Manufacturing Method Thereof, and Terminal Device

ELECTRONIC APPARATUS

BRIDGED BATTERY PACK SENSING MODULE FOR MULTIPLE ARRAYS

METHOD FOR ADDITIVE MANUFACTURING ELECTRONICS AND A PRINTING SUPPOR...

ELECTRONIC DEVICE

CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING S...

CIRCUIT ARRANGEMENT, PRINTED CIRCUIT BOARD ARRANGEMENT, ELECTRIC DR...

CIRCUIT BOARD

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

LED CIRCUIT BOARD STRUCTURE, LED TESTING AND PACKAGING METHOD AND L...

METHODS AND SYSTEMS FOR IMPLEMENTING A MODULAR PLATFORM IMPLEMENTIN...

CHIP-ON-FILM PACKAGE, DISPLAY PANEL, AND DISPLAY DEVICE

ELECTRONIC UNIT AND METHOD FOR TESTING AT LEAST ONE STATE OF AN ELE...

INTEGRATED CIRCUIT WITH CONSTRAINED METAL LINE ARRANGEMENT, METHOD...

ELECTRONIC DEVICE

MULTIPLE CIRCUIT BOARD TESTER

DISPLAY DEVICE AND AN INSPECTION METHOD OF A DISPLAY DEVICE

PRINTED CIRCUIT BOARD FOR DEGRADATION DETECTION

WIRING STRUCTURE

DIE PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME