for electroless plating

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CPC
H05K3/387

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/387for electroless plating

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Printed wiring board
- Patent number 12,028,988
- Issue date Jul 2, 2024
- Ibiden Co., Ltd.
- Takuya Inishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protection tape for printed circuit board and display device includ...
- Patent number 11,987,031
- Issue date May 21, 2024
- Samsung Display Co., Ltd.
- Jun Namkung
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multi-layer circuit board with traces thicker than a circuit board
- Patent number 11,406,024
- Issue date Aug 2, 2022
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminate and method for manufacturing the same
- Patent number 11,317,507
- Issue date Apr 26, 2022
- Arisawa Mfg. Co., Ltd.
- Naoki Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microcircuit forming method and etching fluid composition
- Patent number 11,089,691
- Issue date Aug 10, 2021
- Inktec Co., Ltd.
- Su Han Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Multi-layer circuit board with traces thicker than a circuit board...
- Patent number 11,039,540
- Issue date Jun 15, 2021
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protection tape for printed circuit board and display device includ...
- Patent number 11,034,128
- Issue date Jun 15, 2021
- Samsung Display Co., Ltd.
- Jun Namkung
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit board using non-catalytic laminate with catalytic adhesive...
- Patent number 10,959,329
- Issue date Mar 23, 2021
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal coating of objects using plasma polymerisation pretreatment
- Patent number 10,934,617
- Issue date Mar 2, 2021
- Cuptronic Technology Ltd.
- Sven Göthe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metalization of surfaces
- Patent number 10,822,702
- Issue date Nov 3, 2020
- Cuptronic Technology Ltd.
- Björn Atthoff
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Catalytic circuit board with traces and vias
- Patent number 10,806,029
- Issue date Oct 13, 2020
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for manufacture of circuit boards
- Patent number 10,750,618
- Issue date Aug 18, 2020
- University of Hawaii
- David Garmire
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protection tape for printed circuit board and display device includ...
- Patent number 10,668,687
- Issue date Jun 2, 2020
- Samsung Display Co., Ltd.
- Jun Namkung
- B32 - LAYERED PRODUCTS
Information Patent Grant
Methods of fast fabrication of single and multilayer circuit with h...
- Patent number 10,660,217
- Issue date May 19, 2020
- Jun Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Polymer compound, surface treatment agent, laminated body using sur...
- Patent number 10,550,281
- Issue date Feb 4, 2020
- Nikon Corporation
- Yusuke Kawakami
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Circuit board with catalytic adhesive
- Patent number 10,306,756
- Issue date May 28, 2019
- Sierra Circuits, Inc.
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminate structure of metal coating
- Patent number 10,306,774
- Issue date May 28, 2019
- Electroplating Engineers of Japan Limited
- Masahiro Ito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Lighting device
- Patent number 10,125,949
- Issue date Nov 13, 2018
- LG Innotek Co., Ltd
- Moo Ryong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board, electronic component, and method for produci...
- Patent number 10,111,330
- Issue date Oct 23, 2018
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Hiroshi Ueda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board apparatus and method
- Patent number 9,942,981
- Issue date Apr 10, 2018
- Sierra Circuits, Inc.
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of substrate structure, substrate structure an...
- Patent number 9,790,609
- Issue date Oct 17, 2017
- Wistron NeWeb Corp.
- Tzu-Wen Chuang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semi-finished product for the production of a printed circuit board...
- Patent number 9,763,337
- Issue date Sep 12, 2017
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Stefan Jäger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacture of fine line circuitry
- Patent number 9,713,266
- Issue date Jul 18, 2017
- Atotech Deutschland GmbH
- Richard Nichols
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Catalytic laminate apparatus and method
- Patent number 9,706,650
- Issue date Jul 11, 2017
- Sierra Circuits, Inc.
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via in a printed circuit board
- Patent number 9,706,667
- Issue date Jul 11, 2017
- Sierra Circuits, Inc.
- Konstantine Karavakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process of depositing a metallic pattern on a medium
- Patent number 9,674,966
- Issue date Jun 6, 2017
- DSM IP Assets B.V.
- Franciscus Wilhelmus Maria Gelissen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Via in a printed circuit board
- Patent number 9,674,967
- Issue date Jun 6, 2017
- Sierra Circuits, Inc.
- Konstantine Karavakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lighting device
- Patent number 9,587,797
- Issue date Mar 7, 2017
- LG Innotek Co., Ltd
- Moo Ryong Park
- G02 - OPTICS
Information Patent Grant
Method for treating substrate that support catalyst particles for p...
- Patent number 9,565,776
- Issue date Feb 7, 2017
- Tanaka Kikinzoku Kogyo K.K.
- Noriaki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulating adhesive film, prepreg, laminate, cured article, and com...
- Patent number 9,453,145
- Issue date Sep 27, 2016
- Zeon Corporation
- Makoto Fujimura
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
PROTECTION TAPE FOR PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUD...
- Publication number 20240300208
- Publication date Sep 12, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jun NAMKUNG
- B32 - LAYERED PRODUCTS
Information Patent Application
Component Carrier With Photosensitive Adhesion Promoter and Method...
- Publication number 20240237230
- Publication date Jul 11, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Abderrazzaq Ifis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20230422406
- Publication date Dec 28, 2023
- IBIDEN CO., LTD.
- Takuya INISHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD
- Publication number 20230328898
- Publication date Oct 12, 2023
- Toyota Jidosha Kabushiki Kaisha
- Miwako SHIONOYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR PRODUCING CIRCUIT BOARD
- Publication number 20220192033
- Publication date Jun 16, 2022
- Idemitsu Kosan Co.,Ltd
- Fumioki FUKATSU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING A STRUCTURE HAVING CONDUCTIVE LINES
- Publication number 20210329790
- Publication date Oct 21, 2021
- Industrial Technology Research Institute
- Yu-Ming WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-Layer Circuit Board with Traces Thicker than a Circuit Board
- Publication number 20210282274
- Publication date Sep 9, 2021
- CATLAM LLC
- Kenneth S. BAHL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTION TAPE FOR PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUD...
- Publication number 20210276301
- Publication date Sep 9, 2021
- SAMSUNG DISPLAY CO., LTD.
- Jun NAMKUNG
- B32 - LAYERED PRODUCTS
Information Patent Application
LAMINATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200413535
- Publication date Dec 31, 2020
- Arisawa Mfg. Co., Ltd.
- Naoki Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board using non-catalytic laminate with catalytic adhesive...
- Publication number 20200404785
- Publication date Dec 24, 2020
- CATLAM, LLC
- Kenneth S. BAHL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTION TAPE FOR PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUD...
- Publication number 20200290308
- Publication date Sep 17, 2020
- SAMSUNG DISPLAY CO., LTD.
- Jun NAMKUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-Layer Circuit Board with Traces Thicker than a Circuit Board...
- Publication number 20200214144
- Publication date Jul 2, 2020
- CATLAM, LLC
- Kenneth S. BAHL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR MANUFACTURE OF CIRCUIT BOARDS
- Publication number 20190327837
- Publication date Oct 24, 2019
- University of Hawaii
- David Garmire
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Catalytic Laminate Apparatus and Method
- Publication number 20190239349
- Publication date Aug 1, 2019
- SIERRA CIRCUITS, INC.
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE STRUCTURE OF METAL COATING
- Publication number 20190090357
- Publication date Mar 21, 2019
- ELECTROPLATING ENGINEERS OF JAPAN LIMITED
- Masahiro ITO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
15993351
- Publication number 20180352661
- Publication date Dec 6, 2018
- Jun YANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Circuit board with Catalytic Adhesive
- Publication number 20180168036
- Publication date Jun 14, 2018
- SIERRA CIRCUITS, INC.
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board Apparatus and Method
- Publication number 20180054889
- Publication date Feb 22, 2018
- Sierra Circuits, Inc.
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLYMER COMPOUND, SURFACE TREATMENT AGENT, LAMINATED BODY USING SUR...
- Publication number 20170321079
- Publication date Nov 9, 2017
- Nikon Corporation
- Yusuke KAWAKAMI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED CIRCUIT BOARD, ELECTRONIC COMPONENT, AND METHOD FOR PRODUCI...
- Publication number 20170135206
- Publication date May 11, 2017
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Hiroshi UEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VIA IN A PRINTED CIRCUIT BOARD
- Publication number 20160295708
- Publication date Oct 6, 2016
- SIERRA CIRCUITS, INC.
- Konstantine Karavakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semi-Finished Product for the Production of a Printed Circuit Board...
- Publication number 20150342062
- Publication date Nov 26, 2015
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Stefan Jäger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS OF DEPOSITING A METALLIC PATTERN ON A MEDIUM
- Publication number 20150305168
- Publication date Oct 22, 2015
- DSM IP Assets B. V.
- Franciscus Wilhelmus Maria GELISSEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE PROCESSING METHOD FOR SUPPORTING A CATALYST PARTICLE FOR...
- Publication number 20150237742
- Publication date Aug 20, 2015
- TANAKA KIKINZOKU KOGYO K.K.
- Noriaki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURE OF FINE LINE CIRCUITRY
- Publication number 20150083602
- Publication date Mar 26, 2015
- Atotech Deutschland GmbH
- Richard Nichols
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LIGHTING DEVICE
- Publication number 20140376233
- Publication date Dec 25, 2014
- Moo Ryong PARK
- G02 - OPTICS
Information Patent Application
INSULATING ADHESIVE FILM, PREPREG, LAMINATE, CURED ARTICLE, AND COM...
- Publication number 20140234614
- Publication date Aug 21, 2014
- Zeon Corporation
- Makoto Fujimura
- B32 - LAYERED PRODUCTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140182904
- Publication date Jul 3, 2014
- Yong Jin Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STABILIZED SILVER CATALYSTS AND METHODS
- Publication number 20140171296
- Publication date Jun 19, 2014
- DOW GLOBAL TECHNOLOGIES LLC
- Kurt F. HIRSEKORN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Glass Wiring Board
- Publication number 20140097005
- Publication date Apr 10, 2014
- TYCO ELECTRONICS JAPAN G.K.
- Katsunori Fukuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

for electroless plating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed wiring board

Protection tape for printed circuit board and display device includ...

Multi-layer circuit board with traces thicker than a circuit board

Laminate and method for manufacturing the same

Microcircuit forming method and etching fluid composition

Multi-layer circuit board with traces thicker than a circuit board...

Protection tape for printed circuit board and display device includ...

Circuit board using non-catalytic laminate with catalytic adhesive...

Metal coating of objects using plasma polymerisation pretreatment

Metalization of surfaces

Catalytic circuit board with traces and vias

System and method for manufacture of circuit boards

Protection tape for printed circuit board and display device includ...

Methods of fast fabrication of single and multilayer circuit with h...

Polymer compound, surface treatment agent, laminated body using sur...

Circuit board with catalytic adhesive

Laminate structure of metal coating

Lighting device

Printed circuit board, electronic component, and method for produci...

Circuit board apparatus and method

Manufacturing method of substrate structure, substrate structure an...

Semi-finished product for the production of a printed circuit board...

Method for manufacture of fine line circuitry

Catalytic laminate apparatus and method

Via in a printed circuit board

Process of depositing a metallic pattern on a medium

Via in a printed circuit board

Lighting device

Method for treating substrate that support catalyst particles for p...

Insulating adhesive film, prepreg, laminate, cured article, and com...

Patents Applicationslast 30 patents

PROTECTION TAPE FOR PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUD...

Component Carrier With Photosensitive Adhesion Promoter and Method...

PRINTED WIRING BOARD

BOARD

CIRCUIT BOARD AND METHOD FOR PRODUCING CIRCUIT BOARD

METHOD OF MANUFACTURING A STRUCTURE HAVING CONDUCTIVE LINES

Multi-Layer Circuit Board with Traces Thicker than a Circuit Board

PROTECTION TAPE FOR PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUD...

LAMINATE AND METHOD FOR MANUFACTURING THE SAME

Circuit Board using non-catalytic laminate with catalytic adhesive...

PROTECTION TAPE FOR PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUD...

Multi-Layer Circuit Board with Traces Thicker than a Circuit Board...

SYSTEM AND METHOD FOR MANUFACTURE OF CIRCUIT BOARDS

Catalytic Laminate Apparatus and Method

LAMINATE STRUCTURE OF METAL COATING

15993351

Circuit board with Catalytic Adhesive

Circuit Board Apparatus and Method

POLYMER COMPOUND, SURFACE TREATMENT AGENT, LAMINATED BODY USING SUR...

PRINTED CIRCUIT BOARD, ELECTRONIC COMPONENT, AND METHOD FOR PRODUCI...

VIA IN A PRINTED CIRCUIT BOARD

Semi-Finished Product for the Production of a Printed Circuit Board...

PROCESS OF DEPOSITING A METALLIC PATTERN ON A MEDIUM

SUBSTRATE PROCESSING METHOD FOR SUPPORTING A CATALYST PARTICLE FOR...

METHOD FOR MANUFACTURE OF FINE LINE CIRCUITRY

LIGHTING DEVICE

INSULATING ADHESIVE FILM, PREPREG, LAMINATE, CURED ARTICLE, AND COM...

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

STABILIZED SILVER CATALYSTS AND METHODS

Glass Wiring Board