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Semiconductor package and method
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Patent number 11,942,435
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Issue date Mar 26, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd
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Po-Han Wang
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H01 - BASIC ELECTRIC ELEMENTS
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Plated metallization structures
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Patent number 11,862,518
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Issue date Jan 2, 2024
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Analog Devices International Unlimited Company
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Jan Kubik
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Semiconductor package and method
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Patent number 11,664,323
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Issue date May 30, 2023
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Taiwan Semiconductor Manufacturing Company, Ltd
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Po-Han Wang
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H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device
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Patent number 11,574,871
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Issue date Feb 7, 2023
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Samsung Electronics Co., Ltd.
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Jun-Kwan Kim
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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