for electroplating

Industry

CPC
H01L21/76873

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76873for electroplating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing composite layer circuit structure of elect...
- Patent number 12,362,252
- Issue date Jul 15, 2025
- INNOLUX CORPORATION
- Yu-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 12,354,956
- Issue date Jul 8, 2025
- Tahoe Research, LTD.
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip redistribution structure and preparation method thereof
- Patent number 12,341,064
- Issue date Jun 24, 2025
- CHIPMORE TECHNOLOGY CORPORATION LIMITED
- Guanmeng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating systems having reduced air entrainment
- Patent number 12,312,702
- Issue date May 27, 2025
- Applied Materials, Inc.
- Cameron Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gold through silicon mask plating
- Patent number 12,293,943
- Issue date May 6, 2025
- Lam Research Corporation
- Lee Peng Chua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 12,283,545
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact with bronze material to mitigate undercut
- Patent number 12,237,219
- Issue date Feb 25, 2025
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for determining horizontal position of substr...
- Patent number 12,237,220
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Lung Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure with power connect...
- Patent number 12,224,227
- Issue date Feb 11, 2025
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 12,205,888
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package structure of electronic device
- Patent number 12,191,197
- Issue date Jan 7, 2025
- INNOLUX CORPORATION
- Ching-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for pressure force inspection
- Patent number 12,181,362
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung Chang Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Through electrode substrate and semiconductor device
- Patent number 12,183,661
- Issue date Dec 31, 2024
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating redistribution circuit structure
- Patent number 12,170,223
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems of forming metal interconnect layers using engi...
- Patent number 12,165,881
- Issue date Dec 10, 2024
- Rashid Mavliev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Chemical direct pattern plating method
- Patent number 12,159,837
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Jiun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing same
- Patent number 12,154,859
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Woonchun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked staggered electrode foil capacitor structures in semiconduc...
- Patent number 12,154,940
- Issue date Nov 26, 2024
- SARAS MICRO DEVICES, INC.
- Richard P. Sheridan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming a metallic film on a substrate by cyclical depo...
- Patent number 12,106,965
- Issue date Oct 1, 2024
- ASM IP Holding B.V.
- Katja Väyrynen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic device package and method of manufacturing the same
- Patent number 12,094,772
- Issue date Sep 17, 2024
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for determining horizontal position of substr...
- Patent number 12,087,625
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Lung Hou
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods for forming contact plugs with reduced corrosion
- Patent number 12,068,197
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating for thermal management
- Patent number 12,068,221
- Issue date Aug 20, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of making a semiconductor device and semiconductor device
- Patent number 12,051,617
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min Han Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a dual material redistribution line
- Patent number 12,027,447
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Anhao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt fill for gate structures
- Patent number 11,996,328
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doped selective metal caps to improve copper electromigration with...
- Patent number 11,990,368
- Issue date May 21, 2024
- Applied Materials, Inc.
- Mehul B. Naik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,942,435
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out packages and methods of forming the same
- Patent number 11,929,319
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,923,292
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Jinkuk Bae
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250226317
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE AND METHODS OF FORMATION
- Publication number 20250218793
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufactacturing Company, Ltd.
- I-Chun WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stamping Surface Profile in Design Layer and Using Patterned Electr...
- Publication number 20250137159
- Publication date May 1, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Heinrich TRISCHLER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE WITH POWER CONNECT...
- Publication number 20250132229
- Publication date Apr 24, 2025
- TZU-WEI CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrolyte and Deposition of a Copper Barrier Layer in a Damascene...
- Publication number 20250125151
- Publication date Apr 17, 2025
- Louis Caillard
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WAFER-LEVEL POWER MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20250096109
- Publication date Mar 20, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Jianhong ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Fabricating Redistribution Circuit Structure
- Publication number 20250069951
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods And Systems Of Forming Metal Interconnect Layers Using Engi...
- Publication number 20250069900
- Publication date Feb 27, 2025
- Rashid Mavliev
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A DEFECT...
- Publication number 20250051950
- Publication date Feb 13, 2025
- BASF SE
- Charlotte Emnet
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20250054870
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- WOONCHUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PAD METALLIZATION SYSTEMS AND RELATED METHODS
- Publication number 20250054887
- Publication date Feb 13, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Guy BRIZAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20250046681
- Publication date Feb 6, 2025
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VIAS INCLUDING AN ELECTROPLATED LAYER AND METHODS FOR FABRICATING T...
- Publication number 20250038010
- Publication date Jan 30, 2025
- Corning Incorporated
- Bomi Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH WETTABLE FLANKS AND RELATED METHODS
- Publication number 20250022831
- Publication date Jan 16, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Nam Khong THEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250015041
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESS FLOW FOR ENABLING SUBSTRATE TO DIE HYBRID BONDING
- Publication number 20240421043
- Publication date Dec 19, 2024
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATED DIAL-IN OF ELECTROPLATING PROCESS PARAMETERS BASED ON WAF...
- Publication number 20240413011
- Publication date Dec 12, 2024
- Applied Materials, Inc.
- Jing Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20240413012
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240404878
- Publication date Dec 5, 2024
- Amkor Technology Portugal, S.A.
- Eoin O'Toole
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIA WITH TEXTURED STRUCTURE AND FOOTING FEATURES
- Publication number 20240395666
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR PRESSURE FORCE INSPECTION
- Publication number 20240393199
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung Chang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-RESISTANCE COPPER INTERCONNECTS
- Publication number 20240387382
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR COPPER PLATING IN SEMICONDUCTOR DEVICES
- Publication number 20240387379
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun-Nan NIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20240387359
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240379595
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORIES AND FABRICATION METHODS THEREOF, MEMORY SYSTEMS, AND ELECT...
- Publication number 20240379497
- Publication date Nov 14, 2024
- Yangtze Memory Technologies Co., Ltd.
- Hao Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND SYSTEMS FOR ELECTROPLATING
- Publication number 20240363406
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Lung HOU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS FOR FORMING CONTACT PLUGS WITH REDUCED CORROSION
- Publication number 20240363409
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240355670
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min Han HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURED RESIN FILM, SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEM...
- Publication number 20240352275
- Publication date Oct 24, 2024
- Resonac Corporation
- Yuki IMAZU
- H01 - BASIC ELECTRIC ELEMENTS

for electroplating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing composite layer circuit structure of elect...

Cobalt based interconnects and methods of fabrication thereof

Chip redistribution structure and preparation method thereof

Plating systems having reduced air entrainment

Gold through silicon mask plating

Package structure and method of manufacturing the same

Contact with bronze material to mitigate undercut

Apparatus and methods for determining horizontal position of substr...

Method for manufacturing semiconductor structure with power connect...

Semiconductor packages and methods of forming the same

Manufacturing method of package structure of electronic device

Device and method for pressure force inspection

Through electrode substrate and semiconductor device

Method of fabricating redistribution circuit structure

Methods and systems of forming metal interconnect layers using engi...

Chemical direct pattern plating method

Semiconductor package and method of manufacturing same

Stacked staggered electrode foil capacitor structures in semiconduc...

Methods for forming a metallic film on a substrate by cyclical depo...

Electronic device package and method of manufacturing the same

Apparatus and methods for determining horizontal position of substr...

Methods for forming contact plugs with reduced corrosion

Plating for thermal management

Method of making a semiconductor device and semiconductor device

Semiconductor device having a dual material redistribution line

Cobalt fill for gate structures

Doped selective metal caps to improve copper electromigration with...

Semiconductor package and method

Integrated fan-out packages and methods of forming the same

Semiconductor device and method of fabricating the same

Patents Applicationslast 30 patents

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DIE AND METHODS OF FORMATION

Stamping Surface Profile in Design Layer and Using Patterned Electr...

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE WITH POWER CONNECT...

Electrolyte and Deposition of a Copper Barrier Layer in a Damascene...

WAFER-LEVEL POWER MODULE AND MANUFACTURING METHOD THEREFOR

Method of Fabricating Redistribution Circuit Structure

Methods And Systems Of Forming Metal Interconnect Layers Using Engi...

ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A DEFECT...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

COPPER PAD METALLIZATION SYSTEMS AND RELATED METHODS

THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE

VIAS INCLUDING AN ELECTROPLATED LAYER AND METHODS FOR FABRICATING T...

SEMICONDUCTOR PACKAGES WITH WETTABLE FLANKS AND RELATED METHODS

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

SUBSTRATE PROCESS FLOW FOR ENABLING SUBSTRATE TO DIE HYBRID BONDING

AUTOMATED DIAL-IN OF ELECTROPLATING PROCESS PARAMETERS BASED ON WAF...

Semiconductor Device and Method

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

THROUGH SILICON VIA WITH TEXTURED STRUCTURE AND FOOTING FEATURES

DEVICE AND METHOD FOR PRESSURE FORCE INSPECTION

LOW-RESISTANCE COPPER INTERCONNECTS

METHOD AND APPARATUS FOR COPPER PLATING IN SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME

MEMORIES AND FABRICATION METHODS THEREOF, MEMORY SYSTEMS, AND ELECT...

APPARATUSES AND SYSTEMS FOR ELECTROPLATING

METHODS FOR FORMING CONTACT PLUGS WITH REDUCED CORROSION

SEMICONDUCTOR DEVICE

CURED RESIN FILM, SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEM...