for electroplating

Industry

CPC
H01L21/76873

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76873for electroplating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods for forming a metallic film on a substrate by cyclical depo...
- Patent number 12,106,965
- Issue date Oct 1, 2024
- ASM IP Holding B.V.
- Katja Väyrynen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic device package and method of manufacturing the same
- Patent number 12,094,772
- Issue date Sep 17, 2024
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for determining horizontal position of substr...
- Patent number 12,087,625
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Lung Hou
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods for forming contact plugs with reduced corrosion
- Patent number 12,068,197
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating for thermal management
- Patent number 12,068,221
- Issue date Aug 20, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of making a semiconductor device and semiconductor device
- Patent number 12,051,617
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min Han Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a dual material redistribution line
- Patent number 12,027,447
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Anhao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt fill for gate structures
- Patent number 11,996,328
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doped selective metal caps to improve copper electromigration with...
- Patent number 11,990,368
- Issue date May 21, 2024
- Applied Materials, Inc.
- Mehul B. Naik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,942,435
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out packages and methods of forming the same
- Patent number 11,929,319
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,923,292
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Jinkuk Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vias for cobalt-based interconnects and methods of fabrication thereof
- Patent number 11,908,735
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an interconnect structure
- Patent number 11,901,226
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Kuei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rework for metal interconnects using etch and thermal anneal
- Patent number 11,901,224
- Issue date Feb 13, 2024
- International Business Machines Corporation
- Prasad Bhosale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-pass plating process with intermediate rinse and dry
- Patent number 11,887,888
- Issue date Jan 30, 2024
- Texas Instruments Incorporated
- Peter John Holverson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for electrochemical deposition of isolated seed layer areas
- Patent number 11,875,996
- Issue date Jan 16, 2024
- Applied Materials, Inc.
- Marvin Louis Bernt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,862,560
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 11,862,563
- Issue date Jan 2, 2024
- Tahoe Research, LTD.
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated metallization structures
- Patent number 11,862,518
- Issue date Jan 2, 2024
- Analog Devices International Unlimited Company
- Jan Kubik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composite wafer, semiconductor device and electronic component
- Patent number 11,848,237
- Issue date Dec 19, 2023
- Infineon Technologies AG
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating redistribution circuit structure
- Patent number 11,817,352
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming copper interconnect structure with manganese barr...
- Patent number 11,804,405
- Issue date Oct 31, 2023
- TESSERA LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio gratings fabricated by electrodeposition
- Patent number 11,798,844
- Issue date Oct 24, 2023
- National Technology & Engineering Solutions of Sandia, LLC
- Christian Lew Arrington
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Through silicon via fabrication
- Patent number 11,776,849
- Issue date Oct 3, 2023
- Quantinuum LLC
- Robert Edward Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a metal-insulator-metal (MIM) capacitor
- Patent number 11,769,722
- Issue date Sep 26, 2023
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating systems having reduced air entrainment
- Patent number 11,739,434
- Issue date Aug 29, 2023
- Applied Materials, Inc.
- Cameron Law
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Integrated passive device and fabrication method using a last throu...
- Patent number 11,735,497
- Issue date Aug 22, 2023
- Semiconductor Components Industries, LLC
- Takashi Noma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate and semiconductor device
- Patent number 11,728,243
- Issue date Aug 15, 2023
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper electrodeposition sequence for the filling of cobalt lined f...
- Patent number 11,699,590
- Issue date Jul 11, 2023
- Lam Research Corporation
- Jeyavel Velmurugan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
LOW-RESISTANCE COPPER INTERCONNECTS
- Publication number 20240387382
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR COPPER PLATING IN SEMICONDUCTOR DEVICES
- Publication number 20240387379
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun-Nan NIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20240387359
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20240379595
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORIES AND FABRICATION METHODS THEREOF, MEMORY SYSTEMS, AND ELECT...
- Publication number 20240379497
- Publication date Nov 14, 2024
- Yangtze Memory Technologies Co., Ltd.
- Hao Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND SYSTEMS FOR ELECTROPLATING
- Publication number 20240363406
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Lung HOU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS FOR FORMING CONTACT PLUGS WITH REDUCED CORROSION
- Publication number 20240363409
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURED RESIN FILM, SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEM...
- Publication number 20240352275
- Publication date Oct 24, 2024
- Resonac Corporation
- Yuki IMAZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240355670
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min Han HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT FILL FOR GATE STRUCTURES
- Publication number 20240312837
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE REDISTRIBUTION STRUCTURE AND FABRICATION METH...
- Publication number 20240282628
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dian-Hau CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CIRCUIT PART AND METHOD OF MANUFACTURING THREE-DI...
- Publication number 20240282588
- Publication date Aug 22, 2024
- MAXELL, LTD.
- Akiko KITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Back End of Line Metal Via Process
- Publication number 20240258165
- Publication date Aug 1, 2024
- Shanghai Huali Integrated Circuit Corporation
- Qiaodan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SEMICONDUCTOR COMPONENT ON THE BASIS OF GALLIUM NITRIDE...
- Publication number 20240234512
- Publication date Jul 11, 2024
- ROBERT BOSCH GmbH
- Kevin Dannecker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ATMOSPHERIC PLASMA TREATMENT STATION IN PROCESSING TOOL
- Publication number 20240213089
- Publication date Jun 27, 2024
- LAM RESEARCH CORPORATION
- Navaneetha Krishnan SUBBAIYAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240194611
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vias for Cobalt-Based Interconnects and Methods of Fabrication Thereof
- Publication number 20240194525
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING CONDUCTIVE VIA, CONDUCTIVE VIA AND PASSIVE DEVICE
- Publication number 20240162138
- Publication date May 16, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Xiyuan WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR FILM PLATING PERIMETER MAPPING AND COMPENSATION
- Publication number 20240145251
- Publication date May 2, 2024
- Applied Materials, Inc.
- Kyle M. Hanson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
- Publication number 20240145391
- Publication date May 2, 2024
- Tahoe Research, Ltd.
- Christopher J. JEZEWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240145375
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Hyeonjeong HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SEMICONDUCTOR COMPONENT ON THE BASIS OF GALLIUM NITRIDE...
- Publication number 20240136407
- Publication date Apr 25, 2024
- ROBERT BOSCH GmbH
- Kevin Dannecker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Improving Copper Alloy Electroplating Filling Process
- Publication number 20240060205
- Publication date Feb 22, 2024
- Shanghai Huali Integrated Circuit Corporation
- Yu Bao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MANUFACTURING METHOD FOR DEVICE EMBEDDED PACKAGING STRUCTURE
- Publication number 20240063055
- Publication date Feb 22, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...
- Publication number 20240006237
- Publication date Jan 4, 2024
- Adeia Semiconductor Solutions LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Pillars Preventing Wetting on Sidewalls and Method Forming Same
- Publication number 20230395492
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20230395429
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kan-Ju LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20230378058
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230378065
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Fabricating Redistribution Circuit Structure
- Publication number 20230377969
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS

for electroplating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods for forming a metallic film on a substrate by cyclical depo...

Electronic device package and method of manufacturing the same

Apparatus and methods for determining horizontal position of substr...

Methods for forming contact plugs with reduced corrosion

Plating for thermal management

Method of making a semiconductor device and semiconductor device

Semiconductor device having a dual material redistribution line

Cobalt fill for gate structures

Doped selective metal caps to improve copper electromigration with...

Semiconductor package and method

Integrated fan-out packages and methods of forming the same

Semiconductor device and method of fabricating the same

Vias for cobalt-based interconnects and methods of fabrication thereof

Method for forming an interconnect structure

Rework for metal interconnects using etch and thermal anneal

Multi-pass plating process with intermediate rinse and dry

Methods for electrochemical deposition of isolated seed layer areas

Package structure and method of manufacturing the same

Cobalt based interconnects and methods of fabrication thereof

Plated metallization structures

Composite wafer, semiconductor device and electronic component

Method of fabricating redistribution circuit structure

Method of forming copper interconnect structure with manganese barr...

High aspect ratio gratings fabricated by electrodeposition

Through silicon via fabrication

Method of forming a metal-insulator-metal (MIM) capacitor

Plating systems having reduced air entrainment

Integrated passive device and fabrication method using a last throu...

Through electrode substrate and semiconductor device

Copper electrodeposition sequence for the filling of cobalt lined f...

Patents Applicationslast 30 patents

LOW-RESISTANCE COPPER INTERCONNECTS

METHOD AND APPARATUS FOR COPPER PLATING IN SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME

MEMORIES AND FABRICATION METHODS THEREOF, MEMORY SYSTEMS, AND ELECT...

APPARATUSES AND SYSTEMS FOR ELECTROPLATING

METHODS FOR FORMING CONTACT PLUGS WITH REDUCED CORROSION

CURED RESIN FILM, SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEM...

SEMICONDUCTOR DEVICE

COBALT FILL FOR GATE STRUCTURES

SEMICONDUCTOR PACKAGE REDISTRIBUTION STRUCTURE AND FABRICATION METH...

THREE-DIMENSIONAL CIRCUIT PART AND METHOD OF MANUFACTURING THREE-DI...

Method of Back End of Line Metal Via Process

VERTICAL SEMICONDUCTOR COMPONENT ON THE BASIS OF GALLIUM NITRIDE...

INTEGRATED ATMOSPHERIC PLASMA TREATMENT STATION IN PROCESSING TOOL

SEMICONDUCTOR PACKAGE AND METHOD

Vias for Cobalt-Based Interconnects and Methods of Fabrication Thereof

METHOD FOR FORMING CONDUCTIVE VIA, CONDUCTIVE VIA AND PASSIVE DEVICE

SEMICONDUCTOR FILM PLATING PERIMETER MAPPING AND COMPENSATION

COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

VERTICAL SEMICONDUCTOR COMPONENT ON THE BASIS OF GALLIUM NITRIDE...

Method for Improving Copper Alloy Electroplating Filling Process

MANUFACTURING METHOD FOR DEVICE EMBEDDED PACKAGING STRUCTURE

METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...

Metal Pillars Preventing Wetting on Sidewalls and Method Forming Same

CONDUCTIVE STRUCTURES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Method of Fabricating Redistribution Circuit Structure