for encapsulating mounted components

Industry

CPC
H05K3/284

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/284for encapsulating mounted components

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic device with multilayer laminate
- Patent number 12,185,474
- Issue date Dec 31, 2024
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Jeroen Van Den Brand
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assemblies including a conformal moisture barrier
- Patent number 12,178,398
- Issue date Dec 31, 2024
- Intuitive Surgical Operations, Inc.
- Majeed A. Foad
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer level bump stack for chip scale package
- Patent number 12,177,988
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module
- Patent number 12,160,947
- Issue date Dec 3, 2024
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Motor housing for a riding lawn mower
- Patent number 12,150,405
- Issue date Nov 26, 2024
- Nanjing Chervon Industry Co., LTD
- Zhen Wang
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Grant
Method for forming a protective film on an electronic module
- Patent number 12,150,249
- Issue date Nov 19, 2024
- ELEADTK CO., LTD.
- Shao-Chi Liu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Coatings for waterproofing electronic components
- Patent number 12,139,635
- Issue date Nov 12, 2024
- Henkel AG & Co. KGaA
- John L. Zimmerman
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Lighting system with lens assembly
- Patent number 12,129,990
- Issue date Oct 29, 2024
- KORRUS, INC.
- Ariel Meir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated printed circuit board and a method of encapsulating a...
- Patent number 12,127,362
- Issue date Oct 22, 2024
- BLACK & DECKER INC.
- Michael Varipatis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mouth guard having user-notification feature of impact force
- Patent number 12,109,045
- Issue date Oct 8, 2024
- Force Impact Technologies, Inc.
- Anthony M. Gonzales
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Coatings for waterproofing electronic components
- Patent number 12,110,413
- Issue date Oct 8, 2024
- Henkel AG & Co. KGaA
- John L. Zimmerman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Waterproof electronic pen
- Patent number 12,111,986
- Issue date Oct 8, 2024
- Wacom Co., Ltd.
- Takayuki Arai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Polymer plastic front plate and method for manufacturing the same
- Patent number 12,109,587
- Issue date Oct 8, 2024
- ENFLEX CORPORATION
- Hsin Yuan Chen
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Shielding process for SIP packaging
- Patent number 12,107,053
- Issue date Oct 1, 2024
- Weifang Goertek Microelectronics Co., Ltd.
- Juncheng Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 12,089,349
- Issue date Sep 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conformal electromagnetic interference shielding film
- Patent number 12,069,845
- Issue date Aug 20, 2024
- Microsoft Technology Licensing, LLC
- Jaejin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Static dissipating coatings, electronic circuits comprising such co...
- Patent number 12,065,585
- Issue date Aug 20, 2024
- The Boeing Company
- Patrick John Kinlen
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
System and method for monitoring conditions of a subject based on w...
- Patent number 12,053,302
- Issue date Aug 6, 2024
- Peerbridge Health, Inc.
- Angelo Joseph Acquista
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Smart ring and methods for manufacturing
- Patent number 12,052,816
- Issue date Jul 30, 2024
- Ouraring Inc.
- Denis Mars
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing a number of electrical nodes, electrical n...
- Patent number 12,052,829
- Issue date Jul 30, 2024
- TACTOTEK OY
- Tomi Simula
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically-isolated and moisture-resistant designs for wearable d...
- Patent number 12,029,553
- Issue date Jul 9, 2024
- Verily Life Sciences LLC
- Mandy Philippine
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D-printed, PCB composite structures, and formation methods
- Patent number 12,035,465
- Issue date Jul 9, 2024
- Continental Automotive Systems, Inc.
- Stanton F Rak
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Camera module and array camera module based on integral packaging t...
- Patent number 12,035,029
- Issue date Jul 9, 2024
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with stress reduction design and method for f...
- Patent number 12,035,475
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical device having heat dissipation structure using filler an...
- Patent number 12,028,985
- Issue date Jul 2, 2024
- SOLUM CO., LTD.
- Jun Kyu Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with stacked passive components
- Patent number 12,022,618
- Issue date Jun 25, 2024
- Western Digital Technologies, Inc.
- Chien Te Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module
- Patent number 12,016,112
- Issue date Jun 18, 2024
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extensible and contractible mounting board
- Patent number 12,016,117
- Issue date Jun 18, 2024
- Murata Manufacturing Co., Ltd.
- Takahito Tomoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,004,301
- Issue date Jun 4, 2024
- Dongwoo Fine-Chem Co., Ltd.
- Ki Joon Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vacuum injection molding for optoelectronic modules
- Patent number 11,996,505
- Issue date May 28, 2024
- ams Sensors Singapore Pte. Ltd.
- Ji Wang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
PACKAGING METHOD AND PACKAGING DEVICE FOR PCBA BOARD
- Publication number 20240431033
- Publication date Dec 26, 2024
- KONIG ELECTRONIC TECHNOLOGY CO., LTD
- Jianxiao ZHU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Polymer Plastic Front Plate And Method For Manufacturing The Same
- Publication number 20240424528
- Publication date Dec 26, 2024
- Enflex Corporation
- Hsin Yuan Chen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
WATERPROOF ELECTRONIC PEN
- Publication number 20240427435
- Publication date Dec 26, 2024
- WACOM CO., LTD.
- Takayuki Arai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DESIGN OF A RECYCLABLE ELECTRONIC DEVICE
- Publication number 20240431037
- Publication date Dec 26, 2024
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Stephan HARKEMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...
- Publication number 20240422914
- Publication date Dec 19, 2024
- Mitsubishi Electric Corporation
- Yosuke NAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY-ISOLATED AND MOISTURE-RESISTANT DESIGNS FOR WEARABLE D...
- Publication number 20240398288
- Publication date Dec 5, 2024
- Verily Life Sciences LLC
- Mandy Philippine
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SYSTEM AND METHOD FOR MONITORING CONDITIONS OF A SUBJECT BASED ON W...
- Publication number 20240398347
- Publication date Dec 5, 2024
- Peerbridge Health, Inc.
- Angelo Joseph Acquista
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
ELECTRONIC DEVICE AND METHOD TO PRODUCE ELECTRONIC DEVICE
- Publication number 20240389244
- Publication date Nov 21, 2024
- Darwin Precisions Corporation
- Keng-Kuei Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED IN A CAVITY OF A CORE...
- Publication number 20240373561
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Jung Won PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONFORMAL ELECTROMAGNETIC INTERFERENCE SHIELDING FILM
- Publication number 20240373608
- Publication date Nov 7, 2024
- Microsoft Technology Licensing, LLC
- Jaejin LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wireless Golf Ball Method of Manufacture
- Publication number 20240359062
- Publication date Oct 31, 2024
- Graff Golf LLC
- Eric Goodchild
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR PACKAGE WITH STRESS REDUCTION DE...
- Publication number 20240334608
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Kuei HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL DEVICE HAVING HEAT DISSIPATION STRUCTURE USING FILLER AN...
- Publication number 20240334614
- Publication date Oct 3, 2024
- SOLUM CO., LTD.
- Jun Kyu Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SUPPLY DEVICE AND PRODUCTION METHOD THEREOF
- Publication number 20240314958
- Publication date Sep 19, 2024
- Shimadzu Corporation
- Masafumi TSUJI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPLANTABLE MEDICAL DEVICE CASE FIT WITH SELECTIVE ENCAPSULATION
- Publication number 20240306310
- Publication date Sep 12, 2024
- Cardiac Pacemakers, Inc.
- Benjamin J. Haasl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYER FOR AN ELECTRICAL DEVICE
- Publication number 20240306309
- Publication date Sep 12, 2024
- Honeywell International Inc.
- Sandeep Laxman MAUT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTUING ELECTRONIC DEVICES
- Publication number 20240292547
- Publication date Aug 29, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Shaun Bowers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB STACK WITH EMBEDDED COMPONENT PACKAGE AND SINTERED VIAS
- Publication number 20240276637
- Publication date Aug 15, 2024
- Microchip Technology Caldicot Limited
- George Taylor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SUPPLY MODULE AND METHOD OF ASSEMBLY
- Publication number 20240276649
- Publication date Aug 15, 2024
- Advanced Energy Industries, Inc.
- Antonios Tzimas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING A BATTERY SENSOR
- Publication number 20240274895
- Publication date Aug 15, 2024
- Xin HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240244762
- Publication date Jul 18, 2024
- IBIDEN CO., LTD.
- Nobuhisa KURODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY WITH MULTIPLE CONDUCTION PATHS
- Publication number 20240244739
- Publication date Jul 18, 2024
- Milwaukee Electric Tool Corporation
- Joshua D. Widder
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, AND LIGHT EMITTING...
- Publication number 20240237232
- Publication date Jul 11, 2024
- HANNSTAR DISPLAY CORPORATION
- Pei-Hao Hung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240215202
- Publication date Jun 27, 2024
- TMY Technology Inc.
- Pei-Hung Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20240206077
- Publication date Jun 20, 2024
- FUJIFILM CORPORATION
- Norihide SHIMOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND APPARATUS
- Publication number 20240194390
- Publication date Jun 13, 2024
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT BOARD MODULE AND METHOD FOR MANUFACTURING SAME
- Publication number 20240188218
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Yonglak CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATERIAL DEPOSITION APPARATUS AND METHOD
- Publication number 20240188223
- Publication date Jun 6, 2024
- Intel Corporation
- Zhixin XIE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LARGE AREA MONITORING APPARATUS
- Publication number 20240179833
- Publication date May 30, 2024
- WIT CORPORATION
- Jae Hwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIDING LAWN MOWER
- Publication number 20240172588
- Publication date May 30, 2024
- Nanjing Chervon Industry Co., Ltd.
- Zhen Wang
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING

for encapsulating mounted components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device with multilayer laminate

Electronic assemblies including a conformal moisture barrier

Wafer level bump stack for chip scale package

Electronic module

Motor housing for a riding lawn mower

Method for forming a protective film on an electronic module

Coatings for waterproofing electronic components

Lighting system with lens assembly

Encapsulated printed circuit board and a method of encapsulating a...

Mouth guard having user-notification feature of impact force

Coatings for waterproofing electronic components

Waterproof electronic pen

Polymer plastic front plate and method for manufacturing the same

Shielding process for SIP packaging

Semiconductor device package and method of manufacturing the same

Conformal electromagnetic interference shielding film

Static dissipating coatings, electronic circuits comprising such co...

System and method for monitoring conditions of a subject based on w...

Smart ring and methods for manufacturing

Method for manufacturing a number of electrical nodes, electrical n...

Electrically-isolated and moisture-resistant designs for wearable d...

3D-printed, PCB composite structures, and formation methods

Camera module and array camera module based on integral packaging t...

Semiconductor package with stress reduction design and method for f...

Electrical device having heat dissipation structure using filler an...

Printed circuit board with stacked passive components

Electronic module

Extensible and contractible mounting board

Circuit board

Vacuum injection molding for optoelectronic modules

Patents Applicationslast 30 patents

PACKAGING METHOD AND PACKAGING DEVICE FOR PCBA BOARD

Polymer Plastic Front Plate And Method For Manufacturing The Same

WATERPROOF ELECTRONIC PEN

DESIGN OF A RECYCLABLE ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFA...

ELECTRICALLY-ISOLATED AND MOISTURE-RESISTANT DESIGNS FOR WEARABLE D...

SYSTEM AND METHOD FOR MONITORING CONDITIONS OF A SUBJECT BASED ON W...

ELECTRONIC DEVICE AND METHOD TO PRODUCE ELECTRONIC DEVICE

SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED IN A CAVITY OF A CORE...

CONFORMAL ELECTROMAGNETIC INTERFERENCE SHIELDING FILM

Wireless Golf Ball Method of Manufacture

METHOD FOR FORMING A SEMICONDUCTOR PACKAGE WITH STRESS REDUCTION DE...

ELECTRICAL DEVICE HAVING HEAT DISSIPATION STRUCTURE USING FILLER AN...

POWER SUPPLY DEVICE AND PRODUCTION METHOD THEREOF

IMPLANTABLE MEDICAL DEVICE CASE FIT WITH SELECTIVE ENCAPSULATION

BARRIER LAYER FOR AN ELECTRICAL DEVICE

ELECTRONIC DEVICES AND METHODS OF MANUFACTUING ELECTRONIC DEVICES

PCB STACK WITH EMBEDDED COMPONENT PACKAGE AND SINTERED VIAS

POWER SUPPLY MODULE AND METHOD OF ASSEMBLY

METHOD OF MAKING A BATTERY SENSOR

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD ASSEMBLY WITH MULTIPLE CONDUCTION PATHS

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, AND LIGHT EMITTING...

PACKAGE STRUCTURE

MANUFACTURING METHOD OF ELECTRONIC DEVICE

POWER MODULE AND APPARATUS

CIRCUIT BOARD MODULE AND METHOD FOR MANUFACTURING SAME

MATERIAL DEPOSITION APPARATUS AND METHOD

LARGE AREA MONITORING APPARATUS

RIDING LAWN MOWER