for etching

Industry

CPC
H01L21/67063

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/67063for etching

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integrated substrate measurement system to improve manufacturing pr...
- Patent number 12,136,557
- Issue date Nov 5, 2024
- Applied Materials, Inc.
- Upendra V. Ummethala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrapure water supply apparatus, substrate processing system inclu...
- Patent number 12,122,702
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Jongha Yun
- B08 - CLEANING
Information Patent Grant
Method of manufacturing semiconductor fabrication system
- Patent number 12,086,505
- Issue date Sep 10, 2024
- Samsung Electronics Co., Ltd.
- Seora Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Plasma processing apparatus, and temperature control method
- Patent number 12,063,717
- Issue date Aug 13, 2024
- Tokyo Electron Limited
- Shinsuke Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inner wall and substrate processing apparatus
- Patent number 12,040,198
- Issue date Jul 16, 2024
- Tokyo Electron Limited
- Yuji Asakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor fabrication system embedded with effective baking module
- Patent number 12,033,863
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Han-Yu Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 12,029,032
- Issue date Jul 2, 2024
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic coated quartz lid for processing chamber
- Patent number 12,009,178
- Issue date Jun 11, 2024
- Applied Materials, Inc.
- Bernard L. Hwang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing method and film forming system
- Patent number 11,984,319
- Issue date May 14, 2024
- Tokyo Electron Limited
- Kensaku Narushima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processing apparatus
- Patent number 11,967,511
- Issue date Apr 23, 2024
- Tokyo Electron Limited
- Akira Ishikawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Showerhead device for semiconductor processing system
- Patent number 11,948,813
- Issue date Apr 2, 2024
- ASM IP Holding B.V.
- Tom E. Blomberg
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing semiconductor device having hybrid bonding...
- Patent number 11,894,247
- Issue date Feb 6, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and manufacturing method of the semicon...
- Patent number 11,812,615
- Issue date Nov 7, 2023
- SK hynix Inc.
- Nam Jae Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for processing a workpiece using a multi-cycle thermal treat...
- Patent number 11,764,072
- Issue date Sep 19, 2023
- BEIJING E-TOWN SEMICONDUCTOR TECHNOLOGY, CO., LTD
- Michael X. Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer processing apparatus
- Patent number 11,749,557
- Issue date Sep 5, 2023
- ZEUS CO., LTD.
- Jiho Park
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method of removing phosphorus-doped silicon film and system therefor
- Patent number 11,749,530
- Issue date Sep 5, 2023
- Tokyo Electron Limited
- Yoshihiro Takezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck
- Patent number 11,735,459
- Issue date Aug 22, 2023
- MiCo Ceramics Ltd.
- Mina Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck and wafer etching device including the same
- Patent number 11,728,198
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Myoung-Soo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Designer atomic layer etching
- Patent number 11,721,558
- Issue date Aug 8, 2023
- Lam Research Corporation
- Keren Jacobs Kanarik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chamber apparatus
- Patent number 11,721,565
- Issue date Aug 8, 2023
- Samsung Electronics Co., Ltd.
- Yong Jun Choi
- B08 - CLEANING
Information Patent Grant
Integrated substrate measurement system to improve manufacturing pr...
- Patent number 11,688,616
- Issue date Jun 27, 2023
- Applied Materials, Inc.
- Upendra V. Ummethala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Retaining ring for CMP
- Patent number 11,673,226
- Issue date Jun 13, 2023
- Applied Materials, Inc.
- Andrew J. Nagengast
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus
- Patent number 11,664,243
- Issue date May 30, 2023
- Samsung Electronics Co., Ltd.
- Sang-jine Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of selectively forming n-type doped material on a surface,...
- Patent number 11,646,205
- Issue date May 9, 2023
- ASM IP Holding B.V.
- Rami Khazaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,631,684
- Issue date Apr 18, 2023
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for analyzing a semiconductor device
- Patent number 11,626,306
- Issue date Apr 11, 2023
- SK hynix Inc.
- Jin Hee Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method, and tool of manufacture
- Patent number 11,621,342
- Issue date Apr 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih Hung Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Structures with doped semiconductor layers and methods and systems...
- Patent number 11,594,600
- Issue date Feb 28, 2023
- ASM IP Holding B.V.
- Lucas Petersen Barbosa Lima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate treating apparatus and substrate treating method
- Patent number 11,594,421
- Issue date Feb 28, 2023
- Semes Co., Ltd.
- Youngil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Platform and method of operating for integrated end-to-end fully se...
- Patent number 11,594,451
- Issue date Feb 28, 2023
- Tokyo Electron Limited
- Robert Clark
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, METHOD AND TOOL OF MANUFACTURE
- Publication number 20240387227
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE THICKNESS MEASURING DEVICE, SUBSTRATE PROCESSING SYSTEM,...
- Publication number 20240369339
- Publication date Nov 7, 2024
- TOKYO ELECTRON LIMITED
- Teruhiko MORIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20240355647
- Publication date Oct 24, 2024
- TOKYO ELECTRON LIMITED
- Takashi UNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR FABRICATION SYSTEM EMBEDDED WITH EFFECTIVE BAKING MODULE
- Publication number 20240347345
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Han-Yu Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF PERFORMING MAINTENANCE ON SUBSTRATE PROCESSING APPARATUS,...
- Publication number 20240339307
- Publication date Oct 10, 2024
- TOKYO ELECTRON LIMITED
- Yuya MINOURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHOWERHEAD DEVICE FOR SEMICONDUCTOR PROCESSING SYSTEM
- Publication number 20240332039
- Publication date Oct 3, 2024
- ASM IP HOLDING B.V.
- Tom E. Blomberg
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Inner Wall and substrate Processing Apparatus
- Publication number 20240321602
- Publication date Sep 26, 2024
- TOKYO ELECTRON LIMITED
- Yuji ASAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20240315018
- Publication date Sep 19, 2024
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCHEMICAL-ADDITIVE MANUFACTURING SYSTEMS WITH PROTECTED ELECT...
- Publication number 20240304440
- Publication date Sep 12, 2024
- FABRIC8LABS, INC.
- Ryan Nicholl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Circuitry And Methods Used In Forming Memory Circuitry
- Publication number 20240268118
- Publication date Aug 8, 2024
- Micron Technology, Inc.
- Darwin A. Clampitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SACRIFICIAL LAYER FOR FORMING MERGED HIGH ASPECT RATIO CONTACTS IN...
- Publication number 20240090213
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Jialiang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS
- Publication number 20240047258
- Publication date Feb 8, 2024
- Hitachi High-Tech Corporation
- Tomoyuki Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET CLEAN APPARATUS FOR SINGLE WAFER
- Publication number 20240038552
- Publication date Feb 1, 2024
- Shanghai Huali Integrated Circuit Corporation
- Wenqian XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ETCHING APPARATUS
- Publication number 20240021460
- Publication date Jan 18, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Faming ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING SYSTEM FOR FABRICATING SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20230420273
- Publication date Dec 28, 2023
- NANYA TECHNOLOGY CORPORATION
- TZU-CHING TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TREATING METHOD AND SUBSTRATE TREATING APPARATUS
- Publication number 20230395399
- Publication date Dec 7, 2023
- SEMES CO., LTD.
- Ki Yung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF IN-SITU SELECTIVE METAL REMOVAL VIA GRADIENT OXIDATION FO...
- Publication number 20230343644
- Publication date Oct 26, 2023
- Applied Materials, Inc.
- Chih-Hsun HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHAMBER APPARATUS
- Publication number 20230343613
- Publication date Oct 26, 2023
- Samsung Electronics Co., Ltd.
- Yong Jun CHOI
- B08 - CLEANING
Information Patent Application
INTEGRATED SUBSTRATE MEASUREMENT SYSTEM TO IMPROVE MANUFACTURING PR...
- Publication number 20230326773
- Publication date Oct 12, 2023
- Applied Materials, Inc.
- Upendra V. Ummethala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID PATTERNING-BONDING SEMICONDUCTOR TOOL
- Publication number 20230326814
- Publication date Oct 12, 2023
- TOKYO ELECTRON LIMITED
- Anthony R. SCHEPIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR FABRICATION SYSTEM
- Publication number 20230306146
- Publication date Sep 28, 2023
- Samsung Electronics Co., Ltd.
- SEORA PARK
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ETCHING METHOD, ETCHING APPARATUS, MANUFACTURING METHOD OF SEMICOND...
- Publication number 20230307233
- Publication date Sep 28, 2023
- KIOXIA Corporation
- Noriko Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20230209822
- Publication date Jun 29, 2023
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR CONTROLLING MOISTURE IN SEMICONDUCTOR PROCE...
- Publication number 20230197472
- Publication date Jun 22, 2023
- ASM IP HOLDING, B.V.
- Joseph Kraus
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STRUCTURES WITH DOPED SEMICONDUCTOR LAYERS AND METHODS AND SYSTEMS...
- Publication number 20230197792
- Publication date Jun 22, 2023
- ASM IP HOLDING B.V.
- Lucas Petersen Barbosa Lima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Processing Apparatus, Substrate Processing Method, Method...
- Publication number 20230191449
- Publication date Jun 22, 2023
- Kokusai Electric Corporation
- Satoshi TAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Reducing Surface Roughness
- Publication number 20230197441
- Publication date Jun 22, 2023
- SPTS TECHNOLOGIES LIMITED
- Roland Mumford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Improving Stability of Etching Rate of Etching Chamber
- Publication number 20230162995
- Publication date May 25, 2023
- SHANGHAI HUALI MICROELECTRONICS CORPORATION
- Kaiqu Ang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20230134436
- Publication date May 4, 2023
- TOKYO ELECTRON LIMITED
- Shinya ISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEVEL ETCHER USING ATMOSPHERIC PLASMA
- Publication number 20230129291
- Publication date Apr 27, 2023
- ASM IP HOLDING B.V.
- Yoshio Susa
- H01 - BASIC ELECTRIC ELEMENTS

for etching

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated substrate measurement system to improve manufacturing pr...

Ultrapure water supply apparatus, substrate processing system inclu...

Method of manufacturing semiconductor fabrication system

Plasma processing apparatus, and temperature control method

Inner wall and substrate processing apparatus

Semiconductor fabrication system embedded with effective baking module

Integrated assemblies and methods of forming integrated assemblies

Ceramic coated quartz lid for processing chamber

Substrate processing method and film forming system

Plasma processing apparatus

Showerhead device for semiconductor processing system

Method of manufacturing semiconductor device having hybrid bonding...

Semiconductor memory device and manufacturing method of the semicon...

Method for processing a workpiece using a multi-cycle thermal treat...

Wafer processing apparatus

Method of removing phosphorus-doped silicon film and system therefor

Electrostatic chuck

Electrostatic chuck and wafer etching device including the same

Designer atomic layer etching

Multi-chamber apparatus

Integrated substrate measurement system to improve manufacturing pr...

Retaining ring for CMP

Substrate processing apparatus

Methods of selectively forming n-type doped material on a surface,...

Integrated assemblies and methods of forming integrated assemblies

Method for analyzing a semiconductor device

Semiconductor device, method, and tool of manufacture

Structures with doped semiconductor layers and methods and systems...

Substrate treating apparatus and substrate treating method

Platform and method of operating for integrated end-to-end fully se...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, METHOD AND TOOL OF MANUFACTURE

SUBSTRATE THICKNESS MEASURING DEVICE, SUBSTRATE PROCESSING SYSTEM,...

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM

SEMICONDUCTOR FABRICATION SYSTEM EMBEDDED WITH EFFECTIVE BAKING MODULE

METHOD OF PERFORMING MAINTENANCE ON SUBSTRATE PROCESSING APPARATUS,...

SHOWERHEAD DEVICE FOR SEMICONDUCTOR PROCESSING SYSTEM

Inner Wall and substrate Processing Apparatus

Integrated Assemblies and Methods of Forming Integrated Assemblies

ELECTROCHEMICAL-ADDITIVE MANUFACTURING SYSTEMS WITH PROTECTED ELECT...

Memory Circuitry And Methods Used In Forming Memory Circuitry

SACRIFICIAL LAYER FOR FORMING MERGED HIGH ASPECT RATIO CONTACTS IN...

PLASMA PROCESSING APPARATUS

WET CLEAN APPARATUS FOR SINGLE WAFER

SEMICONDUCTOR ETCHING APPARATUS

ETCHING SYSTEM FOR FABRICATING SEMICONDUCTOR DEVICE STRUCTURE

SUBSTRATE TREATING METHOD AND SUBSTRATE TREATING APPARATUS

METHOD OF IN-SITU SELECTIVE METAL REMOVAL VIA GRADIENT OXIDATION FO...

MULTI-CHAMBER APPARATUS

INTEGRATED SUBSTRATE MEASUREMENT SYSTEM TO IMPROVE MANUFACTURING PR...

HYBRID PATTERNING-BONDING SEMICONDUCTOR TOOL

METHOD OF MANUFACTURING SEMICONDUCTOR FABRICATION SYSTEM

ETCHING METHOD, ETCHING APPARATUS, MANUFACTURING METHOD OF SEMICOND...

Integrated Assemblies and Methods of Forming Integrated Assemblies

SYSTEMS AND METHODS FOR CONTROLLING MOISTURE IN SEMICONDUCTOR PROCE...

STRUCTURES WITH DOPED SEMICONDUCTOR LAYERS AND METHODS AND SYSTEMS...

Substrate Processing Apparatus, Substrate Processing Method, Method...

Method of Reducing Surface Roughness

Method for Improving Stability of Etching Rate of Etching Chamber

PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

BEVEL ETCHER USING ATMOSPHERIC PLASMA