for shaped solder piece feeding

Industry

CPC
B23K3/0623

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B23Machine tools B23KSOLDERING OR UNSOLDERING WELDING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY B23K3/00Tools, devices, or special appurtenances for soldering

Current Industry

B23K3/0623for shaped solder piece feeding

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor wafer and method of ball drop on thin wafer with edge...
- Patent number 12,154,877
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual-type solder ball placement system
- Patent number 12,151,315
- Issue date Nov 26, 2024
- S.S.P. INC.
- Kyouho Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of applying solid brazing material, method of producing coat...
- Patent number 12,115,601
- Issue date Oct 15, 2024
- HARIMA CHEMICALS, INCORPORATED
- Satoshi Moriya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder supply unit, solder piece manufacturing device, part mountin...
- Patent number 12,083,626
- Issue date Sep 10, 2024
- HIRATA CORPORATION
- Toshiomi Ikeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vacuum-assisted BGA joint formation
- Patent number 11,963,307
- Issue date Apr 16, 2024
- International Business Machines Corporation
- Matthew Doyle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Varied ball ball-grid-array (BGA) packages
- Patent number 11,916,003
- Issue date Feb 27, 2024
- Intel Corporation
- Xiao Lu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux tool using elastic pad
- Patent number 11,850,683
- Issue date Dec 26, 2023
- S.S.P. INC.
- Kyouho Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro solder joint and stencil aperture design
- Patent number 11,839,031
- Issue date Dec 5, 2023
- Western Digital Technologies, Inc.
- John Patrick Burke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reliable transportation mechanism for micro solder balls
- Patent number 11,780,022
- Issue date Oct 10, 2023
- Western Digital Technologies, Inc.
- Yusuke Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for providing an interface on a printed circuit...
- Patent number 11,731,207
- Issue date Aug 22, 2023
- Eagle Technology, LLC
- Michael T. De Roy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-temperature superconducting striated tape combinations
- Patent number 11,711,983
- Issue date Jul 25, 2023
- The Government of the United States of America, as represented by the Secreta...
- Joseph C. Prestigiacomo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of applying conductive adhesive and manufacturing device usi...
- Patent number 11,626,295
- Issue date Apr 11, 2023
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing plate-shaped solder and manufacturing device
- Patent number 11,618,111
- Issue date Apr 4, 2023
- Mitsubishi Electric Corporation
- Shuji Uozumi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball feeding device
- Patent number 11,618,094
- Issue date Apr 4, 2023
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for providing an interface on a printed circuit...
- Patent number 11,602,800
- Issue date Mar 14, 2023
- Eagle Technology, LLC
- Michael T. De Roy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication of high-temperature superconducting striated tape combi...
- Patent number 11,600,762
- Issue date Mar 7, 2023
- The Government of the United States of America, as represented by the Secreta...
- Joseph C. Prestigiacomo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder member mounting system
- Patent number 11,583,948
- Issue date Feb 21, 2023
- Samsung Electronics Co., Ltd.
- Soo-Hwan Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming electrical connections with solder dispensing and...
- Patent number 11,541,471
- Issue date Jan 3, 2023
- Seagate Technology LLC
- Aaron Collins
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball disposition system, method of disposing a ball on a substrate...
- Patent number 11,488,928
- Issue date Nov 1, 2022
- Samsung Electronics Co., Ltd.
- Sukmin Oh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple module chip manufacturing arrangement
- Patent number 11,440,117
- Issue date Sep 13, 2022
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Automated wire processing system
- Patent number 11,322,278
- Issue date May 3, 2022
- The Boeing Company
- John Porter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder member mounting method and system
- Patent number 11,278,979
- Issue date Mar 22, 2022
- Samsung Electronics Co., Ltd.
- Soo-Hwan Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for discharging fluid
- Patent number 11,259,415
- Issue date Feb 22, 2022
- Senju Metal Industry Co., Ltd.
- Hideki Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluidization of agglomerated solder microspheres
- Patent number 11,247,285
- Issue date Feb 15, 2022
- Seagate Technology LLC
- Aaron Collins
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for the separate application of solder material deposits
- Patent number 11,224,928
- Issue date Jan 18, 2022
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for manufacturing plate solder and method for manufacturing...
- Patent number 11,213,921
- Issue date Jan 4, 2022
- Mitsubishi Electric Corporation
- Shuji Uozumi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for establishing a wire connection as well as a c...
- Patent number 11,217,558
- Issue date Jan 4, 2022
- PAC Tech-Packaging Technologies GmbH
- Andrej Kolbasow
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste feeding assembly and method
- Patent number 11,173,562
- Issue date Nov 16, 2021
- Illinois Tool Works Inc.
- Ning Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor wafer and method of ball drop on thin wafer with edge...
- Patent number 11,164,835
- Issue date Nov 2, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of applying conductive adhesive and manufacturing device usi...
- Patent number 11,018,028
- Issue date May 25, 2021
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SINGLE-HEAD TIN BALL IMPLANTATION SPRAY HEAD
- Publication number 20250018491
- Publication date Jan 16, 2025
- DONGGUAN D-TEK TECHNOLOGY CO., LTD.
- Houyong LUO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER SUPPLY UNIT, SOLDER PIECE MANUFACTURING DEVICE, PART MOUNTIN...
- Publication number 20240383061
- Publication date Nov 21, 2024
- HIRATA CORPORATION
- Toshiomi IKEDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BALL ATTACHMENT APPARATUS
- Publication number 20240207961
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BALL SUPPLY DEVICE AND SOLDER BALL SUPPLY METHOD
- Publication number 20240165727
- Publication date May 23, 2024
- FUJI CORPORATION
- Yuji KAWASAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES
- Publication number 20240162134
- Publication date May 16, 2024
- Intel Corporation
- Xiao LU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
QUALITY DETERMINATION DEVICE AND QUALITY DETERMINATION METHOD
- Publication number 20240149363
- Publication date May 9, 2024
- FUJI CORPORATION
- Seijiro HAGI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser-Assisted Soldering Apparatus
- Publication number 20240109144
- Publication date Apr 4, 2024
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BALL ATTACHING APPARATUS
- Publication number 20240071983
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Bongken YU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO SOLDER JOINT AND STENCIL APERTURE DESIGN
- Publication number 20240057261
- Publication date Feb 15, 2024
- Western Digital Technologies, Inc.
- John Patrick Burke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAD ASSEMBLY FOR MOUNTING CONDUCTIVE BALL
- Publication number 20240009747
- Publication date Jan 11, 2024
- PROTEC CO., LTD.
- Youn Sung Ko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO SOLDER JOINT AND STENCIL APERTURE DESIGN
- Publication number 20230328892
- Publication date Oct 12, 2023
- Western Digital Technologies, Inc.
- John Patrick Burke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR MOUNTING SOLDER BALLS
- Publication number 20230187228
- Publication date Jun 15, 2023
- Samsung Electronics Co., Ltd.
- Young-Ja KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING AN INTERFACE ON A PRINTED CIRCUIT...
- Publication number 20230121381
- Publication date Apr 20, 2023
- Eagle Technology, LLC
- Michael T. De Roy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER SOLDERING DEVICE APPLYING MULTI NOZZLE AND THE METHOD THEREOF
- Publication number 20230120590
- Publication date Apr 20, 2023
- LASERVALL TECHNOLOGY CO., LTD.
- Byoung Chan CHOI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser-assisted Soldering Apparatus and Solder Deposition Machine
- Publication number 20230105144
- Publication date Apr 6, 2023
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Press-Forming Device for Depositing Solder and Producing Individual...
- Publication number 20230105729
- Publication date Apr 6, 2023
- Pac Tech - Packaging Technologies GmbH
- Andrej Kolbasow
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR CONTROLLING BOAT/STRIP TYPE SOLDER BALL PLACEMENT SYSTEM
- Publication number 20230086461
- Publication date Mar 23, 2023
- S.S.P. INC.
- Kyouho LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUX TOOL USING ELASTIC PAD
- Publication number 20230087608
- Publication date Mar 23, 2023
- S.S.P. INC.
- Kyouho LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL-TYPE SOLDER BALL PLACEMENT SYSTEM
- Publication number 20230088097
- Publication date Mar 23, 2023
- S.S.P. INC.
- Kyouho LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
High-Temperature Superconducting Striated Tape Combinations
- Publication number 20230081740
- Publication date Mar 16, 2023
- The Government of the United States of America, as represented by the Secreta...
- Joseph C. Prestigiacomo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-Free and Antimony-Free Solder Alloy, Solder Ball, and Solder J...
- Publication number 20230060857
- Publication date Mar 2, 2023
- SENJU METAL INDUSTRY CO., LTD.
- Yuuki IIJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VACUUM-ASSISTED BGA JOINT FORMATION
- Publication number 20220322540
- Publication date Oct 6, 2022
- International Business Machines Corporation
- Matthew Doyle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER MEMBER MOUNTING SYSTEM
- Publication number 20220152718
- Publication date May 19, 2022
- Samsung Electronics Co., Ltd.
- Soo-Hwan LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF APPLYING SOLID BRAZING MATERIAL, METHOD OF PRODUCING COAT...
- Publication number 20220118540
- Publication date Apr 21, 2022
- HARIMA CHEMICALS, INCORPORATED
- Satoshi MORIYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...
- Publication number 20220028812
- Publication date Jan 27, 2022
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Assembly and Method for Applying Solder Balls to a Substrate
- Publication number 20210379683
- Publication date Dec 9, 2021
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF APPLYING CONDUCTIVE ADHESIVE AND MANUFACTURING DEVICE USI...
- Publication number 20210280436
- Publication date Sep 9, 2021
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BALL DISPOSITION SYSTEM, METHOD OF DISPOSING A BALL ON A SUBSTRATE...
- Publication number 20210249378
- Publication date Aug 12, 2021
- Samsung Electronics Co., Ltd.
- SUKMIN OH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR DISCHARGING FLUID
- Publication number 20210144863
- Publication date May 13, 2021
- SENJU METAL INDUSTRY CO., LTD.
- Hideki NAKAMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
A SOLDER PASTE FEEDING ASSEMBLY AND METHOD
- Publication number 20210129248
- Publication date May 6, 2021
- Illinois Tool Works Inc.
- Ning Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

for shaped solder piece feeding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor wafer and method of ball drop on thin wafer with edge...

Dual-type solder ball placement system

Method of applying solid brazing material, method of producing coat...

Solder supply unit, solder piece manufacturing device, part mountin...

Vacuum-assisted BGA joint formation

Varied ball ball-grid-array (BGA) packages

Flux tool using elastic pad

Micro solder joint and stencil aperture design

Reliable transportation mechanism for micro solder balls

Systems and methods for providing an interface on a printed circuit...

High-temperature superconducting striated tape combinations

Method of applying conductive adhesive and manufacturing device usi...

Method of manufacturing plate-shaped solder and manufacturing device

Solder ball feeding device

Systems and methods for providing an interface on a printed circuit...

Fabrication of high-temperature superconducting striated tape combi...

Solder member mounting system

Method of forming electrical connections with solder dispensing and...

Ball disposition system, method of disposing a ball on a substrate...

Multiple module chip manufacturing arrangement

Automated wire processing system

Solder member mounting method and system

Method for discharging fluid

Fluidization of agglomerated solder microspheres

Device for the separate application of solder material deposits

Device for manufacturing plate solder and method for manufacturing...

Method and device for establishing a wire connection as well as a c...

Solder paste feeding assembly and method

Semiconductor wafer and method of ball drop on thin wafer with edge...

Method of applying conductive adhesive and manufacturing device usi...

Patents Applicationslast 30 patents

SINGLE-HEAD TIN BALL IMPLANTATION SPRAY HEAD

SOLDER SUPPLY UNIT, SOLDER PIECE MANUFACTURING DEVICE, PART MOUNTIN...

BALL ATTACHMENT APPARATUS

SOLDER BALL SUPPLY DEVICE AND SOLDER BALL SUPPLY METHOD

VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES

QUALITY DETERMINATION DEVICE AND QUALITY DETERMINATION METHOD

Laser-Assisted Soldering Apparatus

SOLDER BALL ATTACHING APPARATUS

MICRO SOLDER JOINT AND STENCIL APERTURE DESIGN

HEAD ASSEMBLY FOR MOUNTING CONDUCTIVE BALL

MICRO SOLDER JOINT AND STENCIL APERTURE DESIGN

APPARATUS FOR MOUNTING SOLDER BALLS

SYSTEMS AND METHODS FOR PROVIDING AN INTERFACE ON A PRINTED CIRCUIT...

LASER SOLDERING DEVICE APPLYING MULTI NOZZLE AND THE METHOD THEREOF

Laser-assisted Soldering Apparatus and Solder Deposition Machine

Press-Forming Device for Depositing Solder and Producing Individual...

METHOD FOR CONTROLLING BOAT/STRIP TYPE SOLDER BALL PLACEMENT SYSTEM

FLUX TOOL USING ELASTIC PAD

DUAL-TYPE SOLDER BALL PLACEMENT SYSTEM

High-Temperature Superconducting Striated Tape Combinations

Lead-Free and Antimony-Free Solder Alloy, Solder Ball, and Solder J...

VACUUM-ASSISTED BGA JOINT FORMATION

SOLDER MEMBER MOUNTING SYSTEM

METHOD OF APPLYING SOLID BRAZING MATERIAL, METHOD OF PRODUCING COAT...

SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...

Assembly and Method for Applying Solder Balls to a Substrate

METHOD OF APPLYING CONDUCTIVE ADHESIVE AND MANUFACTURING DEVICE USI...

BALL DISPOSITION SYSTEM, METHOD OF DISPOSING A BALL ON A SUBSTRATE...

METHOD FOR DISCHARGING FLUID

A SOLDER PASTE FEEDING ASSEMBLY AND METHOD