for structures comprising one transistor one-capacitor memory cells

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H01L27/10847

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

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H01L27/10847for structures comprising one transistor one-capacitor memory cells

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional dynamic random-access memory array
- Patent number 11,690,210
- Issue date Jun 27, 2023
- Micron Technology, Inc.
- Vladimir Machkaoutsan
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device
- Patent number 11,670,673
- Issue date Jun 6, 2023
- Samsung Electronics Co., Ltd.
- Hyun-suk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded unified semiconductor chips and fabrication and operation me...
- Patent number 11,631,688
- Issue date Apr 18, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- G11 - INFORMATION STORAGE
Information Patent Grant
Devices having a transistor and a capacitor along a common horizont...
- Patent number 11,626,406
- Issue date Apr 11, 2023
- Micron Technology, Inc.
- Fredrick D. Fishburn
- G11 - INFORMATION STORAGE
Information Patent Grant
Apparatus comprising aluminum interconnections, memory devices comp...
- Patent number 11,587,870
- Issue date Feb 21, 2023
- Micron Technology, Inc.
- Shigeru Sugioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with multiple liners and method for...
- Patent number 11,581,216
- Issue date Feb 14, 2023
- NANYA TECHNOLOGY CORPORATION
- Yu-Han Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for manufacturing the same, and integr...
- Patent number 11,574,909
- Issue date Feb 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Yen Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device, and a photomask used therein
- Patent number 11,569,089
- Issue date Jan 31, 2023
- Micron Technology, Inc.
- Hidenori Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,563,009
- Issue date Jan 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jenn-Gwo Hwu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with embedded dynamic random-access...
- Patent number 11,551,753
- Issue date Jan 10, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of forming semiconductor device having capped air gaps betwe...
- Patent number 11,508,614
- Issue date Nov 22, 2022
- United Microelectronics Corp.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor memory device
- Patent number 11,502,084
- Issue date Nov 15, 2022
- Samsung Electronics Co., Ltd.
- Joongchan Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support pillars for vertical three-dimensional (3D) memory
- Patent number 11,476,254
- Issue date Oct 18, 2022
- Micron Technology, Inc.
- Yuichi Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial silicon within horizontal access devices in vertical thre...
- Patent number 11,469,232
- Issue date Oct 11, 2022
- Micron Technology, Inc.
- Si-Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,430,795
- Issue date Aug 30, 2022
- Samsung Electronics Co., Ltd.
- Hyewon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor, semiconductor device, and manufacturing method of semico...
- Patent number 11,380,688
- Issue date Jul 5, 2022
- Semiconductor Energy Laboratory Co., Ltd.
- Yuichi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate dielectric repair on three-node access device formation for ve...
- Patent number 11,329,051
- Issue date May 10, 2022
- Micron Technology, Inc.
- John A. Smythe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded unified semiconductor chips and fabrication and operation me...
- Patent number 11,302,706
- Issue date Apr 12, 2022
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Feedback 1T DRAM device having localized partial insulating layers
- Patent number 11,296,086
- Issue date Apr 5, 2022
- Gachon Univ. of Industry-Academic Co-op Foundation
- Seongjae Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory packages and methods of forming same
- Patent number 11,282,816
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic devices, and related microelectr...
- Patent number 11,257,766
- Issue date Feb 22, 2022
- Micron Technology, Inc.
- Russell A. Benson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and method of fabricating the same
- Patent number 11,205,652
- Issue date Dec 21, 2021
- Samsung Electronics Co., Ltd.
- Dongjun Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor devices and methods for fabricating the same
- Patent number 11,201,156
- Issue date Dec 14, 2021
- Samsung Electronics Co., Ltd.
- Chan-Sic Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrays of capacitors, methods used in forming integrated circuitry,...
- Patent number 11,195,838
- Issue date Dec 7, 2021
- Micron Technology, Inc.
- Scott L. Light
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices, methods of forming a device, and memory devices
- Patent number 11,127,745
- Issue date Sep 21, 2021
- Micron Technology, Inc.
- Kentaro Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked three-dimensional heterogeneous memory devices and methods...
- Patent number 11,056,454
- Issue date Jul 6, 2021
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays, and methods of forming memory arrays
- Patent number 11,004,494
- Issue date May 11, 2021
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic devices
- Patent number 10,985,165
- Issue date Apr 20, 2021
- Micron Technology, Inc.
- Si-Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device having vertical structure
- Patent number 10,937,788
- Issue date Mar 2, 2021
- Samsung Electronics Co., Ltd.
- Nam-gun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,903,308
- Issue date Jan 26, 2021
- Samsung Electronics Co., Ltd.
- Hyun-suk Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BOTTOM UP MOLYBDENUM GAPFILL
- Publication number 20240035149
- Publication date Feb 1, 2024
- Applied Materials, Inc.
- Rand Haddadin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING ISLAND STRUCTURE
- Publication number 20230422490
- Publication date Dec 28, 2023
- NANYA TECHNOLOGY CORPORATION
- CHEN-CHENG CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMATION METHOD THEREOF
- Publication number 20230389263
- Publication date Nov 30, 2023
- Changxin Memory Technologies, Inc.
- Xiaojie LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING WORD LINE EMBEDDED IN GATE TRENCH
- Publication number 20230189502
- Publication date Jun 15, 2023
- Micron Technology, Inc.
- Toshiyasu Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
U-SHAPED CHANNEL ACCESS TRANSISTORS AND METHODS FOR FORMING THE SAME
- Publication number 20230164989
- Publication date May 25, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yun-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH STACKED MEMORY DEVICES
- Publication number 20230163101
- Publication date May 25, 2023
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES HAVING VERTICAL TRANSISTORS AND METHODS FOR FORMING...
- Publication number 20230134556
- Publication date May 4, 2023
- Yangtze Memory Technologies Co., Ltd.
- Tao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230115443
- Publication date Apr 13, 2023
- SK HYNIX INC.
- Seung Hwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR MEMORY DEVICE, AND METHOD FOR M...
- Publication number 20230090044
- Publication date Mar 23, 2023
- KIOXIA Corporation
- Tomoki ISHIMARU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES INCLUDING CONTACTS IN A PERIPHERAL REGION AND METHODS F...
- Publication number 20230056343
- Publication date Feb 23, 2023
- Micron Technology, Inc.
- YUTAKA NAKAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE AND FORMING METHOD THEREOF
- Publication number 20230042535
- Publication date Feb 9, 2023
- CHANGXIN MEMORY TECHNOLOGIES,INC.
- Jingwen LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-SIDE REVEAL FOR POWER DELIVERY TO BACKEND MEMORY
- Publication number 20220415904
- Publication date Dec 29, 2022
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20220415895
- Publication date Dec 29, 2022
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Yi-Wang Jhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKEND MEMORY WITH AIR GAPS IN UPPER METAL LAYERS
- Publication number 20220406782
- Publication date Dec 22, 2022
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND INTEGR...
- Publication number 20220384447
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220367475
- Publication date Nov 17, 2022
- WINBOND ELECTRONICS CORP.
- Hung-Yu WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF SEMICO...
- Publication number 20220359523
- Publication date Nov 10, 2022
- Semiconductor Energy Laboratory Co., Ltd.
- Yuichi SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREPARING SEMICONDUCTOR DEVICE STRUCTURE WITH MULTIPLE L...
- Publication number 20220352011
- Publication date Nov 3, 2022
- NANYA TECHNOLOGY CORPORATION
- YU-HAN HSUEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH MULTIPLE LINERS AND METHOD FOR...
- Publication number 20220352009
- Publication date Nov 3, 2022
- NANYA TECHNOLOGY CORPORATION
- YU-HAN HSUEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20220310611
- Publication date Sep 29, 2022
- CHANIGXIN MEMORY TECHNOLOGIES, INC.
- Feng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR STORAGE DEVICE
- Publication number 20220302311
- Publication date Sep 22, 2022
- KIOXIA Corporation
- Hikari TAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY CELL STRUCTURE
- Publication number 20220302121
- Publication date Sep 22, 2022
- TOKYO ELECTRON LIMITED
- Paul GUTWIN
- G11 - INFORMATION STORAGE
Information Patent Application
EPITAXIAL SILICON WITHIN HORIZONTAL ACCESS DEVICES IN VERTICAL THRE...
- Publication number 20220254784
- Publication date Aug 11, 2022
- Micron Technology, Inc.
- Si-Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT PILLARS FOR VERTICAL THREE-DIMENSIONAL (3D) MEMORY
- Publication number 20220246618
- Publication date Aug 4, 2022
- Micron Technology, Inc.
- Yuichi Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY PACKAGES AND METHODS OF FORMING SAME
- Publication number 20220208735
- Publication date Jun 30, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, SEMICONDUCTOR MEMBER, AND METHOD FOR MANUFACT...
- Publication number 20220139439
- Publication date May 5, 2022
- UltraMemory Inc.
- Fumitake OKUTSU
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20220115382
- Publication date Apr 14, 2022
- Samsung Electronics Co., Ltd.
- Dongjun Lee
- G11 - INFORMATION STORAGE
Information Patent Application
CONDUCTIVE LINE CONTACT REGIONS HAVING MULTIPLE MULTI-DIRECTION CON...
- Publication number 20220108988
- Publication date Apr 7, 2022
- Micron Technology, Inc.
- Byung Yoon Kim
- G11 - INFORMATION STORAGE
Information Patent Application
BONDED UNIFIED SEMICONDUCTOR CHIPS AND FABRICATION AND OPERATION ME...
- Publication number 20220093614
- Publication date Mar 24, 2022
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE DIELECTRIC REPAIR ON THREE-NODE ACCESS DEVICE FORMATION FOR VE...
- Publication number 20220068933
- Publication date Mar 3, 2022
- Micron Technology, Inc.
- John A. Smythe III
- G11 - INFORMATION STORAGE

for structures comprising one transistor one-capacitor memory cells

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Three-dimensional dynamic random-access memory array

Semiconductor device

Bonded unified semiconductor chips and fabrication and operation me...

Devices having a transistor and a capacitor along a common horizont...

Apparatus comprising aluminum interconnections, memory devices comp...

Semiconductor device structure with multiple liners and method for...

Semiconductor device, method for manufacturing the same, and integr...

Method of forming a semiconductor device, and a photomask used therein

Semiconductor memory device

Three-dimensional memory device with embedded dynamic random-access...

Method of forming semiconductor device having capped air gaps betwe...

Three-dimensional semiconductor memory device

Support pillars for vertical three-dimensional (3D) memory

Epitaxial silicon within horizontal access devices in vertical thre...

Semiconductor device and method of fabricating the same

Capacitor, semiconductor device, and manufacturing method of semico...

Gate dielectric repair on three-node access device formation for ve...

Bonded unified semiconductor chips and fabrication and operation me...

Feedback 1T DRAM device having localized partial insulating layers

Memory packages and methods of forming same

Methods of forming microelectronic devices, and related microelectr...

Semiconductor memory device and method of fabricating the same

Semiconductor devices and methods for fabricating the same

Arrays of capacitors, methods used in forming integrated circuitry,...

Devices, methods of forming a device, and memory devices

Stacked three-dimensional heterogeneous memory devices and methods...

Memory arrays, and methods of forming memory arrays

Methods of forming microelectronic devices

Memory device having vertical structure

Semiconductor device

Patents Applicationslast 30 patents

BOTTOM UP MOLYBDENUM GAPFILL

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING ISLAND STRUCTURE

SEMICONDUCTOR STRUCTURE AND FORMATION METHOD THEREOF

SEMICONDUCTOR DEVICE HAVING WORD LINE EMBEDDED IN GATE TRENCH

U-SHAPED CHANNEL ACCESS TRANSISTORS AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE WITH STACKED MEMORY DEVICES

MEMORY DEVICES HAVING VERTICAL TRANSISTORS AND METHODS FOR FORMING...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE, SEMICONDUCTOR MEMORY DEVICE, AND METHOD FOR M...

APPARATUSES INCLUDING CONTACTS IN A PERIPHERAL REGION AND METHODS F...

SEMICONDUCTOR STORAGE DEVICE AND FORMING METHOD THEREOF

BACK-SIDE REVEAL FOR POWER DELIVERY TO BACKEND MEMORY

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

BACKEND MEMORY WITH AIR GAPS IN UPPER METAL LAYERS

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND INTEGR...

SEMICONDUCTOR MEMORY STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

CAPACITOR, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF SEMICO...

METHOD FOR PREPARING SEMICONDUCTOR DEVICE STRUCTURE WITH MULTIPLE L...

SEMICONDUCTOR DEVICE STRUCTURE WITH MULTIPLE LINERS AND METHOD FOR...

METHOD OF FORMING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR STORAGE DEVICE

THREE-DIMENSIONAL MEMORY CELL STRUCTURE

EPITAXIAL SILICON WITHIN HORIZONTAL ACCESS DEVICES IN VERTICAL THRE...

SUPPORT PILLARS FOR VERTICAL THREE-DIMENSIONAL (3D) MEMORY

MEMORY PACKAGES AND METHODS OF FORMING SAME

SEMICONDUCTOR MODULE, SEMICONDUCTOR MEMBER, AND METHOD FOR MANUFACT...

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME

CONDUCTIVE LINE CONTACT REGIONS HAVING MULTIPLE MULTI-DIRECTION CON...

BONDED UNIFIED SEMICONDUCTOR CHIPS AND FABRICATION AND OPERATION ME...

GATE DIELECTRIC REPAIR ON THREE-NODE ACCESS DEVICE FORMATION FOR VE...