Front and rear surface processing

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CPC
Y10S438/928

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S438/00Semiconductor device manufacturing: process

Current Industry

Y10S438/928Front and rear surface processing

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,929,190
- Issue date Mar 27, 2018
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,508,620
- Issue date Nov 29, 2016
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,224,667
- Issue date Dec 29, 2015
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated circuit package with open substrate and method of manufa...
- Patent number 9,034,693
- Issue date May 19, 2015
- ST Assembly Test Services Ltd.
- Il Kwon Shim
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Silicon wafer and method for heat-treating silicon wafer
- Patent number 8,999,864
- Issue date Apr 7, 2015
- Global Wafers Japan Co., Ltd.
- Takeshi Senda
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Pulsed processing semiconductor heating methods using combinations...
- Patent number 8,837,923
- Issue date Sep 16, 2014
- Mattson Technology, Inc.
- Paul J. Timans
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 8,497,509
- Issue date Jul 30, 2013
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,415,679
- Issue date Apr 9, 2013
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic device package and method of manufacture
- Patent number 8,384,205
- Issue date Feb 26, 2013
- LSI Corporation
- Qwai Low
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Process for the production of a MWT silicon solar cell
- Patent number 8,227,292
- Issue date Jul 24, 2012
- E I du Pont de Nemours and Company
- Kenneth Warren Hang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method for manufacturing SOI substrate
- Patent number 8,211,780
- Issue date Jul 3, 2012
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Nitride semiconductor wafer having a chamfered edge
- Patent number 8,183,669
- Issue date May 22, 2012
- Sumitomo Electric Industries, Ltd.
- Keiji Ishibashi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,173,520
- Issue date May 8, 2012
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of processing of nitride semiconductor wafer, nitride semico...
- Patent number 8,101,523
- Issue date Jan 24, 2012
- Sumitomo Electric Industries, Ltd.
- Keiji Ishibashi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated circuit package with open substrate
- Patent number 8,030,783
- Issue date Oct 4, 2011
- ST Assembly Test Services Ltd.
- Il Kwon Shim
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,012,854
- Issue date Sep 6, 2011
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of manufacturing layered chip package
- Patent number 8,012,802
- Issue date Sep 6, 2011
- Headway Technologies, Inc.
- Yoshitaka Sasaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Dicing tape and die attach adhesive with patterned backing
- Patent number 8,008,783
- Issue date Aug 30, 2011
- 3M Innovative Properties Company
- David J. Plaut
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Pulsed processing semiconductor heating methods and associated syst...
- Patent number 8,000,587
- Issue date Aug 16, 2011
- Mattson Technology, Inc.
- Paul J. Timans
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic device package and method of manufacture
- Patent number 7,993,981
- Issue date Aug 9, 2011
- LSI Corporation
- Qwai Low
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for cleaning silicon wafer and apparatus for cleaning the si...
- Patent number 7,955,440
- Issue date Jun 7, 2011
- Sumco Corporation
- Shigeru Okuuchi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Conductive through connection and forming method thereof
- Patent number 7,943,513
- Issue date May 17, 2011
- Nanya Technology Corp.
- Shian-Jyh Lin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,923,348
- Issue date Apr 12, 2011
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Flexible and elastic dielectric integrated circuit
- Patent number 7,911,012
- Issue date Mar 22, 2011
- Taiwan Semiconductor Manufacturing Co., Ltd
- Glenn Leedy
- G11 - INFORMATION STORAGE
Information Patent Grant
Nitride semiconductor wafer
- Patent number 7,872,331
- Issue date Jan 18, 2011
- Sumitomo Electric Industries, Ltd.
- Keiji Ishibashi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Dicing tape and die attach adhesive with patterned backing
- Patent number 7,858,499
- Issue date Dec 28, 2010
- 3M Innovative Properties Company
- David J. Plaut
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Structures and methods for reduction of parasitic capacitances in s...
- Patent number 7,825,019
- Issue date Nov 2, 2010
- International Business Machines Corporation
- Lawrence A. Clevenger
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Stress-controlled dielectric integrated circuit
- Patent number 7,820,469
- Issue date Oct 26, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Glenn J Leedy
- G11 - INFORMATION STORAGE
Information Patent Grant
Flexible and elastic dielectric integrated circuit
- Patent number 7,763,948
- Issue date Jul 27, 2010
- Taiwan Semiconductor Manufacturing Co., Ltd
- Glenn J Leedy
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for reducing stress concentrations on a semiconductor wafer...
- Patent number 7,741,701
- Issue date Jun 22, 2010
- Texas Instruments Incorporated
- Richard L. Mahle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20130214434
- Publication date Aug 22, 2013
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20120211874
- Publication date Aug 23, 2012
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING OF NITRIDE SEMICONDUCTOR WAFER, NITRIDE SEMICO...
- Publication number 20120184108
- Publication date Jul 19, 2012
- SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Keiji ISHIBASHI
- C30 - CRYSTAL GROWTH
Information Patent Application
SILICON WAFER AND METHOD FOR HEAT-TREATING SILICON WAFER
- Publication number 20120139088
- Publication date Jun 7, 2012
- Covalent Materials Corporation
- Takeshi Senda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING OF NITRIDE SEMICONDUCTOR WAFER, NITRIDE SEMICO...
- Publication number 20120043645
- Publication date Feb 23, 2012
- SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Keiji ISHIBASHI
- C30 - CRYSTAL GROWTH
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH OPEN SUBSTRATE AND METHOD OF MANUFA...
- Publication number 20120018886
- Publication date Jan 26, 2012
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20110312111
- Publication date Dec 22, 2011
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20110260324
- Publication date Oct 27, 2011
- LSI Corporation
- Qwai Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PULSED PROCESSING SEMICONDUCTOR HEATING METHODS USING COMBINATIONS...
- Publication number 20110236844
- Publication date Sep 29, 2011
- Paul J. Timans
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD OF MANUFACTURING LAYERED CHIP PACKAGE
- Publication number 20110189820
- Publication date Aug 4, 2011
- HEADWAY TECHNOLOGIES, INC.
- Yoshitaka SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20110159771
- Publication date Jun 30, 2011
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR THE PRODUCTION OF A MWT SILICON SOLAR CELL
- Publication number 20110139238
- Publication date Jun 16, 2011
- E.I. du Pont de Nemours and Company
- Kenneth Warren Hang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
DICING TAPE AND DIE ATTACH ADHESIVE WITH PATTERNED BACKING
- Publication number 20110064948
- Publication date Mar 17, 2011
- 3M Innovative Properties Company
- David J. PLAUT
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF PROCESSING OF NITRIDE SEMICONDUCTOR WAFER, NITRIDE SEMICO...
- Publication number 20110049679
- Publication date Mar 3, 2011
- SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Keiji ISHIBASHI
- C30 - CRYSTAL GROWTH
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20100314747
- Publication date Dec 16, 2010
- LSI Corporation
- Qwai Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE SEMICONDUCTOR WAFER
- Publication number 20100270649
- Publication date Oct 28, 2010
- SUNITOMO ELECTRIC INDUSTRIES, LTD
- Keiji Ishibashi
- C30 - CRYSTAL GROWTH
Information Patent Application
CONDUCTIVE THROUGH CONNECTION AND FORMING METHOD THEREOF
- Publication number 20100258917
- Publication date Oct 14, 2010
- NANYA TECHNOLOGY CORP.
- Shian-Jyh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CLEANING SILICON WAFER AND APPARATUS FOR CLEANING THE SI...
- Publication number 20100252070
- Publication date Oct 7, 2010
- SUMCO CORPORATION
- Shigeru Okuuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH OPEN SUBSTRATE
- Publication number 20100038771
- Publication date Feb 18, 2010
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20090275196
- Publication date Nov 5, 2009
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING TAPE AND DIE ATTACH ADHESIVE WITH PATTERNED BACKING
- Publication number 20090227089
- Publication date Sep 10, 2009
- David J. Plaut
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR MANUFACTURING SOI SUBSTRATE
- Publication number 20090142905
- Publication date Jun 4, 2009
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR REDUCTION OF PARASITIC CAPACITANCES IN S...
- Publication number 20090085210
- Publication date Apr 2, 2009
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20080309585
- Publication date Dec 18, 2008
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible and elastic dielectric integrated circuit
- Publication number 20080302559
- Publication date Dec 11, 2008
- Elm Technology Corporation
- Glenn Joseph Leedy
- G02 - OPTICS
Information Patent Application
Universal Serial Bus Hub Attachably Stackable In Multiple Orientati...
- Publication number 20080133813
- Publication date Jun 5, 2008
- Belkin International, Inc.
- Kenneth Mori
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR CONSTRUCTIONS AND SEMICONDUCTOR DEVICE FABRICATION ME...
- Publication number 20080105969
- Publication date May 8, 2008
- International Business Machines Corporation
- Louis L. C. Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pulsed Processing Semiconductor Heating Methods using Combinations...
- Publication number 20080069550
- Publication date Mar 20, 2008
- Paul J. Timans
- C30 - CRYSTAL GROWTH
Information Patent Application
Method of dividing an adhesive film bonded to a wafer
- Publication number 20070249145
- Publication date Oct 25, 2007
- DISCO CORPORATION
- Masaru Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor constructions and semiconductor device fabrication me...
- Publication number 20070184581
- Publication date Aug 9, 2007
- International Business Machines Corporation
- Louis L. C. Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Front and rear surface processing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Integrated circuit package with open substrate and method of manufa...

Silicon wafer and method for heat-treating silicon wafer

Pulsed processing semiconductor heating methods using combinations...

Method of manufacturing a semiconductor device

Semiconductor device and manufacturing method thereof

Electronic device package and method of manufacture

Process for the production of a MWT silicon solar cell

Method for manufacturing SOI substrate

Nitride semiconductor wafer having a chamfered edge

Semiconductor device and manufacturing method thereof

Method of processing of nitride semiconductor wafer, nitride semico...

Integrated circuit package with open substrate

Semiconductor device and manufacturing method thereof

Method of manufacturing layered chip package

Dicing tape and die attach adhesive with patterned backing

Pulsed processing semiconductor heating methods and associated syst...

Electronic device package and method of manufacture

Method for cleaning silicon wafer and apparatus for cleaning the si...

Conductive through connection and forming method thereof

Semiconductor device and manufacturing method thereof

Flexible and elastic dielectric integrated circuit

Nitride semiconductor wafer

Dicing tape and die attach adhesive with patterned backing

Structures and methods for reduction of parasitic capacitances in s...

Stress-controlled dielectric integrated circuit

Flexible and elastic dielectric integrated circuit

Method for reducing stress concentrations on a semiconductor wafer...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD OF PROCESSING OF NITRIDE SEMICONDUCTOR WAFER, NITRIDE SEMICO...

SILICON WAFER AND METHOD FOR HEAT-TREATING SILICON WAFER

METHOD OF PROCESSING OF NITRIDE SEMICONDUCTOR WAFER, NITRIDE SEMICO...

INTEGRATED CIRCUIT PACKAGE WITH OPEN SUBSTRATE AND METHOD OF MANUFA...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURE

PULSED PROCESSING SEMICONDUCTOR HEATING METHODS USING COMBINATIONS...

METHOD OF MANUFACTURING LAYERED CHIP PACKAGE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PROCESS FOR THE PRODUCTION OF A MWT SILICON SOLAR CELL

DICING TAPE AND DIE ATTACH ADHESIVE WITH PATTERNED BACKING

METHOD OF PROCESSING OF NITRIDE SEMICONDUCTOR WAFER, NITRIDE SEMICO...

ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURE

NITRIDE SEMICONDUCTOR WAFER

CONDUCTIVE THROUGH CONNECTION AND FORMING METHOD THEREOF

METHOD FOR CLEANING SILICON WAFER AND APPARATUS FOR CLEANING THE SI...

INTEGRATED CIRCUIT PACKAGE WITH OPEN SUBSTRATE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

DICING TAPE AND DIE ATTACH ADHESIVE WITH PATTERNED BACKING

METHOD FOR MANUFACTURING SOI SUBSTRATE

STRUCTURES AND METHODS FOR REDUCTION OF PARASITIC CAPACITANCES IN S...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Flexible and elastic dielectric integrated circuit

Universal Serial Bus Hub Attachably Stackable In Multiple Orientati...

SEMICONDUCTOR CONSTRUCTIONS AND SEMICONDUCTOR DEVICE FABRICATION ME...

Pulsed Processing Semiconductor Heating Methods using Combinations...

Method of dividing an adhesive film bonded to a wafer

Semiconductor constructions and semiconductor device fabrication me...