Hard particles

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CPC
H05K2201/023

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/023Hard particles

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Biphasic material and stretchable circuit board
- Patent number 11,937,372
- Issue date Mar 19, 2024
- Yale University
- Rebecca Kramer-Bottiglio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless and electrolytic deposition process for forming traces...
- Patent number 11,653,453
- Issue date May 16, 2023
- CATLAM, LLC
- Kenneth S Bahl
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Catalytic laminate with conductive traces formed during lamination
- Patent number 11,477,893
- Issue date Oct 18, 2022
- CATLAM, LLC
- Kenneth S Bahl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Molded interconnect device
- Patent number 11,357,112
- Issue date Jun 7, 2022
- Molex, LLC
- Tsuey Choo Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally conductive flexible adhesive for aerospace applications
- Patent number 11,292,943
- Issue date Apr 5, 2022
- The Boeing Company
- Peter Babilo
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Through hole filling paste
- Patent number 11,259,412
- Issue date Feb 22, 2022
- Ajinomoto Co., Inc.
- Hideki Ooyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for flip-chip bonding using anisotropic adhesive polymer
- Patent number 11,240,918
- Issue date Feb 1, 2022
- Research & Business Foundation Sungkyunkwan University
- Tae Il Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Thermosetting resin composition for LDS, resin molded article, and...
- Patent number 11,174,402
- Issue date Nov 16, 2021
- Sumitomo Bakelite Co., Ltd.
- Toru Meura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Liquid ejection apparatus
- Patent number 11,031,538
- Issue date Jun 8, 2021
- Brother Kogyo Kabushiki Kaisha
- Toru Kakiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting body manufacturing method and anisotropic conductive film
- Patent number 10,887,999
- Issue date Jan 5, 2021
- Dexerials Corporation
- Yasunobu Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming traces on a catalytic laminate
- Patent number 10,849,233
- Issue date Nov 24, 2020
- CATLAM, LLC
- Kenneth S Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic conductive film
- Patent number 10,827,625
- Issue date Nov 3, 2020
- Dexerials Corporation
- Seiichiro Shinohara
- G01 - MEASURING TESTING
Information Patent Grant
Catalytic laminate with conductive traces formed during lamination
- Patent number 10,827,624
- Issue date Nov 3, 2020
- CATLAM, LLC
- Kenneth S Bahl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Liquid ejection apparatus
- Patent number 10,727,392
- Issue date Jul 28, 2020
- Brother Kogyo Kabushiki Kaisha
- Toru Kakiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded circuit patterning feature selective electroless
- Patent number 10,586,715
- Issue date Mar 10, 2020
- Intel Corporation
- Yonggang Yong Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Component carrier and method for manufacturing the same
- Patent number 10,424,541
- Issue date Sep 24, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Hannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition and method for forming conductive pattern, and resin st...
- Patent number 10,349,527
- Issue date Jul 9, 2019
- LG Chem, Ltd.
- Chee-Sung Park
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thermally conductive flexible adhesive for aerospace applications
- Patent number 10,336,916
- Issue date Jul 2, 2019
- The Boeing Company
- Peter Babilo
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Composition for forming conductive pattern and resin structure havi...
- Patent number 10,297,363
- Issue date May 21, 2019
- LG Chem, Ltd.
- Shin Hee Jun
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Selective metallization of an integrated circuit (IC) substrate
- Patent number 10,290,557
- Issue date May 14, 2019
- Intel Corporation
- Brandon C. Marin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure and manufacturing method of package structure
- Patent number 10,256,180
- Issue date Apr 9, 2019
- IBIS Innotech Inc.
- Wen-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection body, method for manufacturing a connection body, connec...
- Patent number 10,175,544
- Issue date Jan 8, 2019
- Dexerials Corporation
- Seiichiro Shinohara
- G02 - OPTICS
Information Patent Grant
Polymer product and method for selectively metallizing polymer subs...
- Patent number 10,161,044
- Issue date Dec 25, 2018
- BYD Company Limited
- Wei Zhou
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Resin composition, prepreg, laminate, metal foil-clad laminate, and...
- Patent number 10,138,393
- Issue date Nov 27, 2018
- Mitsubishi Gas Chemical Company, Inc.
- Katsuya Tomizawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor structure
- Patent number 10,090,256
- Issue date Oct 2, 2018
- IBIS Innotech Inc.
- Wen-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal compound, method for preparing the same, selective metallizat...
- Patent number 10,059,852
- Issue date Aug 28, 2018
- Shenzhen BYD Auto R&D Company Limited
- Qing Gong
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Thermally conductive flexible adhesive for aerospace applications
- Patent number 10,005,927
- Issue date Jun 26, 2018
- The Boeing Company
- Peter Babilo
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Composition and method for forming conductive pattern, and resin st...
- Patent number 9,967,974
- Issue date May 8, 2018
- LG Chem, Ltd.
- Chee-Sung Park
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Light source unit
- Patent number 9,967,981
- Issue date May 8, 2018
- Koito Manufacturing Co., Ltd.
- Yoshiaki Aiso
- B60 - VEHICLES IN GENERAL
Information Patent Grant
High modulus laser direct structuring polycarbonate composites with...
- Patent number 9,944,768
- Issue date Apr 17, 2018
- SABIC GLOBAL TECHNOLOGIES B.V.
- Yunan Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL F...
- Publication number 20240182657
- Publication date Jun 6, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Akira IRIFUNE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT STRUCTURE FOR HOT-PRESS BONDING
- Publication number 20230422405
- Publication date Dec 28, 2023
- SuperC-Touch Corporation
- Hsiang-Yu LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTIL...
- Publication number 20230047699
- Publication date Feb 16, 2023
- Hayato SAWAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A MOLDED INTERCONNECT DEVICE
- Publication number 20220279656
- Publication date Sep 1, 2022
- Molex, LLC
- Tsuey Choo CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BIPHASIC MATERIAL AND STRETCHABLE CIRCUIT BOARD
- Publication number 20210410283
- Publication date Dec 30, 2021
- Yale University
- Rebecca Bottiglio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Catalytic Laminate with Conductive Traces formed during Lamination
- Publication number 20210022252
- Publication date Jan 21, 2021
- CATLAM LLC
- Kenneth S BAHL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THROUGH HOLE FILLING PASTE
- Publication number 20200413542
- Publication date Dec 31, 2020
- AJINOMOTO CO., INC.
- Hideki OOYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID EJECTION APPARATUS
- Publication number 20200321510
- Publication date Oct 8, 2020
- BROTHER KOGYO KABUSHIKI KAISHA
- Toru KAKIUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FLIP-CHIP BONDING USING ANISOTROPIC ADHESIVE POLYMER
- Publication number 20200077523
- Publication date Mar 5, 2020
- Research & Business Foundation Sungkyunkwan University
- Tae Il KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOSETTING RESIN COMPOSITION FOR LDS, RESIN MOLDED ARTICLE, AND...
- Publication number 20190292386
- Publication date Sep 26, 2019
- SUMITOMO BAKELITE CO., LTD.
- Toru MEURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Catalytic Laminate with Conductive Traces formed during Lamination
- Publication number 20190274221
- Publication date Sep 5, 2019
- SIERRA CIRCUITS, INC.
- Kenneth S. BAHL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THERMALLY CONDUCTIVE FLEXIBLE ADHESIVE FOR AEROSPACE APPLICATIONS
- Publication number 20190264073
- Publication date Aug 29, 2019
- The Boeing Company
- Peter Babilo
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
MOLDED INTERCONNECT DEVICE AND METHOD OF MAKING SAME
- Publication number 20190166698
- Publication date May 30, 2019
- Molex, LLC
- Tsuey Choo CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID EJECTION APPARATUS
- Publication number 20190157541
- Publication date May 23, 2019
- BROTHER KOGYO KABUSHIKI KAISHA
- Toru KAKIUCHI
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM
- Publication number 20190090354
- Publication date Mar 21, 2019
- DEXERIALS CORPORATION
- Seiichiro SHINOHARA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMALLY CONDUCTIVE FLEXIBLE ADHESIVE FOR AEROSPACE APPLICATIONS
- Publication number 20180265751
- Publication date Sep 20, 2018
- The Boeing Company
- Peter Babilo
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CONNECTION BODY, METHOD FOR MANUFACTURING A CONNECTION BODY, CONNEC...
- Publication number 20160327826
- Publication date Nov 10, 2016
- DEXERIALS CORPORATION
- Seiichiro SHINOHARA
- G02 - OPTICS
Information Patent Application
VIA IN A PRINTED CIRCUIT BOARD
- Publication number 20160295708
- Publication date Oct 6, 2016
- SIERRA CIRCUITS, INC.
- Konstantine Karavakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER PARTICULATE DISPERSION, CONDUCTIVE FILM FORMING METHOD, AND...
- Publication number 20160029483
- Publication date Jan 28, 2016
- Ishihara Chemical Co., Ltd.
- Yuichi KAWATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, PREPREG, LAMINATE, METAL FOIL-CLAD LAMINATE, AND...
- Publication number 20150344733
- Publication date Dec 3, 2015
- Mitsubishi Gas Chemical Company, Inc.
- Katsuya TOMIZAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CURABLE COMPOSITION FOR ELECTRONIC COMPONENT AND CONNECTION STRUCTURE
- Publication number 20150340120
- Publication date Nov 26, 2015
- SEKISUI CHEMICAL CO., LTD.
- Hideaki Ishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING RESIN MATERIAL AND MULTILAYER SUBSTRATE
- Publication number 20150210884
- Publication date Jul 30, 2015
- Sekisui Chemical Co., Ltd
- Tatsushi Hayashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLYMER ARTICLE AND METHOD FOR SELECTIVE METALLIZATION OF THE SAME
- Publication number 20140349030
- Publication date Nov 27, 2014
- SHENZHEN BYD AUTO R&D COMPANY LIMITED
- Qing GONG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METAL COMPOUND, METHOD FOR PREPARING THE SAME, SELECTIVE METALLIZAT...
- Publication number 20140290530
- Publication date Oct 2, 2014
- BYD COMPANY LIMITED
- Qing GONG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH MODULUS LASER DIRECT STRUCTURING POLYCARBONATE COMPOSITES WITH...
- Publication number 20140296410
- Publication date Oct 2, 2014
- Yunan Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH MODULUS LASER DIRECT STRUCTURING COMPOSITES
- Publication number 20140296411
- Publication date Oct 2, 2014
- SABIC INNOVATIVE PLASTICS IP BV
- Yunan Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING THREE-DIMENSIONAL INTEGRATED CIRCUIT
- Publication number 20140284849
- Publication date Sep 25, 2014
- Dongsheng LIU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
AQUEOUS ACTIVATOR SOLUTION AND PROCESS FOR ELECTROLESS COPPER DEPOS...
- Publication number 20140255600
- Publication date Sep 11, 2014
- Enthone Inc.
- Edwin W. Bastenbeck
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND DISPLAY APPARATUS HAVING THE SAME
- Publication number 20140254117
- Publication date Sep 11, 2014
- SAMSUNG DISPLAY CO., LTD.
- Moon-Seok Roh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLUG AND METHOD FOR PRODUCING SAME
- Publication number 20140199890
- Publication date Jul 17, 2014
- REICHLE & DE-MASSARI AG
- Dominik Schweizer
- H01 - BASIC ELECTRIC ELEMENTS

Hard particles

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Biphasic material and stretchable circuit board

Electroless and electrolytic deposition process for forming traces...

Catalytic laminate with conductive traces formed during lamination

Molded interconnect device

Thermally conductive flexible adhesive for aerospace applications

Through hole filling paste

Method for flip-chip bonding using anisotropic adhesive polymer

Thermosetting resin composition for LDS, resin molded article, and...

Liquid ejection apparatus

Mounting body manufacturing method and anisotropic conductive film

Process for forming traces on a catalytic laminate

Anisotropic conductive film

Catalytic laminate with conductive traces formed during lamination

Liquid ejection apparatus

Embedded circuit patterning feature selective electroless

Component carrier and method for manufacturing the same

Composition and method for forming conductive pattern, and resin st...

Thermally conductive flexible adhesive for aerospace applications

Composition for forming conductive pattern and resin structure havi...

Selective metallization of an integrated circuit (IC) substrate

Package structure and manufacturing method of package structure

Connection body, method for manufacturing a connection body, connec...

Polymer product and method for selectively metallizing polymer subs...

Resin composition, prepreg, laminate, metal foil-clad laminate, and...

Semiconductor structure

Metal compound, method for preparing the same, selective metallizat...

Thermally conductive flexible adhesive for aerospace applications

Composition and method for forming conductive pattern, and resin st...

Light source unit

High modulus laser direct structuring polycarbonate composites with...

Patents Applicationslast 30 patents

RESIN COMPOSITION, PREPREG, RESIN-COATED FILM, RESIN-COATED METAL F...

CIRCUIT STRUCTURE FOR HOT-PRESS BONDING

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTIL...

METHOD OF MAKING A MOLDED INTERCONNECT DEVICE

BIPHASIC MATERIAL AND STRETCHABLE CIRCUIT BOARD

Catalytic Laminate with Conductive Traces formed during Lamination

THROUGH HOLE FILLING PASTE

LIQUID EJECTION APPARATUS

METHOD FOR FLIP-CHIP BONDING USING ANISOTROPIC ADHESIVE POLYMER

THERMOSETTING RESIN COMPOSITION FOR LDS, RESIN MOLDED ARTICLE, AND...

Catalytic Laminate with Conductive Traces formed during Lamination

THERMALLY CONDUCTIVE FLEXIBLE ADHESIVE FOR AEROSPACE APPLICATIONS

MOLDED INTERCONNECT DEVICE AND METHOD OF MAKING SAME

LIQUID EJECTION APPARATUS

ANISOTROPIC CONDUCTIVE FILM

THERMALLY CONDUCTIVE FLEXIBLE ADHESIVE FOR AEROSPACE APPLICATIONS

CONNECTION BODY, METHOD FOR MANUFACTURING A CONNECTION BODY, CONNEC...

VIA IN A PRINTED CIRCUIT BOARD

COPPER PARTICULATE DISPERSION, CONDUCTIVE FILM FORMING METHOD, AND...

RESIN COMPOSITION, PREPREG, LAMINATE, METAL FOIL-CLAD LAMINATE, AND...

CURABLE COMPOSITION FOR ELECTRONIC COMPONENT AND CONNECTION STRUCTURE

INSULATING RESIN MATERIAL AND MULTILAYER SUBSTRATE

POLYMER ARTICLE AND METHOD FOR SELECTIVE METALLIZATION OF THE SAME

METAL COMPOUND, METHOD FOR PREPARING THE SAME, SELECTIVE METALLIZAT...

HIGH MODULUS LASER DIRECT STRUCTURING POLYCARBONATE COMPOSITES WITH...

HIGH MODULUS LASER DIRECT STRUCTURING COMPOSITES

METHOD FOR MANUFACTURING THREE-DIMENSIONAL INTEGRATED CIRCUIT

AQUEOUS ACTIVATOR SOLUTION AND PROCESS FOR ELECTROLESS COPPER DEPOS...

ANISOTROPIC CONDUCTIVE FILM AND DISPLAY APPARATUS HAVING THE SAME

PLUG AND METHOD FOR PRODUCING SAME