having a supporting carrier or a mounting substrate or a mounting plate

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G02B6/4257

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Parent Industries

GPHYSICS G02Optics G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS G02B6/00Light guides

Current Industry

G02B6/4257having a supporting carrier or a mounting substrate or a mounting plate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Optical waveguide package and light-emitting device
- Patent number 12,181,723
- Issue date Dec 31, 2024
- Kyocera Corporation
- Yoshiaki Itakura
- G02 - OPTICS
Information Patent Grant
Compact micro bench for optical transceiver sub-assembly
- Patent number 12,169,313
- Issue date Dec 17, 2024
- CLOUD LIGHT TECHNOLOGY LIMITED
- Wing Keung Mark Mak
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Chip-scale optical interconnect using microLEDs
- Patent number 12,074,192
- Issue date Aug 27, 2024
- AvicenaTech, Corp.
- Bardia Pezeshki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pluggable optical module and optical communication system
- Patent number 12,072,530
- Issue date Aug 27, 2024
- NEC Corporation
- Yuuji Minota
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical block with textured surface
- Patent number 12,055,771
- Issue date Aug 6, 2024
- SAMTEC, INC.
- Jignesh H. Shah
- G02 - OPTICS
Information Patent Grant
ASIC package with photonics and vertical power delivery
- Patent number 11,978,721
- Issue date May 7, 2024
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fiber-based transmitter and receiver channels of light detection an...
- Patent number 11,789,128
- Issue date Oct 17, 2023
- Innovusion, Inc.
- Yufeng Li
- G02 - OPTICS
Information Patent Grant
Connector having optical fiber connection mechanism and connector a...
- Patent number 11,774,690
- Issue date Oct 3, 2023
- Delta Electronics, Inc.
- Sheng-Hua Li
- G02 - OPTICS
Information Patent Grant
Waveguide connection structure, waveguide chip, connector, and meth...
- Patent number 11,747,577
- Issue date Sep 5, 2023
- Nippon Telegraph and Telephone Corporation
- Norio Sato
- G02 - OPTICS
Information Patent Grant
Free air intrasystem interconnect
- Patent number 11,726,278
- Issue date Aug 15, 2023
- Intel Corporation
- Arvind Sundaram
- G02 - OPTICS
Information Patent Grant
Methods for co-packaging optical modules on switch package substrate
- Patent number 11,719,898
- Issue date Aug 8, 2023
- MARVELL ASIA PTE. LTD.
- Radhakrishnan L. Nagarajan
- G02 - OPTICS
Information Patent Grant
System comprising packaged optical devices
- Patent number 11,722,220
- Issue date Aug 8, 2023
- Advanced Semiconductor Engineering, Inc.
- Chang-Yu Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical module
- Patent number 11,722,221
- Issue date Aug 8, 2023
- Furukawa Electric Co., Ltd.
- Kazuya Nagashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical block with textured surface
- Patent number 11,693,194
- Issue date Jul 4, 2023
- Samtec, Inc.
- Jignesh H. Shah
- G02 - OPTICS
Information Patent Grant
Pluggable optical module and optical communication system
- Patent number 11,635,571
- Issue date Apr 25, 2023
- NEC Corporation
- Yuuji Minota
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical module
- Patent number 11,592,629
- Issue date Feb 28, 2023
- Nippon Telegraph and Telephone Corporation
- Yuriko Kawamura
- G02 - OPTICS
Information Patent Grant
Optical module
- Patent number 11,567,275
- Issue date Jan 31, 2023
- Nippon Telegraph and Telephone Corporation
- Yuriko Kawamura
- G02 - OPTICS
Information Patent Grant
Chip-scale optical interconnect using microLEDs
- Patent number 11,515,356
- Issue date Nov 29, 2022
- AVICENATECH CORP.
- Bardia Pezeshki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly method for coherent receiver
- Patent number 11,454,768
- Issue date Sep 27, 2022
- Sumitomo Electric Industries, Ltd.
- Munetaka Kurokawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical fiber illumination apparatus
- Patent number 11,442,212
- Issue date Sep 13, 2022
- Hyundai Motor Company
- Byoung Suk Ahn
- G02 - OPTICS
Information Patent Grant
Optical module
- Patent number 11,415,764
- Issue date Aug 16, 2022
- Fujitsu Optical Components Limited
- Teruhiro Kubo
- G02 - OPTICS
Information Patent Grant
Optical transceiver module and optical cable module
- Patent number 11,409,062
- Issue date Aug 9, 2022
- USENLIGHT CORPORATION
- Chun-Yang Chang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical interposer
- Patent number 11,409,063
- Issue date Aug 9, 2022
- Samtec, Inc.
- Marc Epitaux
- G02 - OPTICS
Information Patent Grant
Optical semiconductor device and optical module
- Patent number 11,385,422
- Issue date Jul 12, 2022
- Sumitomo Electric Industries, Ltd.
- Tomoya Saeki
- G02 - OPTICS
Information Patent Grant
Implantable optical sensor with hermetically sealed cover cap
- Patent number 11,372,176
- Issue date Jun 28, 2022
- Indigo Diabetes N.V.
- Koenraad Van Schuylenbergh
- G02 - OPTICS
Information Patent Grant
Optical transceiver module and optical cable module
- Patent number 11,347,010
- Issue date May 31, 2022
- USENLIGHT CORPORATION
- Chun-Yang Chang
- G02 - OPTICS
Information Patent Grant
Free air intrasystem interconnect
- Patent number 11,294,127
- Issue date Apr 5, 2022
- Intel Corporation
- Arvind Sundaram
- G02 - OPTICS
Information Patent Grant
Solder-aligned optical socket with interposer reference and methods...
- Patent number 11,275,222
- Issue date Mar 15, 2022
- Hewlett Packard Enterprise Development LP
- Paul Kessler Rosenberg
- G02 - OPTICS
Information Patent Grant
Module with transmit optical subassembly and receive optical subass...
- Patent number 11,262,498
- Issue date Mar 1, 2022
- Rockley Photonics Limited
- Gerald Cois Byrd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ASIC package with photonics and vertical power delivery
- Patent number 11,264,358
- Issue date Mar 1, 2022
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL MODULE
- Publication number 20250012987
- Publication date Jan 9, 2025
- HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD
- Xiaokuo ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUGGABLE OPTICAL MODULE AND OPTICAL COMMUNICATION SYSTEM
- Publication number 20240369767
- Publication date Nov 7, 2024
- NEC Corporation
- Yuuji MINOTA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGE DEVICE
- Publication number 20240345341
- Publication date Oct 17, 2024
- Advanced Semiconductor Engineering, Inc.
- Jung Jui KANG
- G02 - OPTICS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240345343
- Publication date Oct 17, 2024
- Advanced Semiconductor Engineering, Inc.
- Jr-Wei LIN
- G02 - OPTICS
Information Patent Application
PHOTOELECTRIC COMPOSITE TRANSMISSION MODULE AND OPTICAL COMMUNICATI...
- Publication number 20240329343
- Publication date Oct 3, 2024
- Nitto Denko Corporation
- Atsushi Yamagishi
- G02 - OPTICS
Information Patent Application
Immersible Optical Module
- Publication number 20240288641
- Publication date Aug 29, 2024
- Optomind Inc.
- Hyun Ryong CHO
- G02 - OPTICS
Information Patent Application
THERMAL MANAGEMENT IN AN OPTICAL SUB-ASSEMBLY
- Publication number 20240288643
- Publication date Aug 29, 2024
- Lumentum Technology UK Limited
- Andrew STRANGE
- G02 - OPTICS
Information Patent Application
Asic Package With Photonics And Vertical Power Delivery
- Publication number 20240213215
- Publication date Jun 27, 2024
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL COUPLING SYSTEM AND PREPARATION METHOD THEREFOR
- Publication number 20240210638
- Publication date Jun 27, 2024
- InnoLight Technology (Suzhou) LTD.
- Xue-zhe ZHENG
- G02 - OPTICS
Information Patent Application
INTEGRATED PHOTONIC DEVICE AND ELECTRONIC DEVICE ARCHITECTURES
- Publication number 20240194657
- Publication date Jun 13, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL WAFER-LEVEL PACKAGE
- Publication number 20240184066
- Publication date Jun 6, 2024
- Cisco Technology, Inc.
- Norbert SCHLEPPLE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240178206
- Publication date May 30, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Hyeon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT COMPRISING AN ASSEMBLY OF AN ELECTRONIC CHIP, AN...
- Publication number 20240168245
- Publication date May 23, 2024
- STMicroelectronics (Grenoble 2) SAS
- Romain COFFY
- G02 - OPTICS
Information Patent Application
OPTICAL INTEGRATED CIRCUIT MODULE AND OPTICAL COMMUNICATION APPARATUS
- Publication number 20240159978
- Publication date May 16, 2024
- FUJITSU OPTICAL COMPONENTS LIMITED
- NOBUAKI MITAMURA
- G02 - OPTICS
Information Patent Application
SUB-MOUNT, OPTICAL MODULATION MODULE, AND OPTICAL COMMUNICATION DEVICE
- Publication number 20240151918
- Publication date May 9, 2024
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Jaegyu PARK
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
OPTICAL FERRULES
- Publication number 20240142726
- Publication date May 2, 2024
- 3M Innovative Properties Company
- Xiaoguang Sun
- G02 - OPTICS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240145455
- Publication date May 2, 2024
- Siliconware Precision Industries Co., Ltd.
- Meng-Jie LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL COMPONENT, OPTOELECTRONIC MODULE AND METHOD OF MANUFACTURE
- Publication number 20240142728
- Publication date May 2, 2024
- SENSIRION AG
- Frank GÜTLE
- G02 - OPTICS
Information Patent Application
LASER MODULE, OPTICAL ENGINE MODULE, AND XR GLASSES
- Publication number 20240142787
- Publication date May 2, 2024
- TDK Corporation
- Hideaki FUKUZAWA
- G02 - OPTICS
Information Patent Application
CONNECTOR FOR ALIGNMENT OF INTEGRATED WAVEGUIDES AND OPTICAL FIBERS
- Publication number 20240111109
- Publication date Apr 4, 2024
- Corning Research & Development Corporation
- Lars Martin Otfried Brusberg
- G02 - OPTICS
Information Patent Application
ASSEMBLY ALIGNMENT STRUCTURE FOR OPTICAL COMPONENT
- Publication number 20240085645
- Publication date Mar 14, 2024
- FOCI FIBER OPTIC COMMUNICATIONS, INC.
- Ting-Ta Hu
- G02 - OPTICS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD OF MANUFACTURING AN ELECTRONIC PACKAGE
- Publication number 20240053552
- Publication date Feb 15, 2024
- Kabushiki Kaisha Toshiba
- Joanna Krystyna SKIBA-SZYMANSKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D High Bandwidth Memory and Optical Connectivity Stacking
- Publication number 20240036278
- Publication date Feb 1, 2024
- Google LLC
- Horia Alexandru Toma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE
- Publication number 20240027702
- Publication date Jan 25, 2024
- HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD
- Jiaao ZHANG
- G02 - OPTICS
Information Patent Application
FIBER-BASED TRANSMITTER AND RECEIVER CHANNELS OF LIGHT DETECTION AN...
- Publication number 20230417879
- Publication date Dec 28, 2023
- Innovusion, Inc.
- Yufeng Li
- G01 - MEASURING TESTING
Information Patent Application
CABLE ADAPTER FOR A CAMERA CONVERTER
- Publication number 20230418008
- Publication date Dec 28, 2023
- Tactical Fiber Systems, Inc.
- Richard David RUBIN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SYSTEM COMPRISING PACKAGED OPTICAL DEVICES
- Publication number 20230403078
- Publication date Dec 14, 2023
- Advanced Semiconductor Engineering, Inc.
- Chang-Yu LIN
- G02 - OPTICS
Information Patent Application
CO-PACKAGING OPTICAL MODULES WITH SURFACE AND EDGE COUPLING
- Publication number 20230400651
- Publication date Dec 14, 2023
- Marvell Asia Pie Ltd
- Radhakrishnan L. NAGARAJAN
- G02 - OPTICS
Information Patent Application
OPTICAL SEMICONDUCTOR DEVICE
- Publication number 20230378716
- Publication date Nov 23, 2023
- FUJITSU OPTICAL COMPONENTS LIMITED
- Nobuaki HATORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE AND BUMP ARRANGEMENT METHOD
- Publication number 20230341641
- Publication date Oct 26, 2023
- FUJITSU OPTICAL COMPONENTS LIMITED
- Takeshi Matsumoto
- G02 - OPTICS

having a supporting carrier or a mounting substrate or a mounting plate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Optical waveguide package and light-emitting device

Compact micro bench for optical transceiver sub-assembly

Chip-scale optical interconnect using microLEDs

Pluggable optical module and optical communication system

Optical block with textured surface

ASIC package with photonics and vertical power delivery

Fiber-based transmitter and receiver channels of light detection an...

Connector having optical fiber connection mechanism and connector a...

Waveguide connection structure, waveguide chip, connector, and meth...

Free air intrasystem interconnect

Methods for co-packaging optical modules on switch package substrate

System comprising packaged optical devices

Optical module

Optical block with textured surface

Pluggable optical module and optical communication system

Optical module

Optical module

Chip-scale optical interconnect using microLEDs

Assembly method for coherent receiver

Optical fiber illumination apparatus

Optical module

Optical transceiver module and optical cable module

Optical interposer

Optical semiconductor device and optical module

Implantable optical sensor with hermetically sealed cover cap

Optical transceiver module and optical cable module

Free air intrasystem interconnect

Solder-aligned optical socket with interposer reference and methods...

Module with transmit optical subassembly and receive optical subass...

ASIC package with photonics and vertical power delivery

Patents Applicationslast 30 patents

OPTICAL MODULE

PLUGGABLE OPTICAL MODULE AND OPTICAL COMMUNICATION SYSTEM

PACKAGE DEVICE

ELECTRONIC DEVICE

PHOTOELECTRIC COMPOSITE TRANSMISSION MODULE AND OPTICAL COMMUNICATI...

Immersible Optical Module

THERMAL MANAGEMENT IN AN OPTICAL SUB-ASSEMBLY

Asic Package With Photonics And Vertical Power Delivery

OPTICAL COUPLING SYSTEM AND PREPARATION METHOD THEREFOR

INTEGRATED PHOTONIC DEVICE AND ELECTRONIC DEVICE ARCHITECTURES

OPTICAL WAFER-LEVEL PACKAGE

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

INTEGRATED CIRCUIT COMPRISING AN ASSEMBLY OF AN ELECTRONIC CHIP, AN...

OPTICAL INTEGRATED CIRCUIT MODULE AND OPTICAL COMMUNICATION APPARATUS

SUB-MOUNT, OPTICAL MODULATION MODULE, AND OPTICAL COMMUNICATION DEVICE

OPTICAL FERRULES

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

OPTICAL COMPONENT, OPTOELECTRONIC MODULE AND METHOD OF MANUFACTURE

LASER MODULE, OPTICAL ENGINE MODULE, AND XR GLASSES

CONNECTOR FOR ALIGNMENT OF INTEGRATED WAVEGUIDES AND OPTICAL FIBERS

ASSEMBLY ALIGNMENT STRUCTURE FOR OPTICAL COMPONENT

ELECTRONIC PACKAGE AND METHOD OF MANUFACTURING AN ELECTRONIC PACKAGE

3D High Bandwidth Memory and Optical Connectivity Stacking

OPTICAL MODULE

FIBER-BASED TRANSMITTER AND RECEIVER CHANNELS OF LIGHT DETECTION AN...

CABLE ADAPTER FOR A CAMERA CONVERTER

SYSTEM COMPRISING PACKAGED OPTICAL DEVICES

CO-PACKAGING OPTICAL MODULES WITH SURFACE AND EDGE COUPLING

OPTICAL SEMICONDUCTOR DEVICE

OPTICAL DEVICE AND BUMP ARRANGEMENT METHOD