having cavities

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CPC
H05K3/4697

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4697having cavities

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board and package substrate including same
- Patent number 12,211,781
- Issue date Jan 28, 2025
- LG Innotek Co., Ltd
- Se Woong Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component-containing substrate
- Patent number 12,200,871
- Issue date Jan 14, 2025
- Shinko Electric Industries Co., Ltd.
- Takao Koshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a printed circuit board with a self-aligned...
- Patent number 12,170,165
- Issue date Dec 17, 2024
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer printed circuit board
- Patent number 12,127,341
- Issue date Oct 22, 2024
- Thales
- Geoffroy Aupee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic wave transmission board comprising an inner board w...
- Patent number 12,074,357
- Issue date Aug 27, 2024
- BOARDTEK ELECTRONICS CORPORATION
- Chung-Hsing Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 12,035,485
- Issue date Jul 9, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Guh Hwan Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 11,997,801
- Issue date May 28, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Woo Seok Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board structure including a closed cavity
- Patent number 11,967,758
- Issue date Apr 23, 2024
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier having component covered with ultra-thin transiti...
- Patent number 11,963,310
- Issue date Apr 16, 2024
- AT&S(China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer resin substrate, and method of manufacturing multilayer...
- Patent number 11,963,294
- Issue date Apr 16, 2024
- Murata Manufacturing Co., Ltd.
- Tomohiro Furumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 11,963,311
- Issue date Apr 16, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Woong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity printed circuit board for three-dimensional IC package
- Patent number 11,963,296
- Issue date Apr 16, 2024
- Google LLC
- Yuan Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer with flexible portion
- Patent number 11,942,412
- Issue date Mar 26, 2024
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically functional circuit board core material
- Patent number 11,943,869
- Issue date Mar 26, 2024
- KEMET Electronics Corporation
- Brandon Summey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power device assemblies having embedded PCBS and enhanced cooling a...
- Patent number 11,910,521
- Issue date Feb 20, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with solder mask on internal copper pad
- Patent number 11,910,540
- Issue date Feb 20, 2024
- Pui Yin Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 11,856,701
- Issue date Dec 26, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hyun Woo Kwon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and manufacturing method for printed wiring board
- Patent number 11,849,546
- Issue date Dec 19, 2023
- Kyocera Corporation
- Atsuo Kawagoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and package substrate including same
- Patent number 11,842,893
- Issue date Dec 12, 2023
- LG Innotek Co., Ltd
- Se Woong Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating carrier structure
- Patent number 11,792,938
- Issue date Oct 17, 2023
- Silicon Precision Industries Co., Ltd.
- Yu-Lung Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic board having components in cavities and shared solder pa...
- Patent number 11,770,899
- Issue date Sep 26, 2023
- SAFRAN ELECTRONICS & DEFENSE
- Philippe Chocteau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with phase change material
- Patent number 11,742,259
- Issue date Aug 29, 2023
- Advanced Micro Devices, Inc.
- Manish Arora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter wave antenna and method of manufacturing the same
- Patent number 11,721,887
- Issue date Aug 8, 2023
- SHENZHEN JAGUAR WAVE TECHNOLOGY LTD.
- Haibo Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit carrier, package, and method for manufacturing a package
- Patent number 11,723,155
- Issue date Aug 8, 2023
- Siemens Aktiengesellschaft
- Stefan Pfefferlein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a packaged circuit structure
- Patent number 11,683,888
- Issue date Jun 20, 2023
- Leading Interconnect Semiconductor Technology Qinhuangdao Co, Ltd.
- Chun-Chieh Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with protruding thermally conductive tongue and c...
- Patent number 11,672,076
- Issue date Jun 6, 2023
- AT&SAustria Technologie & Systemtechnik AG
- Naoto Yokoi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hollow waveguide assembly formed by affixing first and second subst...
- Patent number 11,664,567
- Issue date May 30, 2023
- NXP B.V.
- Adrianus Buijsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of printed circuit board
- Patent number 11,641,719
- Issue date May 2, 2023
- SHENNAN CIRCUITS CO., LTD.
- Hegen Zhang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printed circuit board
- Patent number 11,641,715
- Issue date May 2, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Eun Sun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a self-aligned planar magnetic structure
- Patent number 11,640,873
- Issue date May 2, 2023
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD
- Publication number 20250048557
- Publication date Feb 6, 2025
- LG Innotek Co., Ltd.
- Soo Min LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240389241
- Publication date Nov 21, 2024
- DAEDUCK ELECTRONICS CO., LTD.
- Min-Geun JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONE...
- Publication number 20240298409
- Publication date Sep 5, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jong-Seok Na
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier For Waveguide Applications
- Publication number 20240292518
- Publication date Aug 29, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Heinrich Trischler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240268034
- Publication date Aug 8, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jesang Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME
- Publication number 20240237233
- Publication date Jul 11, 2024
- LG Innotek Co., Ltd.
- Jong Bae SHIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER BOARD AND CIRCUIT BOARD INCLUDING THE SAME
- Publication number 20240224436
- Publication date Jul 4, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Young Kuk Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING OF CAPACITORS ON PRINTED CIRCUIT BOARDS FOR NON-VOLATILE M...
- Publication number 20240224431
- Publication date Jul 4, 2024
- Western Digital Technologies, Inc.
- Uthayarajan AL Rasalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE ARCHITECTURES WITH IMPROVED COOLING
- Publication number 20240188212
- Publication date Jun 6, 2024
- Intel Corporation
- Mohammad Mamunur Rahman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240172368
- Publication date May 23, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Yun Je JI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE
- Publication number 20240164027
- Publication date May 16, 2024
- Innolux Corporation
- Ying-Jen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240147620
- Publication date May 2, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jin Uk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME
- Publication number 20240138077
- Publication date Apr 25, 2024
- LG Innotek Co., Ltd.
- Jong Bae SHIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240130051
- Publication date Apr 18, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Young Kuk Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND MANUFACTURING METHOD FOR PRINTED WIRING BOARD
- Publication number 20240121903
- Publication date Apr 11, 2024
- Kyocera Corporation
- Atsuo KAWAGOE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND PACKAGE SUBSTRATE INCLUDING SAME
- Publication number 20240055340
- Publication date Feb 15, 2024
- LG Innotek Co., Ltd.
- Se Woong NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240049389
- Publication date Feb 8, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jin Uk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUSTOMIZED THERMAL PATHWAYS IN A PCB
- Publication number 20240008190
- Publication date Jan 4, 2024
- DSBJ PTE. LTD.
- Todd Robinson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED MAGNETIC COMPONENT DEVICE INCLUDING VENTED CHANNEL AND MUL...
- Publication number 20230422400
- Publication date Dec 28, 2023
- Murata Manufacturing Co., Ltd.
- Takayuki TANGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier For Waveguide Applications
- Publication number 20230413421
- Publication date Dec 21, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Heinrich Trischler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE, FOR EXAMPLE AN OPTICAL PACKAGE, FOR AN INTEGRATED CIRCUIT
- Publication number 20230403791
- Publication date Dec 14, 2023
- STMicroelectronics (Grenoble 2) SAS
- Romain COFFY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAVITY BASED POWER DELIVERY AND DECOUPLING
- Publication number 20230397343
- Publication date Dec 7, 2023
- Cisco Technology, Inc.
- Mike Sapozhnikov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230335466
- Publication date Oct 19, 2023
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20230328886
- Publication date Oct 12, 2023
- LG Innotek Co., Ltd.
- Jong Bae SHIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD WITH SOLDER MASK ON INTERNAL COPPER PAD
- Publication number 20230328896
- Publication date Oct 12, 2023
- DSBJ PTE. LTD.
- Pui Yin YU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND CIRCUIT BOARD MODULE WITH DOCKING STRUCTURE AND M...
- Publication number 20230328900
- Publication date Oct 12, 2023
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING A CLOSED CAVITY PRINTED CIRCUIT BOARD WITH PATTERN...
- Publication number 20230328901
- Publication date Oct 12, 2023
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inlay With Exposed Porous Layer, Component Carrier and Manufacturin...
- Publication number 20230309236
- Publication date Sep 28, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Stefanie Paller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER DEVICE ASSEMBLIES HAVING EMBEDDED PCBS AND ENHANCED COOLING A...
- Publication number 20230300972
- Publication date Sep 21, 2023
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT-CONTAINING SUBSTRATE
- Publication number 20230300990
- Publication date Sep 21, 2023
- Shinko Electric Industries Co., Ltd.
- Takao KOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

having cavities

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board and package substrate including same

Component-containing substrate

Method of manufacturing a printed circuit board with a self-aligned...

Multilayer printed circuit board

Electromagnetic wave transmission board comprising an inner board w...

Printed circuit board and method for manufacturing the same

Printed circuit board

Printed circuit board structure including a closed cavity

Component carrier having component covered with ultra-thin transiti...

Multilayer resin substrate, and method of manufacturing multilayer...

Printed circuit board and method of manufacturing the same

Cavity printed circuit board for three-dimensional IC package

Interposer with flexible portion

Electrically functional circuit board core material

Power device assemblies having embedded PCBS and enhanced cooling a...

Circuit board with solder mask on internal copper pad

Printed circuit board

Printed wiring board and manufacturing method for printed wiring board

Printed circuit board and package substrate including same

Method for fabricating carrier structure

Electronic board having components in cavities and shared solder pa...

Circuit board with phase change material

Millimeter wave antenna and method of manufacturing the same

Circuit carrier, package, and method for manufacturing a package

Method for manufacturing a packaged circuit structure

Component carrier with protruding thermally conductive tongue and c...

Hollow waveguide assembly formed by affixing first and second subst...

Manufacturing method of printed circuit board

Printed circuit board

Method of manufacturing a self-aligned planar magnetic structure

Patents Applicationslast 30 patents

CIRCUIT BOARD

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONE...

Component Carrier For Waveguide Applications

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME

INTERPOSER BOARD AND CIRCUIT BOARD INCLUDING THE SAME

MOUNTING OF CAPACITORS ON PRINTED CIRCUIT BOARDS FOR NON-VOLATILE M...

PACKAGE SUBSTRATE ARCHITECTURES WITH IMPROVED COOLING

PRINTED CIRCUIT BOARD

MANUFACTURING METHOD OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD

CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PRINTED WIRING BOARD AND MANUFACTURING METHOD FOR PRINTED WIRING BOARD

PRINTED CIRCUIT BOARD AND PACKAGE SUBSTRATE INCLUDING SAME

PRINTED CIRCUIT BOARD

CUSTOMIZED THERMAL PATHWAYS IN A PCB

EMBEDDED MAGNETIC COMPONENT DEVICE INCLUDING VENTED CHANNEL AND MUL...

Component Carrier For Waveguide Applications

PACKAGE, FOR EXAMPLE AN OPTICAL PACKAGE, FOR AN INTEGRATED CIRCUIT

CAVITY BASED POWER DELIVERY AND DECOUPLING

ELECTRONIC PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD

CIRCUIT BOARD WITH SOLDER MASK ON INTERNAL COPPER PAD

CIRCUIT BOARD AND CIRCUIT BOARD MODULE WITH DOCKING STRUCTURE AND M...

METHOD OF MAKING A CLOSED CAVITY PRINTED CIRCUIT BOARD WITH PATTERN...

Inlay With Exposed Porous Layer, Component Carrier and Manufacturin...

POWER DEVICE ASSEMBLIES HAVING EMBEDDED PCBS AND ENHANCED COOLING A...

COMPONENT-CONTAINING SUBSTRATE