having edge contacts

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CPC
H05K3/3442

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/3442having edge contacts

Industries

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Patents Grantslast 30 patents

Information Patent Grant
High powered RF part for improved manufacturability
- Patent number 12,176,592
- Issue date Dec 24, 2024
- TTM Technologies Inc.
- Michael Len
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer ceramic electronic component, multi-layer ceramic elect...
- Patent number 12,170,174
- Issue date Dec 17, 2024
- Taiyo Yuden Co., Ltd.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and configuration for stacking multiple printed circuit boards
- Patent number 12,156,333
- Issue date Nov 26, 2024
- Mellanox Technologies, Ltd.
- Xiuzhuang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing textile with conductive yarns and integrate...
- Patent number 12,120,823
- Issue date Oct 15, 2024
- Myant Inc.
- Tony Chahine
- D04 - BRAIDING LACE-MAKING KNITTING TRIMMINGS NON-WOVEN FABRICS
Information Patent Grant
QFN device having a mechanism that enables an inspectable solder jo...
- Patent number 12,087,673
- Issue date Sep 10, 2024
- Texas Instruments Incorporated
- Abram Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical device having improved surface mounting electrodes
- Patent number 12,068,126
- Issue date Aug 20, 2024
- Bourns, Inc.
- Kelly C. Casey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switched capacitor converter package structure and method
- Patent number 12,028,980
- Issue date Jul 2, 2024
- Halo Microelectronics International
- Rui Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board with stacked passive components
- Patent number 12,022,618
- Issue date Jun 25, 2024
- Western Digital Technologies, Inc.
- Chien Te Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Quad flat no-lead package with wettable flanges
- Patent number 11,935,821
- Issue date Mar 19, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tombstone prevention for a surface mount device
- Patent number 11,917,761
- Issue date Feb 27, 2024
- Western Digital Technologies, Inc.
- Joyce Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component
- Patent number 11,894,195
- Issue date Feb 6, 2024
- TDK Corporation
- Yoji Tozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with compact passive component arrangement
- Patent number 11,837,588
- Issue date Dec 5, 2023
- Advanced Micro Devices, Inc.
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low noise capacitors
- Patent number 11,817,262
- Issue date Nov 14, 2023
- KYOCERA AVX Components Corporation
- Andrew P. Ritter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit film, display device, and method of fabricating pri...
- Patent number 11,737,215
- Issue date Aug 22, 2023
- Samsung Display Co., Ltd.
- Dong Hyun Lee
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Shield case and electronic circuit module
- Patent number 11,711,889
- Issue date Jul 25, 2023
- Lapis Semiconductor Co., Ltd.
- Mitsuhiro Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip resistor and mounting structure thereof
- Patent number 11,676,742
- Issue date Jun 13, 2023
- ROHM Co, Ltd.
- Masaki Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic module, electronic module, and e...
- Patent number 11,632,886
- Issue date Apr 18, 2023
- Canon Kabushiki Kaisha
- Mitsutoshi Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and electronic apparatus
- Patent number 11,532,415
- Issue date Dec 20, 2022
- Taiyo Yuden Co., Ltd.
- Yoshikazu Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer ceramic electronic component and circuit board
- Patent number 11,515,095
- Issue date Nov 29, 2022
- Taiyo Yuden Co., Ltd.
- Takashi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with compact passive component arrangement
- Patent number 11,495,588
- Issue date Nov 8, 2022
- Advanced Micro Devices, Inc.
- Milind Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electronic device
- Patent number 11,432,448
- Issue date Aug 30, 2022
- KEMET Electronics Corporation
- John E. McConnell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land for surface mounted component
- Patent number 11,399,431
- Issue date Jul 26, 2022
- Sony Corporation
- Norikimi Moriuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component module, electronic component unit, and method...
- Patent number 11,317,541
- Issue date Apr 26, 2022
- Murata Manufacturing Co., Ltd.
- Shinichiro Kuroiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with flexible terminal
- Patent number 11,297,721
- Issue date Apr 5, 2022
- VISHAY ISRAEL LTD.
- Michael Belman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic board comprising SMDS soldered on buried solder pads
- Patent number 11,284,519
- Issue date Mar 22, 2022
- Safran Electronics & Defense
- Denis Lecordier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component
- Patent number 11,227,721
- Issue date Jan 18, 2022
- TDK Corporation
- Yoji Tozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite electronic component and board having the same
- Patent number 11,206,737
- Issue date Dec 21, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Man Su Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Configurable substrate and systems
- Patent number 11,171,126
- Issue date Nov 9, 2021
- OCTAVO SYSTEMS LLC
- Masood Murtuza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite electronic component and board having the same
- Patent number 11,166,375
- Issue date Nov 2, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Man Su Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coil component and electronic device
- Patent number 11,164,693
- Issue date Nov 2, 2021
- Taiyo Yuden Co., Ltd.
- Satoshi Ito
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND CONFIGURATION FOR STACKING MULTIPLE PRINTED CIRCUIT BOARDS
- Publication number 20250024606
- Publication date Jan 16, 2025
- MELLANOX TECHNOLOGIES, LTD.
- Xiuzhuang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNT ELECTRICAL DEVICES AND METHODS
- Publication number 20240412937
- Publication date Dec 12, 2024
- BOURNS, INC
- Kelly C. CASEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CIRCU...
- Publication number 20240365464
- Publication date Oct 31, 2024
- Canon Kabushiki Kaisha
- HIROYUKI YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING ELECTRONIC COMPONENT MOUNTED SUBSTRATE
- Publication number 20240268036
- Publication date Aug 8, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Shingo OKAMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240237209
- Publication date Jul 11, 2024
- Unimicron Technology Corp.
- Ping-Tsung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID CIRCUIT BOARD DEVICE TO SUPPORT CIRCUIT REUSE AND METHOD OF...
- Publication number 20240206066
- Publication date Jun 20, 2024
- QUALCOMM Incorporated
- Christopher Kong Yee Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FOR PROVISIONALLY FIXING ELECTRONIC COMPONENT TO SOLDER PR...
- Publication number 20240196545
- Publication date Jun 13, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Yuki YOSHIOKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC MODULE, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURIN...
- Publication number 20240147624
- Publication date May 2, 2024
- Canon Kabushiki Kaisha
- NORITAKE TSUBOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240138063
- Publication date Apr 25, 2024
- Unimicron Technology Corp.
- Ping-Tsung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING S...
- Publication number 20240090125
- Publication date Mar 14, 2024
- KIOXIA Corporation
- Takashi YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND CONFIGURATION FOR STACKING MULTIPLE PRINTED CIRCUIT BOARDS
- Publication number 20240049393
- Publication date Feb 8, 2024
- MELLANOX TECHNOLOGIES, LTD.
- Xiuzhuang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED COMPONENT ARRAY STRUCTURE
- Publication number 20240015887
- Publication date Jan 11, 2024
- Tesla, Inc.
- Jin Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT FILM, DISPLAY DEVICE, AND METHOD OF FABRICATING PRI...
- Publication number 20230337364
- Publication date Oct 19, 2023
- SAMSUNG DISPLAY CO., LTD.
- Dong Hyun LEE
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
CHIP RESISTOR AND MOUNTING STRUCTURE THEREOF
- Publication number 20230282396
- Publication date Sep 7, 2023
- ROHM CO., LTD.
- Masaki YONEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOMBSTONE PREVENTION FOR A SURFACE MOUNT DEVICE
- Publication number 20230284388
- Publication date Sep 7, 2023
- Western Digital Technologies, Inc.
- Joyce Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-FREQUENCY ELECTRONIC COMPONENT
- Publication number 20230225049
- Publication date Jul 13, 2023
- MURATA MANUFACTURING CO., LTD.
- Hirofumi OIE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC MODULE, INTERMEDIATE CONNECTION MEMBER, AND ELECTRONIC D...
- Publication number 20230223713
- Publication date Jul 13, 2023
- Canon Kabushiki Kaisha
- Mitsutoshi Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MODULE AND METHOD OF MANUFACTURING ELECTRONIC...
- Publication number 20230225092
- Publication date Jul 13, 2023
- Murata Manufacturing Co., Ltd.
- Toru KOMATSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS, MOVING BODY, AND...
- Publication number 20230164915
- Publication date May 25, 2023
- Mitsubishi Electric Corporation
- Takeshi HIGASHIHATA
- B60 - VEHICLES IN GENERAL
Information Patent Application
MULTI-LAYER CERAMIC ELECTRONIC COMPONENT, MULTI-LAYER CERAMIC ELECT...
- Publication number 20230162925
- Publication date May 25, 2023
- Taiyo Yuden Co., Ltd.
- HIROAKI SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-RECIPROCAL CIRCUIT ELEMENT AND COMMUNICATION APPARATUS HAVING T...
- Publication number 20230139241
- Publication date May 4, 2023
- TDK Corporation
- Hidenori OHATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Switched Capacitor Converter Package Structure and Method
- Publication number 20230126760
- Publication date Apr 27, 2023
- Halo Microelectronics International
- Rui Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD WITH COMPACT PASSIVE COMPONENT ARRANGEMENT
- Publication number 20230047285
- Publication date Feb 16, 2023
- ADVANCED MICRO DEVICES, INC.
- MILIND S. BHAGAVAT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING TEXTILES WITH INTEGRATED ELECTRICAL PATHS A...
- Publication number 20230044571
- Publication date Feb 9, 2023
- Myant Inc.
- Tony CHAHINE
- D04 - BRAIDING LACE-MAKING KNITTING TRIMMINGS NON-WOVEN FABRICS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING SUBSTRATE, ELECTRONIC COMPONENT MOUNT...
- Publication number 20220408560
- Publication date Dec 22, 2022
- SONY GROUP CORPORATION
- Koji AOYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20220386467
- Publication date Dec 1, 2022
- Murata Manufacturing Co., Ltd.
- Satoshi YOKOMIZO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD WITH STACKED PASSIVE COMPONENTS
- Publication number 20220346234
- Publication date Oct 27, 2022
- Western Digital Technologies, Inc.
- Chien Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT FILM, DISPLAY DEVICE, AND METHOD OF FABRICATING PRI...
- Publication number 20210385950
- Publication date Dec 9, 2021
- SAMSUNG DISPLAY CO., LTD.
- Dong Hyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND ELECTRONIC APPARATUS
- Publication number 20210327623
- Publication date Oct 21, 2021
- TAIYO YUDEN CO., LTD.
- Yoshikazu MARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELD CASE AND ELECTRONIC CIRCUIT MODULE
- Publication number 20210307154
- Publication date Sep 30, 2021
- LAPIS SEMICONDUCTOR CO., LTD.
- Mitsuhiro NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

having edge contacts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High powered RF part for improved manufacturability

Multi-layer ceramic electronic component, multi-layer ceramic elect...

Method and configuration for stacking multiple printed circuit boards

Method of manufacturing textile with conductive yarns and integrate...

QFN device having a mechanism that enables an inspectable solder jo...

Electrical device having improved surface mounting electrodes

Switched capacitor converter package structure and method

Printed circuit board with stacked passive components

Quad flat no-lead package with wettable flanges

Tombstone prevention for a surface mount device

Electronic component

Circuit board with compact passive component arrangement

Low noise capacitors

Printed circuit film, display device, and method of fabricating pri...

Shield case and electronic circuit module

Chip resistor and mounting structure thereof

Method of manufacturing electronic module, electronic module, and e...

Electronic component and electronic apparatus

Multi-layer ceramic electronic component and circuit board

Circuit board with compact passive component arrangement

Method of forming an electronic device

Land for surface mounted component

Electronic component module, electronic component unit, and method...

Electronic component with flexible terminal

Electronic board comprising SMDS soldered on buried solder pads

Electronic component

Composite electronic component and board having the same

Configurable substrate and systems

Composite electronic component and board having the same

Coil component and electronic device

Patents Applicationslast 30 patents

METHOD AND CONFIGURATION FOR STACKING MULTIPLE PRINTED CIRCUIT BOARDS

SURFACE MOUNT ELECTRICAL DEVICES AND METHODS

CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CIRCU...

METHOD FOR PRODUCING ELECTRONIC COMPONENT MOUNTED SUBSTRATE

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

HYBRID CIRCUIT BOARD DEVICE TO SUPPORT CIRCUIT REUSE AND METHOD OF...

ADHESIVE FOR PROVISIONALLY FIXING ELECTRONIC COMPONENT TO SOLDER PR...

ELECTRONIC MODULE, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURIN...

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING S...

METHOD AND CONFIGURATION FOR STACKING MULTIPLE PRINTED CIRCUIT BOARDS

STACKED COMPONENT ARRAY STRUCTURE

PRINTED CIRCUIT FILM, DISPLAY DEVICE, AND METHOD OF FABRICATING PRI...

CHIP RESISTOR AND MOUNTING STRUCTURE THEREOF

TOMBSTONE PREVENTION FOR A SURFACE MOUNT DEVICE

HIGH-FREQUENCY ELECTRONIC COMPONENT

ELECTRONIC MODULE, INTERMEDIATE CONNECTION MEMBER, AND ELECTRONIC D...

ELECTRONIC COMPONENT MODULE AND METHOD OF MANUFACTURING ELECTRONIC...

SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS, MOVING BODY, AND...

MULTI-LAYER CERAMIC ELECTRONIC COMPONENT, MULTI-LAYER CERAMIC ELECT...

NON-RECIPROCAL CIRCUIT ELEMENT AND COMMUNICATION APPARATUS HAVING T...

Switched Capacitor Converter Package Structure and Method

CIRCUIT BOARD WITH COMPACT PASSIVE COMPONENT ARRANGEMENT

METHOD OF MANUFACTURING TEXTILES WITH INTEGRATED ELECTRICAL PATHS A...

ELECTRONIC COMPONENT MOUNTING SUBSTRATE, ELECTRONIC COMPONENT MOUNT...

METHOD OF MANUFACTURING ELECTRONIC COMPONENT

PRINTED CIRCUIT BOARD WITH STACKED PASSIVE COMPONENTS

PRINTED CIRCUIT FILM, DISPLAY DEVICE, AND METHOD OF FABRICATING PRI...

ELECTRONIC COMPONENT AND ELECTRONIC APPARATUS

SHIELD CASE AND ELECTRONIC CIRCUIT MODULE