Heatconductors between device and heatsink

Industry

CPC
H01L2023/4068

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2023/4068Heatconductors between device and heatsink

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and semiconductor module with improved heat di...
- Patent number 12,033,916
- Issue date Jul 9, 2024
- Mitsubishi Electric Corporation
- Hiroyuki Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Head unit and liquid discharge apparatus
- Patent number 11,996,341
- Issue date May 28, 2024
- Seiko Epson Corporation
- Shunsuke Yamamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,935,813
- Issue date Mar 19, 2024
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,764,126
- Issue date Sep 19, 2023
- Mitsubishi Electric Corporation
- Hideo Komo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,749,582
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including heat dissipation structure and fabri...
- Patent number 11,694,943
- Issue date Jul 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Add-in module
- Patent number 11,632,878
- Issue date Apr 18, 2023
- SHANNON SYSTEMS LTD.
- Jiangshan Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power semiconductor module
- Patent number 11,626,361
- Issue date Apr 11, 2023
- Kyocera Corporation
- Takashi Tojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a spring plate
- Patent number 11,621,213
- Issue date Apr 4, 2023
- Mitsubishi Electric Corporation
- Hideo Komo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dissipation of heat from a semiconductor chip
- Patent number 11,616,001
- Issue date Mar 28, 2023
- Innostar Service, Inc.
- Chih-Meng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Card-type connector having heat conductive members extending over t...
- Patent number 11,444,405
- Issue date Sep 13, 2022
- Japan Aviation Electronics Industry, Limited
- Tomohiro Nakamura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package structure
- Patent number 11,444,002
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for detaching a microprocessor from a heat sink
- Patent number 11,296,009
- Issue date Apr 5, 2022
- Intel Corporation
- Rolf Laido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and electronic device
- Patent number 11,282,767
- Issue date Mar 22, 2022
- ADVANCED SEMICONDUTOR ENGINEERING, INC.
- Hsin-En Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming flexure based cooling solutions for package stru...
- Patent number 11,276,625
- Issue date Mar 15, 2022
- Intel Corporation
- Siddarth Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation structure and heat dissipation method
- Patent number 11,229,114
- Issue date Jan 18, 2022
- NEC Platforms, Ltd.
- Jun Eto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, semiconductor device, and manufacturing metho...
- Patent number 11,195,775
- Issue date Dec 7, 2021
- Fuji Electric Co., Ltd.
- Takeshi Kamimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module for motherboard
- Patent number 11,195,779
- Issue date Dec 7, 2021
- Raytheon Company
- Michael Benjamin Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including heat dissipation structure and fabri...
- Patent number 11,177,192
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor module and semiconductor module
- Patent number 11,037,847
- Issue date Jun 15, 2021
- Renesas Electronics Corporation
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi layer thermal interface material
- Patent number 11,037,860
- Issue date Jun 15, 2021
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct bonded metal substrates with encapsulated phase change mater...
- Patent number 11,031,317
- Issue date Jun 8, 2021
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with partial integrated heat spreader
- Patent number 11,004,768
- Issue date May 11, 2021
- Intel Corporation
- Muhammad S. Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit device
- Patent number 10,930,578
- Issue date Feb 23, 2021
- Autonetworks Technologies, Ltd.
- Akira Haraguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreaders for use with semiconductor devices
- Patent number 10,847,439
- Issue date Nov 24, 2020
- Micron Technology, Inc.
- George E. Pax
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation device
- Patent number 10,790,215
- Issue date Sep 29, 2020
- COOLER MASTER TECHNOLOGY INC.
- Yu-Te Wei
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic apparatus for cooling heating element
- Patent number 10,727,155
- Issue date Jul 28, 2020
- Canon Kabushiki Kaisha
- Masayoshi Shibata
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Heart dissipator structure
- Patent number 10,721,841
- Issue date Jul 21, 2020
- YU QIN TECHNOLOGY, LTD.
- Chia-Sheng Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device apparatus with multiple thermally conductive path...
- Patent number 10,720,377
- Issue date Jul 21, 2020
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive lid and semiconductor device package
- Patent number 10,685,899
- Issue date Jun 16, 2020
- Advanced Semiconductor Engineering, Inc.
- Hsin-En Chen
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
MOUNTING BOARD, AND ELECTRIC APPARATUS EQUIPPED WITH MOUNTING BOARD
- Publication number 20240397606
- Publication date Nov 28, 2024
- Omron Corporation
- Junya MISHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240282664
- Publication date Aug 22, 2024
- Mitsubishi Electric Corporation
- Hidetoshi ISHIBASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE MODULE
- Publication number 20240258198
- Publication date Aug 1, 2024
- ACER INCORPORATED
- Yu-Shih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOATING HEAT SPREADER WITH GUIDED MECHANISM
- Publication number 20240258190
- Publication date Aug 1, 2024
- ADVANCED MICRO DEVICES, INC.
- Gamal REFAI-AHMED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CONTROL UNIT, MANUFACTURING METHOD THEREOF, AND ELECTRIC...
- Publication number 20240222335
- Publication date Jul 4, 2024
- ROBERT BOSCH GmbH
- Bo Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING A SEMICONDUCTOR MODULE
- Publication number 20240040689
- Publication date Feb 1, 2024
- INFINEON TECHNOLOGIES AG
- Ramdas Rangnath Ugale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER BLOCK BASED ON TOP-SIDE COOL SURFACE-MOUNT DISCRETE DEVICES W...
- Publication number 20240030096
- Publication date Jan 25, 2024
- Qorvo US, Inc.
- Ke Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION DEVICE
- Publication number 20230307317
- Publication date Sep 28, 2023
- AURAS Technology Co., Ltd.
- Cheng-Ju CHANG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Reinforcement Structure and Electronic Device
- Publication number 20230290743
- Publication date Sep 14, 2023
- Huawei Technologies Co., Ltd
- Zhenxing Xiong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230260869
- Publication date Aug 17, 2023
- Mitsubishi Electric Corporation
- Yuki MATSUTAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die, Heat Spreader, Semiconductor Package, Semiconduc...
- Publication number 20230197566
- Publication date Jun 22, 2023
- Intel Corporation
- Bernd WAIDHAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230187311
- Publication date Jun 15, 2023
- Fuji Electric Co., Ltd.
- Motohito HORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISSIPATION OF HEAT FROM A SEMICONDUCTOR CHIP
- Publication number 20230089958
- Publication date Mar 23, 2023
- Innostar Service, Inc.
- CHIH-MENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO CONTROL...
- Publication number 20230027076
- Publication date Jan 26, 2023
- Intel Corporation
- Andres Ramirez Macias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20220359343
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING HEAT DISSIPATION STRUCTURE AND FABRI...
- Publication number 20220077024
- Publication date Mar 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20220037228
- Publication date Feb 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220005745
- Publication date Jan 6, 2022
- Fuji Electric Co., Ltd.
- Ryoichi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210343623
- Publication date Nov 4, 2021
- Mitsubishi Electric Corporation
- Hideo KOMO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING FLEXURE BASED COOLING SOLUTIONS FOR PACKAGE STRU...
- Publication number 20210280495
- Publication date Sep 9, 2021
- Intel Corporation
- Siddarth Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20210225731
- Publication date Jul 22, 2021
- Mitsubishi Electric Corporation
- Hiroyuki MASUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20210210421
- Publication date Jul 8, 2021
- KYOCERA CORPORATION
- Takashi TOJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR PROCESSOR LOADING MECHANISMS
- Publication number 20210193558
- Publication date Jun 24, 2021
- Intel Corporation
- Ralph V. Miele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE FOR MOTHERBOARD
- Publication number 20210043542
- Publication date Feb 11, 2021
- Raytheon Company
- Michael Benjamin Brown
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTI-CHIP PACKAGE WITH PARTIAL INTEGRATED HEAT SPREADER
- Publication number 20210035886
- Publication date Feb 4, 2021
- Intel Corporation
- Muhammad S. Islam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATING STRUCTURE FOR ELECTRONIC UNITS AND DISPLAY DEVICE...
- Publication number 20210013124
- Publication date Jan 14, 2021
- NIPPON SEIKI CO., LTD.
- Mitsuru IKENO
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHO...
- Publication number 20210005528
- Publication date Jan 7, 2021
- Fuji Electric Co., Ltd.
- Takeshi KAMIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20200286811
- Publication date Sep 10, 2020
- Mitsubishi Electric Corporation
- Hideo KOMO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND ELECTRONIC DEVICE
- Publication number 20200266123
- Publication date Aug 20, 2020
- Advanced Semiconductor Engineering, Inc.
- Hsin-En CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC HEAT PATH DEVICES, AND SYSTEMS AND METHODS USING THE SAME
- Publication number 20200194337
- Publication date Jun 18, 2020
- TONY RAY BENSON
- H01 - BASIC ELECTRIC ELEMENTS

Heatconductors between device and heatsink

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and semiconductor module with improved heat di...

Head unit and liquid discharge apparatus

Semiconductor device

Semiconductor device and method of manufacturing semiconductor device

Package structure

Semiconductor device including heat dissipation structure and fabri...

Add-in module

Power semiconductor module

Semiconductor device including a spring plate

Dissipation of heat from a semiconductor chip

Card-type connector having heat conductive members extending over t...

Package structure

Method and apparatus for detaching a microprocessor from a heat sink

Semiconductor package structure and electronic device

Methods of forming flexure based cooling solutions for package stru...

Heat dissipation structure and heat dissipation method

Semiconductor module, semiconductor device, and manufacturing metho...

Electronic module for motherboard

Semiconductor device including heat dissipation structure and fabri...

Method of manufacturing semiconductor module and semiconductor module

Multi layer thermal interface material

Direct bonded metal substrates with encapsulated phase change mater...

Multi-chip package with partial integrated heat spreader

Circuit device

Heat spreaders for use with semiconductor devices

Heat dissipation device

Electronic apparatus for cooling heating element

Heart dissipator structure

Electronic device apparatus with multiple thermally conductive path...

Conductive lid and semiconductor device package

Patents Applicationslast 30 patents

MOUNTING BOARD, AND ELECTRIC APPARATUS EQUIPPED WITH MOUNTING BOARD

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

ELECTRONIC PACKAGE MODULE

FLOATING HEAT SPREADER WITH GUIDED MECHANISM

ELECTRONIC CONTROL UNIT, MANUFACTURING METHOD THEREOF, AND ELECTRIC...

SEMICONDUCTOR MODULE AND METHOD FOR FABRICATING A SEMICONDUCTOR MODULE

POWER BLOCK BASED ON TOP-SIDE COOL SURFACE-MOUNT DISCRETE DEVICES W...

HEAT DISSIPATION DEVICE

Reinforcement Structure and Electronic Device

SEMICONDUCTOR DEVICE

Semiconductor Die, Heat Spreader, Semiconductor Package, Semiconduc...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

DISSIPATION OF HEAT FROM A SEMICONDUCTOR CHIP

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO CONTROL...

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE INCLUDING HEAT DISSIPATION STRUCTURE AND FABRI...

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHODS OF FORMING FLEXURE BASED COOLING SOLUTIONS FOR PACKAGE STRU...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

POWER SEMICONDUCTOR MODULE

TECHNOLOGIES FOR PROCESSOR LOADING MECHANISMS

ELECTRONIC MODULE FOR MOTHERBOARD

MULTI-CHIP PACKAGE WITH PARTIAL INTEGRATED HEAT SPREADER

HEAT DISSIPATING STRUCTURE FOR ELECTRONIC UNITS AND DISPLAY DEVICE...

SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHO...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND ELECTRONIC DEVICE

DIELECTRIC HEAT PATH DEVICES, AND SYSTEMS AND METHODS USING THE SAME