Heating methods for reflowing of solder

Industry

CPC
H05K3/3494

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/3494Heating methods for reflowing of solder

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for flexible circuit cable attachment
- Patent number 12,185,476
- Issue date Dec 31, 2024
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level bump stack for chip scale package
- Patent number 12,177,988
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package positioning and fixing structure
- Patent number 12,119,287
- Issue date Oct 15, 2024
- Hitachi Astemo, Ltd.
- Binti Haridan Fatin Farhanah
- G01 - MEASURING TESTING
Information Patent Grant
Surface mount technology method and magnetic carrier system
- Patent number 12,114,435
- Issue date Oct 8, 2024
- SanDisk Technologies, Inc.
- Virgil Zhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for creating orthogonal solder interconnects
- Patent number 12,108,542
- Issue date Oct 1, 2024
- Raytheon Company
- Justin A. Kasemodel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection structure and manufacturing method therefor
- Patent number 12,100,923
- Issue date Sep 24, 2024
- Resonac Corporation
- Kunihiko Akai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid nanosilver/liquid metal ink composition and uses thereof
- Patent number 12,096,554
- Issue date Sep 17, 2024
- Xerox Corporation
- Naveen Chopra
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
QFN device having a mechanism that enables an inspectable solder jo...
- Patent number 12,087,673
- Issue date Sep 10, 2024
- Texas Instruments Incorporated
- Abram Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board assembly process using multiple solders and a...
- Patent number 12,035,483
- Issue date Jul 9, 2024
- Dell Products L.P.
- Subramanian Vasudevan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reflow furnace
- Patent number 12,013,185
- Issue date Jun 18, 2024
- Illinois Tool Works Inc.
- Yuwei Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering apparatus
- Patent number 11,986,899
- Issue date May 21, 2024
- ERSA GmbH
- Lothar Endreß
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connection test for unpopulated printed circuit boards
- Patent number 11,940,481
- Issue date Mar 26, 2024
- Dyconex AG
- Daniel Luchsinger
- G01 - MEASURING TESTING
Information Patent Grant
Flexible inlay and manufacturing method thereof
- Patent number 11,895,777
- Issue date Feb 6, 2024
- IDEX Biometrics ASA
- David N. Light
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging structure with embedded electronic components and method...
- Patent number 11,864,329
- Issue date Jan 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Chih-Chieh Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and semiconductor device
- Patent number 11,837,554
- Issue date Dec 5, 2023
- Kioxia Corporation
- Ryujiro Bando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing intermetallic compound
- Patent number 11,821,058
- Issue date Nov 21, 2023
- Murata Manufacturing Co., Ltd.
- Seitaro Washizuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Front-end module comprising front-end components and a substrate in...
- Patent number 11,777,186
- Issue date Oct 3, 2023
- Allen-Vanguard Corporation
- Sulav Adhikari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a high-temperature resistant lead free solder...
- Patent number 11,772,179
- Issue date Oct 3, 2023
- ENDRESS+HAUSER SE+CO.KG
- Elke Schmidt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic board having components in cavities and shared solder pa...
- Patent number 11,770,899
- Issue date Sep 26, 2023
- SAFRAN ELECTRONICS & DEFENSE
- Philippe Chocteau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for flexible circuit cable attachment
- Patent number 11,765,837
- Issue date Sep 19, 2023
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED precision assembly method
- Patent number 11,749,791
- Issue date Sep 5, 2023
- Jabil Inc.
- Weiping Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for making electrical connectors with an electrical interposer
- Patent number 11,715,895
- Issue date Aug 1, 2023
- Seagate Technology LLC
- Michael J. Peterson
- G11 - INFORMATION STORAGE
Information Patent Grant
Reflow oven with a controllably connected blocked exhaust zone
- Patent number 11,697,168
- Issue date Jul 11, 2023
- Illinois Tool Works Inc.
- Yuwei Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sleeve soldering device and method of producing electronic device
- Patent number 11,696,411
- Issue date Jul 4, 2023
- Denso Corporation
- Hayato Kiuchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling system for a reflow furnace
- Patent number 11,679,444
- Issue date Jun 20, 2023
- Illinois Tool Works Inc.
- Shenghu Yan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reflow grid array to support late attach of components
- Patent number 11,683,890
- Issue date Jun 20, 2023
- Intel Corporation
- Jonathan W. Thibado
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for curing solder paste on a thermally fragile substrate
- Patent number 11,647,594
- Issue date May 9, 2023
- PulseForge, Inc.
- Rob Jacob Hendriks
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module structure
- Patent number 11,647,587
- Issue date May 9, 2023
- Delta Electronics, Inc.
- Da Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-resolution soldering
- Patent number 11,627,667
- Issue date Apr 11, 2023
- Orbotech Ltd.
- Zvi Kotler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Welding quality processing method and device, and circuit board
- Patent number 11,617,258
- Issue date Mar 28, 2023
- BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
- Zhenya Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...
- Publication number 20240389240
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chao-Wei Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR ALIGNING CONTACT SURFACES OF AN ELECTRICAL AND/OR ELECTR...
- Publication number 20240381542
- Publication date Nov 14, 2024
- ROBERT BOSCH GmbH
- Jivan Kapoor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MOUNTING ELECTRONIC DEVICES AND PARTIALLY SHIELDED BOARD...
- Publication number 20240365523
- Publication date Oct 31, 2024
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Sei UEMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REFLOW FURNACE
- Publication number 20240344771
- Publication date Oct 17, 2024
- Illinois Tool Works Inc.
- Yuwei WANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY PROCESS USING MULTIPLE SOLDERS AND A...
- Publication number 20240341040
- Publication date Oct 10, 2024
- Dell Products L.P.
- Subramanian Vasudevan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF BONDING COLUMN TYPE DEPOSITS
- Publication number 20240314939
- Publication date Sep 19, 2024
- PROTEC CO., LTD.
- Youn Sung Ko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL
- Publication number 20240237228
- Publication date Jul 11, 2024
- International Business Machines Corporation
- Theron Lee Lewis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240179850
- Publication date May 30, 2024
- Samsung Electronics Co., Ltd.
- Chunghyo JUNG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL
- Publication number 20240138074
- Publication date Apr 25, 2024
- International Business Machines Corporation
- Theron Lee Lewis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...
- Publication number 20240107682
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chao-Wei Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEADFRAME MOUNTING WITH LEAD INSERTION FOR LEAD WALL BONDING
- Publication number 20240090130
- Publication date Mar 14, 2024
- Semiconductor Components Industries, LLC
- Chad CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
- Publication number 20240049400
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Youngja KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT-END MODULE COMPRISING FRONT-END COMPONENTS AND A SUBSTRATE IN...
- Publication number 20240030575
- Publication date Jan 25, 2024
- ALLEN-VANGUARD CORPORATION
- Sulav ADHIKARI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING-RELATED SYSTEM
- Publication number 20240008235
- Publication date Jan 4, 2024
- FUJI CORPORATION
- Shigeto OYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Apparatus for Flexible Circuit Cable Attachment
- Publication number 20240008189
- Publication date Jan 4, 2024
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLING METHOD OF ELECTRONIC MODULE
- Publication number 20230413450
- Publication date Dec 21, 2023
- Delta Electronics, Inc.
- Kun Jiang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROLLED LOCAL HEATING OF SUBSTRATES
- Publication number 20230373023
- Publication date Nov 23, 2023
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Rob Jacob HENDRIKS
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Surface Mount Technology Method and Magnetic Carrier System
- Publication number 20230371185
- Publication date Nov 16, 2023
- Western Digital Technologies, Inc.
- Virgil Zhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR STACKING PRINTED CIRCUIT BOARD ASSEMBLIES...
- Publication number 20230363094
- Publication date Nov 9, 2023
- Jabil Inc.
- Zambri Bin Samsudin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING STRUCTURE WITH EMBEDDED ELECTRONIC COMPONENTS AND METHOD...
- Publication number 20230345643
- Publication date Oct 26, 2023
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHIH-CHIEH FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A MANUFACTURING PROCESS TO ENHANCE SURFACE MOUNT SOLDER PAD JOINT F...
- Publication number 20230269884
- Publication date Aug 24, 2023
- Fraser Murray SHAW
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES WITH CONDUCTIVE OR MAGNETIC NANOWIRES FOR LOCALIZED HEATING...
- Publication number 20230223324
- Publication date Jul 13, 2023
- Regents of the University of Minnesota
- Bethanie J Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED CONTROL USING AI IN APPARATUS HAVING IR CAMERA HEAT DETECT...
- Publication number 20230180395
- Publication date Jun 8, 2023
- IIIinois Tool Works Inc.
- Eric Wayne Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC MODULE ASSEMBLY STRUCTURE
- Publication number 20230146529
- Publication date May 11, 2023
- Delta Electronics, Inc.
- Kun Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING SYSTEM
- Publication number 20230147525
- Publication date May 11, 2023
- ERSA GMBH
- Alexander Diehm
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT
- Publication number 20230145507
- Publication date May 11, 2023
- Japan Aviation Electronics Industry, Limited
- Osamu Hashiguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERING APPARATUS
- Publication number 20230141430
- Publication date May 11, 2023
- ERSA GMBH
- Lothar Endreß
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITOR, CAPACITOR MANUFACTURING METHOD, AND CAPACITOR MOUNTING M...
- Publication number 20230114631
- Publication date Apr 13, 2023
- NIPPON CHEMI-CON CORPORATION
- Ryuuta Inoue
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE INLAY AND MANUFACTURING METHOD THEREOF
- Publication number 20230101831
- Publication date Mar 30, 2023
- IDEX Biometrics ASA
- David N. Light
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTIVE HEAT SHIELDS FOR THERMALLY SENSITIVE COMPONENTS AND METH...
- Publication number 20230086271
- Publication date Mar 23, 2023
- Flex Ltd.
- Zohair Mehkri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Heating methods for reflowing of solder

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and apparatus for flexible circuit cable attachment

Wafer level bump stack for chip scale package

Chip package positioning and fixing structure

Surface mount technology method and magnetic carrier system

System and method for creating orthogonal solder interconnects

Connection structure and manufacturing method therefor

Hybrid nanosilver/liquid metal ink composition and uses thereof

QFN device having a mechanism that enables an inspectable solder jo...

Printed circuit board assembly process using multiple solders and a...

Reflow furnace

Soldering apparatus

Electrical connection test for unpopulated printed circuit boards

Flexible inlay and manufacturing method thereof

Packaging structure with embedded electronic components and method...

Semiconductor package and semiconductor device

Method for producing intermetallic compound

Front-end module comprising front-end components and a substrate in...

Method for producing a high-temperature resistant lead free solder...

Electronic board having components in cavities and shared solder pa...

Method and apparatus for flexible circuit cable attachment

LED precision assembly method

Methods for making electrical connectors with an electrical interposer

Reflow oven with a controllably connected blocked exhaust zone

Sleeve soldering device and method of producing electronic device

Cooling system for a reflow furnace

Reflow grid array to support late attach of components

Method for curing solder paste on a thermally fragile substrate

Power module structure

High-resolution soldering

Welding quality processing method and device, and circuit board

Patents Applicationslast 30 patents

MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...

METHOD FOR ALIGNING CONTACT SURFACES OF AN ELECTRICAL AND/OR ELECTR...

METHOD OF MOUNTING ELECTRONIC DEVICES AND PARTIALLY SHIELDED BOARD...

REFLOW FURNACE

PRINTED CIRCUIT BOARD ASSEMBLY PROCESS USING MULTIPLE SOLDERS AND A...

METHOD OF BONDING COLUMN TYPE DEPOSITS

REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR

REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL

MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...

LEADFRAME MOUNTING WITH LEAD INSERTION FOR LEAD WALL BONDING

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...

FRONT-END MODULE COMPRISING FRONT-END COMPONENTS AND A SUBSTRATE IN...

MOUNTING-RELATED SYSTEM

Method and Apparatus for Flexible Circuit Cable Attachment

ASSEMBLING METHOD OF ELECTRONIC MODULE

CONTROLLED LOCAL HEATING OF SUBSTRATES

Surface Mount Technology Method and Magnetic Carrier System

METHOD AND APPARATUS FOR STACKING PRINTED CIRCUIT BOARD ASSEMBLIES...

PACKAGING STRUCTURE WITH EMBEDDED ELECTRONIC COMPONENTS AND METHOD...

A MANUFACTURING PROCESS TO ENHANCE SURFACE MOUNT SOLDER PAD JOINT F...

DEVICES WITH CONDUCTIVE OR MAGNETIC NANOWIRES FOR LOCALIZED HEATING...

ENHANCED CONTROL USING AI IN APPARATUS HAVING IR CAMERA HEAT DETECT...

ELECTRONIC MODULE ASSEMBLY STRUCTURE

SOLDERING SYSTEM

ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT

SOLDERING APPARATUS

CAPACITOR, CAPACITOR MANUFACTURING METHOD, AND CAPACITOR MOUNTING M...

FLEXIBLE INLAY AND MANUFACTURING METHOD THEREOF

PROTECTIVE HEAT SHIELDS FOR THERMALLY SENSITIVE COMPONENTS AND METH...