Heating methods for reflowing of solder

Industry

CPC
H05K3/3494

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/3494Heating methods for reflowing of solder

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electrical connection test for unpopulated printed circuit boards
- Patent number 11,940,481
- Issue date Mar 26, 2024
- Dyconex AG
- Daniel Luchsinger
- G01 - MEASURING TESTING
Information Patent Grant
Flexible inlay and manufacturing method thereof
- Patent number 11,895,777
- Issue date Feb 6, 2024
- IDEX Biometrics ASA
- David N. Light
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging structure with embedded electronic components and method...
- Patent number 11,864,329
- Issue date Jan 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Chih-Chieh Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and semiconductor device
- Patent number 11,837,554
- Issue date Dec 5, 2023
- Kioxia Corporation
- Ryujiro Bando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing intermetallic compound
- Patent number 11,821,058
- Issue date Nov 21, 2023
- Murata Manufacturing Co., Ltd.
- Seitaro Washizuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Front-end module comprising front-end components and a substrate in...
- Patent number 11,777,186
- Issue date Oct 3, 2023
- Allen-Vanguard Corporation
- Sulav Adhikari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a high-temperature resistant lead free solder...
- Patent number 11,772,179
- Issue date Oct 3, 2023
- ENDRESS+HAUSER SE+CO.KG
- Elke Schmidt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic board having components in cavities and shared solder pa...
- Patent number 11,770,899
- Issue date Sep 26, 2023
- SAFRAN ELECTRONICS & DEFENSE
- Philippe Chocteau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for flexible circuit cable attachment
- Patent number 11,765,837
- Issue date Sep 19, 2023
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED precision assembly method
- Patent number 11,749,791
- Issue date Sep 5, 2023
- Jabil Inc.
- Weiping Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for making electrical connectors with an electrical interposer
- Patent number 11,715,895
- Issue date Aug 1, 2023
- Seagate Technology LLC
- Michael J. Peterson
- G11 - INFORMATION STORAGE
Information Patent Grant
Reflow oven with a controllably connected blocked exhaust zone
- Patent number 11,697,168
- Issue date Jul 11, 2023
- Illinois Tool Works Inc.
- Yuwei Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sleeve soldering device and method of producing electronic device
- Patent number 11,696,411
- Issue date Jul 4, 2023
- Denso Corporation
- Hayato Kiuchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling system for a reflow furnace
- Patent number 11,679,444
- Issue date Jun 20, 2023
- Illinois Tool Works Inc.
- Shenghu Yan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reflow grid array to support late attach of components
- Patent number 11,683,890
- Issue date Jun 20, 2023
- Intel Corporation
- Jonathan W. Thibado
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for curing solder paste on a thermally fragile substrate
- Patent number 11,647,594
- Issue date May 9, 2023
- PulseForge, Inc.
- Rob Jacob Hendriks
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module structure
- Patent number 11,647,587
- Issue date May 9, 2023
- Delta Electronics, Inc.
- Da Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-resolution soldering
- Patent number 11,627,667
- Issue date Apr 11, 2023
- Orbotech Ltd.
- Zvi Kotler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Welding quality processing method and device, and circuit board
- Patent number 11,617,258
- Issue date Mar 28, 2023
- BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
- Zhenya Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for in-situ warpage monitoring during solder reflow for hea...
- Patent number 11,558,964
- Issue date Jan 17, 2023
- International Business Machines Corporation
- Jennifer I. Bennett
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for removing an adhesively-attached component f...
- Patent number 11,553,631
- Issue date Jan 10, 2023
- Raytheon Company
- Michael Spencer Dunn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protective heat shields for thermally sensitive components and meth...
- Patent number 11,516,924
- Issue date Nov 29, 2022
- Flex Ltd.
- Zohair Mehkri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid nanosilver/liquid metal ink composition and uses thereof
- Patent number 11,510,314
- Issue date Nov 22, 2022
- Xerox Corporation
- Naveen Chopra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 11,503,710
- Issue date Nov 15, 2022
- Delta Electronics, Inc.
- Yahong Xiong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
QFN device having a mechanism that enables an inspectable solder jo...
- Patent number 11,495,524
- Issue date Nov 8, 2022
- Texas Instruments Incorporated
- Abram Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflowable grid array as standby heater for reliability
- Patent number 11,488,839
- Issue date Nov 1, 2022
- Intel Corporation
- Jonathan W. Thibado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for bonding a chip to a substrate
- Patent number 11,476,228
- Issue date Oct 18, 2022
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Gari Arutinov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ovens for equipment such as die attach systems, flip chip bonding s...
- Patent number 11,465,224
- Issue date Oct 11, 2022
- Kulicke and Soffa Industries, Inc.
- Christoph Benno Luechinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate inspection device that inspects application quality of ad...
- Patent number 11,452,250
- Issue date Sep 20, 2022
- CKD Corporation
- Ikuo Futamura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multilayered ceramic substrate and method for manufacturing same
- Patent number 11,419,218
- Issue date Aug 16, 2022
- DIT CO., LTD.
- Tae Hyung Noh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL
- Publication number 20240138074
- Publication date Apr 25, 2024
- International Business Machines Corporation
- Theron Lee Lewis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...
- Publication number 20240107682
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chao-Wei Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEADFRAME MOUNTING WITH LEAD INSERTION FOR LEAD WALL BONDING
- Publication number 20240090130
- Publication date Mar 14, 2024
- Semiconductor Components Industries, LLC
- Chad CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
- Publication number 20240049400
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Youngja KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT-END MODULE COMPRISING FRONT-END COMPONENTS AND A SUBSTRATE IN...
- Publication number 20240030575
- Publication date Jan 25, 2024
- ALLEN-VANGUARD CORPORATION
- Sulav ADHIKARI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Flexible Circuit Cable Attachment
- Publication number 20240008189
- Publication date Jan 4, 2024
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING-RELATED SYSTEM
- Publication number 20240008235
- Publication date Jan 4, 2024
- FUJI CORPORATION
- Shigeto OYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLING METHOD OF ELECTRONIC MODULE
- Publication number 20230413450
- Publication date Dec 21, 2023
- Delta Electronics, Inc.
- Kun Jiang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROLLED LOCAL HEATING OF SUBSTRATES
- Publication number 20230373023
- Publication date Nov 23, 2023
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Rob Jacob HENDRIKS
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Surface Mount Technology Method and Magnetic Carrier System
- Publication number 20230371185
- Publication date Nov 16, 2023
- Western Digital Technologies, Inc.
- Virgil Zhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR STACKING PRINTED CIRCUIT BOARD ASSEMBLIES...
- Publication number 20230363094
- Publication date Nov 9, 2023
- Jabil Inc.
- Zambri Bin Samsudin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING STRUCTURE WITH EMBEDDED ELECTRONIC COMPONENTS AND METHOD...
- Publication number 20230345643
- Publication date Oct 26, 2023
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHIH-CHIEH FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A MANUFACTURING PROCESS TO ENHANCE SURFACE MOUNT SOLDER PAD JOINT F...
- Publication number 20230269884
- Publication date Aug 24, 2023
- Fraser Murray SHAW
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES WITH CONDUCTIVE OR MAGNETIC NANOWIRES FOR LOCALIZED HEATING...
- Publication number 20230223324
- Publication date Jul 13, 2023
- Regents of the University of Minnesota
- Bethanie J Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED CONTROL USING AI IN APPARATUS HAVING IR CAMERA HEAT DETECT...
- Publication number 20230180395
- Publication date Jun 8, 2023
- IIIinois Tool Works Inc.
- Eric Wayne Becker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC MODULE ASSEMBLY STRUCTURE
- Publication number 20230146529
- Publication date May 11, 2023
- Delta Electronics, Inc.
- Kun Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING SYSTEM
- Publication number 20230147525
- Publication date May 11, 2023
- ERSA GMBH
- Alexander Diehm
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT
- Publication number 20230145507
- Publication date May 11, 2023
- Japan Aviation Electronics Industry, Limited
- Osamu Hashiguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERING APPARATUS
- Publication number 20230141430
- Publication date May 11, 2023
- ERSA GMBH
- Lothar Endreß
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITOR, CAPACITOR MANUFACTURING METHOD, AND CAPACITOR MOUNTING M...
- Publication number 20230114631
- Publication date Apr 13, 2023
- NIPPON CHEMI-CON CORPORATION
- Ryuuta Inoue
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE INLAY AND MANUFACTURING METHOD THEREOF
- Publication number 20230101831
- Publication date Mar 30, 2023
- IDEX Biometrics ASA
- David N. Light
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTIVE HEAT SHIELDS FOR THERMALLY SENSITIVE COMPONENTS AND METH...
- Publication number 20230086271
- Publication date Mar 23, 2023
- Flex Ltd.
- Zohair Mehkri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230060577
- Publication date Mar 2, 2023
- Showa Denko Materials Co., Ltd.
- Kunihiko AKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN Device Having A Mechanism That Enables An Inspectable Solder Jo...
- Publication number 20230057405
- Publication date Feb 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Abram Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID NANOSILVER/LIQUID METAL INK COMPOSITION AND USES THEREOF
- Publication number 20220418104
- Publication date Dec 29, 2022
- Xerox Corporation
- Naveen CHOPRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING WIRING BOARD, ELECTRONIC DEVICE MOUNTING BOARD, METHOD OF...
- Publication number 20220402058
- Publication date Dec 22, 2022
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Kenji KANAZAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING SUBSTRATE, ELECTRONIC COMPONENT MOUNT...
- Publication number 20220408560
- Publication date Dec 22, 2022
- SONY GROUP CORPORATION
- Koji AOYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD TO MULTI-SOURCE PD CONTROLLERS FOR USB4 SOLUTIONS AND SYSTEMS
- Publication number 20220408561
- Publication date Dec 22, 2022
- Intel Corporation
- Tomer SAVARIEGO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming Silicon Carbide Module Integrated Structure
- Publication number 20220394857
- Publication date Dec 8, 2022
- PHIHONG TECHNOLOGY CO., LTD.
- Kao Ping Lo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINTERING COMPOSITION
- Publication number 20220371089
- Publication date Nov 24, 2022
- Alpha Assembly Solutions Inc.
- Shamik GHOSHAL
- B22 - CASTING POWDER METALLURGY

Heating methods for reflowing of solder

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electrical connection test for unpopulated printed circuit boards

Flexible inlay and manufacturing method thereof

Packaging structure with embedded electronic components and method...

Semiconductor package and semiconductor device

Method for producing intermetallic compound

Front-end module comprising front-end components and a substrate in...

Method for producing a high-temperature resistant lead free solder...

Electronic board having components in cavities and shared solder pa...

Method and apparatus for flexible circuit cable attachment

LED precision assembly method

Methods for making electrical connectors with an electrical interposer

Reflow oven with a controllably connected blocked exhaust zone

Sleeve soldering device and method of producing electronic device

Cooling system for a reflow furnace

Reflow grid array to support late attach of components

Method for curing solder paste on a thermally fragile substrate

Power module structure

High-resolution soldering

Welding quality processing method and device, and circuit board

Process for in-situ warpage monitoring during solder reflow for hea...

Systems and methods for removing an adhesively-attached component f...

Protective heat shields for thermally sensitive components and meth...

Hybrid nanosilver/liquid metal ink composition and uses thereof

Power module

QFN device having a mechanism that enables an inspectable solder jo...

Reflowable grid array as standby heater for reliability

Method and system for bonding a chip to a substrate

Ovens for equipment such as die attach systems, flip chip bonding s...

Substrate inspection device that inspects application quality of ad...

Multilayered ceramic substrate and method for manufacturing same

Patents Applicationslast 30 patents

REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL

MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...

LEADFRAME MOUNTING WITH LEAD INSERTION FOR LEAD WALL BONDING

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...

FRONT-END MODULE COMPRISING FRONT-END COMPONENTS AND A SUBSTRATE IN...

Method and Apparatus for Flexible Circuit Cable Attachment

MOUNTING-RELATED SYSTEM

ASSEMBLING METHOD OF ELECTRONIC MODULE

CONTROLLED LOCAL HEATING OF SUBSTRATES

Surface Mount Technology Method and Magnetic Carrier System

METHOD AND APPARATUS FOR STACKING PRINTED CIRCUIT BOARD ASSEMBLIES...

PACKAGING STRUCTURE WITH EMBEDDED ELECTRONIC COMPONENTS AND METHOD...

A MANUFACTURING PROCESS TO ENHANCE SURFACE MOUNT SOLDER PAD JOINT F...

DEVICES WITH CONDUCTIVE OR MAGNETIC NANOWIRES FOR LOCALIZED HEATING...

ENHANCED CONTROL USING AI IN APPARATUS HAVING IR CAMERA HEAT DETECT...

ELECTRONIC MODULE ASSEMBLY STRUCTURE

SOLDERING SYSTEM

ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT

SOLDERING APPARATUS

CAPACITOR, CAPACITOR MANUFACTURING METHOD, AND CAPACITOR MOUNTING M...

FLEXIBLE INLAY AND MANUFACTURING METHOD THEREOF

PROTECTIVE HEAT SHIELDS FOR THERMALLY SENSITIVE COMPONENTS AND METH...

CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR

QFN Device Having A Mechanism That Enables An Inspectable Solder Jo...

HYBRID NANOSILVER/LIQUID METAL INK COMPOSITION AND USES THEREOF

MOUNTING WIRING BOARD, ELECTRONIC DEVICE MOUNTING BOARD, METHOD OF...

ELECTRONIC COMPONENT MOUNTING SUBSTRATE, ELECTRONIC COMPONENT MOUNT...

METHOD TO MULTI-SOURCE PD CONTROLLERS FOR USB4 SOLUTIONS AND SYSTEMS

Method for Forming Silicon Carbide Module Integrated Structure

SINTERING COMPOSITION