High frequency adaptations

Industry

CPC
H05K1/0237

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0237High frequency adaptations

Industries

Patents Grantslast 30 patents

Information Patent Grant
Surface wave launcher for high-speed data links over high-voltage p...
- Patent number 12,137,517
- Issue date Nov 5, 2024
- Intel Corporation
- Vishram Shriram Pandit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal transmission line comprising stacked insulating layers havin...
- Patent number 12,119,531
- Issue date Oct 15, 2024
- Murata Manufacturing Co., Ltd.
- Nobuo Ikemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit module for mounting high frequency circuit carriers
- Patent number 12,101,876
- Issue date Sep 24, 2024
- Rohde & Schwarz GmbH & Co. KG
- Nico Riedmann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package with integrated waveguide launcher
- Patent number 12,074,124
- Issue date Aug 27, 2024
- NXP B.V.
- Abdellatif Zanati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing circuit board and circuit board assembly
- Patent number 12,063,752
- Issue date Aug 13, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Wen-Zhu Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Waveguide including a substrate having a coplanar waveguide and a s...
- Patent number 12,057,612
- Issue date Aug 6, 2024
- Alibaba Group Holding Limited
- Hua Xu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flexible hybrid interconnect circuits
- Patent number 12,052,814
- Issue date Jul 30, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna and foldable electronic device including the same
- Patent number 12,034,466
- Issue date Jul 9, 2024
- Samsung Electronics Co., Ltd.
- Taeyun Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Transmission apparatus, printed circuit board, and information appl...
- Patent number 12,027,743
- Issue date Jul 2, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Kazuya Sawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid coupler and method for manufacturing hybrid couplers
- Patent number 12,027,745
- Issue date Jul 2, 2024
- CommScope Technologies LLC
- Kamalakar Yeddula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency crossover with high isolation in microelectronics H...
- Patent number 12,022,608
- Issue date Jun 25, 2024
- Northrop Grumman Systems Corporation
- Dah-Weih Duan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed flexible wiring apparatus in a cryostat
- Patent number 12,016,138
- Issue date Jun 18, 2024
- EQUAL 1 LABORATORIES IRELAND LIMITED
- Hans Haenlein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plurality of antennas and electronic device comprising same
- Patent number 12,010,255
- Issue date Jun 11, 2024
- Samsung Electronics Co., Ltd.
- Hojung Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible substrate and electronic device
- Patent number 12,004,289
- Issue date Jun 4, 2024
- Murata Manufacturing Co., Ltd.
- Tomohiro Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and information processing device
- Patent number 12,003,047
- Issue date Jun 4, 2024
- Hitachi, Ltd.
- Norio Chujo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer board
- Patent number 12,004,290
- Issue date Jun 4, 2024
- Murata Manufacturing Co., Ltd.
- Nobuyuki Tenno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 11,974,388
- Issue date Apr 30, 2024
- LG Innotek Co., Ltd
- Byeong Kyun Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including antenna
- Patent number 11,963,290
- Issue date Apr 16, 2024
- Samsung Electronics Co., Ltd.
- Jongwoo Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sample holder and superconducting quantum computer
- Patent number 11,956,889
- Issue date Apr 9, 2024
- NEC Corporation
- Yoshihito Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board for transmitting high-frequency signal and method for...
- Patent number 11,950,357
- Issue date Apr 2, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Fu-Yun Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and related method for providing unidirectional microwave pr...
- Patent number 11,946,878
- Issue date Apr 2, 2024
- University of Manitoba
- Can-Ming Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition for circuit board, molded body for circuit board,...
- Patent number 11,939,450
- Issue date Mar 26, 2024
- Daikin Industries, Ltd.
- Hirofumi Mukae
- B32 - LAYERED PRODUCTS
Information Patent Grant
Wiring substrate, antenna module, and communication device
- Patent number 11,936,096
- Issue date Mar 19, 2024
- Murata Manufacturing Co., Ltd.
- Norikazu Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission line assembly
- Patent number 11,936,089
- Issue date Mar 19, 2024
- Denso Corporation
- Yuuji Kakuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic coupler including spaced apart coupled conductors h...
- Patent number 11,929,540
- Issue date Mar 12, 2024
- BAE SYSTEMS AUSTRALIA LIMITED
- Michel A Ross
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate integrated waveguide (SIW) including fences with wall str...
- Patent number 11,909,089
- Issue date Feb 20, 2024
- VAYYAR IMAGING LTD.
- Naftali Chayat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for high-speed signal layer transition
- Patent number 11,889,617
- Issue date Jan 30, 2024
- BAIDU USA LLC
- Zhenwei Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency component
- Patent number 11,876,277
- Issue date Jan 16, 2024
- ENDRESS+HAUSER SE+CO.KG
- Martin Hitzler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate and antenna module
- Patent number 11,864,308
- Issue date Jan 2, 2024
- Fujikura Ltd.
- Michikazu Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna structure comprising transmission line for transitioning an...
- Patent number 11,864,309
- Issue date Jan 2, 2024
- Samsung Electronics Co., Ltd.
- Sumin Yun
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Flexible Hybrid Interconnect Circuits
- Publication number 20240373546
- Publication date Nov 7, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMISSION LINE
- Publication number 20240356190
- Publication date Oct 24, 2024
- Murata Manufacturing Co., Ltd.
- Tomohiro Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-RESIN COMPOSITE, SURFACE TREATMENT METHOD, AND SUBSTRATE OF C...
- Publication number 20240342968
- Publication date Oct 17, 2024
- Nanjing University
- Wei CHEN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WIRING BOARD
- Publication number 20240332772
- Publication date Oct 3, 2024
- Shinko Electric Industries Co., Ltd.
- Hiroshi TANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MEASURING SURFACE PARAMETER OF COPPER FOIL, METHOD FOR S...
- Publication number 20240328779
- Publication date Oct 3, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Hiroaki KURIHARA
- G01 - MEASURING TESTING
Information Patent Application
ANTENNA MODULE
- Publication number 20240334609
- Publication date Oct 3, 2024
- TDK Corporation
- Toshiyuki ABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID COUPLER AND METHOD FOR MANUFACTURING HYBRID COUPLERS
- Publication number 20240322415
- Publication date Sep 26, 2024
- CommScope Technologies LLC
- Kamalakar Yeddula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultra-Thin Sandwich Component
- Publication number 20240314928
- Publication date Sep 19, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier For Waveguide Applications
- Publication number 20240292518
- Publication date Aug 29, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Heinrich Trischler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLURALITY OF ANTENNAS AND ELECTRONIC DEVICE COMPRISING SAME
- Publication number 20240291914
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Hojung NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR IMPLEMENTING MULTIPURPOSE SCREW H...
- Publication number 20240251499
- Publication date Jul 25, 2024
- Meta Platforms Technologies, LLC
- Qiuming Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for coating and forming novel material layer structure of hi...
- Publication number 20240244763
- Publication date Jul 18, 2024
- LongKai LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RELEASE LAYER FOR METAL FOIL WITH CARRIER AND METAL FOIL COMPRISING...
- Publication number 20240237229
- Publication date Jul 11, 2024
- YMT CO., LTD.
- Sung Wook CHUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240224413
- Publication date Jul 4, 2024
- Resonac Corporation
- Kosuke URASHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING POLYIMIDE RESIN POWDER
- Publication number 20240199810
- Publication date Jun 20, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Yuuki SATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SAMPLE HOLDER AND SUPERCONDUCTING QUANTUM COMPUTER
- Publication number 20240196521
- Publication date Jun 13, 2024
- NEC Corporation
- Yoshihito HASHIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED ELECTRONIC DEVICE FOR THE TRANSMISSION/RECEPTION OF A RA...
- Publication number 20240186679
- Publication date Jun 6, 2024
- STMicroelectronics International N.V.
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE FOR A CONVERTER WITH IMPROVED FIELD SHIELDING OF SIGNA...
- Publication number 20240188263
- Publication date Jun 6, 2024
- ZF Friedrichshafen AG
- Kevin Böhm
- B60 - VEHICLES IN GENERAL
Information Patent Application
DIFFERENTIAL PAIR IMPEDANCE MATCHING FOR A PRINTED CIRCUIT BOARD
- Publication number 20240188209
- Publication date Jun 6, 2024
- Jabil Inc.
- Ian Jeffery Timmins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antennas Having Substrate Layers With Compound Curvature
- Publication number 20240186686
- Publication date Jun 6, 2024
- Apple Inc.
- Yi Jiang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DECORATIVE FLEXIBLE-ELECTRONIC-FILM STRUCTURE AND METHOD OF FORMING...
- Publication number 20240179834
- Publication date May 30, 2024
- Darwin Precisions Corporation
- Hsuan Yao
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
RELEASE LAYER FOR METAL FOIL WITH CARRIER AND METAL FOIL COMPRISING...
- Publication number 20240138075
- Publication date Apr 25, 2024
- YMT CO>< LTD.
- Sung Wook CHUN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TRANSMISSION DEVICE
- Publication number 20240128626
- Publication date Apr 18, 2024
- Unimicron Technology Corp.
- Yu-Kuang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D GLASS MODULES
- Publication number 20240114617
- Publication date Apr 4, 2024
- ELECTRONIC DESIGN & DEVELOPMENT, CORP.
- Sergio E. Cardona
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC DEVICE PACKAGE INCLUDING ANTENNA AND SEMICONDUCTOR...
- Publication number 20240113413
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE GLASS
- Publication number 20240101467
- Publication date Mar 28, 2024
- AGC Inc.
- Takeyuki KATO
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE
- Publication number 20240107662
- Publication date Mar 28, 2024
- Murata Manufacturing Co., Ltd.
- Noriaki OKUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TERMINAL STRUCTURE AND ELECTRONIC COMPONENT
- Publication number 20240096772
- Publication date Mar 21, 2024
- Murata Manufacturing Co., Ltd.
- Mitsuo IWATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIGNAL PROCESSING CIRCUIT AND DISTRIBUTION CIRCUIT
- Publication number 20240072406
- Publication date Feb 29, 2024
- Sony Semiconductor Solutions Corporation
- TOMOMICHI MURAKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE FOR MOUNTING HIGH FREQUENCY CIRCUIT CARRIERS
- Publication number 20240074036
- Publication date Feb 29, 2024
- ROHDE & SCHWARZ GMBH & CO. KG
- Nico RIEDMANN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

High frequency adaptations

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Surface wave launcher for high-speed data links over high-voltage p...

Signal transmission line comprising stacked insulating layers havin...

Circuit module for mounting high frequency circuit carriers

Integrated circuit package with integrated waveguide launcher

Methods of manufacturing circuit board and circuit board assembly

Waveguide including a substrate having a coplanar waveguide and a s...

Flexible hybrid interconnect circuits

Antenna and foldable electronic device including the same

Transmission apparatus, printed circuit board, and information appl...

Hybrid coupler and method for manufacturing hybrid couplers

Radio frequency crossover with high isolation in microelectronics H...

Printed flexible wiring apparatus in a cryostat

Plurality of antennas and electronic device comprising same

Flexible substrate and electronic device

Wiring substrate and information processing device

Multilayer board

Circuit board

Electronic device including antenna

Sample holder and superconducting quantum computer

Circuit board for transmitting high-frequency signal and method for...

Device and related method for providing unidirectional microwave pr...

Resin composition for circuit board, molded body for circuit board,...

Wiring substrate, antenna module, and communication device

Transmission line assembly

Electromagnetic coupler including spaced apart coupled conductors h...

Substrate integrated waveguide (SIW) including fences with wall str...

Techniques for high-speed signal layer transition

High-frequency component

Substrate and antenna module

Antenna structure comprising transmission line for transitioning an...

Patents Applicationslast 30 patents

Flexible Hybrid Interconnect Circuits

TRANSMISSION LINE

METAL-RESIN COMPOSITE, SURFACE TREATMENT METHOD, AND SUBSTRATE OF C...

WIRING BOARD

METHOD FOR MEASURING SURFACE PARAMETER OF COPPER FOIL, METHOD FOR S...

ANTENNA MODULE

HYBRID COUPLER AND METHOD FOR MANUFACTURING HYBRID COUPLERS

Ultra-Thin Sandwich Component

Component Carrier For Waveguide Applications

PLURALITY OF ANTENNAS AND ELECTRONIC DEVICE COMPRISING SAME

APPARATUS, SYSTEM, AND METHOD FOR IMPLEMENTING MULTIPURPOSE SCREW H...

Method for coating and forming novel material layer structure of hi...

RELEASE LAYER FOR METAL FOIL WITH CARRIER AND METAL FOIL COMPRISING...

WIRING SUBSTRATE

METHOD FOR PRODUCING POLYIMIDE RESIN POWDER

SAMPLE HOLDER AND SUPERCONDUCTING QUANTUM COMPUTER

INTEGRATED ELECTRONIC DEVICE FOR THE TRANSMISSION/RECEPTION OF A RA...

POWER MODULE FOR A CONVERTER WITH IMPROVED FIELD SHIELDING OF SIGNA...

DIFFERENTIAL PAIR IMPEDANCE MATCHING FOR A PRINTED CIRCUIT BOARD

Antennas Having Substrate Layers With Compound Curvature

DECORATIVE FLEXIBLE-ELECTRONIC-FILM STRUCTURE AND METHOD OF FORMING...

RELEASE LAYER FOR METAL FOIL WITH CARRIER AND METAL FOIL COMPRISING...

TRANSMISSION DEVICE

3D GLASS MODULES

MICROELECTRONIC DEVICE PACKAGE INCLUDING ANTENNA AND SEMICONDUCTOR...

PHOTOSENSITIVE GLASS

MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE

TERMINAL STRUCTURE AND ELECTRONIC COMPONENT

SIGNAL PROCESSING CIRCUIT AND DISTRIBUTION CIRCUIT

CIRCUIT MODULE FOR MOUNTING HIGH FREQUENCY CIRCUIT CARRIERS