Holes or slots in insulating substrate not used for electrical connections

Industry

CPC
H05K2201/09063

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09063Holes or slots in insulating substrate not used for electrical connections

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Connector structure and connector
- Patent number 12,170,423
- Issue date Dec 17, 2024
- Murata Manufacturing Co., Ltd.
- Takayoshi Obata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed network device with orthogonal pluggable optics modules
- Patent number 12,158,627
- Issue date Dec 3, 2024
- Arista Networks, Inc.
- Adam Hemp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voice-controlled electronic device
- Patent number 12,147,610
- Issue date Nov 19, 2024
- Apple Inc.
- Craig M. Stanley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Switching power supply including wiring layer
- Patent number 12,149,171
- Issue date Nov 19, 2024
- Rohm Co., Ltd.
- Yutaka Mimino
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electronic apparatus
- Patent number 12,150,245
- Issue date Nov 19, 2024
- Samsung Display Co., Ltd.
- Jinhyuk Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including interface terminal having outer shell a...
- Patent number 12,126,122
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Juho Yi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board connector for a circuit board
- Patent number 12,124,092
- Issue date Oct 22, 2024
- MD Elektronik GmbH
- Helmut Pritz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly for a communication system
- Patent number 12,119,577
- Issue date Oct 15, 2024
- TE CONNECTIVITY SOLUTIONS GmbH
- Randall Robert Henry
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board assembly
- Patent number 12,101,881
- Issue date Sep 24, 2024
- Unimicron Technology Corporation
- Ching-Ho Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cable release device and method for releasing a cable
- Patent number 12,095,217
- Issue date Sep 17, 2024
- Quanta Computer Inc.
- Yaw-Tzorng Tsorng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Touch detection through metal with detailed lit icon
- Patent number 12,089,335
- Issue date Sep 10, 2024
- Flex Ltd.
- Curtis V. Bradford
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board arrangement, differential probe circuit and method
- Patent number 12,069,800
- Issue date Aug 20, 2024
- Rohde & Schwarz GmbH & Co. KG
- Andreas Ziegler
- G01 - MEASURING TESTING
Information Patent Grant
Mainboard connection structure and guiding device
- Patent number 12,052,823
- Issue date Jul 30, 2024
- Fulian Precision Electronics (Tianjin) Co., LTD.
- Chia-Kang Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method of manufacturing the same
- Patent number 12,052,903
- Issue date Jul 30, 2024
- Samsung Display Co., Ltd.
- Jong-Tae Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical junction box
- Patent number 12,048,105
- Issue date Jul 23, 2024
- Yazaki Corporation
- Hitoshi Tsugane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing light-emitting device, method of manufactur...
- Patent number 12,044,399
- Issue date Jul 23, 2024
- Nichia Corporation
- Isamu Niki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate and electronic device
- Patent number 12,028,968
- Issue date Jul 2, 2024
- Sony Group Corporation
- Takahiro Shinojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board soldering structure
- Patent number 11,996,586
- Issue date May 28, 2024
- Panasonic Energy Co., Ltd.
- Fumiya Matsushita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit interrupting device having printed circuit board coils
- Patent number 11,996,257
- Issue date May 28, 2024
- Hubbell Incorporated
- John E. Brower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus with airflow chamber
- Patent number 11,991,820
- Issue date May 21, 2024
- Comcast Cable Communications, LLC
- Osman Cueto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Battery connection module and battery device
- Patent number 11,979,989
- Issue date May 7, 2024
- Molex, LLC
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable substrate having improved stretch uniformity and method...
- Patent number 11,968,778
- Issue date Apr 23, 2024
- Korea Institute of Science and Technology
- Phillip Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board structure including a closed cavity
- Patent number 11,967,758
- Issue date Apr 23, 2024
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shunt resistor module
- Patent number 11,961,642
- Issue date Apr 16, 2024
- LG ENERGY SOLUTION, LTD.
- Dong-Wan Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit carrier arrangement and method for producing such a circuit...
- Patent number 11,961,785
- Issue date Apr 16, 2024
- Vitesco Technologies GmbH
- Jens Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor interposer employing castellated through-vias
- Patent number 11,950,363
- Issue date Apr 2, 2024
- DexCom, Inc.
- Sean Frick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 11,950,356
- Issue date Apr 2, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly and system for communication to an access po...
- Patent number 11,937,393
- Issue date Mar 19, 2024
- ARINC Incorporated
- Curtis Wicks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power conversion device, multilayer board included in the same, and...
- Patent number 11,923,125
- Issue date Mar 5, 2024
- Sumitomo Electric Industries, Ltd.
- Keiji Tashiro
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Device connectable to a printed circuit board with high precision
- Patent number 11,923,629
- Issue date Mar 5, 2024
- MELLANOX TECHNOLOGIES LTD.
- Tamir Lederman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of Producing a PCB, as well as a PCB, and a Circuit Board
- Publication number 20240422894
- Publication date Dec 19, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Agneta Ljungbro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SENSOR WITH PLURALITY OF SENSOR ELEMENTS ARRANGED ON A FLEXIBLE SUB...
- Publication number 20240402024
- Publication date Dec 5, 2024
- UNIVERSAL CEMENT CORPORATION
- Sih-Wei Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20240407084
- Publication date Dec 5, 2024
- HKC Corporation Limited
- Yao LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD TO PRODUCE ELECTRONIC DEVICE
- Publication number 20240389244
- Publication date Nov 21, 2024
- Darwin Precisions Corporation
- Keng-Kuei Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLOW SENSING DEVICE AND ASSOCIATED METHOD
- Publication number 20240318992
- Publication date Sep 26, 2024
- Honeywell International Inc.
- Manjesh B
- G01 - MEASURING TESTING
Information Patent Application
CIRCUIT INTERRUPTING DEVICE HAVING PRINTED CIRCUIT BOARD COILS
- Publication number 20240312735
- Publication date Sep 19, 2024
- HUBBELL INCORPORATED
- John E. Brower
- G01 - MEASURING TESTING
Information Patent Application
Circuit Board Cooling Configurations
- Publication number 20240314917
- Publication date Sep 19, 2024
- Microsoft Technology Licensing, LLC
- Ruslan NAGIMOV
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD CONNECTING MECHANISM
- Publication number 20240297459
- Publication date Sep 5, 2024
- Na Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE, MANUFACTURE METHOD THEREFOR AND ELECTRIC DEVICE COM...
- Publication number 20240292550
- Publication date Aug 29, 2024
- BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
- Xinrui Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SEMICONDUCTOR MODULE WITH VIBRATION DAMPENERS AND POWER ELECT...
- Publication number 20240266300
- Publication date Aug 8, 2024
- INFINEON TECHNOLOGIES AG
- Marco Bäßler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION COMPONENTS FOR CONNECTING A SEMICONDUCTOR PACKAGE WITH A...
- Publication number 20240266301
- Publication date Aug 8, 2024
- Juniper Networks, Inc.
- Gautam GANGULY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240260192
- Publication date Aug 1, 2024
- SAMSUNG DISPLAY CO., LTD.
- KYUNG-MOK LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DRIVING CHIP ACCOMMODATING CIRCUIT BOARD AND DISPLAY DEVICE HAVING...
- Publication number 20240237222
- Publication date Jul 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- HYEONJI KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING CIRCUIT BOARD AND METHOD FOR PRODUCING WIRING CIRCUIT BOARD
- Publication number 20240206053
- Publication date Jun 20, 2024
- Nitto Denko Corporation
- Takahiro IKEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20240196518
- Publication date Jun 13, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS
- Publication number 20240196531
- Publication date Jun 13, 2024
- Dexcom, Inc.
- Sean Frick
- G01 - MEASURING TESTING
Information Patent Application
CIRCUIT BOARD MODULE AND METHOD FOR MANUFACTURING SAME
- Publication number 20240188218
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Yonglak CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DECORATIVE FLEXIBLE-ELECTRONIC-FILM STRUCTURE AND METHOD OF FORMING...
- Publication number 20240179834
- Publication date May 30, 2024
- Darwin Precisions Corporation
- Hsuan Yao
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ELECTRONIC APPARATUS MINIMIZING DIFFERENTIAL THERMAL CONTRACTION FO...
- Publication number 20240155759
- Publication date May 9, 2024
- International Business Machines Corporation
- Shawn Anthony Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FILM AND TEST COMPONENT
- Publication number 20240130040
- Publication date Apr 18, 2024
- Innolux Corporation
- Ker-Yih Kao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240096378
- Publication date Mar 21, 2024
- Kabushiki Kaisha Toshiba
- Nobuhiro YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER CONVERTER, INTER-COMPONENT CONNECTION SYSTEM, AND INTER-COMPO...
- Publication number 20240088588
- Publication date Mar 14, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- MOTOHIKO FUJIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Insulating unit for circuit board
- Publication number 20240090124
- Publication date Mar 14, 2024
- HARTING Electric Stiftung & Co. KG
- Norbert KROPIEWNICKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPUTING MODULE LOCKING DEVICES
- Publication number 20240074060
- Publication date Feb 29, 2024
- Hewlett-Packard Development Company, L.P.
- Derek Kyle Joseph Kanas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS
- Publication number 20240049388
- Publication date Feb 8, 2024
- Dexcom, Inc.
- Sean Frick
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
CONFIGURABLE CARD CONNECTOR
- Publication number 20240039193
- Publication date Feb 1, 2024
- Dell Products L.P.
- Edward Davis Geist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER BLOCK BASED ON TOP-SIDE COOL SURFACE-MOUNT DISCRETE DEVICES W...
- Publication number 20240030096
- Publication date Jan 25, 2024
- Qorvo US, Inc.
- Ke Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD ASSEMBLY
- Publication number 20230413441
- Publication date Dec 21, 2023
- UNIMICRON TECHNOLOGY CORPORATION
- Ching-Ho Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATTERY CONNECTION MODULE AND BATTERY DEVICE
- Publication number 20230380070
- Publication date Nov 23, 2023
- Molex, LLC
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA MODULE
- Publication number 20230371170
- Publication date Nov 16, 2023
- LG Innotek Co., Ltd.
- Won Seob SHIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Holes or slots in insulating substrate not used for electrical connections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Connector structure and connector

High speed network device with orthogonal pluggable optics modules

Voice-controlled electronic device

Switching power supply including wiring layer

Electronic apparatus

Electronic device including interface terminal having outer shell a...

Circuit board connector for a circuit board

Electronic assembly for a communication system

Circuit board assembly

Cable release device and method for releasing a cable

Touch detection through metal with detailed lit icon

Circuit board arrangement, differential probe circuit and method

Mainboard connection structure and guiding device

Electronic device and method of manufacturing the same

Electrical junction box

Method of manufacturing light-emitting device, method of manufactur...

Substrate and electronic device

Circuit board soldering structure

Circuit interrupting device having printed circuit board coils

Apparatus with airflow chamber

Battery connection module and battery device

Stretchable substrate having improved stretch uniformity and method...

Printed circuit board structure including a closed cavity

Shunt resistor module

Circuit carrier arrangement and method for producing such a circuit...

Sensor interposer employing castellated through-vias

Mating backplane for high speed, high density electrical connector

Circuit board assembly and system for communication to an access po...

Power conversion device, multilayer board included in the same, and...

Device connectable to a printed circuit board with high precision

Patents Applicationslast 30 patents

Method of Producing a PCB, as well as a PCB, and a Circuit Board

SENSOR WITH PLURALITY OF SENSOR ELEMENTS ARRANGED ON A FLEXIBLE SUB...

ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE

ELECTRONIC DEVICE AND METHOD TO PRODUCE ELECTRONIC DEVICE

FLOW SENSING DEVICE AND ASSOCIATED METHOD

CIRCUIT INTERRUPTING DEVICE HAVING PRINTED CIRCUIT BOARD COILS

Circuit Board Cooling Configurations

CIRCUIT BOARD CONNECTING MECHANISM

DISPLAY MODULE, MANUFACTURE METHOD THEREFOR AND ELECTRIC DEVICE COM...

POWER SEMICONDUCTOR MODULE WITH VIBRATION DAMPENERS AND POWER ELECT...

CONNECTION COMPONENTS FOR CONNECTING A SEMICONDUCTOR PACKAGE WITH A...

DISPLAY DEVICE

DRIVING CHIP ACCOMMODATING CIRCUIT BOARD AND DISPLAY DEVICE HAVING...

WIRING CIRCUIT BOARD AND METHOD FOR PRODUCING WIRING CIRCUIT BOARD

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS

CIRCUIT BOARD MODULE AND METHOD FOR MANUFACTURING SAME

DECORATIVE FLEXIBLE-ELECTRONIC-FILM STRUCTURE AND METHOD OF FORMING...

ELECTRONIC APPARATUS MINIMIZING DIFFERENTIAL THERMAL CONTRACTION FO...

CONDUCTIVE FILM AND TEST COMPONENT

ELECTRONIC DEVICE

POWER CONVERTER, INTER-COMPONENT CONNECTION SYSTEM, AND INTER-COMPO...

Insulating unit for circuit board

COMPUTING MODULE LOCKING DEVICES

SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS

CONFIGURABLE CARD CONNECTOR

POWER BLOCK BASED ON TOP-SIDE COOL SURFACE-MOUNT DISCRETE DEVICES W...

CIRCUIT BOARD ASSEMBLY

BATTERY CONNECTION MODULE AND BATTERY DEVICE

CAMERA MODULE