Holes or slots in insulating substrate not used for electrical connections

Industry

CPC
H05K2201/09063

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09063Holes or slots in insulating substrate not used for electrical connections

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus for temperature measurement and method of processing subs...
- Patent number 12,317,419
- Issue date May 27, 2025
- Semes Co., Ltd.
- Yong Jun Seo
- G01 - MEASURING TESTING
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 12,309,915
- Issue date May 20, 2025
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display module and manufacturing method therefor, and display device
- Patent number 12,284,863
- Issue date Apr 22, 2025
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Haotian Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Sensor interposer employing castellated through-vias
- Patent number 12,250,768
- Issue date Mar 11, 2025
- DexCom, Inc.
- Sean Frick
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Motor controller heat dissipating systems and methods
- Patent number 12,245,408
- Issue date Mar 4, 2025
- Lyft, Inc.
- Adam Christopher Bender
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Interface card assembly and circuit board module using the same
- Patent number 12,237,618
- Issue date Feb 25, 2025
- ASUSTeK COMPUTER Inc.
- Po-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having through parts of different shapes
- Patent number 12,230,600
- Issue date Feb 18, 2025
- Fuji Electric Co., Ltd.
- Narumi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and electronic device including the same
- Patent number 12,219,721
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Yusuf Cinar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light module aperture for printed circuit board integration
- Patent number 12,207,406
- Issue date Jan 21, 2025
- Electronic Theatre Controls, Inc.
- Sunya Nimityongskul
- F21 - LIGHTING
Information Patent Grant
Sensor driving device having substrate with electromagnetic driving...
- Patent number 12,206,966
- Issue date Jan 21, 2025
- LG Innotek Co., Ltd
- Yun Sang Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating unit for circuit board
- Patent number 12,200,856
- Issue date Jan 14, 2025
- HARTING Electric Stiftung & Co. KG
- Norbert Kropiewnicki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector structure and connector
- Patent number 12,170,423
- Issue date Dec 17, 2024
- Murata Manufacturing Co., Ltd.
- Takayoshi Obata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed network device with orthogonal pluggable optics modules
- Patent number 12,158,627
- Issue date Dec 3, 2024
- Arista Networks, Inc.
- Adam Hemp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voice-controlled electronic device
- Patent number 12,147,610
- Issue date Nov 19, 2024
- Apple Inc.
- Craig M. Stanley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Switching power supply including wiring layer
- Patent number 12,149,171
- Issue date Nov 19, 2024
- Rohm Co., Ltd.
- Yutaka Mimino
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electronic apparatus
- Patent number 12,150,245
- Issue date Nov 19, 2024
- Samsung Display Co., Ltd.
- Jinhyuk Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board connector for a circuit board
- Patent number 12,124,092
- Issue date Oct 22, 2024
- MD Elektronik GmbH
- Helmut Pritz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including interface terminal having outer shell a...
- Patent number 12,126,122
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Juho Yi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic assembly for a communication system
- Patent number 12,119,577
- Issue date Oct 15, 2024
- TE CONNECTIVITY SOLUTIONS GmbH
- Randall Robert Henry
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board assembly
- Patent number 12,101,881
- Issue date Sep 24, 2024
- Unimicron Technology Corporation
- Ching-Ho Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cable release device and method for releasing a cable
- Patent number 12,095,217
- Issue date Sep 17, 2024
- Quanta Computer Inc.
- Yaw-Tzorng Tsorng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Touch detection through metal with detailed lit icon
- Patent number 12,089,335
- Issue date Sep 10, 2024
- Flex Ltd.
- Curtis V. Bradford
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board arrangement, differential probe circuit and method
- Patent number 12,069,800
- Issue date Aug 20, 2024
- Rohde & Schwarz GmbH & Co. KG
- Andreas Ziegler
- G01 - MEASURING TESTING
Information Patent Grant
Mainboard connection structure and guiding device
- Patent number 12,052,823
- Issue date Jul 30, 2024
- Fulian Precision Electronics (Tianjin) Co., LTD.
- Chia-Kang Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method of manufacturing the same
- Patent number 12,052,903
- Issue date Jul 30, 2024
- Samsung Display Co., Ltd.
- Jong-Tae Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical junction box
- Patent number 12,048,105
- Issue date Jul 23, 2024
- Yazaki Corporation
- Hitoshi Tsugane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing light-emitting device, method of manufactur...
- Patent number 12,044,399
- Issue date Jul 23, 2024
- Nichia Corporation
- Isamu Niki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate and electronic device
- Patent number 12,028,968
- Issue date Jul 2, 2024
- Sony Group Corporation
- Takahiro Shinojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board soldering structure
- Patent number 11,996,586
- Issue date May 28, 2024
- Panasonic Energy Co., Ltd.
- Fumiya Matsushita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit interrupting device having printed circuit board coils
- Patent number 11,996,257
- Issue date May 28, 2024
- Hubbell Incorporated
- John E. Brower
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMPUTER HARDWARE INSTALLATION AND REMOVAL TOOL
- Publication number 20250133648
- Publication date Apr 24, 2025
- International Business Machines Corporation
- Wayne A. Barringer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMORY MODULES AND SOCKETS
- Publication number 20250126714
- Publication date Apr 17, 2025
- Xiang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SENSOR DRIVING DEVICE HAVING SUBSTRATE WITH ELECTROMAGNETIC DRIVING...
- Publication number 20250126339
- Publication date Apr 17, 2025
- LG Innotek Co., Ltd.
- Yun Sang SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECEPTACLE ASSEMBLY AND CIRCUIT BOARD
- Publication number 20250120007
- Publication date Apr 10, 2025
- Yamaichi Electronics Co., Ltd.
- Toshiyasu ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20250081346
- Publication date Mar 6, 2025
- Hyundai Motor Company
- Se Yoon JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT TAPE AND FLEXIBLE CIRCUIT BOARD THEREOF
- Publication number 20250071895
- Publication date Feb 27, 2025
- Chipbond Technology Corporation
- Chih-Hsiung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD HAVING AN EDGE CONTAINING CONDUCTIVE REGIONS
- Publication number 20250063664
- Publication date Feb 20, 2025
- Teradyne, Inc.
- Daniel L. Engel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH SPEED NETWORK DEVICE WITH ORTHOGONAL PLUGGABLE OPTICS MODULES
- Publication number 20250044536
- Publication date Feb 6, 2025
- Arista Networks, Inc.
- Andreas Bechtolsheim
- G02 - OPTICS
Information Patent Application
FLAT MOUNT COMPONENT
- Publication number 20250048540
- Publication date Feb 6, 2025
- KEITH JON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VOICE-CONTROLLED ELECTRONIC DEVICE
- Publication number 20250044879
- Publication date Feb 6, 2025
- Apple Inc.
- Craig M. Stanley
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD STRUCTURE CONTAINING THERMAL INTERFACE MATERI...
- Publication number 20240431016
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Joohan KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Producing a PCB, as well as a PCB, and a Circuit Board
- Publication number 20240422894
- Publication date Dec 19, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Agneta Ljungbro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SENSOR WITH PLURALITY OF SENSOR ELEMENTS ARRANGED ON A FLEXIBLE SUB...
- Publication number 20240402024
- Publication date Dec 5, 2024
- UNIVERSAL CEMENT CORPORATION
- Sih-Wei Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20240407084
- Publication date Dec 5, 2024
- HKC Corporation Limited
- Yao LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD TO PRODUCE ELECTRONIC DEVICE
- Publication number 20240389244
- Publication date Nov 21, 2024
- Darwin Precisions Corporation
- Keng-Kuei Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLOW SENSING DEVICE AND ASSOCIATED METHOD
- Publication number 20240318992
- Publication date Sep 26, 2024
- Honeywell International Inc.
- Manjesh B
- G01 - MEASURING TESTING
Information Patent Application
CIRCUIT INTERRUPTING DEVICE HAVING PRINTED CIRCUIT BOARD COILS
- Publication number 20240312735
- Publication date Sep 19, 2024
- HUBBELL INCORPORATED
- John E. Brower
- G01 - MEASURING TESTING
Information Patent Application
Circuit Board Cooling Configurations
- Publication number 20240314917
- Publication date Sep 19, 2024
- Microsoft Technology Licensing, LLC
- Ruslan NAGIMOV
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD CONNECTING MECHANISM
- Publication number 20240297459
- Publication date Sep 5, 2024
- Na Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE, MANUFACTURE METHOD THEREFOR AND ELECTRIC DEVICE COM...
- Publication number 20240292550
- Publication date Aug 29, 2024
- BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
- Xinrui Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SEMICONDUCTOR MODULE WITH VIBRATION DAMPENERS AND POWER ELECT...
- Publication number 20240266300
- Publication date Aug 8, 2024
- INFINEON TECHNOLOGIES AG
- Marco Bäßler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION COMPONENTS FOR CONNECTING A SEMICONDUCTOR PACKAGE WITH A...
- Publication number 20240266301
- Publication date Aug 8, 2024
- Juniper Networks, Inc.
- Gautam GANGULY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240260192
- Publication date Aug 1, 2024
- SAMSUNG DISPLAY CO., LTD.
- KYUNG-MOK LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DRIVING CHIP ACCOMMODATING CIRCUIT BOARD AND DISPLAY DEVICE HAVING...
- Publication number 20240237222
- Publication date Jul 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- HYEONJI KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING CIRCUIT BOARD AND METHOD FOR PRODUCING WIRING CIRCUIT BOARD
- Publication number 20240206053
- Publication date Jun 20, 2024
- Nitto Denko Corporation
- Takahiro IKEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20240196518
- Publication date Jun 13, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS
- Publication number 20240196531
- Publication date Jun 13, 2024
- Dexcom, Inc.
- Sean Frick
- G01 - MEASURING TESTING
Information Patent Application
CIRCUIT BOARD MODULE AND METHOD FOR MANUFACTURING SAME
- Publication number 20240188218
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Yonglak CHO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DECORATIVE FLEXIBLE-ELECTRONIC-FILM STRUCTURE AND METHOD OF FORMING...
- Publication number 20240179834
- Publication date May 30, 2024
- Darwin Precisions Corporation
- Hsuan Yao
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ELECTRONIC APPARATUS MINIMIZING DIFFERENTIAL THERMAL CONTRACTION FO...
- Publication number 20240155759
- Publication date May 9, 2024
- International Business Machines Corporation
- Shawn Anthony Hall
- H01 - BASIC ELECTRIC ELEMENTS

Holes or slots in insulating substrate not used for electrical connections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatus for temperature measurement and method of processing subs...

Mating backplane for high speed, high density electrical connector

Display module and manufacturing method therefor, and display device

Sensor interposer employing castellated through-vias

Motor controller heat dissipating systems and methods

Interface card assembly and circuit board module using the same

Semiconductor device having through parts of different shapes

Memory device and electronic device including the same

Light module aperture for printed circuit board integration

Sensor driving device having substrate with electromagnetic driving...

Insulating unit for circuit board

Connector structure and connector

High speed network device with orthogonal pluggable optics modules

Voice-controlled electronic device

Switching power supply including wiring layer

Electronic apparatus

Circuit board connector for a circuit board

Electronic device including interface terminal having outer shell a...

Electronic assembly for a communication system

Circuit board assembly

Cable release device and method for releasing a cable

Touch detection through metal with detailed lit icon

Circuit board arrangement, differential probe circuit and method

Mainboard connection structure and guiding device

Electronic device and method of manufacturing the same

Electrical junction box

Method of manufacturing light-emitting device, method of manufactur...

Substrate and electronic device

Circuit board soldering structure

Circuit interrupting device having printed circuit board coils

Patents Applicationslast 30 patents

COMPUTER HARDWARE INSTALLATION AND REMOVAL TOOL

MEMORY MODULES AND SOCKETS

SENSOR DRIVING DEVICE HAVING SUBSTRATE WITH ELECTROMAGNETIC DRIVING...

RECEPTACLE ASSEMBLY AND CIRCUIT BOARD

POWER MODULE

FLEXIBLE CIRCUIT TAPE AND FLEXIBLE CIRCUIT BOARD THEREOF

CIRCUIT BOARD HAVING AN EDGE CONTAINING CONDUCTIVE REGIONS

HIGH SPEED NETWORK DEVICE WITH ORTHOGONAL PLUGGABLE OPTICS MODULES

FLAT MOUNT COMPONENT

VOICE-CONTROLLED ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD STRUCTURE CONTAINING THERMAL INTERFACE MATERI...

Method of Producing a PCB, as well as a PCB, and a Circuit Board

SENSOR WITH PLURALITY OF SENSOR ELEMENTS ARRANGED ON A FLEXIBLE SUB...

ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE

ELECTRONIC DEVICE AND METHOD TO PRODUCE ELECTRONIC DEVICE

FLOW SENSING DEVICE AND ASSOCIATED METHOD

CIRCUIT INTERRUPTING DEVICE HAVING PRINTED CIRCUIT BOARD COILS

Circuit Board Cooling Configurations

CIRCUIT BOARD CONNECTING MECHANISM

DISPLAY MODULE, MANUFACTURE METHOD THEREFOR AND ELECTRIC DEVICE COM...

POWER SEMICONDUCTOR MODULE WITH VIBRATION DAMPENERS AND POWER ELECT...

CONNECTION COMPONENTS FOR CONNECTING A SEMICONDUCTOR PACKAGE WITH A...

DISPLAY DEVICE

DRIVING CHIP ACCOMMODATING CIRCUIT BOARD AND DISPLAY DEVICE HAVING...

WIRING CIRCUIT BOARD AND METHOD FOR PRODUCING WIRING CIRCUIT BOARD

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS

CIRCUIT BOARD MODULE AND METHOD FOR MANUFACTURING SAME

DECORATIVE FLEXIBLE-ELECTRONIC-FILM STRUCTURE AND METHOD OF FORMING...

ELECTRONIC APPARATUS MINIMIZING DIFFERENTIAL THERMAL CONTRACTION FO...