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H01L2027/11862

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2027/11862Horizontal or vertical grid line density

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Power rail and signal conducting line arrangement
- Patent number 11,967,596
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Guo-Huei Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit device with improved layout
- Patent number 11,935,894
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fong-yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods of designing and fabricating a semiconductor device based o...
- Patent number 11,854,976
- Issue date Dec 26, 2023
- Samsung Electronics Co., Ltd.
- Sanghoon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 11,784,188
- Issue date Oct 10, 2023
- SOCIONEXT INC.
- Toshio Hino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device with improved layout
- Patent number 11,495,619
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fong-yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device with stacked wirings having respective pitches...
- Patent number 11,462,475
- Issue date Oct 4, 2022
- Samsung Electronics Co., Ltd.
- Sanghoon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 11,387,256
- Issue date Jul 12, 2022
- SOCIONEXT INC.
- Toshio Hino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including clubfoot structure conductive patterns
- Patent number 11,152,392
- Issue date Oct 19, 2021
- Samsung Electronics Co., Ltd.
- Jung-ho Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device with improved layout
- Patent number 10,903,239
- Issue date Jan 26, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fong-yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,840,263
- Issue date Nov 17, 2020
- SOCIONEXT INC.
- Toshio Hino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including clubfoot structure conductive patterns
- Patent number 10,790,305
- Issue date Sep 29, 2020
- Samsung Electronics Co., Ltd.
- Jung-ho Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional device and method of forming the same
- Patent number 10,770,479
- Issue date Sep 8, 2020
- Tokyo Electron Limited
- Jeffrey Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and cell structure in the integrated circuit
- Patent number 10,644,030
- Issue date May 5, 2020
- Mediatek Inc.
- Chuan-Shian Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cell layout utilizing boundary cell with mixed poly pitch within in...
- Patent number 10,445,453
- Issue date Oct 15, 2019
- Mediatek Inc.
- Jen-Hang Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor chip having region including gate electrode features...
- Patent number 10,217,763
- Issue date Feb 26, 2019
- Tela Innovations, Inc.
- Scott T. Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor chip having region including gate electrode features...
- Patent number 10,186,523
- Issue date Jan 22, 2019
- Tela Innovations, Inc.
- Scott T. Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor chip including region having rectangular-shaped gate...
- Patent number 10,141,334
- Issue date Nov 27, 2018
- Tela Innovations, Inc.
- Scott T. Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor CIP including region having rectangular-shaped gate s...
- Patent number 10,141,335
- Issue date Nov 27, 2018
- Tela Innovations, Inc.
- Scott T. Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor chip including region having rectangular-shaped gate...
- Patent number 9,905,576
- Issue date Feb 27, 2018
- Tela Innovations, Inc.
- Scott T. Becker
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
POWER RAIL AND SIGNAL CONDUCTING LINE ARRANGEMENT
- Publication number 20240274607
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Guo-Huei WU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH IMPROVED LAYOUT
- Publication number 20240203997
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Fong-yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20230411396
- Publication date Dec 21, 2023
- SOCIONEXT INC.
- Toshio HINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH IMPROVED LAYOUT
- Publication number 20230057672
- Publication date Feb 23, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Fong-yuan CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20220310658
- Publication date Sep 29, 2022
- SOCIONEXT INC.
- Toshio HINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20210305278
- Publication date Sep 30, 2021
- SOCIONEXT INC.
- Yoko SHIRAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20210028191
- Publication date Jan 28, 2021
- SOCIONEXT INC.
- Toshio HINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INCLUDING CLUBFOOT STRUCTURE CONDUCTIVE PATTERNS
- Publication number 20210013230
- Publication date Jan 14, 2021
- Samsung Electronics Co., Ltd.
- Jung-ho Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INCLUDING CLUBFOOT STRUCTURE CONDUCTIVE PATTERNS
- Publication number 20190355750
- Publication date Nov 21, 2019
- Samsung Electronics Co., Ltd.
- Jung-ho Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20190288004
- Publication date Sep 19, 2019
- TOKYO ELECTRON LIMITED
- Jeffrey SMITH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20190198530
- Publication date Jun 27, 2019
- SOCIONEXT INC.
- Toshio HINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND CELL STRUCTURE IN THE INTEGRATED CIRCUIT
- Publication number 20190123062
- Publication date Apr 25, 2019
- MEDIATEK Inc.
- Chuan-Shian FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH IMPROVED LAYOUT
- Publication number 20190035811
- Publication date Jan 31, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Fong-yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Chip Having Region Including Gate Electrode Features...
- Publication number 20190019810
- Publication date Jan 17, 2019
- Tela Innovations, Inc.
- Scott T. Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Chip Having Region Including Gate Electrode Features...
- Publication number 20180374872
- Publication date Dec 27, 2018
- Tela Innovations, Inc.
- Scott T. Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Chip Having Region Including Gate Electrode Features...
- Publication number 20180374873
- Publication date Dec 27, 2018
- Tela Innovations, Inc.
- Scott T. Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Chip Having Region Including Gate Electrode Features...
- Publication number 20180374871
- Publication date Dec 27, 2018
- Tela Innovations, Inc.
- Scott T. Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Chip and Method for Manufacturing the Same
- Publication number 20170365620
- Publication date Dec 21, 2017
- Tela Innovations, Inc.
- Scott T. Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Chip and Method for Manufacturing the Same
- Publication number 20170365621
- Publication date Dec 21, 2017
- Tela Innovations, Inc.
- Scott T. Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Chip and Method for Manufacturing the Same
- Publication number 20170358600
- Publication date Dec 14, 2017
- Tela Innovations, Inc.
- Scott T. Becker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Chip and Method for Manufacturing the Same
- Publication number 20170186771
- Publication date Jun 29, 2017
- Tela Innovations, Inc.
- Scott T. Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip and Method for Manufacturing the Same
- Publication number 20170053937
- Publication date Feb 23, 2017
- Tela Innovations, Inc.
- Scott T. Becker
- H01 - BASIC ELECTRIC ELEMENTS

Horizontal or vertical grid line density

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power rail and signal conducting line arrangement

Integrated circuit device with improved layout

Methods of designing and fabricating a semiconductor device based o...

Semiconductor integrated circuit device

Integrated circuit device with improved layout

Semiconductor device with stacked wirings having respective pitches...

Semiconductor integrated circuit device

Integrated circuit including clubfoot structure conductive patterns

Integrated circuit device with improved layout

Semiconductor integrated circuit device

Integrated circuit including clubfoot structure conductive patterns

Three-dimensional device and method of forming the same

Integrated circuit and cell structure in the integrated circuit

Cell layout utilizing boundary cell with mixed poly pitch within in...

Semiconductor chip having region including gate electrode features...

Semiconductor chip having region including gate electrode features...

Semiconductor chip including region having rectangular-shaped gate...

Semiconductor CIP including region having rectangular-shaped gate s...

Semiconductor chip including region having rectangular-shaped gate...

Patents Applicationslast 30 patents

POWER RAIL AND SIGNAL CONDUCTING LINE ARRANGEMENT

INTEGRATED CIRCUIT DEVICE WITH IMPROVED LAYOUT

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

INTEGRATED CIRCUIT DEVICE WITH IMPROVED LAYOUT

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

INTEGRATED CIRCUIT INCLUDING CLUBFOOT STRUCTURE CONDUCTIVE PATTERNS

INTEGRATED CIRCUIT INCLUDING CLUBFOOT STRUCTURE CONDUCTIVE PATTERNS

THREE-DIMENSIONAL DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

INTEGRATED CIRCUIT AND CELL STRUCTURE IN THE INTEGRATED CIRCUIT

INTEGRATED CIRCUIT DEVICE WITH IMPROVED LAYOUT

Semiconductor Chip Having Region Including Gate Electrode Features...

Semiconductor Chip Having Region Including Gate Electrode Features...

Semiconductor Chip Having Region Including Gate Electrode Features...

Semiconductor Chip Having Region Including Gate Electrode Features...

Semiconductor Chip and Method for Manufacturing the Same

Semiconductor Chip and Method for Manufacturing the Same

Semiconductor Chip and Method for Manufacturing the Same

Semiconductor Chip and Method for Manufacturing the Same

Semiconductor Chip and Method for Manufacturing the Same