Horizontally held PCB

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CPC
H05K2203/1509

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/1509Horizontally held PCB

Industries

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Patents Grantslast 30 patents

Information Patent Grant
System and method for controlling flow of solder in a wave solderin...
- Patent number 12,363,833
- Issue date Jul 15, 2025
- Illinois Tool Works Inc.
- Jonathan M. Dautenhahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for controlling flow of solder in a wave solderin...
- Patent number 12,356,555
- Issue date Jul 8, 2025
- Illinois Tool Works Inc.
- Jonathan M. Dautenhahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering apparatus
- Patent number 12,097,575
- Issue date Sep 24, 2024
- ERSA GmbH
- Lothar Endreß
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressure sintering device and method for manufacturing an electroni...
- Patent number 12,046,576
- Issue date Jul 23, 2024
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for manufacturing printed circuit boards
- Patent number 11,963,306
- Issue date Apr 16, 2024
- Gebr. Schmid GmbH
- Christian Schmid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for manufacturing printed circuit boards
- Patent number 11,917,767
- Issue date Feb 27, 2024
- Gebr. Schmid GmbH
- Christian Schmid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and method of fabricating display device using th...
- Patent number 11,798,912
- Issue date Oct 24, 2023
- Samsung Display Co., Ltd.
- Taeyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Motion-based reconfigurable microelectronics system
- Patent number 11,229,125
- Issue date Jan 18, 2022
- The United States of America as represented by the Secretary of the Army
- Jeffrey Spencer Pulskamp
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Filling assembly
- Patent number 11,172,578
- Issue date Nov 9, 2021
- ITC Intercircuit Electronic GmbH
- Hubertus Hein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for assembling hook type heatsink
- Patent number 11,141,822
- Issue date Oct 12, 2021
- ARRIS Enterprises LLC
- Ti-Hsing Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Desmearing method and desmearing device
- Patent number 11,102,889
- Issue date Aug 24, 2021
- Ushio Denki Kabushiki Kaisha
- Kenichi Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate holder and plating apparatus
- Patent number 11,015,261
- Issue date May 25, 2021
- Ebara Corporation
- Yoshitaka Mukaiyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Vertical circuit board printer
- Patent number 10,917,975
- Issue date Feb 9, 2021
- Shenzhen Jingjiang Yunchuang Technology Co., Ltd.
- Xue-Qin Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Edge lock assembly for a stencil printer
- Patent number 10,703,089
- Issue date Jul 7, 2020
- Illinois Tool Works Inc.
- Daniel Mariano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
FPC flattening jig and FPC flattening method
- Patent number 10,575,409
- Issue date Feb 25, 2020
- BOE Technology Group Co., Ltd.
- Yongkang Hou
- B30 - PRESSES
Information Patent Grant
Clamping device for soldering operations
- Patent number 10,335,903
- Issue date Jul 2, 2019
- HONGFUJIN PRECISION ELECTRONICS (ZHENGZHOU) CO., LTD.
- Xi-Hang Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Motion-based reconfigurable microelectronics system
- Patent number 10,271,437
- Issue date Apr 23, 2019
- The United States of America as represented by the Secretary of the Army
- Jeffrey Spencer Pulskamp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and soldering device for selective soldering with at least o...
- Patent number 10,201,866
- Issue date Feb 12, 2019
- SEHO Systemtechnik GmbH
- Bernd Dreikorn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing jig and manufacturing apparatus for temperature measu...
- Patent number 10,117,339
- Issue date Oct 30, 2018
- BOE Technology Group Co., Ltd.
- Yan Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Increasing solder hole-fill in a printed circuit board assembly
- Patent number 9,986,649
- Issue date May 29, 2018
- International Business Machine Corporation
- Stephen M. Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Jet nozzle and jet soldering apparatus
- Patent number 9,849,535
- Issue date Dec 26, 2017
- Senju Metal Industry Co., Ltd.
- Noboru Hashimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method, treatment station and assembly for treating a planar materi...
- Patent number 9,713,265
- Issue date Jul 18, 2017
- Atotech Deutschland GmbH
- Henry Kunze
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process apparatus capable of pushing panel-shaped object and proces...
- Patent number 9,699,911
- Issue date Jul 4, 2017
- Wistron Corporation
- Hao-Chun Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering device, soldering method, and substrate and electronic co...
- Patent number 9,686,871
- Issue date Jun 20, 2017
- TANIGUROGUMI CORPORATION
- Katsumori Taniguro
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Increasing solder hole-fill in a printed circuit board assembly
- Patent number 9,662,732
- Issue date May 30, 2017
- International Business Machines Corporation
- Stephen M. Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Increasing solder hole-fill in a printed circuit board assembly
- Patent number 9,427,828
- Issue date Aug 30, 2016
- International Business Machines Corporation
- Stephen M. Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method, holding means, apparatus and system for transporting a flat...
- Patent number 9,380,708
- Issue date Jun 28, 2016
- Atotech Deutschland GmbH
- Henry Kunze
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate treating apparatus
- Patent number 9,358,587
- Issue date Jun 7, 2016
- SCREEN Holdings Co., Ltd.
- Yukio Tomifuji
- B08 - CLEANING
Information Patent Grant
System for removing an electronic component from a substrate
- Patent number 9,338,935
- Issue date May 10, 2016
- International Business Machines Corporation
- Yvan Bessette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate cleaning method, substrate cleaning apparatus and storage...
- Patent number 9,307,653
- Issue date Apr 5, 2016
- Tokyo Electron Limited
- Kousuke Yoshihara
- B08 - CLEANING

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT PATTERN, AND ETCHIN...
- Publication number 20250185177
- Publication date Jun 5, 2025
- NHK Spring Co., Ltd.
- Shinya YANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR CONTROLLING FLOW OF SOLDER IN A WAVE SOLDERIN...
- Publication number 20250133663
- Publication date Apr 24, 2025
- Illinois Tool Works Inc.
- Jonathan M. Dautenhahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR CONTROLLING FLOW OF SOLDER IN A WAVE SOLDERIN...
- Publication number 20250133664
- Publication date Apr 24, 2025
- Illinois Tool Works Inc.
- Jonathan M. Dautenhahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTING SYSTEM AND METHOD FOR CONTROLLING PRINTING SYSTEM
- Publication number 20250108597
- Publication date Apr 3, 2025
- Illinois Tool Works Inc.
- Zaizai Cheng
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
LASER WELDING APPARATUS AND WELDING METHOD USING THE SAME
- Publication number 20240408699
- Publication date Dec 12, 2024
- LG ENERGY SOLUTION, LTD.
- Jae Young JANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS
- Publication number 20240155773
- Publication date May 9, 2024
- Gebr. Schmid GmbH
- Christian Schmid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR ETCHING THE PERIPHERY EDGE OF A SUBSTRATE AND METHOD FOR...
- Publication number 20230269881
- Publication date Aug 24, 2023
- DEVICEENG CO., LTD
- Taek Youb LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Press-in machine for pressing components into a substrate, in parti...
- Publication number 20230139895
- Publication date May 4, 2023
- ERSA GMBH
- Kathrin Englert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE PROCESSING DEVICE HAVING HEAT HOLE
- Publication number 20220399192
- Publication date Dec 15, 2022
- Hanwha Corporation
- Su Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOOLING VACUUM UNIT
- Publication number 20210300014
- Publication date Sep 30, 2021
- ASM Assembly Systems Singapore Pte. Ltd.
- George Harold Bertram FOOT
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PRINTED CIRCUIT BOARDS IMPREGNATED WITH CARBON NANO TUBES
- Publication number 20210282269
- Publication date Sep 9, 2021
- Honeycomb Secure Systems, Inc.
- Thomas R. Goldberg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Filling Assembly
- Publication number 20210037655
- Publication date Feb 4, 2021
- ITC Intercircuit Electronic GmbH
- Hubertus Hein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR REPAIRING COATED PRINTED CIRCUIT BOARDS
- Publication number 20200260592
- Publication date Aug 13, 2020
- HAMILTON SUNDSTRAND CORPORATION
- Paul Sheedy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD, DEVICE, AND SYSTEM FOR MANUFACTURING PRINTED CIRCUIT BOARDS
- Publication number 20200221579
- Publication date Jul 9, 2020
- Gebr. Schmid GmbH
- Christian Schmid
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICAL CIRCUIT BOARD PRINTER
- Publication number 20190357359
- Publication date Nov 21, 2019
- FU TAI HUA INDUSTRY (SHENZHEN) CO., LTD.
- XUE-QIN ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Soldering Device Minimizing Voids When Soldering Printed Circuit Bo...
- Publication number 20170072491
- Publication date Mar 16, 2017
- ERSA GMBH
- Viktoria Rawinski
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DESMEAR TREATMENT DEVICE
- Publication number 20160330846
- Publication date Nov 10, 2016
- Ushio Denki Kabushiki Kaisha
- Noritaka TAKEZOE
- B08 - CLEANING
Information Patent Application
MANUFACTURING JIG AND MANUFACTURING APPARATUS FOR TEMPERATURE MEASU...
- Publication number 20150351255
- Publication date Dec 3, 2015
- BOE TECHNOLOGY GROUP CO., LTD.
- Yan JIANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF ETCHING METAL LAYER
- Publication number 20140251945
- Publication date Sep 11, 2014
- TOKYO ELECTRON LIMITED
- Eiichi NISHIMURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS FOR COATING SUBSTRATE AND METHOD FOR COATING SUBSTRATE
- Publication number 20130260041
- Publication date Oct 3, 2013
- Samsung Electro-mechanics Co., Ltd.
- Cheol Kang
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
SUBSTRATE TREATING APPARATUS
- Publication number 20130255732
- Publication date Oct 3, 2013
- Dainippon Screen Mfg. Co., Ltd.
- Yukio TOMIFUJI
- B08 - CLEANING
Information Patent Application
INSOLATION MACHINE FOR PANELS FITTED WITH A PANEL TURNER
- Publication number 20130239406
- Publication date Sep 19, 2013
- ALTIX
- Christophe COUSIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE CLEANING METHOD, SUBSTRATE CLEANING APPARATUS AND STORAGE...
- Publication number 20130174873
- Publication date Jul 11, 2013
- TOKYO ELECTRON LIMITED
- Kousuke Yoshihara
- B08 - CLEANING
Information Patent Application
Reflow Apparatus, Reflow Method, And Package Apparatus
- Publication number 20130068731
- Publication date Mar 21, 2013
- Samsung Electronics Co., Ltd.
- Minill KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR REMOVING AN ELECTRONIC COMPONENT FROM A SUBST...
- Publication number 20120266459
- Publication date Oct 25, 2012
- International Business Machines Corporation
- Yvan Bessette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND ASSEMBLY FOR TREATING A PLANAR MATERIAL TO BE TREATED AN...
- Publication number 20120111365
- Publication date May 10, 2012
- Atotech Deutschland GmbH
- Henry Kunze
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD, HOLDING MEANS, APPARATUS AND SYSTEM FOR TRANSPORTING A FLAT...
- Publication number 20120107074
- Publication date May 3, 2012
- Atotech Deutschland GmbH
- Henry Kunze
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ETCHING APPARATUS WITH SUCTION MECHANISM
- Publication number 20120103521
- Publication date May 3, 2012
- ZHEN DING TECHNOLOGY CO., LTD.
- CHIEN-PANG CHENG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD, TREATMENT STATION AND ASSEMBLY FOR TREATING A PLANAR MATERI...
- Publication number 20120080322
- Publication date Apr 5, 2012
- Atotech Deutschland GmbH
- Henry Kunze
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS AND METHOD FOR WET PROCESSING SUBSTRATE
- Publication number 20120067848
- Publication date Mar 22, 2012
- FOXCONN ADVANCED TECHNOLOGY INC.
- Chao-Wen LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Horizontally held PCB

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

System and method for controlling flow of solder in a wave solderin...

System and method for controlling flow of solder in a wave solderin...

Soldering apparatus

Pressure sintering device and method for manufacturing an electroni...

Apparatus for manufacturing printed circuit boards

Apparatus for manufacturing printed circuit boards

Bonding apparatus and method of fabricating display device using th...

Motion-based reconfigurable microelectronics system

Filling assembly

System and method for assembling hook type heatsink

Desmearing method and desmearing device

Substrate holder and plating apparatus

Vertical circuit board printer

Edge lock assembly for a stencil printer

FPC flattening jig and FPC flattening method

Clamping device for soldering operations

Motion-based reconfigurable microelectronics system

Method and soldering device for selective soldering with at least o...

Manufacturing jig and manufacturing apparatus for temperature measu...

Increasing solder hole-fill in a printed circuit board assembly

Jet nozzle and jet soldering apparatus

Method, treatment station and assembly for treating a planar materi...

Process apparatus capable of pushing panel-shaped object and proces...

Soldering device, soldering method, and substrate and electronic co...

Increasing solder hole-fill in a printed circuit board assembly

Increasing solder hole-fill in a printed circuit board assembly

Method, holding means, apparatus and system for transporting a flat...

Substrate treating apparatus

System for removing an electronic component from a substrate

Substrate cleaning method, substrate cleaning apparatus and storage...

Patents Applicationslast 30 patents

CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT PATTERN, AND ETCHIN...

SYSTEM AND METHOD FOR CONTROLLING FLOW OF SOLDER IN A WAVE SOLDERIN...

SYSTEM AND METHOD FOR CONTROLLING FLOW OF SOLDER IN A WAVE SOLDERIN...

PRINTING SYSTEM AND METHOD FOR CONTROLLING PRINTING SYSTEM

LASER WELDING APPARATUS AND WELDING METHOD USING THE SAME

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS

DEVICE FOR ETCHING THE PERIPHERY EDGE OF A SUBSTRATE AND METHOD FOR...

Press-in machine for pressing components into a substrate, in parti...

SUBSTRATE PROCESSING DEVICE HAVING HEAT HOLE

TOOLING VACUUM UNIT

PRINTED CIRCUIT BOARDS IMPREGNATED WITH CARBON NANO TUBES

Filling Assembly

METHOD FOR REPAIRING COATED PRINTED CIRCUIT BOARDS

METHOD, DEVICE, AND SYSTEM FOR MANUFACTURING PRINTED CIRCUIT BOARDS

VERTICAL CIRCUIT BOARD PRINTER

Soldering Device Minimizing Voids When Soldering Printed Circuit Bo...

DESMEAR TREATMENT DEVICE

MANUFACTURING JIG AND MANUFACTURING APPARATUS FOR TEMPERATURE MEASU...

METHOD OF ETCHING METAL LAYER

APPARATUS FOR COATING SUBSTRATE AND METHOD FOR COATING SUBSTRATE

SUBSTRATE TREATING APPARATUS

INSOLATION MACHINE FOR PANELS FITTED WITH A PANEL TURNER

SUBSTRATE CLEANING METHOD, SUBSTRATE CLEANING APPARATUS AND STORAGE...

Reflow Apparatus, Reflow Method, And Package Apparatus

SYSTEM AND METHOD FOR REMOVING AN ELECTRONIC COMPONENT FROM A SUBST...

METHOD AND ASSEMBLY FOR TREATING A PLANAR MATERIAL TO BE TREATED AN...

METHOD, HOLDING MEANS, APPARATUS AND SYSTEM FOR TRANSPORTING A FLAT...

ETCHING APPARATUS WITH SUCTION MECHANISM

METHOD, TREATMENT STATION AND ASSEMBLY FOR TREATING A PLANAR MATERI...

APPARATUS AND METHOD FOR WET PROCESSING SUBSTRATE