Housing Encapsulation

Industry

CPC
H01G4/224

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Parent Industries

HELECTRICITY H01Electric elements H01GCAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE H01G4/00Fixed capacitors Processes of their manufacture

Current Industry

H01G4/224Housing Encapsulation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Chip parts
- Patent number 12,217,913
- Issue date Feb 4, 2025
- Rohm Co., Ltd.
- Keisuke Fukae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 12,217,915
- Issue date Feb 4, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hwi Dae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor with multiple elements for multiple replacement applications
- Patent number 12,211,655
- Issue date Jan 28, 2025
- AmRad Manufacturing, LLC
- Robert M. Stockman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 12,205,769
- Issue date Jan 21, 2025
- Taiyo Yuden Co., Ltd.
- Yoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor header
- Patent number 12,205,767
- Issue date Jan 21, 2025
- FIRST LIGHT FUSION LIMITED
- Paul Holligan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for patterning valve metals
- Patent number 12,198,855
- Issue date Jan 14, 2025
- The Florida International University Board of Trustees
- Markondeyaraj Pulugurtha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 12,198,862
- Issue date Jan 14, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yeong Lim Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-voltage feed-through capacitor with element body, through-cond...
- Patent number 12,198,865
- Issue date Jan 14, 2025
- TDK Corporation
- Yuta Kamo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor with multiple elements for multiple replacement applications
- Patent number 12,191,087
- Issue date Jan 7, 2025
- AmRad Manufacturing, LLC
- Robert M. Stockman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 12,191,083
- Issue date Jan 7, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Su Ji Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer ceramic electronic component, multi-layer ceramic elect...
- Patent number 12,170,174
- Issue date Dec 17, 2024
- Taiyo Yuden Co., Ltd.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor including side margin portion having m...
- Patent number 12,165,811
- Issue date Dec 10, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chang Suek Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure and power converter
- Patent number 12,154,725
- Issue date Nov 26, 2024
- SUNGROW POWER SUPPLY CO., LTD.
- Jun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mutilayer electronic component
- Patent number 12,148,571
- Issue date Nov 19, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- SoEun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 12,142,437
- Issue date Nov 12, 2024
- Murata Manufacturing Co., Ltd.
- Hiroaki Sugita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for patterning valve metals
- Patent number 12,142,429
- Issue date Nov 12, 2024
- The Florida International University Board of Trustees
- Markondeyaraj Pulugurtha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component including cover layer having insula...
- Patent number 12,136,518
- Issue date Nov 5, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Do Young Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low inductance capacitor with annular distributed cores
- Patent number 12,136,519
- Issue date Nov 5, 2024
- SHANGHAI UNIVERSITY OF ENGINEERING SCIENCE
- Hui Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer ceramic electronic component and circuit board
- Patent number 12,131,869
- Issue date Oct 29, 2024
- Taiyo Yuden Co., Ltd.
- Kiyoshiro Yatagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method for manufacturing electronic component
- Patent number 12,131,871
- Issue date Oct 29, 2024
- Murata Manufacturing Co., Ltd.
- Yasuhiro Tamatani
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Capacitor with multiple elements for multiple replacement applications
- Patent number 12,125,645
- Issue date Oct 22, 2024
- AmRad Manufacturing, LLC
- Robert M. Stockman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 12,112,892
- Issue date Oct 8, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hyung Jong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage feed-through capacitor
- Patent number 12,106,906
- Issue date Oct 1, 2024
- TDK Corporation
- Yuta Kamo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,107,025
- Issue date Oct 1, 2024
- Murata Manufacturing Co., Ltd.
- Yohei Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device having an electro-ceramic component
- Patent number 12,102,009
- Issue date Sep 24, 2024
- Relyon Plasma Gmbh
- Stefan Nettesheim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor and method for manufacturing same
- Patent number 12,100,556
- Issue date Sep 24, 2024
- Nichicon Corporation
- Takashi Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor with fixing bus bar and capacitor case including rib for...
- Patent number 12,087,508
- Issue date Sep 10, 2024
- Denso Corporation
- Ryota Hiyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip capacitor including capacitor wires
- Patent number 12,080,479
- Issue date Sep 3, 2024
- Samsung Electronics Co., Ltd.
- Soojae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, cured product, molding and method for producing...
- Patent number 12,077,666
- Issue date Sep 3, 2024
- Resonac Corporation
- Yasunori Kawabata
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Capacitor assembly, method for production thereof and converter ass...
- Patent number 12,073,995
- Issue date Aug 27, 2024
- Siemens Energy Global GmbH & Co. KG
- Torsten Harald Simon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT
- Publication number 20250022658
- Publication date Jan 16, 2025
- Murata Manufacturing Co., Ltd.
- Satoshi MIYAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM CAPACITOR
- Publication number 20250014823
- Publication date Jan 9, 2025
- Murata Manufacturing Co., Ltd.
- Shoji OKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical capacitor
- Publication number 20250014817
- Publication date Jan 9, 2025
- ELECTRONICON Kondensatoren GmbH
- Volker Geitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUS BAR FOR A CAPACITOR AND CAPACITOR
- Publication number 20250014826
- Publication date Jan 9, 2025
- TDK Electronics AG
- Tomás WAGNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20250014828
- Publication date Jan 9, 2025
- Murata Manufacturing Co., Ltd.
- Hironori TSUTSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT
- Publication number 20250006429
- Publication date Jan 2, 2025
- Murata Manufacturing Co., Ltd.
- Satoshi MIYAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC DEVICE, MANUFACTURING METHOD OF THE S...
- Publication number 20240412924
- Publication date Dec 12, 2024
- Taiyo Yuden Co., Ltd.
- Daisuke IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20240404750
- Publication date Dec 5, 2024
- Murata Manufacturing Co., Ltd.
- Ryo NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20240404756
- Publication date Dec 5, 2024
- Murata Manufacturing Co., Ltd.
- Masaru TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitor for Multiple Replacement Applications
- Publication number 20240395468
- Publication date Nov 28, 2024
- AmRad Manufacturing, LLC
- Robert M. Stockman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND METHOD FOR MANUFACTURING SAME
- Publication number 20240395461
- Publication date Nov 28, 2024
- Nichicon Corporation
- Takashi MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20240387114
- Publication date Nov 21, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chang Ho SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20240379292
- Publication date Nov 14, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Hyun Sik Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240355548
- Publication date Oct 24, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Yong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20240355550
- Publication date Oct 24, 2024
- Murata Manufacturing Co., Ltd.
- Kazuhiro NISHIBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240339268
- Publication date Oct 10, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Yoonbin Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR PRODUCING ELECTRONIC COMPONENT
- Publication number 20240331943
- Publication date Oct 3, 2024
- Murata Manufacturing Co., Ltd.
- Shoji FUKUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240331944
- Publication date Oct 3, 2024
- Taiyo Yuden Co., Ltd.
- Yuji TAKITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC DEVICE AND MANUFACTURING METHOD OF TH...
- Publication number 20240331942
- Publication date Oct 3, 2024
- Taiyo Yuden Co., Ltd.
- Takumu YANAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR
- Publication number 20240331949
- Publication date Oct 3, 2024
- Murata Manufacturing Co., Ltd.
- Haruki Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240312712
- Publication date Sep 19, 2024
- Murata Manufacturing Co., Ltd.
- Daiki FUKUNAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20240312713
- Publication date Sep 19, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Dae Hee LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM CAPACITOR AND METHOD FOR PRODUCING FILM CAPACITOR
- Publication number 20240312724
- Publication date Sep 19, 2024
- Murata Manufacturing Co., Ltd.
- Satoru JOGAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20240312717
- Publication date Sep 19, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Youngjun Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL CIRCUIT AND POWER SUPPLY DEVICE
- Publication number 20240314924
- Publication date Sep 19, 2024
- Sharp Kabushiki Kaisha
- TAKESHI SHIOMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20240304385
- Publication date Sep 12, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sin Il Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20240304390
- Publication date Sep 12, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Gyuho Yeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20240282518
- Publication date Aug 22, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Dongwoo Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WOUND CAPACITOR PACKAGE STRUCTURE AND SEALING ELEMENT THEREOF
- Publication number 20240282526
- Publication date Aug 22, 2024
- APAQ TECHNOLOGY CO., LTD.
- CHUNG-JUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERED ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240274368
- Publication date Aug 15, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Tae Gyeom LEE
- H01 - BASIC ELECTRIC ELEMENTS

Housing Encapsulation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip parts

Multilayer electronic component

Capacitor with multiple elements for multiple replacement applications

Multilayer ceramic capacitor

Capacitor header

Systems and methods for patterning valve metals

Multilayer electronic component

High-voltage feed-through capacitor with element body, through-cond...

Capacitor with multiple elements for multiple replacement applications

Multilayer electronic component

Multi-layer ceramic electronic component, multi-layer ceramic elect...

Multilayer ceramic capacitor including side margin portion having m...

Capacitor structure and power converter

Mutilayer electronic component

Multilayer ceramic capacitor

Systems and methods for patterning valve metals

Multilayer electronic component including cover layer having insula...

Low inductance capacitor with annular distributed cores

Multi-layer ceramic electronic component and circuit board

Electronic component and method for manufacturing electronic component

Capacitor with multiple elements for multiple replacement applications

Multilayer electronic component

High voltage feed-through capacitor

Semiconductor device

Device having an electro-ceramic component

Capacitor and method for manufacturing same

Capacitor with fixing bus bar and capacitor case including rib for...

Chip capacitor including capacitor wires

Resin composition, cured product, molding and method for producing...

Capacitor assembly, method for production thereof and converter ass...

Patents Applicationslast 30 patents

MULTILAYER CERAMIC ELECTRONIC COMPONENT

FILM CAPACITOR

Electrical capacitor

BUS BAR FOR A CAPACITOR AND CAPACITOR

MULTILAYER CERAMIC CAPACITOR

MULTILAYER CERAMIC ELECTRONIC COMPONENT

MULTILAYER CERAMIC ELECTRONIC DEVICE, MANUFACTURING METHOD OF THE S...

MULTILAYER CERAMIC CAPACITOR

MULTILAYER CERAMIC CAPACITOR

Capacitor for Multiple Replacement Applications

CAPACITOR AND METHOD FOR MANUFACTURING SAME

MULTILAYER ELECTRONIC COMPONENT

MULTILAYER ELECTRONIC COMPONENT

MULTILAYER ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

MULTILAYER CERAMIC CAPACITOR

MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC COMPONENT AND METHOD FOR PRODUCING ELECTRONIC COMPONENT

CERAMIC ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME

MULTILAYER CERAMIC ELECTRONIC DEVICE AND MANUFACTURING METHOD OF TH...

CAPACITOR

ELECTRONIC COMPONENT

MULTILAYER ELECTRONIC COMPONENT

FILM CAPACITOR AND METHOD FOR PRODUCING FILM CAPACITOR

MULTILAYER CERAMIC CAPACITOR

CONTROL CIRCUIT AND POWER SUPPLY DEVICE

MULTILAYER ELECTRONIC COMPONENT

MULTILAYER CERAMIC CAPACITOR

MULTILAYER ELECTRONIC COMPONENT

WOUND CAPACITOR PACKAGE STRUCTURE AND SEALING ELEMENT THEREOF

MULTILAYERED ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME