Housing Encapsulation

Industry

CPC
H01G4/224

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Parent Industries

HELECTRICITY H01Electric elements H01GCAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE H01G4/00Fixed capacitors Processes of their manufacture

Current Industry

H01G4/224Housing Encapsulation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Multilayer electronic component
- Patent number 12,362,099
- Issue date Jul 15, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sang Yeop Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip parts
- Patent number 12,362,096
- Issue date Jul 15, 2025
- Rohm Co., Ltd.
- Keisuke Fukae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 12,354,805
- Issue date Jul 8, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jun Il Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 12,354,806
- Issue date Jul 8, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jeong Bong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component having structure for improved adhes...
- Patent number 12,354,803
- Issue date Jul 8, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hyung Jong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor including main-surface-side outer laye...
- Patent number 12,347,621
- Issue date Jul 1, 2025
- Murata Manufacturing Co., Ltd.
- Kenta Hirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,340,943
- Issue date Jun 24, 2025
- TDK Corporation
- Takaaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component containing coating layers having an...
- Patent number 12,334,270
- Issue date Jun 17, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sung Min Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic component
- Patent number 12,334,272
- Issue date Jun 17, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Eun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive paste and multilayer electronic component
- Patent number 12,334,260
- Issue date Jun 17, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kun Ho Koo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component having the dielectric film not covers a corner...
- Patent number 12,334,265
- Issue date Jun 17, 2025
- TDK Corporation
- Kazuhiro Yoshikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, electronic component manufacturing method, ca...
- Patent number 12,334,266
- Issue date Jun 17, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hiroki Takeoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low inductance capacitor with concentric ring capacitor core simila...
- Patent number 12,327,691
- Issue date Jun 10, 2025
- University of Shanghai for Science and Technology
- Lihui Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor including a rare earth element and zirconium
- Patent number 12,322,552
- Issue date Jun 3, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Je Hee Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor with multiple elements for multiple replacement applications
- Patent number 12,315,679
- Issue date May 27, 2025
- AmRad Manufacturing, LLC
- Robert M. Stockman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 12,308,174
- Issue date May 20, 2025
- Murata Manufacturing Co., Ltd.
- Yuuta Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component including insulating layer
- Patent number 12,308,173
- Issue date May 20, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jeong Mo Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor with multiple elements for multiple replacement applications
- Patent number 12,308,179
- Issue date May 20, 2025
- AmRad Manufacturing, LLC
- Robert M. Stockman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor and board component having the same
- Patent number 12,308,172
- Issue date May 20, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Man Su Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic electronic component with glass grains in side m...
- Patent number 12,300,441
- Issue date May 13, 2025
- Taiyo Yuden Co., Ltd.
- Maiko Yamane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer ceramic electronic component and board for mounting the...
- Patent number 12,300,440
- Issue date May 13, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Byeong Chan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 12,300,442
- Issue date May 13, 2025
- Murata Manufacturing Co., Ltd.
- Yasuyuki Shimada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metacapacitors and power-electronic converters for power-electronic...
- Patent number 12,289,056
- Issue date Apr 29, 2025
- 10644137 CANADA INC.
- Majid Pahlevaninezhad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 12,278,055
- Issue date Apr 15, 2025
- TDK Corporation
- Akihiro Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component including barium calcium titanate
- Patent number 12,278,057
- Issue date Apr 15, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jeong Bong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 12,278,058
- Issue date Apr 15, 2025
- Murata Manufacturing Co., Ltd.
- Yukie Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor for multiple replacement applications
- Patent number 12,272,501
- Issue date Apr 8, 2025
- AmRad Manufacturing, LLC
- Robert M. Stockman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor with multiple elements for multiple replacement applications
- Patent number 12,272,503
- Issue date Apr 8, 2025
- AmRad Manufacturing, LLC
- Robert M. Stockman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic electronic component
- Patent number 12,266,476
- Issue date Apr 1, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kyo Yeol Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor with multiple elements for multiple replacement applications
- Patent number 12,260,997
- Issue date Mar 25, 2025
- AmRad Manufacturing, LLC
- Robert M. Stockman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PARTIALLY ENCAPSULATED DC LINK CAPACITOR MODULE AND VOLTAGE CONVERTER
- Publication number 20250232918
- Publication date Jul 17, 2025
- VALEO ELECTRIFICATION
- Lothar SEIF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitor for Multiple Replacement Applications
- Publication number 20250232922
- Publication date Jul 17, 2025
- AmRad Manufacturing, LLC
- Robert M. Stockman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND METHOD FOR MANUFACTURING CAPACITOR
- Publication number 20250232919
- Publication date Jul 17, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- SHUHEI YOKOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitor for Multiple Replacement Applications
- Publication number 20250226157
- Publication date Jul 10, 2025
- AmRad Manufacturing, LLC
- Robert M. Stockman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METACAPACITORS AND POWER-ELECTRONIC CONVERTERS FOR POWER-ELECTRONIC...
- Publication number 20250226755
- Publication date Jul 10, 2025
- 10644137 CANADA INC.
- Majid Pahlevaninezhad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METACAPACITORS AND POWER-ELECTRONIC CONVERTERS FOR POWER-ELECTRONIC...
- Publication number 20250226756
- Publication date Jul 10, 2025
- 10644137 CANADA INC.
- Majid Pahlevaninezhad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR WITH MULTIPLE ELEMENTS FOR MULTIPLE REPLACEMENT APPLICATIONS
- Publication number 20250218694
- Publication date Jul 3, 2025
- AmRad Manufacturing, LLC
- Robert M. Stockman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20250218677
- Publication date Jul 3, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Taek Jung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20250218685
- Publication date Jul 3, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Young Eun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20250218679
- Publication date Jul 3, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20250218687
- Publication date Jul 3, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Seung Yeon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20250218661
- Publication date Jul 3, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jun Il SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE WITHIN A HOLE IN A SUBSTRATE CORE ATTACHED TO METAL FEATURES OV...
- Publication number 20250218678
- Publication date Jul 3, 2025
- Intel Corporation
- Hiroki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC DEVICE
- Publication number 20250210266
- Publication date Jun 26, 2025
- TDK Corporation
- Yuuki Hidaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-FABRICATED COMPONENT-HYBRIDS FOR EMBEDDING IN A CORE
- Publication number 20250210268
- Publication date Jun 26, 2025
- Intel Corporation
- Srinivasan RAMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT, PACKAGE BODY, AND CIRCUIT...
- Publication number 20250201476
- Publication date Jun 19, 2025
- Taiyo Yuden Co., Ltd.
- Hiroaki SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT
- Publication number 20250201475
- Publication date Jun 19, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Kyo Yeol LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR
- Publication number 20250201484
- Publication date Jun 19, 2025
- NICHICON CORPORATION
- Yoshiyuki YAMAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC DEVICE AND MANUFACTURING METHOD OF TH...
- Publication number 20250201477
- Publication date Jun 19, 2025
- Taiyo Yuden Co., Ltd.
- Kyousuke SHIMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20250201474
- Publication date Jun 19, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Eun Kyung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY EMBEDDED PRE-FORMED DEEP TRENCH CAPACITOR MODULES
- Publication number 20250201485
- Publication date Jun 19, 2025
- Intel Corporation
- Hiroki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND POWER SOURCE MODULE
- Publication number 20250201478
- Publication date Jun 19, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Kenichi ASANUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20250182973
- Publication date Jun 5, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Ji Hye YU
- C01 - INORGANIC CHEMISTRY
Information Patent Application
ELECTRONIC COMPONENT, CIRCUIT BOARD ARRANGEMENT, ELECTRONIC DEVICE,...
- Publication number 20250182971
- Publication date Jun 5, 2025
- Taiyo Yuden Co., Ltd.
- Ryosuke HOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20250174407
- Publication date May 29, 2025
- Murata Manufacturing Co., Ltd.
- Hisaki KITAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20250166897
- Publication date May 22, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jung Wun HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM CAPACITOR
- Publication number 20250166919
- Publication date May 22, 2025
- Murata Manufacturing Co., Ltd.
- Tomoki INAKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20250166922
- Publication date May 22, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Hyo Sung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER ELECTRONIC COMPONENT
- Publication number 20250166911
- Publication date May 22, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jae Eun HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC DEVICE
- Publication number 20250158111
- Publication date May 15, 2025
- Taiyo Yuden Co., Ltd.
- Chie KAWAMURA
- H01 - BASIC ELECTRIC ELEMENTS

Housing Encapsulation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multilayer electronic component

Chip parts

Multilayer electronic component

Multilayer electronic component

Multilayer electronic component having structure for improved adhes...

Multilayer ceramic capacitor including main-surface-side outer laye...

Electronic device

Multilayer electronic component containing coating layers having an...

Multilayer electronic component

Conductive paste and multilayer electronic component

Electronic component having the dielectric film not covers a corner...

Electronic component, electronic component manufacturing method, ca...

Low inductance capacitor with concentric ring capacitor core simila...

Multilayer capacitor including a rare earth element and zirconium

Capacitor with multiple elements for multiple replacement applications

Electronic component

Ceramic electronic component including insulating layer

Capacitor with multiple elements for multiple replacement applications

Multilayer capacitor and board component having the same

Multilayer ceramic electronic component with glass grains in side m...

Multi-layer ceramic electronic component and board for mounting the...

Multilayer ceramic capacitor

Metacapacitors and power-electronic converters for power-electronic...

Electronic component

Ceramic electronic component including barium calcium titanate

Multilayer ceramic capacitor

Capacitor for multiple replacement applications

Capacitor with multiple elements for multiple replacement applications

Multilayer ceramic electronic component

Capacitor with multiple elements for multiple replacement applications

Patents Applicationslast 30 patents

PARTIALLY ENCAPSULATED DC LINK CAPACITOR MODULE AND VOLTAGE CONVERTER

Capacitor for Multiple Replacement Applications

CAPACITOR AND METHOD FOR MANUFACTURING CAPACITOR

Capacitor for Multiple Replacement Applications

METACAPACITORS AND POWER-ELECTRONIC CONVERTERS FOR POWER-ELECTRONIC...

METACAPACITORS AND POWER-ELECTRONIC CONVERTERS FOR POWER-ELECTRONIC...

CAPACITOR WITH MULTIPLE ELEMENTS FOR MULTIPLE REPLACEMENT APPLICATIONS

MULTILAYER ELECTRONIC COMPONENT

MULTILAYER ELECTRONIC COMPONENT

MULTILAYER ELECTRONIC COMPONENT

MULTILAYER ELECTRONIC COMPONENT

MULTILAYER ELECTRONIC COMPONENT

DIE WITHIN A HOLE IN A SUBSTRATE CORE ATTACHED TO METAL FEATURES OV...

MULTILAYER CERAMIC ELECTRONIC DEVICE

PRE-FABRICATED COMPONENT-HYBRIDS FOR EMBEDDING IN A CORE

MULTILAYER CERAMIC ELECTRONIC COMPONENT, PACKAGE BODY, AND CIRCUIT...

MULTILAYER CERAMIC ELECTRONIC COMPONENT

CAPACITOR

MULTILAYER CERAMIC ELECTRONIC DEVICE AND MANUFACTURING METHOD OF TH...

MULTILAYER ELECTRONIC COMPONENT

VERTICALLY EMBEDDED PRE-FORMED DEEP TRENCH CAPACITOR MODULES

CAPACITOR AND POWER SOURCE MODULE

MULTILAYER ELECTRONIC COMPONENT

ELECTRONIC COMPONENT, CIRCUIT BOARD ARRANGEMENT, ELECTRONIC DEVICE,...

ELECTRONIC COMPONENT

MULTILAYER ELECTRONIC COMPONENT

FILM CAPACITOR

MULTILAYER ELECTRONIC COMPONENT

MULTILAYER ELECTRONIC COMPONENT

MULTILAYER CERAMIC ELECTRONIC DEVICE