Impedance arrangements

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H05K1/025

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/025Impedance arrangements

Industries

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Patents Grantslast 30 patents

Information Patent Grant
High-frequency circuit and communication module
- Patent number 12,171,059
- Issue date Dec 17, 2024
- Mitsubishi Electric Corporation
- Nobuo Ohata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency filter
- Patent number 12,160,217
- Issue date Dec 3, 2024
- Mitsubishi Electric Corporation
- Motomi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bend compensation for conductive traces on printed circuit boards
- Patent number 12,150,240
- Issue date Nov 19, 2024
- Amphenol Corporation
- Michael Rowlands
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Antenna impedance matching circuit, antenna system and mobile terminal
- Patent number 12,150,241
- Issue date Nov 19, 2024
- Huizhou TCL Mobile Communication Co., Ltd
- Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for charge storage and providing power
- Patent number 12,140,619
- Issue date Nov 12, 2024
- Analog Devices International Unlimited Company
- Alan J. O'Donnell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection of electronics in negative pressure wound therapy systems
- Patent number 12,127,333
- Issue date Oct 22, 2024
- Smith & Nephew PLC
- Ben Alan Askem
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Multilayer substrate
- Patent number 12,120,815
- Issue date Oct 15, 2024
- Murata Manufacturing Co., Ltd.
- Tomohiro Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus including antistatic portion
- Patent number 12,111,542
- Issue date Oct 8, 2024
- Samsung Electronics Co., Ltd.
- Hyukjun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display substrate and preparation method thereof, and display appar...
- Patent number 12,113,060
- Issue date Oct 8, 2024
- Beijing Boe Display Technology Co., Ltd.
- Tingting Wang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Organism monitoring devices and organism monitoring methods
- Patent number 12,096,747
- Issue date Sep 24, 2024
- Battelle Memorial Institute
- Z. Daniel Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electricity meter
- Patent number 12,089,333
- Issue date Sep 10, 2024
- Sentec Ltd.
- Andrew Nicholas Dames
- G01 - MEASURING TESTING
Information Patent Grant
Signal transmission device
- Patent number 12,080,933
- Issue date Sep 3, 2024
- Hitachi Astemo, Ltd.
- Yutaka Uematsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-level printed circuit boards and memory modules including the...
- Patent number 12,075,560
- Issue date Aug 27, 2024
- Samsung Electronics Co., Ltd.
- Jong-Hyun Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Branch coupler having U-shaped and L-shaped microstrip lines
- Patent number 12,069,799
- Issue date Aug 20, 2024
- Nanning FuLian FuGui Precision Industrial Co., Ltd.
- Yu-Chih Chueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board arrangement, differential probe circuit and method
- Patent number 12,069,800
- Issue date Aug 20, 2024
- Rohde & Schwarz GmbH & Co. KG
- Andreas Ziegler
- G01 - MEASURING TESTING
Information Patent Grant
Circuit to compensate for temperature impedance drift of conductive...
- Patent number 12,061,124
- Issue date Aug 13, 2024
- Advanced Micro Devices (Shanghai) Co., Ltd.
- Lin Wang
- G01 - MEASURING TESTING
Information Patent Grant
Module board and memory module including the same
- Patent number 12,063,736
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Wonseop Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic control device
- Patent number 12,058,822
- Issue date Aug 6, 2024
- Hitachi Astemo, Ltd.
- Yuki Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tools and methods for reduced mechanical ringing
- Patent number 12,038,549
- Issue date Jul 16, 2024
- Halliburton Energy Services, Inc.
- Chang S. Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and printed circuit board including structure for...
- Patent number 12,035,462
- Issue date Jul 9, 2024
- Samsung Electronics Co., Ltd.
- Hongkyu Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Carrier board and power module using same
- Patent number 12,028,969
- Issue date Jul 2, 2024
- Delta Electronics (Shanghai) Co., Ltd.
- Shouyu Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate and electronic device
- Patent number 12,028,968
- Issue date Jul 2, 2024
- Sony Group Corporation
- Takahiro Shinojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission line power dividers and power combiners with matched p...
- Patent number 12,022,609
- Issue date Jun 25, 2024
- L3 Technologies, Inc.
- Brian Christopher Clark
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method thereof
- Patent number 12,022,612
- Issue date Jun 25, 2024
- Unimicron Technology Corp.
- Chun-Hung Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Setting the impedance of signal traces of a circuit board using a r...
- Patent number 12,016,114
- Issue date Jun 18, 2024
- Super Micro Computer, Inc.
- Manhtien V. Phan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Header and package with integrated cooler for electronic components
- Patent number 12,009,634
- Issue date Jun 11, 2024
- Schott AG
- Andreas Krause
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,010,795
- Issue date Jun 11, 2024
- LG Innotek Co., Ltd
- Il Sik Nam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resonant-coupled transmission line
- Patent number 12,004,288
- Issue date Jun 4, 2024
- Teradyne, Inc.
- Andrew Westwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices and systems with parallel impedance adjustment circu...
- Patent number 12,001,368
- Issue date Jun 4, 2024
- Hyun Yoo Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flexible circuit board assembly, display assembly and display device
- Patent number 11,991,830
- Issue date May 21, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Qizhong Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20240414844
- Publication date Dec 12, 2024
- LG Innotek Co., Ltd.
- Yong Suk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20240407095
- Publication date Dec 5, 2024
- LG Innotek Co., Ltd.
- Han Sang KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE AND OPTICAL TRANSCEIVER
- Publication number 20240407104
- Publication date Dec 5, 2024
- FUJITSU OPTICAL COMPONENTS LIMITED
- Masaki Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPARK GAP STRUCTURES FOR ELECTRICAL OVERSTRESS DETECTION AND PROTEC...
- Publication number 20240405519
- Publication date Dec 5, 2024
- Analog Devices International Unlimited Company
- David J. Clarke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BREAKPOINT INSULATION FILM
- Publication number 20240397613
- Publication date Nov 28, 2024
- Taicang Manaflex Technology Co., Ltd.
- Robert C. LANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURIED SKIP VIAS FOR IMPROVED SIGNAL AND POWER INTEGRITY
- Publication number 20240389230
- Publication date Nov 21, 2024
- NVIDIA Corporation
- Mingyi Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD TO MAINTAIN SIGNAL INTEGRITY BETWEEN MULTIPLE SIG...
- Publication number 20240389223
- Publication date Nov 21, 2024
- Dell Products L.P.
- SANDOR TIBOR FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND IMAGE DISPLAY DEVICE INCLUDING SAME
- Publication number 20240373547
- Publication date Nov 7, 2024
- LG ELECTRONICS INC.
- Geumsub SIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR LOCATING HALL EFFECT SENSOR ASSEMBLY
- Publication number 20240334604
- Publication date Oct 3, 2024
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Lucas Alan Mann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPACT HALL EFFECT SENSOR PACKAGE
- Publication number 20240334605
- Publication date Oct 3, 2024
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Lucas Alan Mann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM FOR LOCATING HALL EFFECT SENSOR ASSEMBLY
- Publication number 20240334606
- Publication date Oct 3, 2024
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Akaylia Ashliegh Kimberly Morgan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPEDANCE MATCHED VIA CONNECTIONS IN A PRINTED CIRCUIT BOARD
- Publication number 20240324097
- Publication date Sep 26, 2024
- The Phoenix Company of Chicago, Inc.
- Sri Satya Parthiva Sumanam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMISSION LINE POWER DIVIDERS AND POWER COMBINERS WITH MATCHED P...
- Publication number 20240314925
- Publication date Sep 19, 2024
- L3 Technologies, Inc.
- Brian Christopher Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stripline Wafer for Wafer Based Connector System
- Publication number 20240313480
- Publication date Sep 19, 2024
- TE Connectivity Solutions GMBH
- Bruce Allen CHAMPION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURGE PROTECTION MODULE
- Publication number 20240306355
- Publication date Sep 12, 2024
- HO-HSIEN LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HALF-BRIDGE SWITCH ARRANGEMENT
- Publication number 20240298402
- Publication date Sep 5, 2024
- SEG Automotive Germany GmbH
- Nima SAADAT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240292534
- Publication date Aug 29, 2024
- LG Innotek Co., Ltd.
- Il Sik NAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATCHING CIRCUIT BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20240292520
- Publication date Aug 29, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD, DISPLAY MODULE AND DRIVING METHOD THEREOF, A...
- Publication number 20240276635
- Publication date Aug 15, 2024
- HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Zhenzhou Xing
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
CIRCUIT BOARD, ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME, AND...
- Publication number 20240276640
- Publication date Aug 15, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Young-Gon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND DISPLAY MODULE
- Publication number 20240251501
- Publication date Jul 25, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Jiahua WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH VOLTAGE CASCADE
- Publication number 20240250601
- Publication date Jul 25, 2024
- Siemens Healthineers AG
- Patrick LUDWIG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
DUAL IN-LINE MEMORY MODULE (DIMM) SOLUTION THAT INCLUDES FLEXIBLE T...
- Publication number 20240237193
- Publication date Jul 11, 2024
- Intel Corporation
- Yi HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROSTATIC DISCHARGE PROTECTION FOR SENSORS IN WOUND THERAPY
- Publication number 20240215906
- Publication date Jul 4, 2024
- Smith & Nephew PLC
- Ben Alan Askem
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE COMPONENT
- Publication number 20240215150
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEI CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Display device
- Publication number 20240215360
- Publication date Jun 27, 2024
- InnoLux Corporation
- Hui-Min HUANG
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
EXTERNAL CONNECTION TERMINAL
- Publication number 20240196522
- Publication date Jun 13, 2024
- FUJIFILM CORPORATION
- Katsuyuki NUKUI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC COMPONENT AND BOARD HAVING ELECTRONIC COMPONENT MOUNTED...
- Publication number 20240196523
- Publication date Jun 13, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20240196518
- Publication date Jun 13, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20240196524
- Publication date Jun 13, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- CHIKARA OHMORI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Impedance arrangements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High-frequency circuit and communication module

High frequency filter

Bend compensation for conductive traces on printed circuit boards

Antenna impedance matching circuit, antenna system and mobile terminal

Systems and methods for charge storage and providing power

Protection of electronics in negative pressure wound therapy systems

Multilayer substrate

Display apparatus including antistatic portion

Display substrate and preparation method thereof, and display appar...

Organism monitoring devices and organism monitoring methods

Electricity meter

Signal transmission device

Multi-level printed circuit boards and memory modules including the...

Branch coupler having U-shaped and L-shaped microstrip lines

Circuit board arrangement, differential probe circuit and method

Circuit to compensate for temperature impedance drift of conductive...

Module board and memory module including the same

Electronic control device

Tools and methods for reduced mechanical ringing

Electronic device and printed circuit board including structure for...

Carrier board and power module using same

Substrate and electronic device

Transmission line power dividers and power combiners with matched p...

Circuit board and manufacturing method thereof

Setting the impedance of signal traces of a circuit board using a r...

Header and package with integrated cooler for electronic components

Printed circuit board

Resonant-coupled transmission line

Memory devices and systems with parallel impedance adjustment circu...

Flexible circuit board assembly, display assembly and display device

Patents Applicationslast 30 patents

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

OPTICAL MODULE AND OPTICAL TRANSCEIVER

SPARK GAP STRUCTURES FOR ELECTRICAL OVERSTRESS DETECTION AND PROTEC...

BREAKPOINT INSULATION FILM

BURIED SKIP VIAS FOR IMPROVED SIGNAL AND POWER INTEGRITY

SYSTEM AND METHOD TO MAINTAIN SIGNAL INTEGRITY BETWEEN MULTIPLE SIG...

PRINTED CIRCUIT BOARD AND IMAGE DISPLAY DEVICE INCLUDING SAME

METHOD FOR LOCATING HALL EFFECT SENSOR ASSEMBLY

COMPACT HALL EFFECT SENSOR PACKAGE

SYSTEM FOR LOCATING HALL EFFECT SENSOR ASSEMBLY

IMPEDANCE MATCHED VIA CONNECTIONS IN A PRINTED CIRCUIT BOARD

TRANSMISSION LINE POWER DIVIDERS AND POWER COMBINERS WITH MATCHED P...

Stripline Wafer for Wafer Based Connector System

SURGE PROTECTION MODULE

HALF-BRIDGE SWITCH ARRANGEMENT

PRINTED CIRCUIT BOARD

MATCHING CIRCUIT BOARD AND SEMICONDUCTOR DEVICE

PRINTED CIRCUIT BOARD, DISPLAY MODULE AND DRIVING METHOD THEREOF, A...

CIRCUIT BOARD, ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME, AND...

FLEXIBLE CIRCUIT BOARD AND DISPLAY MODULE

HIGH VOLTAGE CASCADE

DUAL IN-LINE MEMORY MODULE (DIMM) SOLUTION THAT INCLUDES FLEXIBLE T...

ELECTROSTATIC DISCHARGE PROTECTION FOR SENSORS IN WOUND THERAPY

PACKAGE COMPONENT

Display device

EXTERNAL CONNECTION TERMINAL

ELECTRONIC COMPONENT AND BOARD HAVING ELECTRONIC COMPONENT MOUNTED...

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

CIRCUIT BOARD