in combination with capacitors only

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CPC
H01L27/0733

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/0733in combination with capacitors only

Industries

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 11,984,511
- Issue date May 14, 2024
- NANYA TECHNOLOGY CORPORATION
- Jhen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power MOSFETs structure
- Patent number 11,967,645
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yogendra Yadav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device
- Patent number 11,955,479
- Issue date Apr 9, 2024
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,942,431
- Issue date Mar 26, 2024
- Kioxia Corporation
- Nobuyuki Momo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer trench capacitor structure
- Patent number 11,916,100
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsuan-Han Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 11,830,889
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Victor Chiang Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for testing nanoscale devices including ferroelectric ca...
- Patent number 11,729,994
- Issue date Aug 15, 2023
- Chenchen Jacob Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Negative capacitance fet device with reduced hysteresis window
- Patent number RE49563
- Issue date Jun 27, 2023
- Samsung Electronics Co., Ltd.
- Chang Hwan Shin
Information Patent Grant
Method of manufacturing an integrated circuit comprising a capaciti...
- Patent number 11,605,702
- Issue date Mar 14, 2023
- STMicroelectronics (Rousset) SAS
- Abderrezak Marzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor structure
- Patent number 11,588,010
- Issue date Feb 21, 2023
- Realtek Semiconductor Corporation
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits with capacitors
- Patent number 11,587,790
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsiao-Han Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid high and low stress oxide embedded capacitor dielectric
- Patent number 11,495,658
- Issue date Nov 8, 2022
- Texas Instruments Incorporated
- Elizabeth Costner Stewart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding between isolation capacitors for multichip modules
- Patent number 11,495,553
- Issue date Nov 8, 2022
- Texas Instruments Incorporated
- Thomas Dyer Bonifield
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,437,324
- Issue date Sep 6, 2022
- Kioxia Corporation
- Nobuyuki Momo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-mask, high-q performance metal-insulator-metal capacitor (MI...
- Patent number 11,398,545
- Issue date Jul 26, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical memory devices
- Patent number 11,380,700
- Issue date Jul 5, 2022
- Samsung Electronics Co., Ltd.
- Junhyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses having memory cells with two transistors and one capaci...
- Patent number 11,302,703
- Issue date Apr 12, 2022
- Micron Technology, Inc.
- Kamal M. Karda
- G11 - INFORMATION STORAGE
Information Patent Grant
Negative capacitance FinFET device and manufacturing method of the...
- Patent number RE49015
- Issue date Apr 5, 2022
- Samsung Electronics Co., Ltd.
- Chang Hwan Shin
Information Patent Grant
Semiconductor device
- Patent number 11,257,829
- Issue date Feb 22, 2022
- Kabushiki Kaisha Toshiba
- Shinji Kawahara
- G11 - INFORMATION STORAGE
Information Patent Grant
IC with larger and smaller width contacts
- Patent number 11,239,230
- Issue date Feb 1, 2022
- Texas Instruments Incorporated
- Abbas Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for testing nanoscale devices including ferroelectric ca...
- Patent number 11,183,504
- Issue date Nov 23, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Chenchen Jacob Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,177,395
- Issue date Nov 16, 2021
- Renesas Electronics Corporation
- Eisuke Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure with embedded memory device and contact isolation scheme
- Patent number 11,152,355
- Issue date Oct 19, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fan-Shuen Meng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures with deep trench capacitor and methods of...
- Patent number 11,145,658
- Issue date Oct 12, 2021
- International Business Machines Corporation
- Kevin K. Chan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,127,859
- Issue date Sep 21, 2021
- NANYA TECHNOLOGY CORPORATION
- Jhen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures with deep trench capacitor and methods of...
- Patent number 11,107,821
- Issue date Aug 31, 2021
- International Business Machines Corporation
- Kevin K. Chan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 11,094,723
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Victor Chiang Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power MOSFETs structure
- Patent number 11,088,277
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yogendra Yadav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures with deep trench capacitor and methods of...
- Patent number 11,056,493
- Issue date Jul 6, 2021
- International Business Machines Corporation
- Kevin K. Chan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of making a semiconductor device
- Patent number 11,011,556
- Issue date May 18, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Victor Chiang Liang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240250187
- Publication date Jul 25, 2024
- NANYA TECHNOLOGY CORPORATION
- Jhen-Yu TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH CURRENT POWER MODULE PACKAGE WITH LINEAR OPERATION CAPABILITIE...
- Publication number 20240170482
- Publication date May 23, 2024
- INFINEON TECHNOLOGIES AG
- Benno Koeppl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER TRENCH CAPACITOR STRUCTURE
- Publication number 20240153987
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsuan-Han Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND NON-VOLATILE MEMORY DEVICE
- Publication number 20240145530
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Yongjun KIM
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING SEMICONDUCTOR...
- Publication number 20240113020
- Publication date Apr 4, 2024
- Samsung Electronics Co., Ltd.
- Donghoon Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING CAPACITOR, SEMICONDUCTOR DEVICE, MODULE, AND ELE...
- Publication number 20240105713
- Publication date Mar 28, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Tetsuhiro TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR TESTING NANOSCALE DEVICES INCLUDING FERROELECTRIC CA...
- Publication number 20230345736
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Chenchen Jacob WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY LINEAR CAPACITOR IN SEMICONDUCTOR TECHNOLOGIES
- Publication number 20230253400
- Publication date Aug 10, 2023
- QUALCOMM Incorporated
- Bruce LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuits with Capacitors
- Publication number 20230207320
- Publication date Jun 29, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsiao-Han Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER TRENCH CAPACITOR STRUCTURE
- Publication number 20230032620
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsuan-Han Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20220415885
- Publication date Dec 29, 2022
- SOCIONEXT INC.
- Isaya SOBUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220367371
- Publication date Nov 17, 2022
- KIOXIA Corporation
- Nobuyuki MOMO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR TESTING NANOSCALE DEVICES INCLUDING FERROELECTRIC CA...
- Publication number 20220028875
- Publication date Jan 27, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Chenchen Jacob WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20210376165
- Publication date Dec 2, 2021
- NANYA TECHNOLOGY CORPORATION
- Jhen-Yu TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MOSFETS STRUCTURE
- Publication number 20210359129
- Publication date Nov 18, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- YOGENDRA YADAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20210351210
- Publication date Nov 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Victor Chiang LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR TESTING NANOSCALE DEVICES INCLUDING FERROELECTRIC CA...
- Publication number 20210327888
- Publication date Oct 21, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Chenchen Jacob WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING CAPACITOR, SEMICONDUCTOR DEVICE, MODULE, AND ELE...
- Publication number 20210242199
- Publication date Aug 5, 2021
- Semiconductor Energy Laboratory Co., Ltd.
- Tetsuhiro TANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated Circuits with Capacitors
- Publication number 20210091172
- Publication date Mar 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiao-Han Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE
- Publication number 20210091173
- Publication date Mar 25, 2021
- REALTEK SEMICONDUCTOR CORPORATION
- Hsiao-Tsung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210082929
- Publication date Mar 18, 2021
- Kabushiki Kaisha Toshiba
- Shinji Kawahara
- G11 - INFORMATION STORAGE
Information Patent Application
VERTICAL MEMORY DEVICES
- Publication number 20210036001
- Publication date Feb 4, 2021
- Samsung Electronics Co., Ltd.
- Junhyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200388713
- Publication date Dec 10, 2020
- NANYA TECHNOLOGY CORPORATION
- Jhen-Yu TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MOSFETS STRUCTURE
- Publication number 20200279948
- Publication date Sep 3, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- YOGENDRA YADAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COINTEGRATION OF FET DEVICES WITH DECOUPLING CAPACITOR
- Publication number 20200273857
- Publication date Aug 27, 2020
- International Business Machines Corporation
- Juntao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatuses Having Memory Cells with Two Transistors and One Capaci...
- Publication number 20200203338
- Publication date Jun 25, 2020
- Micron Technology, Inc.
- Kamal M. Karda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A SEMICONDUCTOR DEVICE
- Publication number 20200152676
- Publication date May 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Victor Chiang LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20200144315
- Publication date May 7, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Victor Chiang LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuits with Capacitors
- Publication number 20200091277
- Publication date Mar 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiao-Han Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE
- Publication number 20200066716
- Publication date Feb 27, 2020
- TEXAS INSTRUMENTS INCORPORATED
- YIQI TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

in combination with capacitors only

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method of semiconductor device

Power MOSFETs structure

Packaged semiconductor device

Semiconductor device and manufacturing method thereof

Multi-layer trench capacitor structure

Semiconductor device and method of forming the same

Structures for testing nanoscale devices including ferroelectric ca...

Negative capacitance fet device with reduced hysteresis window

Method of manufacturing an integrated circuit comprising a capaciti...

Capacitor structure

Integrated circuits with capacitors

Hybrid high and low stress oxide embedded capacitor dielectric

Wire bonding between isolation capacitors for multichip modules

Semiconductor device and manufacturing method thereof

Single-mask, high-q performance metal-insulator-metal capacitor (MI...

Vertical memory devices

Apparatuses having memory cells with two transistors and one capaci...

Negative capacitance FinFET device and manufacturing method of the...

Semiconductor device

IC with larger and smaller width contacts

Structures for testing nanoscale devices including ferroelectric ca...

Semiconductor device and method of manufacturing the same

Structure with embedded memory device and contact isolation scheme

Semiconductor structures with deep trench capacitor and methods of...

Semiconductor device and manufacturing method thereof

Semiconductor structures with deep trench capacitor and methods of...

Semiconductor device and method of forming the same

Power MOSFETs structure

Semiconductor structures with deep trench capacitor and methods of...

Method of making a semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

HIGH CURRENT POWER MODULE PACKAGE WITH LINEAR OPERATION CAPABILITIE...

MULTI-LAYER TRENCH CAPACITOR STRUCTURE

INTEGRATED CIRCUIT AND NON-VOLATILE MEMORY DEVICE

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING SEMICONDUCTOR...

METHOD FOR FORMING CAPACITOR, SEMICONDUCTOR DEVICE, MODULE, AND ELE...

STRUCTURES FOR TESTING NANOSCALE DEVICES INCLUDING FERROELECTRIC CA...

HIGH DENSITY LINEAR CAPACITOR IN SEMICONDUCTOR TECHNOLOGIES

Integrated Circuits with Capacitors

MULTI-LAYER TRENCH CAPACITOR STRUCTURE

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

STRUCTURES FOR TESTING NANOSCALE DEVICES INCLUDING FERROELECTRIC CA...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

POWER MOSFETS STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

STRUCTURES FOR TESTING NANOSCALE DEVICES INCLUDING FERROELECTRIC CA...

METHOD FOR FORMING CAPACITOR, SEMICONDUCTOR DEVICE, MODULE, AND ELE...

Integrated Circuits with Capacitors

CAPACITOR STRUCTURE

SEMICONDUCTOR DEVICE

VERTICAL MEMORY DEVICES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

POWER MOSFETS STRUCTURE

COINTEGRATION OF FET DEVICES WITH DECOUPLING CAPACITOR

Apparatuses Having Memory Cells with Two Transistors and One Capaci...

METHOD OF MAKING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

Integrated Circuits with Capacitors

PACKAGED SEMICONDUCTOR DEVICE