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CPC
C25D7/0635

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CCHEMISTRY METALLURGY C25Electrolytic processing C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS ELECTROFORMING APPARATUS THEREFOR C25D7/00Electroplating characterised by the article coated

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C25D7/0635In radial cells

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for manufacturing electroplated steel sheet
- Patent number 11,365,489
- Issue date Jun 21, 2022
- JFE Steel Corporation
- Gentaro Takeda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus for fabricating electrode structure
- Patent number 10,927,470
- Issue date Feb 23, 2021
- Electronics and Telecommunications Research Institute
- Woo-Seok Cheong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-walled pipe and manufacture thereof
- Patent number 10,260,660
- Issue date Apr 16, 2019
- TI Automotive (Heidelberg) GmbH
- Sebastian Meier
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and device for electroplating in cylindrical geometry
- Patent number 10,167,565
- Issue date Jan 1, 2019
- Electricite de France
- Gregory Savidand
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Ultrathin copper foil and method of manufacturing the same, and ult...
- Patent number 9,930,776
- Issue date Mar 27, 2018
- JX Nippon Mining & Metals Corporation
- Michiya Kohiki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Partial plating device and partial plating method
- Patent number 9,683,307
- Issue date Jun 20, 2017
- Dowa Metaltech Co., Ltd.
- Kentaro Arai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composite metal foil and production method therefor
- Patent number 9,595,719
- Issue date Mar 14, 2017
- Mitsui Mining & Smelting Co., Ltd.
- Tetsuhiro Matsunaga
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Electrolytic treatment method and electrolytic treatment device
- Patent number 8,968,530
- Issue date Mar 3, 2015
- FUJIFILM Corporation
- Hisashi Hotta
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Foil plating for semiconductor packaging
- Patent number 8,747,640
- Issue date Jun 10, 2014
- Texas Instruments Incorporated
- Jaime Bayan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process and apparatus for producing a metal covered polyimide compo...
- Patent number 8,721,864
- Issue date May 13, 2014
- JX Nippon Mining & Metals Corporation
- Michiya Kohiki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Foil plating for semiconductor packaging
- Patent number 8,377,267
- Issue date Feb 19, 2013
- National Semiconductor Corporation
- Jaime A. Bayan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Continuous plating system and method with mask registration
- Patent number 8,287,714
- Issue date Oct 16, 2012
- Leviton Manufacturing Co., Inc.
- Darrell W. Zielke
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Continuous plating system and method with mask registration
- Patent number 8,277,629
- Issue date Oct 2, 2012
- Leviton Manufacturing Co., Inc.
- Darrell W. Zielke
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating systems and methods
- Patent number 8,182,655
- Issue date May 22, 2012
- Leviton Manufacturing Co., Inc.
- Darrell W. Zielke
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Continuous plating system and method with mask registration
- Patent number 7,744,732
- Issue date Jun 29, 2010
- Leviton Manufacturing Company, Inc.
- Darrell W. Zielke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Continuous plating system and method with mask registration
- Patent number 7,655,117
- Issue date Feb 2, 2010
- Leviton Manufacturing Co., Inc.
- Darrell W. Zielke
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating device and plating method
- Patent number 7,544,274
- Issue date Jun 9, 2009
- Dowa Metaltech Co., Ltd.
- Hiroshi Miyazawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and device for the electrolytic treatment of electrically co...
- Patent number 6,979,391
- Issue date Dec 27, 2005
- Atotech Deutschland GmbH
- Egon Hubel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroplating installation, electrode and support device for this...
- Patent number 6,334,943
- Issue date Jan 1, 2002
- Sollac
- Philippe Gheeraert
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus and method for electrolytic treatment
- Patent number 6,325,912
- Issue date Dec 4, 2001
- Fuji Photo Film Co., Ltd.
- Tsuyoshi Hirokawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Device for carrying out continuous electrolytic precipitation
- Patent number 6,306,268
- Issue date Oct 23, 2001
- Circuit Foil, S.A. of Luxemburg
- Hans Josef May
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Thin copper foil, and process and apparatus for the manufacture the...
- Patent number 6,291,080
- Issue date Sep 18, 2001
- Yates Foll USA, Inc.
- Charles B. Yates
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process and apparatus for the manufacture of high peel-strength cop...
- Patent number 6,270,648
- Issue date Aug 7, 2001
- Yates Foil USA, Inc.
- Charles B. Yates
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for sequentially metalizing polymeric films an...
- Patent number 6,224,722
- Issue date May 1, 2001
- Gould Electronics Inc.
- Thomas J. Ameen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating installation, electrode and support device for this...
- Patent number 6,129,820
- Issue date Oct 10, 2000
- Sollac
- Philippe Gheeraert
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper foil for a printed circuit board, a process and an apparatus...
- Patent number 5,997,710
- Issue date Dec 7, 1999
- Mitsui Mining & Smelting Co., Ltd.
- Muneharu Ohara
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for sequentially metalizing polymeric films an...
- Patent number 5,944,965
- Issue date Aug 31, 1999
- Gould Electronics Inc.
- Thomas J. Ameen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process for the manufacture of high quality very low profile copper...
- Patent number 5,863,410
- Issue date Jan 26, 1999
- Circuit Foil USA, Inc.
- Charles B. Yates
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper foil for a printed circuit board, a process and an apparatus...
- Patent number 5,833,819
- Issue date Nov 10, 1998
- Mitsui Mining & Smelting Co., Ltd.
- Muneharu Ohara
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for sequentially metalizing polymeric films an...
- Patent number 5,716,502
- Issue date Feb 10, 1998
- Gould Electronics Inc.
- Thomas J. Ameen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
PARTIAL PLATING DEVICE AND PARTIAL PLATING METHOD
- Publication number 20140291159
- Publication date Oct 2, 2014
- DOWA METALTECH CO., LTD.
- Kentaro Arai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating Method and Apparatus, and Strip Obtained by this Method
- Publication number 20130334055
- Publication date Dec 19, 2013
- FCI
- Damien Comte
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITE METAL FOIL AND PRODUCTION METHOD THEREFOR
- Publication number 20130323602
- Publication date Dec 5, 2013
- Mitsui Mining and Smelting Co., Ltd.
- Tetsuhiro Matsunaga
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Foil Plating for Semiconductor Packaging
- Publication number 20130026043
- Publication date Jan 31, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Jaime Bayan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Process and Apparatus for Producing a Metal Covered Polyimide Compo...
- Publication number 20120132531
- Publication date May 31, 2012
- JX NIPPON MINING & METALS CORPORATION
- Michiya Kohiki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLYTIC TREATMENT METHOD AND ELECTROLYTIC TREATMENT DEVICE
- Publication number 20110174635
- Publication date Jul 21, 2011
- Hisashi Hotta
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLYTIC COPPER COATING, METHOD OF MANUFACTURING THE SAME, AND...
- Publication number 20110139626
- Publication date Jun 16, 2011
- FURUKAWA ELECTRIC CO., LTD.
- Takahiro Saito
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FOIL PLATING FOR SEMICONDUCTOR PACKAGING
- Publication number 20110073481
- Publication date Mar 31, 2011
- National Semiconductor Corporation
- Jaime A. BAYAN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Metal Covered Polyimide Composite, Process for Producing the Compos...
- Publication number 20100215982
- Publication date Aug 26, 2010
- Nippon Mining & Metals Co., Ltd.
- Michiya Kohiki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DEVICE FOR FABRICATING FLEXIBLE FILM
- Publication number 20100038239
- Publication date Feb 18, 2010
- Min Keun Seo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONTINUOUS PLATING SYSTEM AND METHOD WITH MASK REGISTRATION
- Publication number 20090255821
- Publication date Oct 15, 2009
- LEVITON MANUFACTURING COMPANY, INC.
- Darrell W. Zielke
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONTINUOUS PLATING SYSTEM AND METHOD WITH MASK REGISTRATION
- Publication number 20090242412
- Publication date Oct 1, 2009
- Leviton Manufacturing Co., Inc.
- Darrell W. Zielke
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING SYSTEMS AND METHODS
- Publication number 20090057158
- Publication date Mar 5, 2009
- Leviton Manufacturing Co., Inc.
- Darrell W. Zielke
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Roll-To-Roll Electroplating for Photovoltaic Film Manufacturing
- Publication number 20080093221
- Publication date Apr 24, 2008
- Bulent M. Basol
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Continuous plating system and method with mask registration
- Publication number 20070045786
- Publication date Mar 1, 2007
- Leviton Manufacturing Co., Inc.
- Darrell W. Zielke
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Continuous plating system and method with mask registration
- Publication number 20060226017
- Publication date Oct 12, 2006
- Leviton Manufacturing Co., Inc.
- Darrell W. Zielke
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating device and plating method
- Publication number 20060137987
- Publication date Jun 29, 2006
- DOWA MINING CO., LTD.
- Hiroshi Miyazawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrolyte solution for manufacturing electrolytic copper foil and...
- Publication number 20040104117
- Publication date Jun 3, 2004
- ILJIN COPPER FOIL Co., Ltd.
- Jeom-Sik Yang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Process and apparatus for the manufacture of high peel-strength cop...
- Publication number 20020023844
- Publication date Feb 28, 2002
- Yates Foil USA, Inc.
- Charles B. Yates
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

In radial cells

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and apparatus for manufacturing electroplated steel sheet

Apparatus for fabricating electrode structure

Multi-walled pipe and manufacture thereof

Method and device for electroplating in cylindrical geometry

Ultrathin copper foil and method of manufacturing the same, and ult...

Partial plating device and partial plating method

Composite metal foil and production method therefor

Electrolytic treatment method and electrolytic treatment device

Foil plating for semiconductor packaging

Process and apparatus for producing a metal covered polyimide compo...

Foil plating for semiconductor packaging

Continuous plating system and method with mask registration

Continuous plating system and method with mask registration

Plating systems and methods

Continuous plating system and method with mask registration

Continuous plating system and method with mask registration

Plating device and plating method

Method and device for the electrolytic treatment of electrically co...

Electroplating installation, electrode and support device for this...

Apparatus and method for electrolytic treatment

Device for carrying out continuous electrolytic precipitation

Thin copper foil, and process and apparatus for the manufacture the...

Process and apparatus for the manufacture of high peel-strength cop...

Method and apparatus for sequentially metalizing polymeric films an...

Electroplating installation, electrode and support device for this...

Copper foil for a printed circuit board, a process and an apparatus...

Method and apparatus for sequentially metalizing polymeric films an...

Process for the manufacture of high quality very low profile copper...

Copper foil for a printed circuit board, a process and an apparatus...

Method and apparatus for sequentially metalizing polymeric films an...

Patents Applicationslast 30 patents

PARTIAL PLATING DEVICE AND PARTIAL PLATING METHOD

Plating Method and Apparatus, and Strip Obtained by this Method

COMPOSITE METAL FOIL AND PRODUCTION METHOD THEREFOR

Foil Plating for Semiconductor Packaging

Process and Apparatus for Producing a Metal Covered Polyimide Compo...

ELECTROLYTIC TREATMENT METHOD AND ELECTROLYTIC TREATMENT DEVICE

ELECTROLYTIC COPPER COATING, METHOD OF MANUFACTURING THE SAME, AND...

FOIL PLATING FOR SEMICONDUCTOR PACKAGING

Metal Covered Polyimide Composite, Process for Producing the Compos...

DEVICE FOR FABRICATING FLEXIBLE FILM

CONTINUOUS PLATING SYSTEM AND METHOD WITH MASK REGISTRATION

CONTINUOUS PLATING SYSTEM AND METHOD WITH MASK REGISTRATION

PLATING SYSTEMS AND METHODS

Roll-To-Roll Electroplating for Photovoltaic Film Manufacturing

Continuous plating system and method with mask registration

Continuous plating system and method with mask registration

Plating device and plating method

Electrolyte solution for manufacturing electrolytic copper foil and...

Process and apparatus for the manufacture of high peel-strength cop...