Claims
- 1. A method for supporting an electroplating electrode, comprising the steps of:providing an electrical contact surface on which a soluble anode electrode may slide and rest, said electrical contact surface having a plurality of grooves; and supporting the soluble anode electrode with the contact surface when the contact surface is submerged in an electroplating bath during electroplating.
- 2. The method of claim 1, wherein the electrical contact surface is formed primarily of graphite.
- 3. A method for electroplating a part, comprising:submerging electrodes in a bath; supporting the electrodes on at least one support device; forming, between a resting surface of each electrode and a contact surface of the at least one support device, an interface having a plurality of groves that open the interface to the bath; supplying a current to the electrodes; holding said part in the bath such that a surface of the part faces the electrodes; and generating an electrical electroplating current flowing between the surface of the part, the electrodes, and the at least one support device.
- 4. The method of claim 3, wherein the resting force of the submerged electrodes on the support devices is less than 1 Newton per cm2.
- 5. The method of claim 4, wherein a density of the electrical current supplied to the electrodes is greater than or equal to 0.025 A/mm2 at the interface.
- 6. The method of claim 4, wherein the resting force is less than 0.1 Newton per cm2.
- 7. The method of claim 6, wherein a density of the electrical current supplied to the electrodes is greater than or equal to 0.025 A/mm2 at the interface.
- 8. The method of claim 3, wherein a density of the electrical current supplied to the electrodes is greater than or equal to 0.025 A/mm2 at the interface.
- 9. The method of claim 3, further comprising the step of:solubilizing anodes of the electrodes during electroplating.
- 10. The method of claim 9, wherein the bath is a chloride-based bath.
Priority Claims (1)
Number |
Date |
Country |
Kind |
97 15179 |
Dec 1997 |
FR |
|
Parent Case Info
This application is a Division of application Ser. No. 09/204,545 filed on Dec. 3, 1998 now U.S. Pat. No 6,129,820.
US Referenced Citations (5)
Number |
Name |
Date |
Kind |
3855108 |
Boltz |
Dec 1974 |
A |
5188720 |
Colin et al. |
Feb 1993 |
A |
5228965 |
Ameen et al. |
Jul 1993 |
A |
5944965 |
Ameen et al. |
Aug 1999 |
A |
6129820 |
Gheeraert et al. |
Oct 2000 |
A |
Foreign Referenced Citations (2)
Number |
Date |
Country |
0 140 474 |
May 1985 |
EP |
0052384 |
Apr 1987 |
FR |