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Y10T29/49142
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GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10
USPC classification
Y10T
TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
Y10T29/00
Metal working
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Y10T29/49142
including metal fusion
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Patents Grants
last 30 patents
Information
Patent Grant
Method of assembling a heat dissipating module of an electronic device
Patent number
9,622,385
Issue date
Apr 11, 2017
Delta Electronics, Inc.
Cheng-Wei Hsu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Substrate structure having electronic components and method of manu...
Patent number
9,485,878
Issue date
Nov 1, 2016
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Jae Soo Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed wiring board and a method of manufacturing a printed wiring...
Patent number
9,480,170
Issue date
Oct 25, 2016
Ibiden Co., Ltd.
Katsuhiko Tanno
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Testing probe head for wafer level testing, and test probe card
Patent number
9,417,263
Issue date
Aug 16, 2016
Taiwan Semiconductor Manufacturing Co., Ltd.
Yung-Hsin Kuo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Illumination device comprising two printed circuit boards
Patent number
9,362,650
Issue date
Jun 7, 2016
Osram GmbH
Thomas Preuschl
F21 - LIGHTING
Information
Patent Grant
Electronic circuit, light source device, and method of manufacturin...
Patent number
9,332,655
Issue date
May 3, 2016
Ricoh Company, Ltd.
Hiroyuki Basho
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Grant
Heat resistant magnetic electrical connector
Patent number
9,312,632
Issue date
Apr 12, 2016
Genesis Technology USA, Inc.
Robert Colantuono
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
High aspect ratio stacked MLCC design
Patent number
8,988,857
Issue date
Mar 24, 2015
Kemet Electronics Corporation
John E. McConnell
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Camera module and method for making same
Patent number
8,760,570
Issue date
Jun 24, 2014
Hon Hai Precision Industry Co., Ltd.
Yun-Kai Yu
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Noise suppressor for semiconductor packages
Patent number
8,631,706
Issue date
Jan 21, 2014
International Business Machines Corporation
Nickolaus J Gruendler
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Assembly techniques for electronic devices having compact housing
Patent number
8,522,425
Issue date
Sep 3, 2013
Apple Inc.
Stephen Brian Lynch
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for conductively connecting a component on a transparent sub...
Patent number
8,484,837
Issue date
Jul 16, 2013
Schott AG
Andreas Nickut
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of manufacturing printed circuit board having flow preventin...
Patent number
8,336,201
Issue date
Dec 25, 2012
Samsung Electro-Mechanics Co., Ltd.
Jin Won Choi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Rib reinforcement of plated thru-holes
Patent number
8,319,116
Issue date
Nov 27, 2012
Oracle America, Inc.
Jorge Eduardo Martinez-Vargas
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printhead assembly incorporating plural printhead integrated circui...
Patent number
8,308,273
Issue date
Nov 13, 2012
Zamtec Limited
Kia Silverbrook
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Method of manufacturing a printed circuit board with an embedded el...
Patent number
8,266,792
Issue date
Sep 18, 2012
Samsung Electro-Mechanics Co., Ltd.
Woon-Chun Kim
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Detachable capacitor device
Patent number
8,254,146
Issue date
Aug 28, 2012
ASUSTeK COMPUTER Inc.
Chung-Wei Kuo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wiring member, method of manufacturing the wiring member and electr...
Patent number
8,217,274
Issue date
Jul 10, 2012
Hitachi, Ltd.
Hiroki Yamamoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
High density connector and method of manufacture
Patent number
8,167,630
Issue date
May 1, 2012
FCI Americas Technology LLC
Timothy A. Lemke
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic component embedded printed circuit board and manufacturi...
Patent number
8,130,508
Issue date
Mar 6, 2012
Samsung Electro-Mechanics Co., Ltd.
Woon-Chun Kim
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed wiring board and a method of manufacturing a printed wiring...
Patent number
8,087,164
Issue date
Jan 3, 2012
Ibiden Co., Ltd.
Katsuhiko Tanno
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of supplying ink to ink ejection nozzles
Patent number
8,087,168
Issue date
Jan 3, 2012
Silverbrook Research Pty Ltd
Kia Silverbrook
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Method for manufacturing substrate having built-in components
Patent number
8,069,558
Issue date
Dec 6, 2011
Murata Manufacturing Co., Ltd.
Katsuro Hirayama
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuit board with solder bump on solder pad and flow preve...
Patent number
8,039,761
Issue date
Oct 18, 2011
Samsung Electro-Mechanics Co., Ltd.
Jin Won Choi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Apparatus for shielding integrated circuit devices
Patent number
8,018,739
Issue date
Sep 13, 2011
Maxwell Technologies, LLC
Janet Patterson
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Printed board with component mounting pin
Patent number
7,891,089
Issue date
Feb 22, 2011
Ibiden Co., Ltd.
Takashi Kariya
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Manufacturing method for integrating passive component within subst...
Patent number
7,849,594
Issue date
Dec 14, 2010
Advanced Semiconductor Engineering Inc.
Chien-Hao Wang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for making an electronic label and electronic label obtained...
Patent number
7,815,122
Issue date
Oct 19, 2010
Pierre-Alain Bauer
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
High density connector and method of manufacture
Patent number
7,802,999
Issue date
Sep 28, 2010
FCI Americas Technology LLC
Timothy A. Lemke
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of sealing a face of a MST device
Patent number
7,776,175
Issue date
Aug 17, 2010
Silverbrook Research Pty Ltd
Kia Silverbrook
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Patents Applications
last 30 patents
Information
Patent Application
TEST PROBE CARD
Publication number
20140347085
Publication date
Nov 27, 2014
Yung-Hsin KUO
G01 - MEASURING TESTING
Information
Patent Application
ELECTRONIC CIRCUIT, LIGHT SOURCE DEVICE, AND METHOD OF MANUFACTURIN...
Publication number
20140198469
Publication date
Jul 17, 2014
Hiroyuki BASHO
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information
Patent Application
SUBSTRATE STRUCTURE HAVING ELECTRONIC COMPONENTS AND METHOD OF MANU...
Publication number
20140111958
Publication date
Apr 24, 2014
Samsung Electro-mechanics Co., Ltd.
Jae Soo Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CAMERA MODULE AND METHOD FOR MAKING SAME
Publication number
20140036218
Publication date
Feb 6, 2014
YUN-KAI YU
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
HIGH ASPECT RATIO STACKED MLCC DESIGN
Publication number
20130146347
Publication date
Jun 13, 2013
Kemet Electronics Corporation
John E. McConnell
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TEST PROBE CARD
Publication number
20130069683
Publication date
Mar 21, 2013
Taiwan Semiconductor Manufacturing Co., LTD
Yung-Hsin KUO
G01 - MEASURING TESTING
Information
Patent Application
LIGHT SOURCE DEVICE, METHOD OF ASSEMBLING LIGHT SOURCE DEVICE, OPTI...
Publication number
20130063798
Publication date
Mar 14, 2013
RICOH COMPANY, LTD.
Shuji TAKAMATSU
G02 - OPTICS
Information
Patent Application
METHOD FOR CONDUCTIVELY CONNECTING A COMPONENT ON A TRANSPARENT SUB...
Publication number
20120266461
Publication date
Oct 25, 2012
Andreas Nickut
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURI...
Publication number
20120124828
Publication date
May 24, 2012
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Woon-Chun KIM
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Printed Wiring Board And A Method Of Manufacturing A Printed Wiring...
Publication number
20120031659
Publication date
Feb 9, 2012
IBIDEN CO., LTD.
Katsuhiko Tanno
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
NOISE SUPPRESSOR FOR SEMICONDUCTOR PACKAGES
Publication number
20120020042
Publication date
Jan 26, 2012
International Business Machines Corporation
Nickolaus J. Gruendler
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of manufacturing printed circuit board having flow preventin...
Publication number
20120000067
Publication date
Jan 5, 2012
SAMSUNG ELLECTRO-MECHANICS CO., LTD.
Jin Won Choi
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
ILLUMINATION DEVICE COMPRISING TWO PRINTED CIRCUIT BOARDS
Publication number
20110222282
Publication date
Sep 15, 2011
OSRAM Gesellschaft mit beschraenkter Haftung
Thomas Preuschl
F21 - LIGHTING
Information
Patent Application
High Density Connector and Method of Manufacture
Publication number
20110076897
Publication date
Mar 31, 2011
TIMOTHY A. LEMKE
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
RIB REINFORCEMENT OF PLATED THRU-HOLES
Publication number
20110061233
Publication date
Mar 17, 2011
SUN MICROSYSTEMS, INC.
Jorge Eduardo Martinez-Vargas
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Wiring Member, Method of Manufacturing the Wiring Member and Electr...
Publication number
20100307802
Publication date
Dec 9, 2010
Hitachi, Ltd
Hiroki YAMAMOTO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Printhead Assembly Incorporating Plural Printhead Integrated Circui...
Publication number
20100225702
Publication date
Sep 9, 2010
SILVERBROOK RESEARCH PTY LTD
Kia Silverbrook
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
DETACHABLE CAPACITOR DEVICE
Publication number
20100214758
Publication date
Aug 26, 2010
Chung-Wei Kuo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
APPARATUS FOR SHIELDING INTEGRATED CIRCUIT DEVICES
Publication number
20100155912
Publication date
Jun 24, 2010
Maxwell Technologies, Inc.
Janet Patterson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Printed Circuit Board Having Flow Preventing Dam And Manufacturing...
Publication number
20100116534
Publication date
May 13, 2010
Samsung Electro-Mechanics Co., Ltd.
Jin Won Choi
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURI...
Publication number
20100101847
Publication date
Apr 29, 2010
Samsung Electro-Mechanics CO., LTD.
Woon-Chun KIM
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR MANUFACTURING SUBSTRATE HAVING BUILT-IN COMPONENTS
Publication number
20100083495
Publication date
Apr 8, 2010
Murata Manufacturing Co., Ltd.
Katsuro HIRAYAMA
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Assembly Techniques for Electronic Devices Having Compact Housing
Publication number
20100077607
Publication date
Apr 1, 2010
Stephen Brian Lynch
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of Soldering a Module Board
Publication number
20090301760
Publication date
Dec 10, 2009
Masato Shimamura
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
METHOD OF SUPPLYING INK TO INK EJECTION NOZZLES
Publication number
20090303267
Publication date
Dec 10, 2009
SILVERBROOK RESEARCH PTY LTD
Kia Silverbrook
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
HIGH DENSITY CONNECTOR AND METHOD OF MANUFACTURE
Publication number
20090191731
Publication date
Jul 30, 2009
TIMOTHY A. LEMKE
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MST DEVICE FOR ATTACHMENT TO SURFACE WITH ADHESIVE
Publication number
20090102882
Publication date
Apr 23, 2009
SILVERBROOK RESEARCH PTY LTD
Kia Silverbrook
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
Electronic Component Mounting Method and Electronic Component Mount...
Publication number
20090049687
Publication date
Feb 26, 2009
Tsukasa Shiraishi
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
PRINTED BOARD WITH COMPONENT MOUNTING PIN
Publication number
20090053910
Publication date
Feb 26, 2009
IBIDEN CO., LTD.
Takashi Kariya
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED BOARD WITH COMPONENT MOUNTING PIN
Publication number
20090053911
Publication date
Feb 26, 2009
IBIDEN CO., LTD.
Takashi Kariya
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR