including wafer charging or discharging means for vacuum chamber

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CPC
Y10S414/139

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S414/00Material or article handling

Current Industry

Y10S414/139including wafer charging or discharging means for vacuum chamber

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Transfer robot for reduced footprint platform architecture
- Patent number 11,908,714
- Issue date Feb 20, 2024
- Lam Research Corporation
- Richard H. Gould
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer transfer apparatus and substrate transfer apparatus
- Patent number RE49671
- Issue date Sep 26, 2023
- Kawasaki Jukogyo Kabushiki Kaisha
- Yasuhiko Hashimoto
Information Patent Grant
Substrate processing apparatus with an air curtain in a loading/unl...
- Patent number 11,749,549
- Issue date Sep 5, 2023
- KCTECH CO., LTD.
- Dong Min Kim
- B24 - GRINDING POLISHING
Information Patent Grant
Reduced footprint platform architecture with linear vacuum transfer...
- Patent number 11,521,869
- Issue date Dec 6, 2022
- Lam Research Corporation
- Richard H. Gould
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer transfer apparatus and substrate transfer apparatus
- Patent number RE48792
- Issue date Oct 26, 2021
- Kawasaki Jukogyo Kabushiki Kaisha
- Yasuhiko Hashimoto
Information Patent Grant
Substrate transporting device, substrate treating apparatus, and su...
- Patent number 10,727,087
- Issue date Jul 28, 2020
- SCREEN Holdings Co., Ltd.
- Joji Kuwahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 10,707,060
- Issue date Jul 7, 2020
- Plasma-Therm LLC
- Chris Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer transfer apparatus and substrate transfer apparatus
- Patent number RE48031
- Issue date Jun 2, 2020
- Kawasaki Jukogyo Kabushiki Kaisha
- Yasuhiko Hashimoto
Information Patent Grant
Wafer transfer apparatus and substrate transfer apparatus
- Patent number RE47909
- Issue date Mar 17, 2020
- Kawasaki Jukogyo Kabushiki Kaisha
- Yasuhiko Hashimoto
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 10,297,427
- Issue date May 21, 2019
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer transfer apparatus and substrate transfer apparatus
- Patent number RE47145
- Issue date Nov 27, 2018
- Kawasaki Jukogyo Kabushiki Kaisha
- Yasuhiko Hashimoto
Information Patent Grant
Semiconductor wafer handling transport
- Patent number 9,884,726
- Issue date Feb 6, 2018
- Brooks Automation, Inc.
- Peter van der Meulen
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Reduced capacity carrier and method of use
- Patent number 9,881,825
- Issue date Jan 30, 2018
- Brooks Automation, Inc.
- Ulysses Gilchrist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer transfer apparatus and substrate transfer apparatus
- Patent number RE46465
- Issue date Jul 4, 2017
- Kawasaki Jukogyo Kabushiki Kaisha
- Yasuhiko Hashimoto
Information Patent Grant
Elevator linear motor drive
- Patent number 9,633,880
- Issue date Apr 25, 2017
- Intevac, Inc.
- Stuart Scollay
- G11 - INFORMATION STORAGE
Information Patent Grant
Substrate processing apparatus
- Patent number 9,570,330
- Issue date Feb 14, 2017
- Brooks Automation, Inc.
- Christopher Hofmeister
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 9,564,366
- Issue date Feb 7, 2017
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost high throughput processing platform
- Patent number 9,493,306
- Issue date Nov 15, 2016
- Mattson Technology, Inc.
- Leszek Niewmierzycki
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Substrate processing systems and robot apparatus for transporting s...
- Patent number 9,457,464
- Issue date Oct 4, 2016
- Applied Materials, Inc.
- Izya Kremerman
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Substrate relay apparatus, substrate relay method, and substrate pr...
- Patent number 9,269,599
- Issue date Feb 23, 2016
- Tokyo Electron Limited
- Shinji Wakabayashi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 9,202,721
- Issue date Dec 1, 2015
- Plasma-Therm LLC
- Dwarakanath Geerpuram
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 9,202,720
- Issue date Dec 1, 2015
- Plasma-Therm LLC
- Linnell Martinez
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Preventing contamination in integrated circuit manufacturing lines
- Patent number 9,177,843
- Issue date Nov 3, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Ming Sung
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wafer transfer apparatus and substrate transfer apparatus
- Patent number RE45772
- Issue date Oct 20, 2015
- Kawasaki Jukogyo Kabushiki Kaisha
- Yasuhiko Hashimoto
- 001 -
Information Patent Grant
Transfer chamber between workstations
- Patent number 9,099,506
- Issue date Aug 4, 2015
- Brooks Automation, Inc.
- Clinton M. Haris
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Substrate transfer equipment and high speed substrate processing sy...
- Patent number 9,054,146
- Issue date Jun 9, 2015
- NEW POWER PLASMA CO., LTD.
- Soon-Im Wi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Substrate processing system and substrate transferring method
- Patent number 9,022,714
- Issue date May 5, 2015
- Jusung Engineering Co., Ltd.
- Kyoo Hwan Lee
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
High throughput, low volume clamshell load lock
- Patent number 9,016,998
- Issue date Apr 28, 2015
- Varian Semiconductor Equipment Associates, Inc.
- Jeffrey C. Blahnik
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Horizontal epitaxy furnace for channel SiGe formation
- Patent number 9,018,065
- Issue date Apr 28, 2015
- GLOBALFOUNDRIES Inc.
- Joanna Wasyluk
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Vacuum processing apparatus and operating method of vacuum processi...
- Patent number 9,011,065
- Issue date Apr 21, 2015
- Hitachi High-Technologies Corporation
- Susumu Tauchi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
TRANSFER ROBOT FOR REDUCED FOOTPRINT PLATFORM ARCHITECTURE
- Publication number 20240194505
- Publication date Jun 13, 2024
- Richard H. Gould
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER ROBOT FOR REDUCED FOOTPRINT PLATFORM ARCHITECTURE
- Publication number 20230062737
- Publication date Mar 2, 2023
- LAM RESEARCH CORPORATION
- Richard H. GOULD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER
- Publication number 20190013243
- Publication date Jan 10, 2019
- Plasma-Therm LLC
- Chris Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELEVATOR LINEAR MOTOR DRIVE
- Publication number 20140377040
- Publication date Dec 25, 2014
- Stuart Scollay
- G11 - INFORMATION STORAGE
Information Patent Application
SUBSTRATE PROCESSING SYSTEMS AND ROBOT APPARATUS FOR TRANSPORTING S...
- Publication number 20140286741
- Publication date Sep 25, 2014
- Izya Kremerman
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
High Throughput, Low Volume Clamshell Load Lock
- Publication number 20140271048
- Publication date Sep 18, 2014
- Varian Semiconductor Equipment Associates, Inc.
- Jeffrey C. Blahnik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER HANDLING TRANSPORT
- Publication number 20140199138
- Publication date Jul 17, 2014
- Brooks Automation, Inc.
- Peter van der Meulen
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20140161570
- Publication date Jun 12, 2014
- Brooks Automation, Inc.
- Christopher Hofmeister
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST HIGH THROUGHPUT PROCESSING PLATFORM
- Publication number 20140151195
- Publication date Jun 5, 2014
- Mattson Technology, Inc.
- Leszek Niewmierzycki
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20140154869
- Publication date Jun 5, 2014
- Plasma-Therm LLC
- Dwarakanath Geerpuram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE RELAY APPARATUS, SUBSTRATE RELAY METHOD, AND SUBSTRATE PR...
- Publication number 20130309047
- Publication date Nov 21, 2013
- TOKYO ELECTRON LIMITED
- Shinji Wakabayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20130230968
- Publication date Sep 5, 2013
- Plasma-Therm LLC
- Chris Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20130230972
- Publication date Sep 5, 2013
- Plasma-Therm LLC
- Chris Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20130230369
- Publication date Sep 5, 2013
- Brooks Automation, Inc.
- Christopher Hofmeister
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20130230969
- Publication date Sep 5, 2013
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20130230971
- Publication date Sep 5, 2013
- Plasma-Therm LLC
- Dwarakanath Geerpuram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20130230970
- Publication date Sep 5, 2013
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER ROBOT
- Publication number 20130195598
- Publication date Aug 1, 2013
- KABUSHIKI KAISHA YASKAWA DENKI
- Masatoshi FURUICHI
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
SEMICONDUCTOR MANUFACTURING PROCESS MODULE
- Publication number 20130121792
- Publication date May 16, 2013
- Peter van der Meulen
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND STO...
- Publication number 20130078059
- Publication date Mar 28, 2013
- TOKYO ELECTRON LIMITED
- Suguru ENOKIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20130065378
- Publication date Mar 14, 2013
- Chris Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20120238073
- Publication date Sep 20, 2012
- Chris Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL MODULAR WAFER TRANSPORT SYSTEM
- Publication number 20120213614
- Publication date Aug 23, 2012
- Anthony C. Bonora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CENTER FINDING WITH CHARGE-COUPLED DEVICES
- Publication number 20120154822
- Publication date Jun 21, 2012
- Brooks Automation, Inc.
- Christopher C. Kiley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINEAR SEMICONDUCTOR PROCESSING FACILITIES
- Publication number 20120148374
- Publication date Jun 14, 2012
- Brooks Automation, Inc.
- Peter van der Meulen
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
ANODIZING APPARATUS
- Publication number 20120138455
- Publication date Jun 7, 2012
- Yasuyoshi MIYAJI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LASER RELEASE PROCESS FOR VERY THIN SI-CARRIER BUILD
- Publication number 20120091585
- Publication date Apr 19, 2012
- International Business Machines Corporation
- Leena P. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING THIN WAFERS
- Publication number 20120093616
- Publication date Apr 19, 2012
- Terry BLUCK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED APPARATUS TO ASSURE WAFER QUALITY AND MANUFACTURABILITY
- Publication number 20120051872
- Publication date Mar 1, 2012
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPAY, LTD.
- Shao-Yen Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING SYSTEMS
- Publication number 20120020759
- Publication date Jan 26, 2012
- Brooks Automation, Inc.
- Peter van der Meulen
- H01 - BASIC ELECTRIC ELEMENTS

including wafer charging or discharging means for vacuum chamber

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Transfer robot for reduced footprint platform architecture

Wafer transfer apparatus and substrate transfer apparatus

Substrate processing apparatus with an air curtain in a loading/unl...

Reduced footprint platform architecture with linear vacuum transfer...

Wafer transfer apparatus and substrate transfer apparatus

Substrate transporting device, substrate treating apparatus, and su...

Method and apparatus for plasma dicing a semi-conductor wafer

Wafer transfer apparatus and substrate transfer apparatus

Wafer transfer apparatus and substrate transfer apparatus

Method and apparatus for plasma dicing a semi-conductor wafer

Wafer transfer apparatus and substrate transfer apparatus

Semiconductor wafer handling transport

Reduced capacity carrier and method of use

Wafer transfer apparatus and substrate transfer apparatus

Elevator linear motor drive

Substrate processing apparatus

Method and apparatus for plasma dicing a semi-conductor wafer

Low cost high throughput processing platform

Substrate processing systems and robot apparatus for transporting s...

Substrate relay apparatus, substrate relay method, and substrate pr...

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Preventing contamination in integrated circuit manufacturing lines

Wafer transfer apparatus and substrate transfer apparatus

Transfer chamber between workstations

Substrate transfer equipment and high speed substrate processing sy...

Substrate processing system and substrate transferring method

High throughput, low volume clamshell load lock

Horizontal epitaxy furnace for channel SiGe formation

Vacuum processing apparatus and operating method of vacuum processi...

Patents Applicationslast 30 patents

TRANSFER ROBOT FOR REDUCED FOOTPRINT PLATFORM ARCHITECTURE

TRANSFER ROBOT FOR REDUCED FOOTPRINT PLATFORM ARCHITECTURE

METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

ELEVATOR LINEAR MOTOR DRIVE

SUBSTRATE PROCESSING SYSTEMS AND ROBOT APPARATUS FOR TRANSPORTING S...

High Throughput, Low Volume Clamshell Load Lock

SEMICONDUCTOR WAFER HANDLING TRANSPORT

SUBSTRATE PROCESSING APPARATUS

LOW COST HIGH THROUGHPUT PROCESSING PLATFORM

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

SUBSTRATE RELAY APPARATUS, SUBSTRATE RELAY METHOD, AND SUBSTRATE PR...

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

SUBSTRATE PROCESSING APPARATUS

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

TRANSFER ROBOT

SEMICONDUCTOR MANUFACTURING PROCESS MODULE

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND STO...

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

UNIVERSAL MODULAR WAFER TRANSPORT SYSTEM

WAFER CENTER FINDING WITH CHARGE-COUPLED DEVICES

LINEAR SEMICONDUCTOR PROCESSING FACILITIES

ANODIZING APPARATUS

LASER RELEASE PROCESS FOR VERY THIN SI-CARRIER BUILD

PROCESSING THIN WAFERS

INTEGRATED APPARATUS TO ASSURE WAFER QUALITY AND MANUFACTURABILITY

SEMICONDUCTOR MANUFACTURING SYSTEMS