Induction heating

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CPC
H01L2021/60127

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2021/60127Induction heating

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Patents Grantslast 30 patents

Information Patent Grant
Bonding method of package components and bonding apparatus
- Patent number 11,955,378
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method of package components and bonding apparatus
- Patent number 11,443,981
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES, FABRICATION METHODS OF SEMICONDUCTOR DEVICES...
- Publication number 20240387408
- Publication date Nov 21, 2024
- Yangtze Memory Technologies Co., Ltd.
- Wei Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD OF PACKAGE COMPONENTS AND BONDING APPARATUS
- Publication number 20220367255
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD OF PACKAGE COMPONENTS AND BONDING APPARATUS
- Publication number 20210050251
- Publication date Feb 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Li HSIAO
- H01 - BASIC ELECTRIC ELEMENTS