Injection plunger or ram: transfer molding type

Industry

CPC
Y10S425/228

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Parent Industries

YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S425/00Plastic article or earthenware shaping or treating: apparatus

Current Industry

Y10S425/228Injection plunger or ram: transfer molding type

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for molding simultaneously a plurality of semi...
- Patent number 7,029,257
- Issue date Apr 18, 2006
- Samsung Electronics Co., Ltd.
- Sung-soo Lee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Molding apparatus including screw for molded articles of thermoplas...
- Patent number 6,652,254
- Issue date Nov 25, 2003
- Sekisui Chemical Co., Ltd.
- Satoshi Shimura
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Resin plunging apparatus for molding resin to seal an electronic de...
- Patent number 6,382,945
- Issue date May 7, 2002
- Industrial Technology Research Institute
- Li-Wei Chen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Automated thermoset molding apparatus
- Patent number 5,902,613
- Issue date May 11, 1999
- The Budd Company
- Jack J. Ritchie
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Resin molding apparatus
- Patent number 5,882,692
- Issue date Mar 16, 1999
- Sony Corporation
- Akira Kojima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Transfer molding apparatus having laminated chase block
- Patent number 5,871,782
- Issue date Feb 16, 1999
- LG Semicon Co. Ltd.
- Sihn Choi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Transfer molding press
- Patent number 5,851,559
- Issue date Dec 22, 1998
- Motorola, Inc.
- Cliff J. Scribner
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of and apparatus for molding resin to seal electronic parts
- Patent number 5,834,035
- Issue date Nov 10, 1998
- Towa Corporation
- Michio Osada
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Encapsulation method
- Patent number 5,798,070
- Issue date Aug 25, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Kunito Sakai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Apparatus for encapsulating electronic packages
- Patent number 5,776,512
- Issue date Jul 7, 1998
- Hestia Technologies, Inc.
- Patrick O. Weber
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Resin sealing mold die set with less resin remainder for semiconduc...
- Patent number 5,766,649
- Issue date Jun 16, 1998
- NEC Corporation
- Kousuke Azuma
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Automated thermoset molding method
- Patent number 5,753,164
- Issue date May 19, 1998
- The Budd Company
- Jack J. Ritchie
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of resin sealing an object with apparatus including a gas sp...
- Patent number 5,700,001
- Issue date Dec 23, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Shunji Yamauchi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Resin molding apparatus
- Patent number 5,650,177
- Issue date Jul 22, 1997
- Sony Corporation
- Akira Kojima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Molding die for sealing semiconductor device with reduced resin burrs
- Patent number 5,635,220
- Issue date Jun 3, 1997
- NEC Corporation
- Atsuhiko Izumi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Apparatus for encapsulating electronic packages
- Patent number 5,609,889
- Issue date Mar 11, 1997
- Hestia Technologies, Inc.
- Patrick O. Weber
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of molding resin to seal electronic parts using two evacuati...
- Patent number 5,603,879
- Issue date Feb 18, 1997
- Towa Corporation
- Michio Osada
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Encapsulation molding equipment
- Patent number 5,484,274
- Issue date Jan 16, 1996
- Neu Dynamics Corp.
- H. Karl Neu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Food pump
- Patent number 5,464,338
- Issue date Nov 7, 1995
- Marlen Research Corporation
- Richard G. Powers
- A22 - BUTCHERING MEAT TREATMENT PROCESSING POULTRY OR FISH
Information Patent Grant
Scraping plunger
- Patent number 5,451,154
- Issue date Sep 19, 1995
- Fico B.V.
- Hendrikus J. M. Schaars
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for pressing a plastic, which cures by means of a reaction,...
- Patent number 5,431,854
- Issue date Jul 11, 1995
- "3P" Licensing B.V.
- Ireneus J. T. M. Pas
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Encapsulating molding equipment and method
- Patent number 5,429,488
- Issue date Jul 4, 1995
- Neu Dynamics Corporation
- H. Karl Neu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Apparatus for molding mini-compact disk cartridge shells
- Patent number 5,425,629
- Issue date Jun 20, 1995
- Yoshihiko Taniyama
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Resin-sealing apparatus including a gas spring
- Patent number 5,413,471
- Issue date May 9, 1995
- Mitsubishi Denki Kabushiki Kaisha
- Shunji Yamauchi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Encapsulation molding equipment
- Patent number 5,409,362
- Issue date Apr 25, 1995
- Neu Dynamics Corp.
- H. Karl Neu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Molding machine and method
- Patent number 5,395,226
- Issue date Mar 7, 1995
- Mitsubishi Denki Kabushiki Kaisha
- Kunito Sakai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Apparatus for pre-shaping plasticated plastics material
- Patent number 5,378,136
- Issue date Jan 3, 1995
- Hoechst Aktiengesellschaft
- Jurgen Henning
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Apparatus for assembling and resin-encapsulating a heat sink-mounte...
- Patent number 5,370,517
- Issue date Dec 6, 1994
- SGS Thomson Microelectronics S.r.l.
- Paolo Casati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal mold for sealing semiconductor devices with a resin
- Patent number 5,356,283
- Issue date Oct 18, 1994
- NEC Corporation
- Makoto Hamada
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Compression-cavity mold for plastic encapsulation of thin-package i...
- Patent number 5,326,243
- Issue date Jul 5, 1994
- Richard H. J. Fierkens
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
Apparatus and method for molding simultaneously a plurality of semi...
- Publication number 20060118982
- Publication date Jun 8, 2006
- Samsung Electronics Co. Ltd.
- Sung-soo Lee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Apparatus and method for molding simultaneously a plurality of semi...
- Publication number 20030209817
- Publication date Nov 13, 2003
- SAMSUNG ELECTRONICS CO., LTD.
- Sung-Soo Lee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Forming device for thermoplastic resin formed part
- Publication number 20030044480
- Publication date Mar 6, 2003
- Satoshi Shimura
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Injection plunger or ram: transfer molding type

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatus and method for molding simultaneously a plurality of semi...

Molding apparatus including screw for molded articles of thermoplas...

Resin plunging apparatus for molding resin to seal an electronic de...

Automated thermoset molding apparatus

Resin molding apparatus

Transfer molding apparatus having laminated chase block

Transfer molding press

Method of and apparatus for molding resin to seal electronic parts

Encapsulation method

Apparatus for encapsulating electronic packages

Resin sealing mold die set with less resin remainder for semiconduc...

Automated thermoset molding method

Method of resin sealing an object with apparatus including a gas sp...

Resin molding apparatus

Molding die for sealing semiconductor device with reduced resin burrs

Apparatus for encapsulating electronic packages

Method of molding resin to seal electronic parts using two evacuati...

Encapsulation molding equipment

Food pump

Scraping plunger

Method for pressing a plastic, which cures by means of a reaction,...

Encapsulating molding equipment and method

Apparatus for molding mini-compact disk cartridge shells

Resin-sealing apparatus including a gas spring

Encapsulation molding equipment

Molding machine and method

Apparatus for pre-shaping plasticated plastics material

Apparatus for assembling and resin-encapsulating a heat sink-mounte...

Metal mold for sealing semiconductor devices with a resin

Compression-cavity mold for plastic encapsulation of thin-package i...

Patents Applicationslast 30 patents

Apparatus and method for molding simultaneously a plurality of semi...

Apparatus and method for molding simultaneously a plurality of semi...

Forming device for thermoplastic resin formed part