TREA

Insulating of windings

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  • CPC
  • H01F41/12
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HELECTRICITY H01Electric elements H01FMAGNETS INDUCTANCES TRANSFORMERS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties

Current Industry

H01F41/12Insulating of windings
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Coil component
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    • Issue date Jun 3, 2025
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Ji Young Park
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    Dual-mode wireless charging device
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    • Taiwan Semiconductor Manufacturing Co., Ltd
    • Shih-Wei Liang
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    Method of manufacturing an embedded magnetic component device
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    • Issue date May 27, 2025
    • Murata Manufacturing Co., Ltd.
    • Scott Andrew Parish
    • H01 - BASIC ELECTRIC ELEMENTS
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    Reactor
    • Patent number 12,308,153
    • Issue date May 20, 2025
    • Autonetworks Technologies, Ltd.
    • Naotoshi Furukawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component and manufacturing method therefor
    • Patent number 12,293,864
    • Issue date May 6, 2025
    • TDK Corporation
    • Nobuyuki Okuzawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multilayer resin substrate and method of manufacturing multilayer r...
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    • Murata Manufacturing Co., Ltd.
    • Rintaro Sugi
    • H01 - BASIC ELECTRIC ELEMENTS
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    Manufacturing method of magnetic element
    • Patent number 12,283,412
    • Issue date Apr 22, 2025
    • Delta Electronics (Shanghai) Co., Ltd.
    • Shouyu Hong
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method for insulation of coil of toroid transformers
    • Patent number 12,278,035
    • Issue date Apr 15, 2025
    • Hun-Ren Energiatudományi Kutatóközpont
    • Gábor Anda
    • H01 - BASIC ELECTRIC ELEMENTS
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    Method for producing a spiral-shaped body with a compressed spiral
    • Patent number 12,272,493
    • Issue date Apr 8, 2025
    • Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
    • Matthias Busse
    • H01 - BASIC ELECTRIC ELEMENTS
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    Electronic module
    • Patent number 12,272,483
    • Issue date Apr 8, 2025
    • Cyntec Co., Ltd.
    • Yi-Cheng Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Surface-mounted magnetic-component module
    • Patent number 12,237,104
    • Issue date Feb 25, 2025
    • Murata Manufacturing Co., Ltd.
    • Lee Francis
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 12,230,431
    • Issue date Feb 18, 2025
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • No Il Park
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 12,224,100
    • Issue date Feb 11, 2025
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Jae Hun Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic component
    • Patent number 12,224,104
    • Issue date Feb 11, 2025
    • TDK Corporation
    • Shinichi Sato
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 12,217,896
    • Issue date Feb 4, 2025
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Chan Yoon
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic component
    • Patent number 12,217,905
    • Issue date Feb 4, 2025
    • TDK Corporation
    • Hidenobu Umeda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Reactor
    • Patent number 12,217,895
    • Issue date Feb 4, 2025
    • Autonetworks Technologies, Ltd.
    • Takehito Kobayashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 12,205,745
    • Issue date Jan 21, 2025
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Soon Seong Jeong
    • H01 - BASIC ELECTRIC ELEMENTS
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    Magnetic coupling coil component
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    • Issue date Jan 21, 2025
    • Taiyo Yuden Co., Ltd.
    • Akihisa Matsuda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 12,205,746
    • Issue date Jan 21, 2025
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Ju Hwan Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 12,205,747
    • Issue date Jan 21, 2025
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Kang Wook Bong
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component and manufacturing method therefor
    • Patent number 12,170,163
    • Issue date Dec 17, 2024
    • TDK Corporation
    • Nobuyuki Okuzawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Surface-mounted magnetic-component module
    • Patent number 12,165,798
    • Issue date Dec 10, 2024
    • Murata Manufacturing Co., Ltd.
    • Lee Francis
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multilayer coil component
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    • Murata Manufacturing Co., Ltd.
    • Ryouji Mizobata
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Surface-mount passive component
    • Patent number 12,154,709
    • Issue date Nov 26, 2024
    • Murata Manufacturing Co., Ltd.
    • Yoshimasa Yoshioka
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of forming an electromagnetic device
    • Patent number 12,154,712
    • Issue date Nov 26, 2024
    • Vishay Dale Electronics, LLC
    • Darek Blow
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of fabrication of composite monolithic structures
    • Patent number 12,154,717
    • Issue date Nov 26, 2024
    • The Mitre Corporation
    • Alejandro Chu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component and method of manufacturing the same
    • Patent number 12,136,512
    • Issue date Nov 5, 2024
    • Murata Manufacturing Co., Ltd.
    • Keiichi Ishida
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Package embedded magnetic inductor structures and manufacturing tec...
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    • Issue date Oct 29, 2024
    • Intel Corporation
    • William J. Lambert
    • H01 - BASIC ELECTRIC ELEMENTS
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    Inductor structure and manufacturing method for the same
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    • Issue date Oct 29, 2024
    • Macronix International Co., Ltd.
    • Erh-Kun Lai
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents