TREA

Insulating of windings

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  • CPC
  • H01F41/12
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Parent Industries

HELECTRICITY H01Electric elements H01FMAGNETS INDUCTANCES TRANSFORMERS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties

Current Industry

H01F41/12Insulating of windings
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Surface-mounted magnetic-component module
    • Patent number 12,237,104
    • Issue date Feb 25, 2025
    • Murata Manufacturing Co., Ltd.
    • Lee Francis
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 12,230,431
    • Issue date Feb 18, 2025
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • No Il Park
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 12,224,100
    • Issue date Feb 11, 2025
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Jae Hun Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic component
    • Patent number 12,224,104
    • Issue date Feb 11, 2025
    • TDK Corporation
    • Shinichi Sato
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 12,217,896
    • Issue date Feb 4, 2025
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Chan Yoon
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic component
    • Patent number 12,217,905
    • Issue date Feb 4, 2025
    • TDK Corporation
    • Hidenobu Umeda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Reactor
    • Patent number 12,217,895
    • Issue date Feb 4, 2025
    • Autonetworks Technologies, Ltd.
    • Takehito Kobayashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 12,205,745
    • Issue date Jan 21, 2025
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Soon Seong Jeong
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Magnetic coupling coil component
    • Patent number 12,205,759
    • Issue date Jan 21, 2025
    • Taiyo Yuden Co., Ltd.
    • Akihisa Matsuda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 12,205,746
    • Issue date Jan 21, 2025
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Ju Hwan Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 12,205,747
    • Issue date Jan 21, 2025
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Kang Wook Bong
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component and manufacturing method therefor
    • Patent number 12,170,163
    • Issue date Dec 17, 2024
    • TDK Corporation
    • Nobuyuki Okuzawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Surface-mounted magnetic-component module
    • Patent number 12,165,798
    • Issue date Dec 10, 2024
    • Murata Manufacturing Co., Ltd.
    • Lee Francis
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multilayer coil component
    • Patent number 12,159,750
    • Issue date Dec 3, 2024
    • Murata Manufacturing Co., Ltd.
    • Ryouji Mizobata
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Surface-mount passive component
    • Patent number 12,154,709
    • Issue date Nov 26, 2024
    • Murata Manufacturing Co., Ltd.
    • Yoshimasa Yoshioka
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of forming an electromagnetic device
    • Patent number 12,154,712
    • Issue date Nov 26, 2024
    • Vishay Dale Electronics, LLC
    • Darek Blow
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of fabrication of composite monolithic structures
    • Patent number 12,154,717
    • Issue date Nov 26, 2024
    • The Mitre Corporation
    • Alejandro Chu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component and method of manufacturing the same
    • Patent number 12,136,512
    • Issue date Nov 5, 2024
    • Murata Manufacturing Co., Ltd.
    • Keiichi Ishida
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Package embedded magnetic inductor structures and manufacturing tec...
    • Patent number 12,132,015
    • Issue date Oct 29, 2024
    • Intel Corporation
    • William J. Lambert
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Inductor structure and manufacturing method for the same
    • Patent number 12,131,863
    • Issue date Oct 29, 2024
    • Macronix International Co., Ltd.
    • Erh-Kun Lai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Transformer with a casting embedding a winding arrangement and meth...
    • Patent number 12,125,632
    • Issue date Oct 22, 2024
    • HITACHI ENERGY LTD
    • Uwe Drofenik
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method for manufacturing a passive electronic component
    • Patent number 12,119,159
    • Issue date Oct 15, 2024
    • Taiyo Yuden Co., Ltd.
    • Ryuichi Kondo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 12,112,880
    • Issue date Oct 8, 2024
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Sung Sik Shin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 12,106,885
    • Issue date Oct 1, 2024
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Seung Mo Lim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil module, actuator provided with coil module, and method for man...
    • Patent number 12,106,893
    • Issue date Oct 1, 2024
    • Rohm Co., Ltd.
    • Akihito Saito
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electrical transformer
    • Patent number 12,080,473
    • Issue date Sep 3, 2024
    • Northrop Grumman Systems Corporation
    • Gary M. Rackson
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 12,062,481
    • Issue date Aug 13, 2024
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Byung Soo Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 12,057,253
    • Issue date Aug 6, 2024
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Do Young Jung
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Hybrid transformers for power supplies
    • Patent number 12,057,255
    • Issue date Aug 6, 2024
    • Acleap Power Inc.
    • Arturo Silva
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component and its manufacturing method
    • Patent number 12,051,531
    • Issue date Jul 30, 2024
    • TDK Corporation
    • Nobuya Takahashi
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents